EP3CLS70F484C7 - Cyclone III LS FPGA 70K LE | Altera | 484-FBGA
Référence : EP3CLS70F484C7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $198.5 | $1 985,00 |
| 100 | $178.2 | $17 820,00 |
| 500 | $162.4 | $81 200,00 |
| 1 000 | $148.75 | $148 750,00 |
EP3CLS70F484C7 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit whose logic, interconnect, memory blocks, and I/O behaviour can be reconfigured after manufacturing via a hardware description language (HDL) bitstream. FPGAs occupy a tier between fixed-function ASICs and general-purpose microcontrollers, offering parallel hardware acceleration for DSP, packet processing, motor control, and custom glue logic that would otherwise require many discrete components. Cyclone III LS extends the Cyclone III family with additional security features such as configuration bitstream encryption and JTAG protection, placing it in the broader taxonomy of low-power programmable logic within the power management and embedded systems domain.
Key features of the EP3CLS70F484C7 include 70,208 logic elements organized into Adaptive Logic Modules (ALMs), 2.93 Mbit of on-chip M9K memory, 278 hardware multipliers for DSP operations, and 4 phase-locked loops (PLLs) for clock synthesis. It supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes and integrates a hard memory controller plus a high-speed LVDS I/O bank architecture. The 484-pin FBGA package enables dense board-level integration for mid-volume industrial designs.
The Cyclone III LS family uses a 65 nm process node with a low-K dielectric and a 1.2 V core voltage, which together deliver roughly 50% lower dynamic power than the previous Cyclone II generation. The architecture embeds 8-input fracturable ALMs, allowing each ALM to implement either a full 8-input LUT or two independent 4-input LUTs, which improves logic packing efficiency for state machines and arithmetic paths.
Typical applications include industrial motor control and factory automation, video surveillance and image processing, automotive infotainment and driver assistance prototypes, portable medical instrumentation, software-defined radio baseband, and low-cost ASIC prototyping. The C7 commercial temperature grade suits indoor enclosures and consumer-grade embedded designs.
When designing with the EP3CLS70F484C7, ensure that all core and I/O power rails meet the datasheet sequencing requirements and that the JTAG chain is properly buffered for in-system programming. The Quartus II design suite from Intel is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, FPGA-class cross references, and practical design notes not found in the manufacturer datasheet, helping engineers quickly assess whether the EP3CLS70F484C7 fits their embedded logic, DSP, or low-power control application.
Alternatives de remplacement direct pour EP3CLS70F484C7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS70F484C7 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), RoHS Status, Configuration Mode.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS70F484C7N
✅ Remplacement direct✓ En stock
$96.3 / unité
Voir la fiche technique →EP3CLS70F484C8
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP3CLS70F484I7
✅ Remplacement direct✓ En stock
$49.1 / unité
Voir la fiche technique →EP3CLS100F484C7
✅ Remplacement direct✓ En stock
$62.8 / unité
Voir la fiche technique →EP3CLS150F484C7
✅ Remplacement direct✓ En stock
$720 / unité
Voir la fiche technique →EP3C55F484C7
✅ Remplacement direct✓ En stock
$52.95 / unité
Voir la fiche technique →EP3C80F484C7
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP3CLS70F484C7 Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Logic Elements | 70,208 LE |
| Adaptive Logic Modules (ALMs) | 27,808 ALM |
| Embedded Memory | 2.93 Mbit (M9K blocks) |
| 18x18 Hardware Multipliers | 278 |
| Maximum User I/O | 294 |
| PLLs | 4 |
| Global Clocks | 20 |
| Core Voltage | 1.15 V to 1.25 V |
| Température de fonctionnement | 0 C to +70 C (commercial, C7 grade) |
| Maximum Internal Frequency | 437.5 MHz |
| Process Node | 65 nm TSMC low-power |
| Boîtier | 484-pin FBGA (FineLine BGA) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Configuration Modes | JTAG, AS, AP, PS |
| Statut RoHS | Compliant |
Configuration des broches de EP3CLS70F484C7
| Broche A1 | VCCIO1 — I/O bank 1 supply |
| Broche A2 | IOB1_A2 — User I/O (bank 1) |
| Broche B1 | GND — Ground |
| Broche B2 | IOB1_B2 — User I/O (bank 1) |
| Broche C1 | VCCINT — Core voltage 1.2 V |
| Broche C2 | IOB1_C2 — User I/O (bank 1) |
| Broche D1 | CONFIG_DONE — Configuration done signal |
| Broche D2 | IOB1_D2 — User I/O (bank 1) |
| Broche E1 | nCONFIG — Configuration control (active low) |
| Broche E2 | IOB2_E2 — User I/O (bank 2) |
| Broche F1 | MSEL0 — Configuration mode select |
| Broche F2 | IOB2_F2 — User I/O (bank 2) |
| Broche G1 | MSEL1 — Configuration mode select |
| Broche G2 | TCK — JTAG clock |
| Broche H1 | TMS — JTAG mode select |
| Broche H2 | TDO — JTAG data out |
| Broche J1 | TDI — JTAG data in |
| Broche J2 | IOB3_J2 — User I/O (bank 3) |
| Broche K1 | DCLK — Configuration clock |
| Broche K2 | IOB3_K2 — User I/O (bank 3) |
| Broche L1 | DATA0 — Configuration data |
| Broche L2 | IOB3_L2 — User I/O (bank 3) |
| Broche M1 | VCCIO3 — I/O bank 3 supply |
| Broche M2 | IOB3_M2 — User I/O (bank 3) |
| Broche N1 | GND — Ground |
| Broche N2 | IOB4_N2 — User I/O (bank 4) |
| Broche P1 | VCCINT — Core voltage 1.2 V |
| Broche P2 | IOB4_P2 — User I/O (bank 4) |
| Broche R1 | CLK0 — Dedicated clock input 0 |
| Broche R2 | IOB4_R2 — User I/O (bank 4) |
| Broche T1 | CLK1 — Dedicated clock input 1 |
| Broche T2 | IOB5_T2 — User I/O (bank 5) |
Applications typiques
EP3CLS70F484C7 convient pour 6 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing, Automotive Infotainment and Driver Assistance Prototypes, Portable Medical Instrumentation, Software-Defined Radio Baseband Processing, ASIC Prototyping and Low-Volume Production.
Industrial Motor Control and Factory Automation
The EP3CLS70F484C7 fits industrial motor control because its 278 hardware 18x18 multipliers and 437.5 MHz fabric implement field-oriented control (FOC), space-vector PWM, and encoder decoding in parallel hardware. The 70K logic elements hold complete multi-axis control loops plus EtherCAT or Modbus glue logic, while the 2.93 Mbit embedded SRAM buffers current/voltage sample streams. Industrial-grade variants with -40C to +85C support (EP3CLS70F484I7) drop in on the same FBGA-484 footprint for harsh factory environments.
Recommandé
Video Surveillance and Image Processing
The EP3CLS70F484C7 supports mid-resolution video pipelines such as H.264 encoding, motion detection, and edge enhancement for IP surveillance cameras. Its 294 user I/Os interface to MIPI CSI-2, BT.656, or parallel CMOS sensors, while 2.93 Mbit embedded memory buffers full video lines for FFT and DCT operations. The 65 nm low-power process keeps board thermals manageable in sealed outdoor housings, and Quartus II reference designs accelerate time to market for new camera platforms.
Recommandé
Automotive Infotainment and Driver Assistance Prototypes
The EP3CLS70F484C7 enables pre-production prototyping of automotive infotainment, ADAS vision preprocessing, and driver-monitoring systems before committing to an AEC-Q100-qualified ASIC. The Cyclone III LS security subsystem with JTAG protection prevents bitstream theft during development, while 4 PLLs generate the multiple pixel-clock and audio-clock domains required by automotive LVDS displays. Production migration to Cyclone V or Cyclone 10 families follows a Quartus II migration path with preserved IP cores.
Recommandé
Portable Medical Instrumentation
The EP3CLS70F484C7 suits portable patient monitors, ultrasound front-ends, and pulse-oximetry signal chains because its low 1.2 V core voltage reduces battery drain versus older 1.8 V FPGA families. The 278 DSP blocks accelerate finite impulse response (FIR) and infinite impulse response (IIR) filters for ECG/EEG denoising, while 294 I/Os interface to 24-bit ADCs and TFT displays. Its 65 nm low-power process meets IEC 60601 thermal-rise budgets for handheld diagnostic housings.
Recommandé
Software-Defined Radio Baseband Processing
The EP3CLS70F484C7 handles software-defined radio baseband for tactical radios, public-safety P25/LTE gateways, and amateur SDR platforms. Its 278 18x18 multipliers compute FFTs, channelizers, and digital down-converters in real time, and 294 I/Os accept high-speed LVDS ADC samples up to several hundred Msps. The PLLs derive independent ADC and DAC clocks from a single reference, simplifying RF board layout versus discrete PLL ICs.
Recommandé
ASIC Prototyping and Low-Volume Production
The EP3CLS70F484C7 serves as a low-cost ASIC prototyping platform for designs targeting 50K-150K gate ASICs, enabling pre-silicon validation at near-ASIC clock frequencies. The 484-pin FBGA exposes hundreds of I/Os for partitioned ASIC emulation, and the Cyclone III LS family shares the same Quartus II toolchain used for Cyclone IV and Cyclone 10 designs. The device also fits low-volume production (sub-10K units/year) where the NRE of an ASIC is uneconomic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS70F484C7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS70F484C7N | EP3CLS70F484C8 | EP3CLS70F484I7 | EP3CLS100F484C7 | EP3CLS150F484C7 | EP3C55F484C7 | EP3C80F484C7 |
|---|---|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Logic Elements | 70,208 LE | 70,208 LE | 70,208 LE | 70,208 LE | 100,448 LE | 150,848 LE | 55,856 LE | 81,264 LE |
| Embedded Memory | 2.93 Mbit | 2.93 Mbit | 3.89 Mbit | 6.39 Mbit | 2.34 Mbit | 2.74 Mbit | ||
| 18x18 Multipliers | 278 | 278 | 396 | 567 | 156 | 244 | ||
| Maximum User I/O | 294 | 294 | 338 | 338 | 316 | 295 | ||
| Temperature Grade | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | ||||
| Speed Grade | C7 | C8 (slower) | C7 | C7 |
Principaux différenciateurs
- Bitstream encryption and JTAG protection unique to LS family (vs EP3C55F484C7)
- 70K LE provides ~26 percent more logic at same footprint than Cyclone III base (vs EP3C55F484C7)
- C7 speed grade enables highest internal Fmax in family (vs EP3CLS70F484C8)
Notes de conception
The EP3CLS70F484C7 requires multiple supply rails: VCCINT 1.15-1.25 V for the core, VCCIO 1.2/1.5/1.8/2.5/3.0/3.3 V per I/O bank, VCC_PLL 1.2 V for the four PLLs, and VCCA 2.5 V for the analog blocks. Intel specifies that VCCIO must reach 0.6 V before or simultaneously with VCCINT during power-up to avoid latch-up; use a power sequencer IC or follow the recommended sequencing in the Cyclone III handbook chapter on power management.
The 484-pin FineLine BGA uses a 1.0 mm ball pitch with 0.6 mm ball diameter. PCB layout requires microvia or laser-drilled via structures; standard 8-mil through-hole vias will not work on the inner rows. Use Intel's recommended 4-layer or 6-layer stack-up with continuous ground planes under the BGA to control return-path impedance for LVDS and PLL supplies.
Estimated: At 100 percent toggle rate on 294 I/Os at 100 MHz and 70 percent logic utilization, the EP3CLS70F484C7 dissipates approximately 2.5 to 3.5 W into the FBGA package. The junction-to-ambient theta_JA of the 484-FBGA is approximately 17 C/W on a 4-layer JEDEC test board, so a 1 square-inch copper pour plus bottom-side thermal vias is recommended to keep Tj below 100 C at 70 C ambient.
Do not leave configuration mode pins (MSEL0, MSEL1) floating - they select between AS/AP/PS/JTAG modes and must be tied to VCCIO via 1 kohm pull-ups or hard-grounded. Also, the nCE and nCONFIG pins must be hard-tied high for normal boot, and the JTAG TDO pin requires a 10 kohm pull-up to VCCIO if JTAG is unused.
Informations de conformité
RoHS and lead-free compliant per Altera/Intel product page. Not AEC-Q100 qualified - select EP3CLS70F484I7N for industrial temperature reliability, but automotive AEC-Q100 requires different family.