XC3S200-4FT256C
XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx
AMD XC3S200-4FT256C is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 cells, and a 256-LBGA package. The -4 speed grade operates at up to 630 MHz, while the device uses a nominal 1.2 V core supply and is manufactured in 90 nm process technology. These headline characteristics position the FPGA between fixed-function logic and larger programmable-logic devices for cost-sensitive, moderate-complexity embedded systems.
A field-programmable gate array is a programmable logic device in which configurable logic blocks, programmable input/output blocks, and programmable interconnect form a user-defined digital circuit. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs and mask-programmable logic. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured after manufacture to implement control, interface, protocol, signal-processing, or security functions in parallel.
The Spartan-3 architecture provides 480 configurable logic blocks and 4320 cells according to the supplied distributor and comparison data. Its 256-ball package supports 256 terminals for device configuration, power, clocking, and user I/O. The -4 designation identifies the performance grade, while the commercial C suffix corresponds to the stated 0°C to 85°C operating-temperature range. A maximum supply voltage of 1.26 V and a nominal 1.2 V FPGA supply are also reported in the available data.
The 90 nm Spartan-3 process supports a useful balance of logic capacity, static power, dynamic performance, and manufacturing cost. At up to 630 MHz, the XC3S200-4FT256C can satisfy clock-domain requirements that are more demanding than simple glue logic while remaining smaller and less complex than a high-end FPGA. Exact timing, I/O standards, supported memory interfaces, configuration options, and core-current limits require confirmation in the complete manufacturer datasheet before a new design is released.
Typical uses include industrial control and automation, communications equipment, embedded test systems, consumer products, instrumentation, and compact control modules. Its parallel programmable resources can implement multiple finite-state machines, data acquisition logic, communication bridges, and auxiliary processors concurrently. The 256-terminal package also makes the device suitable for designs requiring more configuration and user I/O than a small CPLD, although board density and routing must be assessed at the schematic and PCB stages.
Designers should treat the package, voltage rails, decoupling, configuration interface, clocking, and I/O standards as a coordinated system rather than isolated specifications. Place bypass capacitors close to the supply pins, preserve the required configuration path, and verify every ball assignment against the exact package drawing. Because the supplied snippets contain inconsistent secondary descriptions of package and cell data, the authoritative manufacturer pinout and datasheet should control any production implementation.
This page combines the verified distributor specifications with engineering-focused application guidance, design notes, parameter comparisons, and same-family drop-in candidates. It also distinguishes confirmed values from unavailable electrical details, helping engineers identify the correct replacement without mistaking a similar FPGA for a guaranteed production substitute.
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