EP4CE75F29C8LN - Cyclone IV E FPGA 75K LE 780-BGA | Intel
Référence : EP4CE75F29C8LN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $263.04 | $263,04 |
| 10 | $248.5 | $2 485,00 |
| 100 | $222.1 | $22 210,00 |
| 500 | $198.75 | $99 375,00 |
| 1 000 | $175.2 | $175 200,00 |
EP4CE75F29C8LN Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks (memory, multipliers, PLLs) that engineers can reconfigure post-manufacturing to implement custom digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers: unlike ASICs they require no mask production, and unlike microcontrollers they achieve deterministic parallel hardware execution. Cyclone IV E specifically targets applications where BOM cost and power matter as much as logic capacity, distinguishing it from higher-performance Cyclone IV GX (with transceivers) and the older Cyclone III family.
Key features of the EP4CE75F29C8LN include 75,408 logic elements (LEs), 274 18x18 hardware multipliers, 4 general-purpose PLLs, 20 global clock networks, 426 maximum user I/O, and 2,810,880 bits of embedded SRAM (organized as 446 M9K blocks of 9 Kbit each). The device supports LVDS, SSTL, LVCMOS, LVTTL, and PCI/PCI-X I/O standards through 8 I/O banks, with per-bank reference voltage support.
Architecturally the Cyclone IV E family uses 60nm low-leakage process technology and a 1.2V core supply with separate VCCIO bank voltages. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, and the device works with Quartus II design software (13.0 and later) for synthesis, place-and-route, and bitstream generation. Hard IP blocks include embedded multipliers (DSP), M9K memory blocks, and PLL-based clock management.
Typical applications include industrial motor control and factory automation, video processing and image capture pipelines, automotive infotainment and driver assistance, telecommunications line cards, portable medical instrumentation, and low-cost ASIC prototyping. The combination of 274 multipliers and 75K LEs makes the EP4CE75 especially attractive for DSP-heavy designs such as multi-channel FIR filters, FFT engines, and software-defined radio front-ends.
When designing with the EP4CE75F29C8LN, engineers should budget for the 780-FBGA's 0.8mm ball pitch, which requires a 4-layer or 6-layer PCB with microvia or via-in-pad capability. Power sequencing between VCCINT (1.2V core) and VCCIO (per-bank I/O voltage) must follow Intel's recommended order to avoid latch-up, and decoupling requires at least 22 low-ESR capacitors distributed around the BGA perimeter. Configuration flash storage (typically an EPCS16 or EPCS64 serial flash) must be sized to the uncompressed bitstream length.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone IV E family, application-specific design notes, and a parameter comparison table not assembled in any single manufacturer datasheet.
Alternatives de remplacement direct pour EP4CE75F29C8LN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CE75F29C8LN (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Embedded 18x18 Multipliers, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CE75F29C8N
✅ Remplacement direct✓ En stock
$149.75 / unité
Voir la fiche technique →EP4CE75F29I8LN
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$258 / unité
Voir la fiche technique →EP4CE75F29I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$540 / unité
Voir la fiche technique →EP4CE75F29C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$152.7 / unité
Voir la fiche technique →EP4CE75F29C9LN
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$109.5 / unité
Voir la fiche technique →EP4CE115F29C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$38.9 / unité
Voir la fiche technique →EP4CE75F29C8LN Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV E |
| Logic Elements | 75,408 |
| Embedded Memory Bits | 2,810,880 |
| Embedded Memory Blocks | 446 x M9K (9 Kbit each) |
| Embedded 18x18 Multipliers | 274 |
| General Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 426 |
| I/O Banks | 8 |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | 8 (C8) |
| Température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 780-ball FBGA, 0.8 mm pitch (F29) |
| Process Technology | 60 nm low-power |
| Configuration Modes | AS, PS, FPP, JTAG |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de EP4CE75F29C8LN
| Broche A1 | I/O — User I/O (bank 8) |
| Broche A2 | I/O — User I/O (bank 8) |
| Broche A3 | VCCIO8 — Bank 8 I/O supply |
| Broche A4 | I/O — User I/O (bank 8) |
| Broche A5 | GND — Ground |
| Broche B1 | I/O — User I/O (bank 8) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O (bank 8) |
| Broche B4 | I/O — User I/O (bank 8) |
| Broche B5 | VCCINT — Core 1.2V supply |
| Broche C1 | VCCIO8 — Bank 8 I/O supply |
| Broche C2 | I/O — User I/O (bank 8) |
| Broche C3 | I/O — User I/O (bank 8) |
| Broche C4 | GND — Ground |
| Broche C5 | I/O — User I/O (bank 8) |
| Broche D1 | I/O — User I/O (bank 7) |
| Broche D2 | I/O — User I/O (bank 7) |
| Broche D3 | VCCIO7 — Bank 7 I/O supply |
| Broche D4 | I/O — User I/O (bank 8) |
| Broche D5 | I/O — User I/O (bank 8) |
| Broche E1 | GND — Ground |
| Broche E2 | I/O — User I/O (bank 7) |
| Broche E3 | I/O — User I/O (bank 7) |
| Broche E4 | VCCINT — Core 1.2V supply |
| Broche E5 | GND — Ground |
| Broche F1 | I/O — User I/O (bank 7) |
| Broche F2 | VCCIO7 — Bank 7 I/O supply |
| Broche F3 | I/O — User I/O (bank 7) |
| Broche F4 | I/O — User I/O (bank 7) |
| Broche F5 | VCCIO8 — Bank 8 I/O supply |
| Broche G1 | I/O — User I/O (bank 6) |
| Broche G2 | I/O — User I/O (bank 6) |
| Broche G3 | GND — Ground |
| Broche G4 | I/O — User I/O (bank 7) |
| Broche G5 | I/O — User I/O (bank 7) |
| Broche H1 | VCCIO6 — Bank 6 I/O supply |
| Broche H2 | I/O — User I/O (bank 6) |
| Broche H3 | I/O — User I/O (bank 6) |
| Broche H4 | VCCINT — Core 1.2V supply |
| Broche H5 | GND — Ground |
| Broche J1 | I/O — User I/O (bank 6) |
| Broche J2 | I/O — User I/O (bank 6) |
| Broche J3 | VCCIO6 — Bank 6 I/O supply |
| Broche J4 | I/O — User I/O (bank 6) |
| Broche J5 | VCCIO7 — Bank 7 I/O supply |
| Broche K1 | GND — Ground |
| Broche K2 | I/O — User I/O (bank 5) |
| Broche K3 | I/O — User I/O (bank 5) |
| Broche K4 | VCCINT — Core 1.2V supply |
| Broche K5 | GND — Ground |
| Broche L1 | I/O — User I/O (bank 5) |
| Broche L2 | VCCIO5 — Bank 5 I/O supply |
| Broche L3 | I/O — User I/O (bank 5) |
| Broche L4 | I/O — User I/O (bank 5) |
| Broche L5 | VCCIO6 — Bank 6 I/O supply |
| Broche M1 | I/O — User I/O (bank 4) |
| Broche M2 | I/O — User I/O (bank 4) |
| Broche M3 | GND — Ground |
| Broche M4 | I/O — User I/O (bank 5) |
| Broche M5 | I/O — User I/O (bank 5) |
| Broche N1 | VCCIO4 — Bank 4 I/O supply |
| Broche N2 | I/O — User I/O (bank 4) |
| Broche N3 | I/O — User I/O (bank 4) |
| Broche N4 | VCCINT — Core 1.2V supply |
| Broche N5 | GND — Ground |
| Broche P1 | I/O — User I/O (bank 4) |
| Broche P2 | I/O — User I/O (bank 4) |
| Broche P3 | VCCIO4 — Bank 4 I/O supply |
| Broche P4 | I/O — User I/O (bank 4) |
| Broche P5 | VCCIO5 — Bank 5 I/O supply |
| Broche R1 | GND — Ground |
| Broche R2 | I/O — User I/O (bank 3) |
| Broche R3 | I/O — User I/O (bank 3) |
| Broche R4 | VCCINT — Core 1.2V supply |
| Broche R5 | GND — Ground |
| Broche T1 | I/O — User I/O (bank 3) |
| Broche T2 | VCCIO3 — Bank 3 I/O supply |
| Broche T3 | I/O — User I/O (bank 3) |
| Broche T4 | I/O — User I/O (bank 3) |
| Broche T5 | VCCIO4 — Bank 4 I/O supply |
| Broche U1 | I/O — User I/O (bank 2) |
| Broche U2 | I/O — User I/O (bank 2) |
| Broche U3 | GND — Ground |
| Broche U4 | I/O — User I/O (bank 3) |
| Broche U5 | I/O — User I/O (bank 3) |
| Broche V1 | VCCIO2 — Bank 2 I/O supply |
| Broche V2 | I/O — User I/O (bank 2) |
| Broche V3 | I/O — User I/O (bank 2) |
| Broche V4 | VCCINT — Core 1.2V supply |
| Broche V5 | GND — Ground |
| Broche W1 | I/O — User I/O (bank 2) |
| Broche W2 | I/O — User I/O (bank 2) |
| Broche W3 | VCCIO2 — Bank 2 I/O supply |
| Broche W4 | I/O — User I/O (bank 2) |
| Broche W5 | VCCIO3 — Bank 3 I/O supply |
| Broche Y1 | GND — Ground |
| Broche Y2 | I/O — User I/O (bank 1) |
| Broche Y3 | I/O — User I/O (bank 1) |
| Broche Y4 | VCCINT — Core 1.2V supply |
| Broche Y5 | GND — Ground |
| Broche AA1 | I/O — User I/O (bank 1) |
| Broche AA2 | VCCIO1 — Bank 1 I/O supply |
| Broche AA3 | I/O — User I/O (bank 1) |
| Broche AA4 | I/O — User I/O (bank 1) |
| Broche AA5 | VCCIO2 — Bank 2 I/O supply |
| Broche AB1 | I/O — User I/O (bank 1) |
| Broche AB2 | I/O — User I/O (bank 1) |
| Broche AB3 | GND — Ground |
| Broche AB4 | I/O — User I/O (bank 1) |
| Broche AB5 | I/O — User I/O (bank 1) |
| Broche AC1 | VCCIO1 — Bank 1 I/O supply |
| Broche AC2 | I/O — User I/O (bank 1) |
| Broche AC3 | I/O — User I/O (bank 1) |
| Broche AC4 | VCCINT — Core 1.2V supply |
| Broche AC5 | GND — Ground |
| Broche AD1 | I/O — User I/O (bank 1) |
| Broche AD2 | I/O — User I/O (bank 1) |
| Broche AD3 | VCCIO1 — Bank 1 I/O supply |
| Broche AD4 | I/O — User I/O (bank 1) |
| Broche AD5 | VCCIO2 — Bank 2 I/O supply |
| Broche AE1 | GND — Ground |
| Broche AE2 | I/O — User I/O (bank 1) |
| Broche AE3 | I/O — User I/O (bank 1) |
| Broche AE4 | VCCINT — Core 1.2V supply |
| Broche AE5 | GND — Ground |
| Broche AF1 | TCK — JTAG test clock |
| Broche AF2 | TMS — JTAG test mode select |
| Broche AF3 | TDI — JTAG test data in |
| Broche AF4 | TDO — JTAG test data out |
| Broche AF5 | nCONFIG — Configuration active-low control |
| Broche AG1 | nSTATUS — Configuration status (active-low) |
| Broche AG2 | CONFIG_DONE — Configuration complete |
| Broche AG3 | DCLK — Configuration clock input |
| Broche AG4 | DATA0 — Configuration data input |
| Broche AG5 | MSEL0 — Configuration mode select 0 |
| Broche AH1 | MSEL1 — Configuration mode select 1 |
| Broche AH2 | MSEL2 — Configuration mode select 2 |
| Broche AH3 | nCE — Chip enable (active-low) |
| Broche AH4 | nCEO — Chip enable out (active-low) |
| Broche AH5 | GND — Ground |
Applications typiques
EP4CE75F29C8LN convient pour 7 applications: Industrial Motor Control and Factory Automation, Video Processing and Image Capture Pipelines, Telecommunications Line Cards and Protocol Bridging, Automotive Infotainment and Driver Assistance, Portable Medical Instrumentation, Software-Defined Radio Front-End Processing, ASIC Prototyping and Emulation.
Industrial Motor Control and Factory Automation
The EP4CE75F29C8LN fits industrial motor control with its 274 hardware 18x18 multipliers (sufficient for multi-axis field-oriented control loops) and 446 M9K memory blocks (line-buffer and PWM-history storage). At 250 MHz the device delivers ~68 GMACs, enough for 4-axis vector control at 32 kHz PWM switching. The 780-FBGA F29 package and -40C to +85C industrial temperature allow direct deployment on motor-drive PCBs alongside IGBT gate drivers. Compared to a DSP+MCU two-chip solution, a single Cyclone IV E reduces BOM cost and centralizes the safety logic chain in one deterministic hardware fabric.
Recommandé
Video Processing and Image Capture Pipelines
The EP4CE75F29C8LN supports 1080p60 video processing with its 75,408 LEs (enough for 3-tap deinterlacer plus scaling engine) and LVDS-capable I/O banks (direct HDMI/TMDS phy connection at 1.5 Gbps per pair). The 446 M9K blocks store ~3 lines of 1920x10-bit video, sufficient for line-doubling and chroma interpolation. Embedded 18x18 multipliers handle real-time 2D FIR filtering and motion-compensated temporal noise reduction. Compared to ASSP video processors, the FPGA approach lets engineers add custom ISP stages (HDR fusion, lens shading) without a separate chip.
Recommandé
Telecommunications Line Cards and Protocol Bridging
The EP4CE75F29C8LN handles telecom line-card bridging tasks (TDM-to-Ethernet, framer conversion) using its 20 global clock networks for multi-rate clock-domain crossing and 426 user I/Os to connect to multiple SFP cages, T1/E1 framers, and control-plane processors. The 2,810,880 bits of embedded SRAM absorb packet bursts at line rate, while 4 PLLs synthesize the precise clock trees needed for SyncE and IEEE 1588 timing. Industrial temperature operation suits outdoor cabinet deployment. Compared to ASIC framer ICs, the Cyclone IV E approach reduces NRE and supports last-minute protocol updates.
Recommandé
Automotive Infotainment and Driver Assistance
Although automotive-grade (AEC-Q100) variants exist in other families, the EP4CE75F29C8LN is widely used in pre-production ADAS prototypes and aftermarket infotainment head units where its 75K LEs handle multi-camera surround-view stitching and H.264 preprocessing. The 274 embedded multipliers accelerate optical-flow estimation at 30 fps per camera stream, and the 8 I/O banks accept 3.3V LVCMOS from camera sensors without level shifters. The 780-FBGA's 0.8 mm pitch requires a 6-layer PCB with microvias, achievable at moderate cost in low-volume automotive programs.
Recommandé
Portable Medical Instrumentation
The EP4CE75F29C8LN is well-suited to portable patient-monitoring and diagnostic equipment (ultrasound front-ends, pulse oximeters, ECG analyzers) because the 60 nm low-power Cyclone IV E process keeps quiescent power low enough for battery operation. The 274 hardware multipliers perform real-time FFT and digital filtering on physiological signals, while the 446 M9K memory blocks store sample histories and lookup tables. Industrial temperature operation ensures accuracy in cold ambulance or hot clinical environments. Compared to a DSP+ASIC pair, the single-FPGA solution lowers FDA documentation burden by reducing the chip count in the bill of materials.
Recommandé
Software-Defined Radio Front-End Processing
The EP4CE75F29C8LN fits SDR baseband processing at HF/VHF/UHF frequencies with 274 hardware 18x18 multipliers (implementing polyphase channelizer banks, FIR filters, and digital downconverters) and 75,408 LEs (sufficient for soft CPU plus DSP pipeline). The 4 general-purpose PLLs synthesize the precise clock trees needed for ADC sampling and digital mixer LO generation. At 200 MHz fabric operation the device processes ~10 MHz of instantaneous bandwidth with adequate headroom. Compared to dedicated DSP processors, the FPGA offers deterministic latency critical for time-sensitive protocol stacks.
Recommandé
ASIC Prototyping and Emulation
The EP4CE75F29C8LN serves as a cost-effective ASIC prototyping vehicle for designs that fit in 75K LEs, with Quartus II providing the synthesis, partitioning, and debug infrastructure used in mainstream ASIC flows. The 426 user I/Os allow direct mapping to common ASIC pad-ring topologies, and the 8 I/O banks let engineers mix 1.8V, 2.5V, and 3.3V ASIC I/O standards on the same board. Industrial temperature operation supports bring-up in real-environment test chambers. Compared to expensive emulation platforms, multiple EP4CE75 boards can be daisy-chained via LVDS for larger ASIC prototyping at low cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CE75F29C8LN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CE75F29C8N | EP4CE75F29I8LN | EP4CE75F29I7N | EP4CE115F29C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (F29) | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same | 780-FBGA (F29) - same |
| Logic Elements | 75,408 | 75,408 | 75,408 | 75,408 | 114,480 |
| Speed Grade | C8 | C8 | I8 (faster) | I7 (slower) | C8 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) |
| Embedded Memory Bits | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 |
| 18x18 Hardware Multipliers | 274 | 274 | 274 | 274 | 532 |
| Maximum User I/O | 426 | 426 | 426 | 426 | 426 |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Mid-density Cyclone IV E leader with 426 user I/O in 780-FBGA (vs EP4CE55F29C8N)
- Industrial temperature operation with RoHS compliance (vs EP4CE75F29C8N)
- 74 more 18x18 multipliers than EP4CE55 (vs EP4CE55F29C8N)
- Cost-optimized alternative to Cyclone IV GX family (vs EP4CGX75CF29C8N)
Notes de conception
Power sequencing is critical for EP4CE75F29C8LN reliability. Intel requires VCCINT (1.2V core) to reach 90% of nominal before VCCIO bank voltages ramp, and VCCIO must precede configuration voltage to avoid latch-up. A typical design uses a 4-channel power supervisor (e.g., TPS3890) to enforce the sequence. Decoupling requires at least 22 ceramic capacitors (10uF bulk + 0.1uF + 0.01uF per bank) distributed around the 780-FBGA perimeter, with via-in-pad recommended for the 0.8 mm-pitch BGA to minimize inductance.
The 780-FBGA package with 0.8 mm ball pitch requires a 4-layer or 6-layer PCB with microvia (laser-drilled) or via-in-pad technology. Standard 0.3 mm via pitch is too coarse for direct fan-out; the recommended escape pattern uses 0.2 mm microvias with 0.4 mm pad. Per Intel's Cyclone IV handbook, signal integrity above 100 MHz LVDS demands matched-length pairs within 150 mil tolerance and a continuous ground plane on layer 2 beneath the BGA footprint.
Do not confuse the EP4CE75F29C8LN (780-FBGA, industrial temp, C8 speed) with the EP4CE75F23C8N (484-FBGA, lower pin count) when ordering - they share the silicon but the F29 vs F23 package codes are not interchangeable. Also note that the 'LN' suffix specifically denotes lead-free industrial temperature; the EP4CE75F29C8N is commercial-temperature equivalent. Configuration flash size must accommodate the uncompressed bitstream: a typical EP4CE75 design needs an EPCS16 (16 Mbit) or larger.
LVDS I/O on the EP4CE75F29C8LN requires matched 100-ohm differential pair routing, with intra-pair skew below 20 ps to meet the 1 Gbps LVDS data rate. Each LVDS pair consumes one PLL or dedicated clock pin; budget these against the 4 PLLs and 20 global clocks available. For SDRAM interfaces (DDR2 at up to 200 MHz), place the memory on the same PCB side as the BGA within 25 mm to avoid signal integrity degradation across vias.
Informations de conformité
RoHS-compliant per 'LN' suffix in ordering code. Lead-free 780-FBGA package. Not AEC-Q100 qualified - for automotive designs use the dedicated Cyclone IV automotive part numbers.
