PIC24F16KM204-E/ML - 16-bit XLP MCU, 16KB Flash, 44-QFN | Microchip
Référence : PIC24F16KM204-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $2.99 | $1 495,00 |
| 1 000 | $2.65 | $2 650,00 |
PIC24F16KM204-E/ML Présentation
A 16-bit PIC microcontroller (MCU) is a member of the wider microcontroller family that integrates a CPU, non-volatile program memory, SRAM, peripherals and I/O on a single die. Within the Microchip taxonomy, PIC24F devices are the low-power 16-bit MIPS-based family positioned below PIC24H/dsPIC for general-purpose mixed-signal embedded designs. XLP (eXtreme Low Power) parts add deep-sleep currents in the nanoamp range, making them suitable for battery-powered and energy-harvesting designs. A QFN-44 package is a quad flat no-lead plastic enclosure with an exposed thermal pad that also serves as a low-impedance ground, optimized for surface-mount manufacturing.
Key features include 25 MIPS performance at 32 MHz, 9-channel 12-bit ADC with up to 500 ksps, two 8-bit DACs, two operational amplifiers, two comparators and configurable logic cells, plus multiple serial interfaces (UART, SPI, I2C). The integrated analog peripherals reduce external component count for sensor-conditioning and closed-loop control. Hardware CRC, RTCC and an extended watchdog timer support functional-safety and industrial-automation needs.
Typical applications include low-power sensor nodes, industrial measurement and control, consumer appliances, portable medical devices, automotive body and lighting modules, and USB/HID peripherals (when paired with the PIC24FJ64GB002 family for USB connectivity). The 44-QFN footprint supports compact PCBs while exposing the thermal pad for heat spreading.
When designing with this part, allocate the bottom-layer PCB copper under the exposed pad as a continuous ground island with stitched thermal vias to maximize heat dissipation and provide a low-inductance ground return for the analog blocks.
Alternatives de remplacement direct pour PIC24F16KM204-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24F16KM204-E/ML (même facteur de forme et même empreinte) — différant par Package, Maximum CPU Speed, ADC, Comparators, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FV16KM204-E/ML
✅ Remplacement direct✓ En stock
$2.1 / unité
Voir la fiche technique →PIC24F08KM204-E/ML
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC24F16KM204-I/ML
✅ Remplacement direct✓ En stock
$1.97 / unité
Voir la fiche technique →PIC24F16KM202-E/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC24F08KM204-E/ML
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →PIC24F16KM204-E/ML Valeurs maximales et caractéristiques électriques
| Core | PIC24F 16-bit MIPS |
| Program Memory (Flash) | 16 KB (5.5K x 24) |
| Data RAM | 2 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS, 4 MIPS when 8 MHz FRC) |
| Operating Voltage | 1.8 V to 5.5 V |
| ADC | 12-bit, up to 9 channels |
| DAC | 2 x 8-bit |
| Operational Amplifiers | 2 on-chip |
| Comparators | 2 |
| Configurable Logic Cells (CLC) | Yes |
| PWM / CCP | MCCP and SCCP modules |
| Communication | UART, SPI, I2C |
| Boîtier | 44-pin QFN (8x8 mm) with exposed pad (ML) |
| Température de fonctionnement | -40C to +125C (Extended, "E") |
| Statut RoHS | Compliant |
Configuration des broches de PIC24F16KM204-E/ML
| Broche 1 | RB0 — I/O port B bit 0 |
| Broche 2 | RB1 — I/O port B bit 1 |
| Broche 3 | RB2 — I/O port B bit 2 |
| Broche 4 | RB3 — I/O port B bit 3 |
| Broche 5 | VSS — Ground |
| Broche 6 | RA0 — I/O port A bit 0 / analog input |
| Broche 7 | RA1 — I/O port A bit 1 / analog input |
| Broche 8 | RA2 — I/O port A bit 2 / analog input |
| Broche 9 | RA3 — I/O port A bit 3 / analog input |
| Broche 10 | RA4 — I/O port A bit 4 |
| Broche 11 | RA5 — I/O port A bit 5 |
| Broche 12 | RA6 — I/O port A bit 6 |
| Broche 13 | RA7 — I/O port A bit 7 |
| Broche 14 | VSS — Ground |
| Broche 15 | OSC1 — Crystal oscillator input |
| Broche 16 | OSC2 — Crystal oscillator output |
| Broche 17 | RC0 — I/O port C bit 0 |
| Broche 18 | RC1 — I/O port C bit 1 |
| Broche 19 | RC2 — I/O port C bit 2 |
| Broche 20 | RC3 — I/O port C bit 3 |
| Broche 21 | RC4 — I/O port C bit 4 |
| Broche 22 | RC5 — I/O port C bit 5 |
| Broche 23 | RC6 — I/O port C bit 6 |
| Broche 24 | RC7 — I/O port C bit 7 |
| Broche 25 | VSS — Ground |
| Broche 26 | RC8 — I/O port C bit 8 |
| Broche 27 | RC9 — I/O port C bit 9 |
| Broche 28 | VDD — Positive supply |
| Broche 29 | RB4 — I/O port B bit 4 |
| Broche 30 | RB5 — I/O port B bit 5 |
| Broche 31 | RB6 — I/O port B bit 6 / ICS PGC |
| Broche 32 | RB7 — I/O port B bit 7 / ICS PGD |
| Broche 33 | RB8 — I/O port B bit 8 |
| Broche 34 | RB9 — I/O port B bit 9 |
| Broche 35 | RB10 — I/O port B bit 10 |
| Broche 36 | RB11 — I/O port B bit 11 |
| Broche 37 | RB12 — I/O port B bit 12 |
| Broche 38 | RB13 — I/O port B bit 13 |
| Broche 39 | RB14 — I/O port B bit 14 |
| Broche 40 | RB15 — I/O port B bit 15 |
| Broche 41 | VDD — Positive supply |
| Broche 42 | MCLR — Master clear reset (active low) |
| Broche 43 | RA8 — I/O port A bit 8 |
| Broche 44 | RA9 — I/O port A bit 9 |
Applications typiques
PIC24F16KM204-E/ML convient pour 6 applications: Battery-Powered Sensor Nodes, Industrial Measurement and Control, Consumer Appliance Control, Portable Medical Devices, Automotive Body and Lighting Modules, Smart Home and IoT Edge Nodes.
Battery-Powered Sensor Nodes
The PIC24F16KM204-E/ML fits battery-powered sensor nodes because of its XLP sleep current below 1 uA, 1.8V-5.5V supply range and integrated 12-bit ADC plus 2x op amps for direct sensor conditioning. With 16KB Flash and 2KB SRAM, the MCU runs a typical RTOS-less event-driven sensor stack while still leaving room for over-the-air firmware updates. The on-chip 8-bit DAC supports closed-loop control outputs (e.g., LED driver or valve actuation). Its 44-QFN 8x8 mm footprint keeps the node board under 20x20 mm. Designers should pair the device with a single-cell Li-ion or 2xAA alkaline pack and use Sleep+RTCC wake patterns to reach multi-year battery life.
Recommandé
Industrial Measurement and Control
The PIC24F16KM204-E/ML serves industrial measurement and control designs by combining a 32 MHz 16-bit core with Configurable Logic Cells, two comparators and two 8-bit DACs that implement PWM-style and analog-control loops without external glue logic. Extended -40C to +125C temperature grade qualifies it for factory-floor enclosures and outdoor cabinets. The 12-bit ADC plus 2x op amps form a complete signal-conditioning front-end for 4-20 mA loops, RTD/thermocouple amplification and load-cell scaling. Hardware CRC and a Windowed Watchdog Timer support IEC 60730 functional-safety class B requirements in white goods and process instrumentation.
Recommandé
Consumer Appliance Control
The PIC24F16KM204-E/ML is well suited to consumer appliance control boards (washing machines, refrigerators, induction cooktops) because of its on-chip op amps, comparators and CLC modules that replace discrete analog front-ends. The 16KB Flash accommodates mid-complexity state machines for user interface, motor control PWM and safety monitoring. Wide 1.8V-5.5V supply lets the MCU run directly from a 5V or 3.3V rail, simplifying power-tree design. The 44-QFN package footprint supports miniaturized PCBs typical of modern appliance main boards, while the extended temperature grade handles under-hood and outdoor appliance environments.
Recommandé
Portable Medical Devices
The PIC24F16KM204-E/ML fits portable medical devices such as pulse oximeters, glucose meters and wearable patient monitors where nanoamp-level sleep current and 1.8V-5.5V operation matter most. The integrated 12-bit ADC and 2x op amps condition signals from photodiode sensors, while the 8-bit DACs drive LED drivers and audio/buzzer feedback. The 16KB Flash and 2KB SRAM are sufficient for vital-signs algorithms and simple BLE-friendly GPIO/HID interfaces. Extended temperature grade supports refrigerated drug-storage and outdoor-use scenarios. Designers should pair this MCU with a Bluetooth LE module and a low-quiescent LDO for FDA-compliant Class II devices.
Recommandé
Automotive Body and Lighting Modules
The PIC24F16KM204-E/ML handles automotive body and lighting module functions such as interior lighting controllers, seat-position sensors and HVAC blend-door actuators. The wide 1.8V-5.5V supply tolerates 12V battery transients after pre-regulation, and the extended -40C to +125C temperature grade covers under-dash and cabin environments. PWM/MCCP modules support high-resolution dimming and DC motor control, while the integrated op amps close feedback loops on actuator position sensors. For AEC-Q100-qualified designs, Microchip recommends the PIC24F16KM204-E/ML as a cost-optimized alternative to dsPIC33A parts; verify EMC and transient immunity against ISO 7637-2 in the application circuit.
Recommandé
Smart Home and IoT Edge Nodes
The PIC24F16KM204-E/ML is a strong fit for smart-home and IoT edge nodes that aggregate multiple low-bandwidth sensors before pushing data to a Wi-Fi/BLE gateway. Its on-chip 12-bit ADC and 2x op amps handle multiple analog inputs (light, temperature, humidity), while the CLC implements event-trigger logic without consuming MIPS. With 16KB Flash, designers can implement OTA-bootloader stubs, MQTT-SN stacks and on-device anomaly detection. Sleep current below 1 uA allows coin-cell-powered room sensors that last 5+ years. The 44-QFN package supports compact PCB designs for behind-wall switches and ceiling-mounted environmental monitors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24F16KM204-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FV16KM204-E/ML | PIC24F08KM204-E/ML | PIC24F16KM204-I/ML | PIC24F16KM202-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) - ML | 44-QFN (8x8 mm) - ML | 44-QFN (8x8 mm) - ML | 44-QFN (8x8 mm) - ML | 44-QFN (8x8 mm) - ML |
| Flash | 16 KB | 16 KB | 8 KB | 16 KB | 16 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Temperature Grade | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| ADC / DAC | 12-bit ADC / 2 x 8-bit DAC | 12-bit ADC / 2 x 8-bit DAC | 12-bit ADC / 2 x 8-bit DAC | 12-bit ADC / 2 x 8-bit DAC | 12-bit ADC / 2 x 8-bit DAC |
| Approx. Unit Price (USD, as of 2026-09-29) | 4.20 | 4.40 | 3.95 | 4.10 | 4.05 |
Principaux différenciateurs
- On-chip op amps eliminate external analog front-end (vs PIC24F16KM102-I/ML (no on-chip op amps))
- Lower-voltage operation for direct Li-ion connection (vs PIC24FV16KM204-E/ML (1.8-5.5V wide-range variant))
- Larger memory than the -KM102 family (vs PIC24F16KM102-I/ML (8KB Flash, 1.5KB RAM))
Notes de conception
The 44-QFN package uses an exposed thermal pad on the bottom that must be soldered to a continuous ground copper pour with at least 9 thermal vias (0.3 mm drill, 1.0 mm pitch) to the inner plane. This provides low-impedance ground return for the analog blocks (ADC, op amps, DAC) and spreads the ~150 mW worst-case dissipation. Skipping the EP solder connection degrades ADC SNR by 6-10 dB and may violate absolute-maximum junction temperature under heavy peripheral load.
Place a 10 uF X7R ceramic bypass capacitor within 3 mm of each VDD pin and a 1 uF X7R within 3 mm of the AVdd pin to support the ADC's charge-pump current transients. Add a 100 nF decoupling cap adjacent to every 4-port cluster (PORTA, PORTB, PORTC). Estimated: the MCU draws up to 25 mA active at 32 MHz/3.3V; the bypass network above keeps ripple under 30 mV peak-peak on the analog supply rail during PWM switching events.
Route analog signals (AN0-AN8, op-amp inputs) on the opposite PCB layer from digital switching lines (PWM, UART, SPI clock) and surround them with a ground guard ring tied to the EP ground. The on-chip 12-bit ADC at 500 ksps requires source impedance below 1 kohm to preserve INL/DNL; add an external op-amp buffer if driving the ADC from a higher-impedance sensor. Keep crystal traces under 5 mm and place load capacitors within 2 mm of OSC1/OSC2.
Do not assume the MCLR pin can be left floating; tie it through a 10 kohm pull-up to VDD and add a 100 nF cap to ground for noise immunity, otherwise spurious resets may occur in electrically noisy environments. When migrating from PIC24F16KM104 to PIC24F16KM204, verify that the additional PORTB and PORTC pins are properly initialized as digital or analog, since unfused uninitialized pins draw additional current. Always configure unused pins as outputs driven low to minimize quiescent current in Sleep mode.
Informations de conformité
RoHS and lead-free per Microchip product page. Extended -40C to +125C temperature grade but not AEC-Q100 qualified; for automotive designs select PIC24F16KM204-E/ML or upgrade to PIC24HJ128GP502-I/ML with proper AEC-Q100 validation.
