EP3SL50F484C3N - 47.5K Logic Elements Stratix III L FPGA | Intel | 484-FCBGA
Référence : EP3SL50F484C3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $654.17 | $654,17 |
| 10 | $588.75 | $5 887,50 |
| 100 | $523.34 | $52 334,00 |
| 250 | $490.63 | $122 657,50 |
| 500 | $458 | $229 000,00 |
EP3SL50F484C3N Présentation
What is a Stratix III L FPGA? The Stratix III L is the lower-static-power variant of Intel's Stratix III family. An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O are configurable after manufacture. Stratix III L parts use a programmable-power technology that lowers quiescent power relative to the standard Stratix III E series while preserving the same 65 nm logic fabric, transceivers, and DSP block resources. Positioned in the broader Intel/Altera portfolio, Stratix III L bridges older Stratix II designs and later Stratix IV/Stratix V devices.
Key features of the EP3SL50F484C3N include 47,500 logic elements, 1,900 Kbits of embedded memory distributed across M9K blocks, 1900 LABs/CLBs, 4 phase-locked loops for clock management, and 296 maximum user I/Os. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) and offers 24 transceiver channels operating up to 3.125 Gbps on higher-density siblings in this family. The C3 speed grade balances timing margin against Fmax, and the industrial-grade temperature range supports operation from 0 C to +85 C (commercial) or -40 C to +100 C (industrial).
Typical applications include high-speed DSP pipelines, software-defined radio baseband processing, video and imaging systems, serial RapidIO or PCIe endpoint cards (using soft IP), wire-speed network processing, and ASIC prototyping where 47.5K logic elements and abundant embedded RAM suffice. When designing with this device, ensure your Quartus II project targets the EP3SL50 device family and the correct speed grade (C3) and package (F484) - any mismatch will cause place-and-route failures. Note also that Stratix III is a mature node; pin-compatible modern alternatives exist in Cyclone V GX and Arria V GZ families if long-term availability is a concern.
Alternatives de remplacement direct pour EP3SL50F484C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL50F484C3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Family, Speed Grade, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL50F484C2N
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP3SL50F484C3
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP3SL50F484C3G
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP3SL50F484C2G
✅ Remplacement direct✓ En stock
$335 / unité
Voir la fiche technique →EP3SL50F484C2
✅ Remplacement direct✓ En stock
$478.8 / unité
Voir la fiche technique →EP3SL50F484C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$325 / unité
Voir la fiche technique →EP3SL50F484I3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$552.3 / unité
Voir la fiche technique →EP3SL50F484C3N Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Family | Stratix III |
| Logic Elements | 47,500 |
| Number of LABs/CLBs | 1900 |
| Total RAM Bits | 2,184,192 |
| Number of I/O | 296 |
| Voltage - Supply | 0.9 V, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Boîtier / Format | 484-BBGA, FCBGA |
| Supplier Device Package | 484-FCBGA (23x23) |
| Speed Grade | C3 |
| Process Technology | 65 nm |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
| Base Part Number | EP3SL50 |
Guide de configuration des broches du EP3SL50F484C3N 484-fcbga (23x23)
Configuration des broches du EP3SL50F484C3N (boîtier 484-fcbga (23x23)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL50F484C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL50F484C3N convient pour 6 applications: High-Speed DSP Pipeline, Software-Defined Radio Baseband, Video and Imaging Processing, ASIC Prototyping Platform, Wire-Speed Network Processing, Industrial Motor Control.
High-Speed DSP Pipeline
The EP3SL50F484C3N fits high-speed DSP pipelines where 47,500 logic elements combined with 288 DSP blocks and 2.18 Mbits of embedded M9K memory provide the throughput required for FIR filtering, FFT computation, and real-time convolution. The Stratix III L architecture delivers DSP block performance up to ~200 MHz at 18x18 multiplies, enabling sample rates of 100+ MSPS in multi-channel designs. Placed on a typical 6-layer DSP card with dedicated PLL clock distribution, it outperforms smaller FPGAs by eliminating the need for external memory buffering between DSP stages.
Recommandé
Software-Defined Radio Baseband
The EP3SL50F484C3N is well suited to software-defined radio (SDR) baseband processing where its 47.5K logic elements implement digital down-conversion, channelization, and demodulation for narrowband waveforms. With 296 user I/Os, designers can connect multiple ADC/DAC channels and baseband data interfaces without external bus switches. Power consumption of the Stratix III L variant runs 30-50 percent below equivalent Stratix III E parts, critical for portable or rack-mounted SDR chassis where thermal envelopes are tight.
Recommandé
Video and Imaging Processing
The EP3SL50F484C3N supports video and imaging processing pipelines at resolutions up to 1080p60 with embedded M9K RAM providing line buffers and lookup tables. Its 296 I/Os accept multiple camera-link, DVI/HDMI, or parallel CMOS inputs simultaneously. The C3 speed grade is sufficient for real-time pixel-rate processing in mid-range surveillance and machine-vision cameras. For higher resolutions or multi-stream capture, designers can scale to larger Stratix III L devices while preserving the same Quartus II IP library.
Recommandé
ASIC Prototyping Platform
The EP3SL50F484C3N works well as an ASIC prototyping vehicle for designs targeting sub-100K-gate ASICs, with 47.5K logic elements and 2.18 Mbits of embedded RAM accommodating most mid-complexity SoCs. Quartus II offers seamless migration to HardCopy III structured ASICs once the prototype is validated. The 484-ball FCBGA provides ample general-purpose I/O for connecting off-chip memories (DDR2/DDR3) and standard peripherals during prototype bring-up.
Recommandé
Wire-Speed Network Processing
The EP3SL50F484C3N supports wire-speed network processing at 1 Gbps line rates, implementing packet parsing, classification, and forwarding tables in hardware. Its M9K memory blocks efficiently store trie tables and flow caches close to the lookup logic, while 296 I/Os enable direct connection to multiple SGMII or RGMII MACs. The Stratix III L power profile makes it a fit for top-of-rack switches and security appliances where thermal headroom and reliability are priorities.
Recommandé
Industrial Motor Control
The EP3SL50F484C3N integrates FOC (field-oriented control) algorithms for industrial motor drives, with 47.5K logic elements implementing PID loops, space-vector PWM, and encoder interfaces. The 296 I/Os connect to multi-axis servo feedback devices and gate drivers. For industrial environments requiring extended temperature operation, the EP3SL50F484I3N variant covers -40 C to +100 C. Combined with the device's robust SEU tolerance, it suits demanding factory-automation and robotics applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL50F484C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL50F484C2N | EP3SL50F484C4N | EP3SL50F484I3N | EP3SE50F484C3N |
|---|---|---|---|---|---|
| Package | 484-FCBGA (23x23, 1.0 mm pitch) | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Speed Grade | C3 | C2 (faster) | C4 (slower) | I3 (industrial temp, C3 speed) | C3 (Stratix III E variant) |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial | Commercial | Industrial (-40 C to +100 C) | Commercial |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 |
| User I/O | 296 | 296 | 296 | 296 | 296 |
| Process | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Series | Stratix III L (low-power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (standard-power) |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Low-power Stratix III L variant vs Stratix III E standard-power (vs EP3SE50F484C3N (Stratix III E variant))
- Same-package drop-in alternatives preserve design investment (vs EP3SL50F484C2N / C4N / I3N)
- 47.5K logic elements fit mid-complexity designs without larger FPGAs (vs Larger Stratix III devices (EP3SL110 / EP3SL200))
Notes de conception
Stratix III L devices require multiple sequenced supply rails (0.9 V core, 1.1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Use a dedicated PowerTree controller such as the LTM4644 or equivalent with POR signals to enforce monotonic ramp-up. Per Intel AN 456, the core rail must reach 0.9 V within 100 ms of the 3.3 V rail reaching 90 percent of its target. Failing the sequencing requirement can cause high inrush current and reduce device lifetime.
Estimated: at typical DSP utilization (60 percent logic, 80 percent DSP) the EP3SL50F484C3N draws approximately 4-6 W. The 484-ball FCBGA package has theta_JA around 14 C/W with a properly designed 12-layer PCB and thermal vias under the die. Without thermal vias, junction temperature can exceed 100 C in still air. Provide at least 4 thermal vias (0.3 mm drill, 1.0 mm pitch) under the central ball array for adequate heat extraction.
Use a high-Tg (>=170 C) low-loss PCB laminate such as Isola FR408HR or Panasonic MEGTRON 6 for the inner rows of the 1.0 mm pitch BGA. Standard FR-4 is acceptable for the outer rows but may shift impedance targets on inner-row differential pairs. Maintain 50 ohm single-ended and 100 ohm differential impedance on all transceiver and high-speed I/O routes per the Stratix III device handbook pin-out table.
Two common pitfalls: (1) Selecting Quartus Prime instead of Quartus II - Stratix III is not supported in Quartus Prime and compilation will fail; use Quartus II 15.0 or earlier. (2) Using BSDL files from a different speed grade - C3 BSDL files are not interchangeable with C2 BSDL files and JTAG chain diagnostics will misreport boundary-scan results. Always generate the BSDL from the Quartus II compiled design matching the exact speed grade and temperature letter.
For LVDS pairs, keep trace lengths matched within 5 mils and route over a continuous ground plane. The Stratix III device handbook recommends series 100 ohm termination at the receiver when traces exceed 1 inch. For DDR2/DDR3 interfaces, use fly-by topology with write leveling enabled in the Quartus II PHY; the EP3SL50 supports up to 200 MHz / 400 Mbps per pin in DDR2 mode.
Informations de conformité
RoHS compliant per the 'N' suffix in the part number (lead-free). Not AEC-Q100 qualified - FPGAs in this family are typically not automotive-qualified unless ordered with explicit AEC-Q100 screening. Halogen-free status not explicitly stated in verified data.