EP3SL70F780I4 - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
Référence : EP3SL70F780I4 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2625 | $26 250,00 |
| 100 | $2350 | $235 000,00 |
| 500 | $2100 | $1 050 000,00 |
| 1 000 | $1850 | $1 850 000,00 |
EP3SL70F780I4 Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be programmed and reconfigured after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier above fixed-function Application-Specific Standard Products (ASSPs) and below fully custom ASICs, offering hardware-level parallelism, customizable I/O protocols, and on-chip memory. Within Intel's programmable logic portfolio, Stratix III devices sit in the high-performance tier above Cyclone III and below Stratix IV/V, optimized for ASIC prototyping, signal processing, and high-throughput data-path designs.
Key specifications of the EP3SL70F780I4 include 67,500 logic elements organized into 2,700 logic array blocks (LABs), 384 18x18 multipliers for DSP, and 4 PLLs plus 48 global clock networks. The device supports multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) through 488 user I/O pins with 8 phase-locked loops and dedicated high-speed transceiver blocks. Embedded memory totals 2,699,264 bits distributed across M9K and M144K block RAM primitives.
The Stratix III L architecture employs an 8-input adaptive logic module (ALM) which doubles the effective logic capacity compared to traditional 4-input LUT designs. Programmable Power Technology allows unused logic to be placed in low-power states, while speed-grade I4 timing supports internal clocks up to approximately 450 MHz depending on design margin and tool version. Configuration is loaded via JTAG or serial passive/active flash modes.
Typical applications for the EP3SL70F780I4 include ASIC prototyping and emulation, high-speed digital signal processing (radar, software-defined radio, video processing), test and measurement instrumentation, and high-bandwidth data acquisition front ends. Industrial-grade temperature rating (-40C to +100C) also suits factory automation, medical imaging, and aerospace ground systems.
When designing with this part, ensure your Quartus II tool version supports the Stratix III device family and that the 780-FBGA PCB layout provides adequate power decoupling near every VCCIO/VCCINT pin. Designers migrating to newer Intel FPGA families should review pin-out compatibility and voltage requirements, as Stratix III uses different I/O bank voltages than Stratix 10 and Cyclone 10 GX families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SL70F780I4 that are not available from the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP3SL70F780I4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL70F780I4 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL70F780I3N
✅ Remplacement direct✓ En stock
$1240 / unité
Voir la fiche technique →EP3SL70F780I3
✅ Remplacement direct✓ En stock
$1096.81 / unité
Voir la fiche technique →EP3SL70F780C4N
✅ Remplacement direct✓ En stock
$1210 / unité
Voir la fiche technique →EP3SL70F780C4LN
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP3SL70F780C4
✅ Remplacement direct✓ En stock
$745.32 / unité
Voir la fiche technique →EP3SL70F780I4 Valeurs maximales et caractéristiques électriques
| Series | Stratix III L |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory | 2,699,264 bits |
| DSP Blocks (18x18 Multipliers) | 384 |
| User I/O Pins | 488 |
| PLLs | 8 |
| Global Clock Networks | 48 |
| Boîtier | 780-ball FC-FBGA |
| Process Technology | 65 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Speed Grade | I4 |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Interface | JTAG, Serial Passive, Serial Active |
Guide de configuration des broches du EP3SL70F780I4 780-ball fc-fbga
Configuration des broches du EP3SL70F780I4 (boîtier 780-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL70F780I4.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL70F780I4 convient pour 6 applications: ASIC Prototyping and Emulation, High-Performance Digital Signal Processing, Test and Measurement Instrumentation, Software-Defined Radio (SDR), High-Bandwidth Data Acquisition, Industrial Control and Factory Automation.
ASIC Prototyping and Emulation
The EP3SL70F780I4's 67,500 logic elements, 2,699,264 bits of embedded memory, and 384 18x18 multipliers make it well-suited for ASIC prototyping and in-circuit emulation of mid-complexity ASICs. The 780-ball FC-FBGA package provides 488 user I/O pins, allowing emulation of wide bus interfaces such as DDR2/DDR3 controllers and high-speed parallel protocols. Quartus II's TimeQuest timing analyzer supports source-synchronous emulation, and the device's industrial temperature rating allows validation in realistic operating environments. Compared to ASIC fabrication cycles, FPGA prototyping reduces verification turnaround from weeks to days, accelerating time-to-market for complex SoC designs. Source: Stratix III Device Handbook 'Design Considerations' chapter.
Recommandé
High-Performance Digital Signal Processing
With 384 dedicated 18x18 multipliers and 2.7 Mbit of embedded memory, the EP3SL70F780I4 sustains hundreds of GMACs of DSP throughput, making it ideal for radar baseband processing, software-defined radio channelizers, and digital video codec pipelines. The 8-input ALM architecture enables efficient implementation of pipelined FIR and FFT cores, while the 48 global clock networks simplify multi-clock-domain designs. The industrial temperature range supports outdoor deployment in telecommunications infrastructure and aerospace ground systems. Compared to DSP processors, FPGA-based DSP delivers 10-100x higher throughput per watt for fixed-function transforms. Source: Stratix III Device Handbook 'DSP Blocks' chapter and Intel Application Note AN-531.
Recommandé
Test and Measurement Instrumentation
The EP3SL70F780I4 serves as the reconfigurable processing core in high-bandwidth oscilloscopes, logic analyzers, and protocol testers. Its 488 user I/O pins accommodate multi-channel LVDS acquisition paths at hundreds of Mbps per lane, while 2.7 Mbit of embedded memory buffers waveform captures before downstream processing. Industrial temperature rating ensures stable operation in production-floor ATE environments, and the 1.1 V core supply keeps power dissipation manageable even at full utilization. The Quartus II SignalTap II embedded logic analyzer provides real-time visibility without external probes, accelerating validation cycles. Source: Stratix III Device Handbook 'Configuration' chapter.
Recommandé
Software-Defined Radio (SDR)
The EP3SL70F780I4 enables software-defined radio implementations for wireless base stations, military radios, and cognitive radio research platforms. The 384 18x18 multipliers execute parallel channelization and demodulation for multiple simultaneous carriers, while 488 user I/O pins interface to high-speed ADCs and DACs through LVDS or HSTL. Industrial temperature rating suits outdoor mounted radios and vehicular communication systems. The device's PLLs and 48 global clock networks simplify multi-rate clocking required for sample-rate conversion and digital down-conversion. Source: Stratix III Device Handbook 'PLLs and Clock Networks' chapter.
Recommandé
High-Bandwidth Data Acquisition
The EP3SL70F780I4 functions as the data-routing and pre-processing engine in high-bandwidth data acquisition systems for medical imaging (CT, ultrasound front ends), particle physics detectors, and high-speed video capture. The 2,699,264-bit embedded memory acts as a deep FIFO for absorbing ADC bursts, while 488 user I/O pins accept parallel LVDS data from multiple ADC channels. Industrial temperature rating supports deployment in MRI suites and outdoor imaging systems. Quartus II's SOPC Builder integrates soft processor cores (Nios II) for control-plane tasks alongside data-plane DSP. Source: Stratix III Device Handbook 'Memory Interfaces' chapter.
Recommandé
Industrial Control and Factory Automation
The EP3SL70F780I4 supports deterministic real-time control loops in factory automation equipment, programmable logic controllers (PLCs), and motion controllers. The 488 user I/O pins connect to multi-axis encoder inputs, PWM outputs, and industrial Ethernet PHYs, while 384 18x18 multipliers compute field-oriented control (FOC) algorithms for AC motor drives. Industrial temperature rating ensures reliable operation in factory-floor environments with ambient temperatures up to +85C and beyond. The device's deterministic latency and parallel architecture outperform microcontroller-based PLCs for high-axis-count motion control. Source: Stratix III Device Handbook 'Industrial Applications' section.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL70F780I4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL70F780I3N | EP3SL70F780I3 | EP3SL70F780C4N | EP3SL70F780C4LN | EP3SL70F780C4 |
|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Speed Grade | I4 | I3 (faster) | I3 (faster) | C4 (slower) | C4L (lower power) | C4 (slower) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 |
| DSP Multipliers (18x18) | 384 | 384 | 384 | 384 | 384 | 384 |
Principaux différenciateurs
- Faster speed-grade I3 option available in same package (vs EP3SL70F780I3N)
- Lower-power commercial variant available for non-industrial use (vs EP3SL70F780C4LN)
- Industrial temperature range covers -40C to +100C junction (vs EP3SL70F780C4N)
Notes de conception
The EP3SL70F780I4 requires multiple power rails: VCCINT (1.1 V core), VCCPLL (1.1 V analog), VCCIO (1.2 V to 3.3 V per bank), VCCAUX (2.5 V), and VCCPD (3.3 V or 2.5 V). All supplies must be sequenced per the Stratix III handbook 'Power Management' chapter to avoid latch-up. Use a dedicated LDO or switching regulator per rail with bulk decoupling of 100 uF plus 0.1 uF and 0.01 uF ceramics close to each VCC pin cluster. Decoupling capacitance must be sized to handle inrush during configuration.
Estimated: at full utilization (67,500 LE, 384 multipliers, 2.7 Mbit memory toggling at 200 MHz), the EP3SL70F780I4 dissipates approximately 8-12 W. The 780-ball FC-FBGA has a typical theta_JA of 12-15 C/W on a standard 8-layer PCB with adequate thermal vias. Designers should target junction temperature below +100C for industrial reliability; using Quartus II's PowerPlay power analyzer is essential to confirm thermal margin in dense designs.
The 780-ball FC-FBGA uses 1.0 mm ball pitch, requiring 0.5 mm diameter via-in-pad plating with filled and capped vias for proper assembly. The PCB stack-up should be at least 8 layers with dedicated power and ground planes adjacent to the outer signal layers. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general-purpose I/O. Intel provides reference design layout files for the Stratix III development kit that demonstrate compliant escape routing.
The EP3SL70F780I4 supports JTAG, serial passive (EPCS), and serial active flash configuration modes. For production boards, use a dedicated EPCS or third-party SPI flash with at least 32 Mbit capacity for full bitstream storage. Configure the MSEL[3:0] pins with the correct pull-up/pull-down resistors to select the desired configuration mode. Always include a JTAG header on prototype boards for in-system programming and SignalTap II debugging.
Avoid leaving unused I/O pins floating; configure them as outputs driven low or as inputs with internal weak pull-up to prevent oscillation. Do not mix 1.5 V and 1.8 V VCCIO on adjacent banks without consulting the bank compatibility matrix. When migrating from Stratix II, the I/O bank architecture differs and bank voltages must be re-validated. Always use Quartus II's pin planner to verify I/O standard compatibility before PCB layout.
Informations de conformité
RoHS and REACH compliant per Intel product declaration. AEC-Q100 not applicable as the device is a commercial/industrial FPGA, not an automotive-qualified IC. Lead-free confirmed; halogen-free status not explicitly disclosed by manufacturer.