Intel Nova Lake-HX and -H die shots surface: six-tile mobile package mapped
Bare-die photos of Nova Lake-HX and -H lay out a six-tile mobile package using TSMC N2P, Intel 3-E and Intel 18A-P nodes, with new core counts and package sizes.
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Modded Preset C Brings Up to 35% Faster DLSS Frame Generation to RTX 30-Series GPUs
dashdogy's Universal MFG Unlocker v1.5.0 enables NVIDIA's new Preset C on Ampere cards, but RTX 30 numbers and image-quality trade-offs remain unverified.
SP Industrial launches six enterprise SSDs: PCIe Gen5 E1.S to 7.6 TB and 2.5" SATA for AI racks
SP Industrial adds six 3D eTLC enterprise SSDs across E1.S, U.2, M.2 2280, and 2.5" SATA, with a 7.6 TB PCIe Gen5 E1.S and dual 1/3 DWPD endurance tiers.
Hybrid bonding process maturity: what 1um pitch and 450nm demos mean for HBM and chiplet roadmaps
A 3D InCites technical review of hybrid bonding defects, CMP, warpage, and annealing shows Applied Materials at 450nm pitch with 98% yield and imec at 200nm pitch on 300mm W2W.
What ChipAgents and NVIDIA's Build-A-Chip-Bench means for autonomous RTL-to-GDS tooling
ChipAgents and NVIDIA launch Build-A-Chip-Bench to score end-to-end digital chip design. Only ~10% of agent runs hit PPA targets, exposing the gap to tapeout-ready AI.
Epomaker Galaxy75 wireless keyboard adds 75% layout, aluminium case, VIA support
Epomaker confirmed a 75% Galaxy keyboard with VIA remapping, aluminium chassis, gasket mount, and Creamy Jade linear switches; pricing is still unconfirmed.
NVIDIA RTX Spark superchip locked to Windows 11 AAA day-one with DLSS 5 and anti-cheat support
NVIDIA pairs a 20-core Grace CPU with a 6,144-CUDA Blackwell iGPU under the RTX Spark name, backed by Microsoft and game studios for Arm64 translation and kernel-mode anti-cheat parity.
SEMI lifts 300 mm fab equipment outlay to $227B by 2029: what it means for tool and materials supply
SEMI projects 300 mm front-end fab equipment spend rising to $149B in 2026 (+31% YoY) and $227B in 2029, with 20 new fabs/lines starting construction in 2026.
ERS Bundles Three Panel-Level Packaging Steps Into One 310mm Platform
ERS electronic has delivered a fully automated 310x310mm PLP system that runs bonding, debonding and detaping in a single platform at 13 panels per hour, removing inter-tool transfers between three thermally critical steps.
GlobalFoundries FDX Fusion: What a 7 nm-class FD-SOI Return Means for Sourcing
GlobalFoundries re-enters the advanced-node conversation with FDX Fusion, a 7 nm-class FD-SOI platform. Engineers get a low-power option, buyers get a second source angle.
Bioinspired Robotics Pioneer Proposes "Sustainability Robotics" Field for Greenerable Earth Design
Barbara Mazzolai of IIT outlines a manifesto calling for robots designed from the start for reuse, recycling, or biodegradation, with implications for hardware material choices.
HERMES open-source shortwave radio brings file-level data rates to off-grid deployments
Rhizomatica's HERMES digital HF radio and Mercury modem push shortwave beyond voice, supporting encrypted file transfers for telemedicine and distress signaling 100-200 km offshore.
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