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Microchip has acquired VORAGO Technologies, folding radiation-hardened MCUs/MPUs and the HARDSIL silicon process into its aerospace, defense and space portfolio.
Wolfspeed received a conditional 30-year, $1.5B loan commitment from the U.S. Department of War to expand domestic SiC and GaN production. We unpack the deal terms and what buyers should watch.
GlobalFoundries will manufacture silicon interposers for TSMC's CoWoS line at its Malta, NY fab, with H1 2028 ramp and a five-year initial term.
A GitHub project shows the MediaTek MT7996 inside the Gemtek W1700K WiFi 7 router streaming raw I/Q over Ethernet for use as a software-defined radio receiver on the 2.4, 5, and 6 GHz bands.
ERS electronic has delivered a fully automated 310x310mm PLP system that runs bonding, debonding and detaping in a single platform at 13 panels per hour, removing inter-tool transfers between three thermally critical steps.
GlobalFoundries re-enters the advanced-node conversation with FDX Fusion, a 7 nm-class FD-SOI platform. Engineers get a low-power option, buyers get a second source angle.
Oregon State picked Solidigm D5-P5336 for shipboard and ranger-station AI. What 122TB at sea, 55GB/s U.2 reads, and 250TB ingest cycles mean for buyers.
PV Magazine reports that over 70% of U.S. solar manufacturing expansion announcements covering 2027 spending remain unfunded, with 2027 capex forecast to fall below 2026's ~$3 billion figure.
Barbara Mazzolai of IIT outlines a manifesto calling for robots designed from the start for reuse, recycling, or biodegradation, with implications for hardware material choices.
Rhizomatica's HERMES digital HF radio and Mercury modem push shortwave beyond voice, supporting encrypted file transfers for telemedicine and distress signaling 100-200 km offshore.
An open-source business-card device negotiates USB PD 3.1 up to 48 V, displays live V/I/W, and exposes a browser console for bench use.
Micron's Taiwan union has voted 99-to-1 to authorize a strike over profit sharing. With DRAM demand already outstripping supply into 2028, design and procurement teams should brace for further memory cost pressure.
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