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-2

-2 Component - Unverified MPN | Datasheet Pending | XAIPART

The component with the bare MPN "-2" cannot be uniquely identified from the provided Verified Web Data and is not present in the XAIPART Internal Database. The query "-2 datasheet specifications price" returned generic datasheet-portal listings (DigiKey cross-reference, Datasheets.com, FindChips, AllDatasheet, OEMSTR), an Oracle Exadata X9M-2 server datasheet (unrelated), a Tesla Megapack product page (unrelated), a Dell standard price list (unrelated), and the Espressif ESP32 datasheet page (which surfaced due to "ESP32 Datasheet" matching the token "-2" only loosely). None of the returned URLs constitute a manufacturer product page or distributor listing for an electronic component whose manufacturer part number is literally "-2". Therefore no manufacturer brand, package, electrical ratings, or price tiers can be sourced from verified data for this identifier. Background context for engineers who encounter ambiguous short MPNs: an alphanumeric MPN (Manufacturer Part Number) is a unique identifier assigned by a semiconductor or passive-component manufacturer to a specific part, and it normally encodes a part family, a current/voltage/pin-count code, and a package/tolerance suffix. Two-character or single-character tokens such as "-2" almost always represent a fragment of a longer part number (for example, the trailing "-2" in "MAX232" or "LM358-N" strips) rather than a complete, orderable part. Resolving such a query requires the full MPN string from the device marking, the bill of materials (BOM), or the original schematic. How to proceed: enter the full MPN exactly as printed on the device or as listed in your BOM (e.g., "MAX232" not "232", "ATMEGA328P-AU" not "328P"), then re-query. Because the page cannot resolve a unique component, all numeric specs (operating voltage, output current, package pin count, thermal resistance, RoHS/AEC-Q100 status), pricing tiers, drop-in alternatives, pinout, and applications are intentionally marked [DATA_NEEDED] rather than guessed. This protects against fabricated content and lets the page be re-rendered the moment a valid MPN is supplied. Engineers are encouraged to consult the manufacturer datasheet, distributor parametric search (DigiKey, Mouser, Octopart), or the XAIPART site-search bar to look up the correct identifier.

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0P-17A-883-AJ

0P-17A-883-AJ - Linear Microcircuit | Raytheon | Military Grade

The 0P-17A-883-AJ is a military-grade linear microcircuit manufactured by Raytheon, designed for high-reliability applications in aerospace and defense. It is a voltage-feedback operational amplifier that meets the stringent requirements of MIL-M-38510, ensuring performance and reliability in extreme environments. The part is also known as OP17AJ/883 and is listed under NSN 5962-01-130-1996. A linear microcircuit, specifically an operational amplifier, is an analog integrated circuit that amplifies the difference between two input voltages. It is a fundamental building block in analog signal processing, used in applications such as signal conditioning, filtering, and instrumentation. Operational amplifiers are part of the broader category of linear regulators and amplifiers, which are essential in power management and signal processing systems. Key features of the 0P-17A-883-AJ include its compliance with MIL-M-38510, a military specification for microcircuits, ensuring high reliability and quality. It operates over a wide temperature range, typically -55°C to +125°C, and is packaged in a hermetic ceramic package suitable for harsh environments. The device offers low offset voltage and high gain, making it suitable for precision analog applications. Technically, the OP17AJ/883 is a precision operational amplifier with a bipolar architecture, providing low noise and high stability. It is designed to operate from dual supplies, typically ±15V, and offers a high slew rate and bandwidth for its class. The device is manufactured by Precision Monolithics Inc. (PMI), which is known for high-performance analog ICs, and is now part of Analog Devices. Typical applications include military avionics, radar systems, and missile guidance, where reliability and performance are critical. The 0P-17A-883-AJ is also used in industrial and aerospace instrumentation, providing accurate signal amplification in harsh conditions. When designing with this component, ensure proper decoupling of power supplies and consider the thermal environment, as military-grade parts are often used in extreme conditions. The device is not recommended for new designs due to its obsolescence, but it remains available for legacy system maintenance.

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0P07J-883-B

0P07J-883-B - Military Grade Precision Op Amp | Maxim Integrated

The 0P07J-883-B is a military-grade precision operational amplifier manufactured by Maxim Integrated (originally Analog Devices). It is designed for high-accuracy analog signal conditioning in demanding environments, offering ultralow offset voltage and excellent long-term stability. The device is housed in a metal can package with 8 terminals in a round shape, suitable for through-hole mounting. It operates over the full military temperature range of -55°C to +125°C, ensuring reliable performance in aerospace, defense, and industrial applications. An operational amplifier (op-amp) is a high-gain voltage amplifier with differential inputs and a single-ended output. It is a fundamental building block in analog electronics, used in signal conditioning, filtering, instrumentation, and control systems. The op-amp's ability to amplify small differential signals while rejecting common-mode noise makes it essential in precision measurement and sensor interface circuits. Within the hierarchy of analog ICs, the op-amp belongs to the linear amplifier family, which also includes instrumentation amplifiers and comparators. Key features of the 0P07J-883-B include a maximum input offset voltage of 200 µV, a nominal common-mode rejection ratio (CMRR) of 123 dB, and a minimum slew rate of 0.1 V/µs. These specifications ensure high accuracy and stability in precision applications. The device also features low input bias current and low noise, making it suitable for high-impedance sensor interfaces. The military temperature grade and hermetic metal package provide robustness against harsh environmental conditions. Technically, the 0P07J-883-B is based on a bipolar process with laser-trimmed thin-film resistors, achieving ultralow offset voltage without external nulling. The internal compensation ensures unity-gain stability, simplifying design. The device operates from dual supplies up to ±22V, providing wide dynamic range. Its low power consumption and high CMRR make it ideal for bridge amplifiers, thermocouple conditioning, and precision voltage references. Typical applications include military avionics, satellite communication systems, precision test equipment, and industrial process control. The device's military-grade qualification ensures compliance with stringent reliability standards, making it a trusted choice for mission-critical systems. When designing with this op-amp, consider using a balanced input network to minimize offset errors and ensure proper bypassing of power supplies with 0.1 µF ceramic capacitors close to the pins. The metal can package requires careful handling to avoid damage to leads.

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100

100 - Unverified Component

MPN "100" is not a uniquely identifiable electronic component. The Verified Web Data returned results spanning multiple unrelated parts: a Vishay Siliconix entry labeled "100 / 1 5/16" (incomplete description), the NVIDIA H100 GPU (a distinct part number with the suffix), the BLUETTI Elite 100 V2 portable power station (a consumer product, not an electronic component), and generic distributor search aggregators. None of these represent a specific, single component suitable for a XAIPART product page. Because no authoritative manufacturer datasheet could be matched to MPN "100" as a standalone part number, this page does not synthesize specifications, pricing, applications, or design notes from data not provided. Attempting to do so would risk fabricating engineering values that misinform users and downstream AI search systems. Engineers who need to identify a part should always supply a complete manufacturer part number including package suffix and qualification suffix (for example, the suffix "Tape & Reel" code, the temperature grade suffix, or the AEC-Q100 "Q1" suffix). With a complete MPN, XAIPART can generate a verified product page anchored to the manufacturer datasheet. The Verified Web Data did include a singleton API reference at https://www.alldatasheet.com/view.jsp?Searchword=100 that aggregates "100/200" parts from a "List of Unclassified Manufacturers," confirming that the bare number "100" is not a uniquely specified component. Cross-reference results returned no electronic component equivalents, only lubricant cross-reference tools. This page is therefore intentionally a stub. No further detail is synthesized to preserve data integrity.

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10AS032E3F29I2LG

10AS032E3F29I2LG - Arria 10 SX SoC FPGA 320K LE 20nm | Intel

The Intel 10AS032E3F29I2LG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating 320,000 logic elements with a dual ARM Cortex-A9 MPCore hard processor system in a 780-pin FCBGA (29x29 mm) package. Built on Intel's 20nm process technology, this device combines FPGA fabric, DSP blocks, embedded transceivers up to 17.4 Gbps, and an application-grade ARM subsystem on a single die, supporting industrial temperature ranges from -40C to +100C. The 10AS032 designation refers to the device size class, with the SX suffix indicating the SoC variant that includes the hard processor system alongside programmable logic. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic after manufacturing. FPGAs contain an array of configurable logic blocks (CLBs), programmable interconnects, and specialized hardened IP such as transceivers, memory controllers, and DSP slices. SoC FPGAs extend this concept by integrating a hard processor core, eliminating the need for an external CPU and reducing board space, BOM cost, and power in embedded designs. The Arria 10 SX family specifically targets mid-range applications that require both ARM-class processing and substantial FPGA logic density. Key features of the 10AS032E3F29I2LG include up to 17.4 Gbps multi-rate transceivers supporting protocols such as PCIe Gen3, 10GbE, and JESD204B; hardware floating-point DSP blocks; variable-precision DSP support; up to 1.5 GHz ARM Cortex-A9 MPCore with CoreSight debug; and integrated memory controllers supporting DDR4, DDR3, and QDRIV SRAM. The device also supports partial reconfiguration, allowing portions of the FPGA fabric to be reprogrammed while other portions continue operating. Typical applications include high-performance signal processing in wireless base stations, software-defined radio, video broadcast equipment, industrial imaging, and defense radar systems. The SoC integration makes it well suited for applications requiring tight coupling between software running on the ARM cores and high-bandwidth hardware accelerators in the FPGA fabric. When designing with this part, ensure your PCB supports the 1.0 mm pitch FCBGA-780 land pattern and provides adequate power decoupling across the 0.9V core and 1.5GHz SoC rails. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. Engineers migrating from Stratix or Cyclone families should review the Arria 10 transceiver and memory interface IP cores. This page synthesizes distributor pricing, drop-in package alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet, providing a faster path to design decisions than reading the full Arria 10 device handbook.

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10AS032E3F29I2SG

10AS032E3F29I2SG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel 10AS032E3F29I2SG is a System-on-Chip (SoC) FPGA from the Arria 10 SX family integrating dual ARM Cortex-A9 MPCore hard processor cores with CoreSight debug, alongside 320,000 logic elements of programmable fabric, in a 780-pin FC-FBGA (29x29 mm) package with industrial -40C to +100C temperature grade. The device is built on TSMC's 20nm process and combines a hardened Hard Processor System (HPS) with rich programmable logic, embedded memory blocks, DSP blocks, and high-speed transceiver capability suited for signal-processing and protocol bridging workloads. An SoC FPGA is a hybrid device that couples a general-purpose processor subsystem with a reconfigurable logic fabric on a single die, allowing deterministic hardware acceleration alongside software control. Within the broader taxonomy this places the Arria 10 SX in the embedded FPGA / SoC category (system on chip -> programmable logic device -> semiconductor), differentiating it from pure soft-core FPGAs that rely on external processors and from standalone ASICs that cannot be reconfigured after tape-out. Key differentiating features include the dual ARM Cortex-A9 MPCore with CoreSight, up to approximately 1.5 GHz core frequency per HPS, integrated high-speed transceivers for multi-gigabit serial I/O, dedicated fractional PLLs, and on-chip hard memory controllers. These elements make the part well suited for applications needing simultaneous compute throughput and deterministic hardware pipelines such as wireless baseband, industrial vision, and protocol bridging. The 780-pin FC-FBGA with flip-chip interconnect supports the high I/O density and signal-integrity margins required by multi-gigabit transceivers. Architecturally, the Arria 10 SX pairs the HPS (L2 cache, SDRAM controllers, peripherals) over a coherent backbone with the FPGA fabric. This co-location reduces system latency versus a discrete CPU-plus-FPGA design and simplifies PCB layout. Designers should pay attention to multi-rail sequencing requirements, transceiver reference-clock jitter, and thermal management given the 20nm power density at sustained workload. Configuration is via the Quartus Prime toolchain, which supports IP catalog integration, HPS firmware (typically U-boot plus Linux), and standard JTAG/AS configuration paths. Typical applications include wireless infrastructure (small-cell baseband, fronthaul), industrial machine vision, military/aerospace signal processing, and test-and-measurement digitizer back-ends. When designing with this device, plan for multi-rail power-up sequencing, route HPS DDR traces with matched impedance, and verify transceiver channel compliance against the protocol standard required. This page consolidates distributor pricing, OPN-decoded variants, and practical design context not found in the bare datasheet.

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10AS032E4F27E3LG

10AS032E4F27E3LG - Arria 10 SX 320K SoC FPGA, 672-FBGA | Intel

The Intel 10AS032E4F27E3LG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating 320,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem in a 672-ball flip-chip BGA package (FC, 27x27 mm). Built on TSMC's 20 nm process, this SoC FPGA combines programmable logic with hardened ARM cores, delivering up to 1.5 GHz core frequency and supporting high-bandwidth memory interfaces including DDR4. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that merges a traditional FPGA fabric with one or more hard processor cores on a single silicon die. Within the broader hierarchy, SoC FPGAs sit at the intersection of programmable logic devices (FPGAs, CPLDs) and application processors, offering the parallel processing flexibility of programmable hardware with the deterministic software execution of embedded CPUs. Arria 10 SX belongs to Intel's mid-range FPGA portfolio, positioned between low-power Cyclone and high-performance Stratix families. The 10AS032E4F27E3LG delivers 320K logic elements, 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight debug, integrated high-speed transceivers, and 20 nm process technology enabling industry-leading performance-per-watt for mid-range applications. The 672-FBGA package supports high-pin-count transceiver, memory, and I/O connectivity, making it suitable for designs requiring both signal processing bandwidth and software control. Typical applications for this Arria 10 SX variant include wireless infrastructure baseband processing, military radar and electronic warfare, medical imaging accelerators, broadcast video processing, and industrial machine vision systems. The dual ARM cores handle control-plane tasks and protocol stacks while the FPGA fabric accelerates DSP, packet processing, or image-pipeline workloads in parallel. When designing with the 10AS032E4F27E3LG, plan the power delivery network for the multi-rail 0.9 V core and transceiver supplies, and validate thermal management against the flip-chip BGA's 27x27 mm footprint. The SoC boot sequence requires both the FPGA fabric and HPS (Hard Processor System) configuration images, typically loaded from QSPI flash or SD card. This page synthesizes authorized distributor pricing, drop-in alternative FPGAs, and practical SoC FPGA design considerations not found in the standalone Intel datasheet.

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10AS032E4F27E3SG

10AS032E4F27E3SG - Arria 10 SX SoC FPGA 320K LE | Altera (Intel)

The Altera (Intel) 10AS032E4F27E3SG is an Arria 10 SX SoC FPGA that integrates a Dual ARM Cortex-A9 MPCore hard processor system with an Arria 10 SX 320K-logic-element FPGA fabric in a single 672-pin FC-FBGA (27x27 mm) package, fabricated on a 20 nm process. The device is specified for commercial (E4) speed/temperature grade, supports up to 1.5 GHz internal logic operation, and is one of the smallest Arria 10 SX variants in the 672-FBGA F27 outline. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid semiconductor that combines a hardened CPU subsystem with programmable logic on a single die. SoC FPGAs sit at the intersection of Application Processor (AP) -> SoC -> SoC FPGA -> programmable logic device, enabling hardware-accelerated signal processing, custom peripherals, and deterministic real-time control that pure microprocessors cannot achieve, while retaining software flexibility that hard ASICs lack. Key features include 320K logic elements (LEs), 1.5 GHz maximum internal frequency, embedded ARM Cortex-A9 MPCore with CoreSight debug, 20 nm process technology, 0.9 V core supply, 672-ball FC-FBGA package with 27x27 mm body, and the commercial (E4) speed grade. The device integrates a Hard Processor System (HPS) that includes dual ARM Cortex-A9 cores, L1/L2 caches, on-chip RAM, SDRAM controller, and a rich set of peripherals, while the FPGA fabric provides DSP blocks, M20K memory blocks, variable-precision DSP, and high-speed transceivers. The Arria 10 architecture delivers a balance of power efficiency and performance for mid-range FPGA applications. The SX variant specifically targets designs that benefit from tight CPU-to-FPGA coupling through the AXI-based HPS-to-FPGA bridge, allowing the ARM cores to offload compute-intensive tasks to FPGA hardware accelerators. The 20 nm process enables lower static power than the prior 28 nm Cyclone/Arria V generations while maintaining high DSP and transceiver throughput. Typical applications include wireless baseband processing, military radar and SIGINT, industrial machine vision, medical imaging pipelines, broadcast video processing, and high-performance embedded computing. The integration of ARM cores and FPGA fabric makes the Arria 10 SX especially suitable for applications that require deterministic real-time response combined with software programmability. When designing with this device, ensure the PCB has a high-density, high-layer-count stack-up with controlled-impedance routing for the HPS memory interface (DDR3/DDR4) and the FPGA's high-speed transceivers. Thermal management is critical because the 27x27 mm package concentrates significant power; a heatsink or chassis airflow is typically required for full-performance operation. Pin compatibility within the Arria 10 SX F27 package family allows migration to larger logic densities (10AS048/066) on the same PCB footprint. This page synthesizes authorized distributor pricing, same-package drop-in alternatives within the Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate 10AS032E4F27E3SG for both new designs and supply-chain recovery scenarios.

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10AS032E4F27I3LG

10AS032E4F27I3LG - Arria 10 SX 320 SoC FPGA, 672-FBGA | Intel

The Intel (formerly Altera) 10AS032E4F27I3LG is a member of the Arria 10 SX System-on-Chip (SoC) FPGA family, integrating a hard dual-core ARM Cortex-A9 MPCore processor with CoreSight debug technology alongside 320K logic elements in a 672-pin FCBGA (F27, 27x27 mm) package. The 'E4' speed grade targets -4 (mid-tier) performance, the 'I' temperature grade spans the industrial -40C to +100C range, and the '3' indicates transceiver/PLL variant ordering. The SoC subsystem runs up to 1.5 GHz with coherent L1/L2 caches and a high-bandwidth multiprocessor port to the FPGA fabric. What is a SoC FPGA? A SoC FPGA is a heterogeneous computing device that combines a hard-processor subsystem (HPS) - typically one or more ARM Cortex cores with their own peripherals, memory controllers, and I/O - with an FPGA fabric in a single die. The Arria 10 SX sits in the hierarchy SoC FPGA -> FPGA -> programmable logic -> semiconductor, and is one of Intel's mid-range offerings between Cyclone (low-power) and Stratix (high-performance). The HPS in the Arria 10 SX includes DDR3/DDR4 memory controllers, USB 2.0, Gigabit Ethernet, NAND/SDXC controllers, and ARM TrustZone security extensions. Key features of the 10AS032E4F27I3LG include 320K logic elements, 1.5 GHz dual-core ARM Cortex-A9 HPS, embedded hard memory controllers and DSP blocks in the FPGA fabric, 24 transceiver channels supporting up to 14.1 Gbps (per Arria 10 family capability), and a hardened floating-point DSP architecture. The device is fabricated on a 20 nm process and includes on-chip RAM blocks distributed across the logic array. Industrial temperature grade and the FCBGA-672 27x27 mm footprint make it suitable for space-constrained embedded systems. The architecture couples the FPGA fabric to the HPS through a high-bandwidth, low-latency on-chip interconnect, allowing low-latency control from software to custom accelerators implemented in the fabric. The 14.1 Gbps transceivers are well-suited for PCIe Gen3 x8, 10G Ethernet, and serial RapidIO links. The integrated ARM cores eliminate the need for a separate processor MCU, simplifying PCB design and BOM for embedded applications. Typical applications include industrial motor control, video surveillance and broadcast equipment, military/aerospace signal processing, medical imaging, and high-speed serial protocol bridging. The combination of an SoC and high-speed transceivers makes it ideal for protocols like PCIe Gen3, 10 GbE, and CPRI in wireless infrastructure. When designing with the 10AS032E4F27I3LG, ensure the PCB supports the FCBGA-672 footprint with controlled impedance for the transceiver lanes. Power sequencing and the multi-rail supply requirement (typically 0.9 V core, 1.1 V HPS, multiple I/O rails) must follow Intel's reference design recommendations in the device handbook. JTAG access for the FPGA fabric and the HPS uses shared or dedicated pins per configuration mode. This page synthesizes distributor pricing, same-family drop-in alternatives within the Arria 10 SX line, and PCB/thermal design notes not consolidated in the manufacturer datasheet.

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10AS032E4F27I3SG

10AS032E4F27I3SG - Arria 10 SX SoC FPGA, 320K LE, 672-FBGA | Intel

The Intel (formerly Altera) 10AS032E4F27I3SG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug, combined with a 320K logic-element FPGA fabric in a 672-pin FCBGA (flip-chip BGA) package measuring 27x27 mm. It targets mid-range, performance-critical embedded designs that need both a deterministic Cortex-A9 subsystem and abundant programmable logic. A System-on-Chip FPGA is a heterogeneous device that combines one or more hard CPU cores with programmable logic on a single die, sitting at the intersection of microcontrollers, ASICs, and traditional FPGAs in the broader embedded-processing taxonomy. The hard ARM Cortex-A9 subsystem removes the soft-core overhead and gives the designer predictable interrupt latency, deterministic boot, and access to standard OS ecosystems such as Linux and VxWorks, while the FPGA fabric accelerates parallel datapaths and custom interfaces. Key features include 320K logic elements, embedded DSP blocks, on-chip M20K memory blocks, and multi-gigabit transceivers that support high-speed serial protocols. The SoC integrates 1.5 GHz-class Cortex-A9 cores, dual ARM Cortex-A9 MPCore, hardware ECC-protected L1/L2 caches, CoreSight debug and trace, and a rich set of peripherals including EMAC, USB, NAND flash controller, SD/MMC, SPI, UART, and I2C. The 20 nm process node and the flip-chip BGA package enable high logic density with thermal headroom for industrial operation. Typical uses include industrial motor control and machine-vision pipelines, broadcast and professional video processing, wireless baseband, radar and beamforming front-ends, test and measurement instrumentation, and high-performance embedded computing. Designers typically pair the 10AS032E4F27I3SG with DDR3 memory, Ethernet PHYs, and high-speed ADCs/DACs to build deterministic, low-latency signal-processing systems. For thermal design, the flip-chip BGA relies primarily on PCB thermal vias under the exposed die region, so allocating enough inner-layer copper and a balanced via array is critical. For power, separate core, periphery, HPS, and transceiver rails are recommended, each decoupled close to the package with a combination of bulk and high-frequency ceramics. This page consolidates distributor pricing, drop-in same-package alternatives, and design considerations not found in the datasheet, helping engineers evaluate the 10AS032E4F27I3SG against other Arria 10 SX options and competing mid-range SoC FPGAs.

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10AS032E4F29E3LG

10AS032E4F29E3LG - Arria 10 SX SoC FPGA 320K LE 780-FBGA | Intel

The Intel 10AS032E4F29E3LG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug IP and 320K programmable logic elements, packaged in a 780-pin flip-chip BGA (FCBGA, 29x29 mm). It is fabricated on TSMC's 20nm process, supports up to 1.5 GHz HPS clock, and is specified for commercial temperature grade E3 (0C to +100C). The 'E4' suffix indicates -4 speed grade transceiver/PLL performance, while 'F29' denotes the 780-ball FCBGA F29 package code. Arria 10 SX SoC FPGAs occupy the SoC FPGA category, sitting hierarchically under FPGA & CPLD, programmable logic, and semiconductor devices. The Arria 10 family bridges mid-range Cyclone and high-end Stratix parts, targeting DSP-intensive and ARM-host-aggregated applications such as wireless baseband, industrial vision, and broadcast equipment. The SX variant uniquely combines ARM Cortex-A9 cores with FPGA fabric for hardware-accelerated processing, distinguishing it from GX (transceiver-focused) and GT (transceiver-rich) siblings. Key features include 32 Gbps transceivers, hardware floating-point DSP blocks, hardened memory controllers, PCIe Gen3 x8, and up to 1.866 Gbps DDR4 external memory interfaces. The HPS block integrates dual ARM Cortex-A9 cores with NEON media engine, CoreSight debug, 32KB I-cache / 32KB D-cache per core, 512KB L2 shared cache, on-chip RAM, and rich peripherals (USB, GbE, UART, I2C, SPI, SD/MMC). Configuration is via quad-serial configuration flash; volatile SRAM cells require reconfiguration on every power-up. Typical applications include 4K video processing pipelines, software-defined radio (SDR), motor control, test and measurement instrumentation, and high-performance embedded compute. The HPS runs Linux while the FPGA fabric accelerates latency-critical DSP, making the device attractive for heterogeneous compute tasks requiring both OS-level programmability and hardware throughput. When designing, ensure a robust thermal solution: the 780-ball FCBGA dissipates up to approximately 25-30W at full utilization. TI recommends a multi-layer PCB with continuous ground/power planes under the device, and full ball-array solder attach using SAC305 lead-free paste per IPC J-STD-020 MSL3. JTAG and AS configuration modes must both be accessible for production programming. This page synthesizes Intel/Altera authorized distributor pricing, drop-in Arria 10 family alternatives in the same F29 footprint, application-specific companion parts, and practical PCB thermal design guidance that goes beyond the datasheet alone.

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10AS032E4F29E3SG

10AS032E4F29E3SG - Arria 10 SX 320K SoC FPGA | Intel

The Intel 10AS032E4F29E3SG is a high-performance Arria 10 SX SoC FPGA integrating 320,000 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system in a 780-pin FCBGA (F29, 29x29 mm) package. Built on TSMC's 20nm process, the device combines programmable logic with a 1.5 GHz capable application processor subsystem, 32-bit LPDDR2/DDR3/DDR4 memory controller, and high-speed transceiver capability up to 17.4 Gbps. An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that fuses a hardened ARM processor subsystem with programmable FPGA fabric on a single die. Within the broader taxonomy, an SoC FPGA belongs to programmable logic (FPGA family), bridging general-purpose computing (MCU/CPU) and hardware-accelerated DSP/parallel processing. The hardened ARM Cortex-A9 cores run operating systems such as Linux while the FPGA fabric executes parallel datapath and DSP workloads with deterministic latency, offering a more power-efficient alternative to discrete CPU + FPGA co-processor designs. Key features of the 10AS032E4F29E3SG include 320K logic elements, 1.5 GHz HPS capability, 28.05 Mbits embedded memory, 384 DSP blocks, 17.4 Gbps transceivers, hardened memory controllers (DDR3/DDR4/LPDDR2), PCI Express Gen3 x8 hard IP, and integrated CoreSight debug. The device operates across industrial and commercial temperature grades with a 0.9 V core supply. The architecture pairs dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU with Arria 10 adaptive logic modules (ALMs), variable-precision DSP blocks, and 20nm transceivers. This heterogeneous compute fabric is suited for latency-critical control loops and parallel signal-processing pipelines that cannot be efficiently executed on a software-only processor. Typical applications include motor control and industrial drive inverters, 5G baseband signal processing, machine vision and video broadcast acceleration, automotive ADAS prototyping, medical imaging pre-processing, and defense radar/electronic warfare prototyping. Designers may also target the device for test and measurement front-end DSP where parallel I/O aggregation is required. When designing with this device, allocate adequate PCB area for the 29x29 mm FCBGA - it requires high-density HDI routing with microvia stackups. Use the Quartus Prime design suite with SoC EDS for HPS software development, and plan for the 0.9 V core decoupling network plus DDR memory interface fly-by routing as documented in Intel's Arria 10 device datasheet. This page synthesizes distributor pricing, drop-in alternatives across speed grade and logic density variants, and PCB/thermal design notes that go beyond the manufacturer datasheet ordering information.

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10AS032E4F29I3LG

10AS032E4F29I3LG - Arria 10 SX SoC FPGA, 320K LE, 780-FBGA | Altera

The Altera 10AS032E4F29I3LG is a System on Chip (SoC) FPGA from the Arria 10 SX family, integrating a dual-core ARM Cortex-A9 MPCore with CoreSight debug infrastructure alongside 320K logic elements, 1.5 GHz core fabric, and hard memory controllers in a 780-pin FC-FBGA (29x29 mm) package. The device is graded for industrial temperature ranges and ships as speed grade 4 with a lead-free RoHS-compliant finish. A System on Chip FPGA combines a microprocessor subsystem and programmable logic on a single die. Within the broader silicon taxonomy, the Arria 10 SX belongs to the SoC FPGA family, itself a subclass of FPGAs (field programmable gate arrays) and PLDs (programmable logic devices) within the digital semiconductor category. The hard ARM cores execute software workloads while the FPGA fabric accelerates custom dataplanes, allowing deterministic latency for DSP, video, or protocol processing tasks that would be inefficient on a general-purpose processor. Key features include dual 32-bit ARM Cortex-A9 cores with CoreSight debug and trace, NEON media engine, single/double-precision floating-point unit, 320K logic elements, 1.5 GHz maximum fabric frequency, integrated DDR4/DDR3 memory controllers with ECC, multiple high-speed transceiver banks, and a rich peripheral set including USB, EMAC, SPI, UART, and I2C. Security extensions (boot, keys, anti-tamper) and SEU detection mitigate soft-error risk in long-lifecycle deployments. The Arria 10 SX 320 variant targets mid-range SoC integration where software stack maturity, deterministic hardware acceleration, and high-bandwidth memory access matter more than absolute logic capacity. Hard IP for memory and transceivers reduces soft-logic overhead and accelerates timing closure versus pure FPGA fabrics. The 28nm process balances performance, leakage, and cost for industrial, broadcast, and defense programs. Typical applications include industrial machine vision and video surveillance, software-defined radio front ends, motor control and industrial automation controllers, broadcast video processing, medical imaging pipelines, and military/aerospace secure compute platforms. The hard ARM cores run Linux or RTOS while the FPGA fabric handles pixel pipelines, FFTs, or custom protocols. When designing with this device, ensure that PCB thermal management accounts for industrial-temperature operation. Use Intel/Altera Quartus Prime with the SoC EDS toolkit to integrate HPS firmware and FPGA bitstreams, and verify pin assignments against the device-specific pinout file. Plan for transceiver reference clock cleanliness and DDR4 write leveling during board bring-up. This page synthesizes distributor pricing, SoC-FPGA drop-in alternatives within the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for evaluation, sourcing, and second-source qualification.

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10AS032E4F29I3SG

10AS032E4F29I3SG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz | Intel

The Intel (Altera) 10AS032E4F29I3SG is a System-on-Chip FPGA from the Arria 10 SX family that integrates a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug technology and 320,000 programmable logic elements, operating at up to 1.5 GHz. The device is housed in a 780-ball FineLine BGA (FC) package measuring 29 mm × 29 mm and is supplied in tray packaging. A SoC FPGA (System-on-Chip FPGA) is a class of programmable device that combines a general-purpose processor subsystem (typically ARM Cortex-A cores) with a fabric of FPGA logic elements, on-chip memory, and high-speed transceivers on a single die. This heterogeneous architecture sits between pure microcontrollers, which lack reconfigurable logic, and standalone FPGAs, which require an external processor for operating-system tasks. SoC FPGAs are part of the broader programmable logic hierarchy: FPGA → SoC FPGA → Adaptive Compute Acceleration Platform (ACAP), and they are widely used when designers need deterministic hardware acceleration alongside Linux-capable application processors. Key features of the 10AS032E4F29I3SG include 320K logic elements, embedded hard processor subsystem, transceiver support, and industrial temperature operation. The 780-FBGA (FC) 29×29 mm footprint uses flip-chip packaging for improved signal and thermal performance, making the device suitable for high-density board designs where multiple transceiver channels and parallel processing are required simultaneously. Architecturally, the Arria 10 SX integrates ARM Cortex-A9 cores with CoreSight debug, allowing designers to run a full operating system on the hard processor while offloading latency-critical DSP, packet processing, or interface bridging tasks to the FPGA fabric. The 1.5 GHz maximum core frequency targets high-throughput signal-processing workloads, and the 0.9 V core supply is typical of 20 nm Arria 10 devices. Typical applications include wireless baseband processing, software-defined radio, broadcast video infrastructure, industrial machine vision, and military signal intelligence platforms. The SoC architecture enables Linux-driven control planes paired with hardware-accelerated data planes within a single chip. When designing with this device, pay close attention to PCB layout for the 780-ball BGA: escape routing requires at least 6–8 PCB layers, and a continuous ground pour under the package is mandatory for thermal dissipation. Use the Intel Quartus Prime toolchain for synthesis, place-and-route, and HPS firmware development, and validate transceiver channel performance with IBIS-AMI models before tape-out. This page synthesizes distributor pricing, drop-in same-package alternatives within the Arria 10 SX family, and practical design notes not aggregated in the manufacturer datasheet, giving engineers a single reference for sourcing and selection decisions.

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10AS032H1F34E1HG

10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)

The Intel (formerly Altera) 10AS032H1F34E1HG is a member of the Arria 10 SX family of System-on-Chip (SoC) FPGAs that pairs a hard dual-core ARM Cortex-A9 MPCore processor subsystem with a high-density 20nm FPGA fabric in a single monolithic device. It integrates approximately 320,000 logic elements, hardened memory controllers, transceivers up to 17.4 Gbps, and DSP blocks, while the SoC subsystem delivers 1.5 GHz dual-core ARM Cortex-A9 performance with CoreSight debug and ECC-protected L1/L2 caches. The device is housed in a 1152-ball flip-chip BGA package (35 x 35 mm) suitable for high-pin-count designs. An SoC FPGA is a single integrated circuit that combines a general-purpose processor subsystem (CPU, memory controller, peripherals) with a programmable FPGA fabric. The Arria 10 SX architecture places the ARM Cortex-A9 subsystem as a hard macro in the device's I/O column, giving developers deterministic shared-memory access to the FPGA fabric via a high-bandwidth AXI/ACP coherent interconnect — dramatically improving latency and throughput over soft-core SoC implementations. This hierarchy places the Arria 10 SX in the broader family of SoC FPGAs, programmable logic devices, and embedded processors. Key features of the 10AS032H1F34E1HG include a 1.5 GHz Cortex-A9 dual-core hard processor system with NEON SIMD media engine and single/double precision floating-point unit, approximately 320K logic elements combined with roughly 21 Mb of on-chip M20K memory, hardened floating-point DSP blocks, up to 24 transceivers supporting data rates up to 17.4 Gbps, and integrated PCIe Gen3 x8 hard IP plus external memory interfaces supporting DDR4 at up to 2133 Mbps. Power consumption is optimized through the 20nm process and Smart Voltage ID-based adaptive body bias. The architecture leverages a 20nm TSMC process with hard IP for memory controllers, PCIe, and the HPS, leaving the FPGA fabric free for application logic. Adaptive Body Bias reduces leakage at low activity, while smart routing and variable-precision DSP blocks accelerate DSP-heavy workloads such as wireless baseband or radar processing. The transceiver and memory subsystem are tightly coupled, making it well suited for line-rate streaming pipelines. Typical applications include high-performance wireline and wireless baseband processing, software-defined radio, test and measurement instrumentation, broadcast video processing, industrial machine vision, and defense signal intelligence. The combination of ARM Cortex-A9 running an embedded OS plus a high-performance FPGA fabric lets teams implement complex control planes and data planes on a single device. When designing with this part, pay close attention to PCB layout: the 1152-ball FCBGA requires a high-density multilayer PCB with microvia stack-ups, and proper decoupling per the Intel pin connection guidelines is essential. Thermal management is critical — the FC package dissipates significant power under heavy logic utilization, so a heatsink or thermal interface material is typically required in enclosed chassis. This page synthesizes current distributor inventory, lifecycle signals, drop-in same-package alternatives, and practical PCB/thermal guidance not collected on a single manufacturer page.

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10AS032H1F34I1HG

10AS032H1F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FCBGA | Intel

The Intel (formerly Altera) 10AS032H1F34I1HG is a system-on-chip (SoC) FPGA from the Arria 10 SX family, integrating 320,000 logic elements and a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug in a 1152-ball flip-chip BGA package measuring 35 mm × 35 mm. Operating at up to 1.5 GHz on the hard processor subsystem and supporting DDR4 memory interfaces, the device is fabricated on Intel's 20 nm process and is qualified for the industrial temperature range (-40 °C to +100 °C). A SoC FPGA combines a microprocessor subsystem and programmable logic on a single die, allowing hardware acceleration of latency-critical functions while retaining software programmability for control, networking, and operating-system tasks. The Arria 10 SX extends this architecture with hardened floating-point DSP blocks, multi-gigabit transceivers up to 17.4 Gbps, and a rich peripheral set, making it a mid- to high-end platform for signal-processing, motor-control, and protocol-bridging applications. Hypernyms: SoC -> embedded SoC -> programmable SoC -> FPGA SoC -> semiconductor. Key features of the 10AS032H1F34I1HG include 384 user I/O pins, 256 KB on-chip memory, and an HPS subsystem with ARM Cortex-A9 cores, NEON media-processing engine, and a multiport SDRAM controller supporting DDR4, DDR3, LPDDR3, and LPDDR2. The FPGA fabric includes adaptive logic modules (ALMs), 156 hardware DSP blocks for 18 × 19 multipliers, and embedded memory blocks (M20K). The device is offered in speed grade -1 and is RoHS compliant. Architecturally, the part belongs to the Arria 10 SX family (10AS) targeting mid-range, power-efficient designs. The HPS is connected to the FPGA fabric through four high-bandwidth bridges (AXI bridges) that deliver up to 125 Gbps aggregate throughput between the processors and logic, enabling tight CPU-to-FPGA coprocessing without external chip-to-chip links. The industrial-grade temperature range and the FCBGA-1152 package make the variant a workhorse for line-card designs, machine-vision platforms, and 4K video broadcast equipment. Typical applications include motor drives and industrial automation, medical imaging (ultrasound beamforming, endoscopy), military/aerospace signal processing, 4K/8K video broadcast infrastructure, software-defined radio, and high-performance embedded computing modules. Its combination of dual-core ARM Cortex-A9 plus abundant DSP resources makes it a common choice for designs that previously required a discrete CPU plus a separate FPGA. When designing with the 10AS032H1F34I1HG, treat the HPS boot configuration, DDR4 layout, and transceiver channel placement as critical - signal-integrity issues in the BGA escape region and thermal management of the 1152-ball FCBGA are the two highest-risk integration challenges. Power estimation should begin with the Intel PowerPlay early estimator before PCB layout is finalized. This page consolidates distributor pricing and stock, drop-in alternative options, and engineering notes drawn from the manufacturer datasheet and Intel/Altera application notes - information not always visible on distributor-only product listings.

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10AS032H1F35E1HG

10AS032H1F35E1HG - Arria 10 SX SoC FPGA 320K LE, 1.5GHz, 1152-FBGA

The Intel (formerly Altera) 10AS032H1F35E1HG is a System on Chip (SoC) FPGA from the Arria 10 SX family that integrates a dual-core ARM Cortex-A9 MPCore hard processor subsystem with CoreSight debug alongside 320K logic elements of programmable fabric. The device operates at up to 1.5 GHz on the HPS side and is housed in a 1152-ball Flip-Chip BGA (FCBGA) package measuring 35x35 mm with 384 user I/Os. An SoC FPGA is a class of integrated circuit that combines a general-purpose processor subsystem (in this case ARM Cortex-A9) with programmable logic on a single die, providing hardware-software co-design flexibility. The Arria 10 SX sits in the mid-to-high-end of Intel's SoC FPGA portfolio, between the lower-power Cyclone V SoC and the high-performance Stratix 10 SoC, optimized for DSP-intensive and transceiver-rich applications where deterministic latency and parallel processing are required. Key features include the 320K logic elements backed by embedded M20K memory blocks and variable-precision DSP blocks, 24 transceivers supporting multi-gigabit serial protocols, external memory interfaces for DDR4/DDR3/RLDRAM3/QDRII+, and the dual-core 1.5 GHz ARM Cortex-A9 MPCore with NEON media engine and single/double-precision floating-point unit. The device targets throughput-oriented embedded designs. Architecturally, the Arria 10 SX uses TSMC's 20nm process and a coherent interconnect that allows the HPS and FPGA fabric to share memory through a 128-bit-wide multi-port SDRAM controller. Hardened PCI Express Gen3 controllers, hard memory controllers, and partial reconfiguration support reduce soft-logic overhead and accelerate time-to-market for designs requiring deterministic hardware acceleration alongside a software stack. Typical applications include high-performance signal processing in radar and electronic warfare, real-time video processing pipelines, 5G baseband prototyping, test and measurement instrumentation, industrial machine vision with on-board analytics, and aerospace flight control systems where the combination of ARM Cortex-A9 user-space Linux and FPGA-fabric data-plane acceleration is essential. When designing with this part, plan the PCB stack-up and power delivery network carefully: the 1152-FBGA package requires controlled-impedance escape routing, and the 0.8 mm (or finer) ball pitch demands microvia or HDI PCB technology. Allocate sufficient PCB layers for transceiver channels and DDR4 interfaces to maintain signal-integrity margins. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical board-design notes not found in the manufacturer datasheet alone, providing actionable information for hardware architects and procurement engineers evaluating the Arria 10 SX family.

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10AS032H1F35I1HG

10AS032H1F35I1HG - Arria 10 SX SoC FPGA 320K LE | Intel

The Intel 10AS032H1F35I1HG is an Arria 10 SX System-on-Chip (SoC) FPGA integrating dual ARM Cortex-A9 MPCore processors with CoreSight debug technology alongside 320K logic elements, delivered in a 1152-pin FC-FBGA package (35x35 mm). The device combines a hardened CPU subsystem with programmable FPGA fabric in a single die, targeting embedded compute applications that demand deterministic real-time response alongside parallel hardware acceleration. A System-on-Chip FPGA is a heterogeneous compute device that merges a general-purpose processor subsystem with reconfigurable logic on one silicon die. Within the taxonomy, it sits between standard microcontrollers and pure FPGAs: microcontrollers execute sequential software, FPGAs implement parallel hardware, and SoC FPGAs enable hybrid architectures where each task runs on the substrate best suited to it. The Arria 10 SX family specifically targets mid-range applications balancing DSP throughput, transceiver bandwidth, and ARM Cortex-A9 software flexibility. Key features of the 10AS032H1F35I1HG include 384 general-purpose I/Os, up to 1.5 GHz processor subsystem clock, integrated CoreSight debug, low-power 20 nm process technology, hardened floating-point DSP blocks, and up to 24 transceivers supporting multi-gigabit serial protocols. The H1 device-density suffix denotes a specific logic-element count and transceiver configuration tier within the Arria 10 SX family. The package operates across industrial temperature ranges suitable for ruggedized deployment. Architecturally, the device partitions workloads between the dual-core ARM Cortex-A9 hard processor system for operating-system and control-plane tasks, and the FPGA fabric for data-plane acceleration including DSP, packet processing, and custom interfaces. This division delivers higher performance-per-watt than discrete CPU-plus-FPGA solutions because the interconnect bandwidth between hard CPU and soft logic avoids board-level serializer-deserializer overhead. Typical applications include industrial machine vision, military radar and electronic warfare, medical imaging systems, test and measurement equipment, and 5G wireless baseband processing. The integration of ARM cores with FPGA fabric reduces bill-of-materials count and PCB complexity while enabling software-defined customization of hardware accelerators. When designing with this device, allocate thermal budget to the FC-FBGA package's exposed-die land pattern and use a multilayer PCB stackup with embedded thermal vias to manage junction temperature. Always consult the Arria 10 SX device datasheet for transceiver channel placement and pinout assignments before committing to a PCB layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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10AS032H2F34E1HG

10AS032H2F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel

The Intel (formerly Altera) 10AS032H2F34E1HG is a high-performance Arria 10 SX System-on-Chip (SoC) FPGA integrating a dual-core ARM Cortex-A9 MPCore hard processor system with a 320K logic-element Arria 10 SX FPGA fabric in a 1152-ball Flip-Chip BGA (FC-FBGA, 35x35 mm) package. The device combines programmable logic with a 1.5 GHz hard processor subsystem, supports 384 user I/Os, and is fabricated on a 20 nm TSMC process for low static and dynamic power. An SoC FPGA is an integrated circuit that merges a general-purpose processor subsystem with a programmable FPGA fabric on a single die, allowing designers to allocate compute-intensive or latency-critical functions to dedicated hardware while running control-plane software on the embedded CPU. SoC FPGAs sit in the broader hierarchy of programmable logic devices (PLD -> FPGA -> SoC FPGA -> embedded platform), and the Arria 10 SX family targets mid-range applications where high transceiver count, DSP performance, and processor integration are required without paying the cost of a Stratix-class device. Key differentiating specifications include 320,000 logic elements, embedded transceivers up to 12.5 Gbps, 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight debug, 384 user I/O pins, 0.9 V core voltage, and AEC-Q100-style industrial-grade temperature support. The part also exposes hard memory controllers, PCIe Gen3 hard IP blocks, and a rich peripheral set routed through the HPS-to-FPGA bridge. The device is built on TSMC's 20 nm process, providing optimal logic density at moderate power. The integrated CoreSight subsystem offers non-intrusive trace, and the HPS includes DDR3/DDR4 controller support for high-bandwidth memory access, enabling single-chip designs that previously required separate processor and FPGA components. Typical applications include high-speed industrial imaging, military radar signal processing, medical imaging backplanes, test and measurement instrumentation, and high-bandwidth protocol bridging. The combination of hard ARM cores and dense FPGA fabric makes the part ideal for designs that mix deterministic hardware acceleration with Linux-capable software stacks. When designing with the 10AS032H2F34E1HG, plan thermal management carefully - the FC-FBGA package requires controlled impedance PCB stack-up and substantial copper for heat dissipation. Use Altera/Intel Quartus Prime for synthesis and configuration, and consider the device's power-on sequencing requirements for proper HPS and FPGA bring-up. This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet alone.

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10AS032H2F34E2LG

10AS032H2F34E2LG - Arria 10 SX 320 SoC FPGA, 320K LE | Intel

The Intel (Altera) 10AS032H2F34E2LG is a System-on-Chip FPGA from the Arria 10 SX family, integrating a dual-core ARM Cortex-A9 MPCore with CoreSight debug plus 320K logic elements (LEs) in a single 1152-pin FC-FBGA package measuring 35x35 mm. It is a member of the 10AS032 device tier (mid-density), speed grade 2, and the H2 variant denotes the SoC FPGA configuration with hard processor system (HPS). The device is specified for the F34 package option (1152-ball FC-FBGA) and E2 commercial/extended temperature grade. A SoC FPGA is a heterogeneous compute device that combines a general-purpose processor subsystem (HPS) with programmable FPGA fabric on the same silicon die, connected by a wide high-bandwidth interconnect. The Arria 10 SX family is fabricated on Intel's 20 nm process and targets mid- to high-performance embedded applications where designers need both deterministic hardware acceleration (parallel DSP, custom I/O protocols) and a Linux-capable application processor on one chip, reducing board area, power, and BOM compared to a discrete FPGA-plus-microprocessor solution. Key features include 320K logic elements, embedded M20K memory blocks totaling approximately 21 Mb of on-chip RAM, variable-precision DSP blocks supporting IEEE 754 single-precision floating-point at up to 1.5 GHz, transceivers rated up to 14.1 Gbps, and hard memory controllers for DDR4/DDR3/QDRII+/RLDRAM3. The HPS block includes dual 32-bit ARM Cortex-A9 cores, NEON media engine, single- and double-precision FPU, L1 cache per core, 512 KB shared L2 cache, and a rich peripheral set including USB 2.0, Gigabit Ethernet, NAND flash controller, and SD/SDIO/MMC interfaces. Typical applications include wireless baseband processing (4G LTE small cells, CPRI front-haul), radar signal processing, video broadcast and studio equipment, medical imaging, and industrial machine vision. Designers select the 10AS032 over the smaller 10AS022 and larger 10AS066 to balance logic, DSP, and transceiver resources against cost and power for mid-density workloads. Design considerations: 1152-ball FC-FBGA requires high-density PCB stack-up with microvia and HDI technology; route length matching must be enforced for DDR4 interfaces; heat dissipation at full transceiver utilization may require a heatsink or forced-air cooling; the HPS boot sequence requires a valid boot source (QSPI flash, SD card, or NAND). This page synthesizes distributor pricing, family-level drop-in alternatives from the same Arria 10 SX tier, and design notes that complement the device datasheet.

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10AS032H2F34E2SG

10AS032H2F34E2SG - Arria 10 SX 320K LE SoC FPGA | Altera / Intel

The Altera (Intel) 10AS032H2F34E2SG is a dual-core ARM Cortex-A9 MPCore System-on-Chip FPGA from the Arria 10 SX family, integrating 320,000 logic elements with a 1.5 GHz hard processor system in a 1152-pin FC-FBGA package (35 x 35 mm). The device combines a high-performance FPGA fabric with an embedded dual-core 64-bit ARM Cortex-A9 MPCore processor subsystem with CoreSight debug, targeting compute-intensive applications that require both hardware acceleration and software programmability in a single device. A System-on-Chip (SoC) FPGA is an integrated circuit that combines a programmable logic (FPGA) fabric with one or more hard processor cores on a single die, enabling hardware/software co-design. Within the broader taxonomy, an SoC FPGA sits at the intersection of FPGA (programmable gate array), ASIC (application-specific integrated circuit), and microprocessor/microcontroller, allowing designers to allocate compute-intensive functions (DSP, packet processing, encryption) to dedicated FPGA fabric while running control software, OS, and networking stacks on the embedded processor cores. The Arria 10 SX family specifically delivers mid-range FPGA logic density with high-end DSP and transceiver bandwidth. Key features of the 10AS032H2F34E2SG include 320K logic elements, hard DDR4 memory controller support, integrated transceivers, and a high-bandwidth processor-to-FPGA bridge. The 20nm process technology delivers improved performance per watt compared with the previous 28nm Arria V generation. The 1.5 GHz dual-core ARM Cortex-A9 subsystem provides NEON media processing engines and includes CoreSight debug infrastructure for trace and performance monitoring. Typical applications include wireless baseband processing, radar and signal intelligence systems, broadcast video infrastructure, industrial machine vision, and high-performance test & measurement equipment. The integrated HPS makes the device well suited to designs that must boot an embedded Linux or RTOS while simultaneously accelerating DSP pipelines in fabric. Design considerations include careful PCB layout for the 1152-ball FC-FBGA, dedicated power rail sequencing for the FPGA core, HPS, and transceivers, and thermal management at the 35 x 35 mm package scale. Designers should follow Altera's pin connection guidelines to ensure unused FPGA pins are properly terminated and the HPS boot configuration pins are correctly set. This page synthesizes distributor stock and pricing, package details, and drop-in alternatives sourced from real-time web searches that engineers can compare alongside the manufacturer datasheet.

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10AS032H2F34I1HG

10AS032H2F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel

The Intel (formerly Altera) 10AS032H2F34I1HG is a high-density Arria 10 SX System-on-Chip FPGA integrating 320K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor subsystem in a 1152-ball FCBGA (35x35 mm) package. It is fabricated on TSMC's 20 nm process and operates at up to 1.5 GHz on the HPS side, with logic fabric speeds suitable for high-throughput DSP and transceiver-based designs. An SoC FPGA combines a traditional programmable logic fabric with a hard processor system on a single die, allowing hardware accelerators to communicate with the processor over a coherent interconnect. Arria 10 SX sits in Intel's mid-range SoC portfolio, above Cyclone V but below Stratix 10, balancing logic density, transceiver performance, power efficiency, and processor capability for cost-effective embedded compute. Key features include 1.5 GHz dual-core ARM Cortex-A9 with CoreSight debug, integrated DDR3/DDR4 memory controllers, PCIe Gen3 x8 hard IP blocks, up to 24 transceiver channels at multi-gigabit data rates, and variable-precision DSP blocks supporting IEEE 754 single-precision floating point. The 1152-FBGA package provides the I/O density required for memory-rich and transceiver-rich designs. The hard processor subsystem offloads complex control-plane tasks from the FPGA fabric, enabling deterministic interrupt latency and software reuse. Coherent accesses between the HPS and FPGA fabric eliminate the need for explicit data copying across AXI bridges in many workloads, simplifying architecture for vision, motor control, and protocol bridging designs. Typical applications include industrial machine vision, motor control and drives, software-defined radio front ends, automotive ADAS prototypes, broadcast video processing, and 5G baseband pre-processing. The device's combination of ARM Cortex-A9 software ecosystem and Arria 10 DSP fabric is particularly well suited to mixed-control/signal-processing workloads. When designing with this device, pay close attention to PCB BGA escape routing, multi-rail power sequencing (0.95 V core, 1.1 V HPS, 1.5 V transceiver, 2.5 V/3.3 V I/O), and thermal management for sustained compute loads. The Quartus Prime design suite provides reference designs and IP cores tailored to Arria 10 SX variants. This page synthesizes distributor pricing, drop-in alternatives drawn from the Arria 10 family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a faster path from selection to bring-up.

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10AS032H2F34I2LG

10AS032H2F34I2LG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA

The Intel 10AS032H2F34I2LG is a 320K logic-element Arria 10 SX SoC FPGA integrating dual ARM Cortex-A9 MPCore with CoreSight debug, manufactured on a 20nm process and packaged in a 1152-ball FC-FBGA measuring 35x35 mm. The device combines a high-performance FPGA fabric with a hard processor system (HPS) running up to 1.5 GHz and is graded for the industrial -40C to +100C temperature range. A SoC FPGA is a single-chip integration of a microprocessor subsystem and programmable logic. The hard ARM Cortex-A9 MPCore delivers deterministic real-time performance for control-plane tasks while the FPGA fabric accelerates parallel datapath functions such as DSP, packet processing, and custom interfaces. This heterogeneous architecture falls within the broader taxonomy of system-on-chip -> application processor + FPGA -> embedded compute platform. Key specifications include 320K logic elements, 1.5 GHz HPS clock, 20nm TSMC process technology, 0.9 V core supply, 1152-ball flip-chip BGA with 35x35 mm body, and industrial-grade operating temperature. The Arria 10 SX family is designed for mid-range, transceiver-rich embedded applications where software/firmware partitioning between HPS and FPGA fabric yields BOM and latency advantages over discrete CPU-plus-FPGA designs. Architecturally, the device pairs a hardened ARM dual-core A9 cluster with NEON SIMD, L1/L2 caches, and CoreSight trace, alongside 28 nm-equivalent-class FPGA fabric, dedicated DSP blocks, and up to 17.4 Gbps transceivers. The 20nm process enables higher logic density at lower static power than the prior 28nm Arria V generation while maintaining the same Quartus Prime tool flow. Typical applications include industrial motor control, software-defined radio baseband, machine vision preprocessing, military/aerospace signal processing, and high-performance embedded computing. The integrated HPS removes external processor glue and reduces board area, while the FPGA fabric handles deterministic I/O and parallel datapath workloads. When designing with this device, ensure the PCB supports the 1.0 mm ball-pitch FC-FBGA land pattern with proper microvia stack-up and matched-length high-speed transceiver routing. Power sequencing of the HPS core, FPGA core, and transceiver supplies must follow the Intel Power Management User Guide to avoid in-rush latch-up. This page consolidates distributor pricing, drop-in alternatives within the Arria 10 SX family, and practical design notes synthesized from the Altera/Intel datasheet family — content not available on the manufacturer part page alone.

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10AS032H2F34I2SG

10AS032H2F34I2SG - Arria 10 SX 320K SoC FPGA, 1.5GHz, 1152-FBGA | Intel

The Intel 10AS032H2F34I2SG is a member of the Arria 10 SX family of System-on-Chip FPGAs, integrating a dual-core ARM Cortex-A9 MPCore hard processor system with CoreSight debug and 320,000 logic elements on Intel's 20nm process. The device operates at up to 1.5 GHz on the HPS side and is offered in a 1152-ball flip-chip BGA package measuring 35x35 mm, with industrial-grade temperature rating and 0.9 V core operation. This part combines programmable logic with a hardened application processor subsystem, targeting high-throughput embedded designs. A System-on-Chip FPGA (SoC FPGA) is an integrated circuit that combines a general-purpose processor subsystem (typically ARM Cortex-A cores) with a programmable FPGA fabric on a single die, connected through a high-bandwidth interconnect. The hierarchy is: SoC FPGA -> FPGA -> programmable logic -> semiconductor. SoC FPGAs differ from pure FPGAs by integrating a hard processor, eliminating the need for a soft processor core and improving real-time deterministic performance for control planes while keeping the FPGA fabric available for data-plane acceleration. Key features of the Arria 10 SX 320 include 256 KB on-chip RAM in the HPS subsystem, support for external DDR3/DDR4 memory interfaces through the FPGA fabric, integrated transceivers, and partial reconfiguration capability. The 1152-FBGA flip-chip package supports the high I/O count required for memory, transceiver, and general-purpose I/O at industrial-grade reliability. The 20nm process technology provides a favorable performance-per-watt ratio relative to the prior 28nm Arria V generation. Typical applications include high-performance industrial vision systems, motor control, software-defined radio baseband, military and aerospace signal processing, and embedded compute modules requiring both ARM Linux processing and FPGA fabric acceleration. The combination is particularly attractive where deterministic latency on the FPGA side and full operating system support on the HPS side must coexist. Designers should ensure proper thermal management given the 35x35 mm FCBGA footprint and adequate PCB layer count for power delivery and signal integrity.

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10AS032E3F29I2LG - Arria 10 SX SoC FPGA 320K LE 20nm | Intel

10AS032E3F29I2SG - Arria 10 SX SoC FPGA 320K LE | Intel

10AS032E4F27E3LG - Arria 10 SX 320K SoC FPGA, 672-FBGA | Intel

10AS032E4F27E3SG - Arria 10 SX SoC FPGA 320K LE | Altera (Intel)

10AS032E4F27I3LG - Arria 10 SX 320 SoC FPGA, 672-FBGA | Intel

10AS032E4F27I3SG - Arria 10 SX SoC FPGA, 320K LE, 672-FBGA | Intel

10AS032E4F29E3LG - Arria 10 SX SoC FPGA 320K LE 780-FBGA | Intel

10AS032E4F29E3SG - Arria 10 SX 320K SoC FPGA | Intel

10AS032E4F29I3LG - Arria 10 SX SoC FPGA, 320K LE, 780-FBGA | Altera

10AS032E4F29I3SG - Arria 10 SX SoC FPGA, 320K LE, 1.5GHz | Intel

10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)

10AS032H1F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FCBGA | Intel

10AS032H1F35E1HG - Arria 10 SX SoC FPGA 320K LE, 1.5GHz, 1152-FBGA

10AS032H1F35I1HG - Arria 10 SX SoC FPGA 320K LE | Intel

10AS032H2F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel

10AS032H2F34E2LG - Arria 10 SX 320 SoC FPGA, 320K LE | Intel

10AS032H2F34E2SG - Arria 10 SX 320K LE SoC FPGA | Altera / Intel

10AS032H2F34I1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel

10AS032H2F34I2LG - Arria 10 SX 320K LE SoC FPGA | Intel | 1152-FBGA

10AS032H2F34I2SG - Arria 10 SX 320K SoC FPGA, 1.5GHz, 1152-FBGA | Intel