集積回路

サブカテゴリ

📁 ADC/DAC 2,700+ 製品 📁 アンプIC 1,100+ 製品 📁 オーディオコーデック 18 製品 📁 オーディオIC 2 製品 📁 クロック＆タイミング 480+ 製品 📁 Comparator ICs 0 製品 📁 DSP 1,000+ 製品 📁 データ収集IC 2 製品 📁 デジタルポテンショメータ 4 製品 📁 ディスプレイドライバ＆コントローラ 1 製品 📁 FPGA & CPLD 6,800+ 製品 📁 インターフェースIC 2,300+ 製品 📁 LEDドライバ 1 製品 📁 ロジックIC 360+ 製品 📁 メモリIC 870+ 製品 📁 マイクロコントローラ 19,000+ 製品 📁 マイクロプロセッサ 4 製品 📁 モータドライバ 1 製品 📁 その他 1 製品 📁 Sensor and Detector Interfaces 1 製品 📁 専用IC 15 製品 📁 ビデオIC 13 製品

製品 (35,000+)

TAS5827 - 47W Stereo Closed-Loop Class-D Amp | TI
TAS5827

TAS5827 - 47W Stereo Closed-Loop Class-D Amp | TI

The TAS5827 is a stereo high-performance, closed-loop Class-D audio amplifier with an integrated audio processor and support for up to 192-kHz audio. It delivers 47W per channel in BTL mode and is housed in a 32-pin VQFN (5x5 mm) package. The device features a digital input interface, making it ideal for modern digital audio systems. A Class-D amplifier is a switching amplifier that uses pulse-width modulation to achieve high efficiency, often exceeding 90%, compared to linear amplifiers. It is a key component in the audio signal chain, converting digital audio data into high-power analog output while minimizing heat dissipation. The TAS5827 integrates a closed-loop architecture, which improves linearity and reduces distortion, and an audio processor for advanced signal processing. Key features include a delay buffer up to 5ms in BTL mode or 10ms in PBTL mode, Class-H control for enhanced efficiency, and hardware control mode for selecting switching frequency, analog gain, BTL/PBTL mode, and cycle-by-cycle current limit threshold via pin configuration. The device also supports software control mode with classic BQs, 3-band DRC, AGL, and proprietary audio envelope tracking Class-H control. The TAS5827 uses a closed-loop feedback design that reduces power supply noise and improves audio quality. It integrates a high-performance audio processor capable of executing complex DSP algorithms, making it suitable for applications requiring EQ, DRC, and dynamic range compression. The device operates from a single supply and includes comprehensive protection features. Typical applications include smart speakers, soundbars, home theater systems, and active speakers. Its high efficiency and low power dissipation make it ideal for battery-powered and energy-conscious designs. The integrated audio processor reduces external component count, simplifying system design. When designing with the TAS5827, ensure proper PCB layout for thermal management and minimize parasitic inductance in the output stage. Use appropriate decoupling capacitors on the power supply pins and follow the recommended layout in the datasheet for optimal performance.

見積もり お問い合わせ
TAS5827RHBR - 43W Stereo Digital Class-D Amp | Texas Instruments
TAS5827RHBR

TAS5827RHBR - 43W Stereo Digital Class-D Amp | Texas Instruments

The Texas Instruments TAS5827RHBR is a 43-W stereo, digital-input, closed-loop Class-D audio amplifier with integrated audio processing and Class-H control. Housed in a 32-pin VQFN (RHB) package measuring 5x5 mm, this device delivers high-efficiency amplification for a wide range of consumer and professional audio applications. It supports a supply voltage range of 4.5V to 26.4V and operates over a temperature range of -40°C to 85°C. A Class-D amplifier is a switching amplifier that uses pulse-width modulation (PWM) to achieve high efficiency, often exceeding 90%, compared to linear amplifiers. The TAS5827 integrates a closed-loop architecture that reduces distortion and improves power supply rejection, making it suitable for high-fidelity audio systems. The digital input interface accepts I2S, TDM, and other digital audio formats, simplifying system design by eliminating the need for external DACs. Key features include a 43-W output power per channel into 4-ohm loads, integrated audio processor with biquad filters and dynamic range compression, and Class-H control that optimizes power supply voltage for efficiency. The device also supports multiple switching frequencies and offers cycle-by-cycle current limit protection. Its closed-loop design ensures low THD+N and high signal-to-noise ratio, critical for premium audio performance. The TAS5827 uses a digital audio processing core that can be configured via I2C or hardware control mode. In hardware mode, switching frequency, analog gain, BTL/PBTL mode, and current limit threshold are set via pins, eliminating the need for software driver integration. This flexibility makes it easy to deploy in systems where firmware development is not desired. Typical applications include smart speakers, soundbars, home theater systems, and automotive audio. The high efficiency reduces heat dissipation, enabling compact designs without large heatsinks. The integrated audio processor allows designers to implement EQ, crossover, and dynamic range control without external DSP. When designing with this device, ensure proper PCB layout with adequate ground planes and decoupling capacitors near the power pins. The thermal pad must be soldered to a copper area for heat dissipation. Also, consider the input signal format and configure the device accordingly for optimal performance.

見積もり お問い合わせ
TAS6754QDKQRQ1 - Automotive 4-Ch Class-D Audio Amp | TI
TAS6754QDKQRQ1

TAS6754QDKQRQ1 - Automotive 4-Ch Class-D Audio Amp | TI

The TAS6754QDKQRQ1 is an automotive-grade, four-channel digital-input Class-D audio amplifier from Texas Instruments, offered in a 56-pin HSSOP (DKQ) package with exposed thermal pad. It implements 1L modulation, requiring only one inductor per BTL channel, and operates from a 19V supply with a 2MHz switching frequency. The device integrates current sense and real-time DC/AC load diagnostics for robust automotive speaker fault detection. A Class-D audio amplifier is a switching amplifier that converts a digital or analog audio signal into a high-frequency pulse-width modulated square wave, which is then low-pass filtered to reconstruct the audio. Class-D topologies achieve high efficiency (typically 80-90%) because the output transistors operate as switches, minimizing power dissipation compared to linear Class-AB amplifiers. In automotive audio systems, this efficiency reduces heat-sinking requirements and extends the available audio power from the vehicle's electrical system. Key features include four independent audio channels, 1L modulation that removes four inductors versus traditional designs, 2MHz switching for compact output filters, integrated current sense, and DC/AC real-time load diagnostics. The 19V rated supply is aligned with automotive audio power rails, and the AEC-Q100 Q1 suffix qualifies the device for automotive applications. The 56-pin HSSOP package supports surface-mount assembly with an exposed thermal pad for heat removal. 1L modulation is a proprietary Class-D scheme that uses a single inductor per bridge-tied-load channel, reducing system cost and size. The 2MHz switching rate moves the switching fundamental well above the audio band, simplifying the output low-pass filter and lowering out-of-band emissions. Integrated current sense and real-time load diagnostics monitor speaker health, enabling fault detection for shorts, opens, and degradation. The digital input accepts common automotive digital audio formats, eliminating the need for a separate DAC and analog front end. Typical applications include automotive infotainment head units, external amplifier modules, EV pedestrian warning (AVAS), telematics/eCall audio, rear-seat entertainment, and commercial-vehicle audio. The device is especially suited for designs where four channels of clean audio must be delivered from a 19V rail with minimal inductor count and integrated diagnostic coverage. When designing with the TAS6754QDKQRQ1, provide sufficient copper area on the exposed thermal pad and keep the output LC filter close to the device to minimize EMI. Verify the digital audio source timing and protocol against the datasheet before PCB layout.

見積もり お問い合わせ
TC222L16F133NACKXUMA1 - AURIX 32-Bit MCU 133MHz 1MB Flash | Infineon
TC222L16F133NACKXUMA1

TC222L16F133NACKXUMA1 - AURIX 32-Bit MCU 133MHz 1MB Flash | Infineon

The Infineon TC222L16F133NACKXUMA1 is an AURIX TC2xx family 32-bit TriCore microcontroller IC running at 133 MHz with 1 MB on-chip Flash program memory and 96 KB SRAM (including cache), housed in an 80-lead PG-TQFP-80-7 (HTFQFP, exposed pad) package with gull-wing leads and automotive-grade temperature rating. The TC22xL sub-family is positioned as the entry point of the AURIX TC2xx generation for safety-critical chassis, body, and powertrain applications where deterministic computation and integrated peripherals reduce system cost. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, peripherals, and interrupt control on one die. AURIX TriCore combines a RISC-like microcontroller core, a DSP arithmetic unit, and a super-scalar pipeline in one ISA, allowing efficient mixed control-and-signal-processing workloads. The TC22xL belongs to the AURIX microcontroller family, which itself sits within Infineon's embedded processing portfolio and the broader 32-bit automotive MCU category alongside Traveo and PSoC families. Key features of the TC222L16F133NACKXUMA1 include 3 CAN nodes, 133 MHz maximum TriCore clock, 1 MB Flash with 96 KB SRAM, and a 12-bit A/D converter with up to 16 input channels for analog sensing. The device also integrates timers, ASCLIN SPI/UART, and hardware security modules (HSM) for secure boot and cryptographic acceleration. Automotive-grade qualification and a -40C to +125C (or higher) junction-temperature range make it suitable for under-hood and chassis ECUs. Peripheral integration reduces external component BOM compared with discrete MCU plus external ADC designs. Typical applications for TC222L16F133NACKXUMA1 cover electric power steering (EPS), electronic stability control (ESC), airbag systems, body control modules (BCM), and transmission control units (TCU). It is also used in sensor fusion ECUs and zone controllers in zonal vehicle E/E architectures. The integrated HSM and lockstep-capable timers make it a popular choice for ASIL-B/D rated subsystems in next-generation vehicle designs. When designing with this part, ensure PCB layout follows the exposed-pad thermal recommendations - the die is thermally coupled to the package bottom pad and must be soldered to a sufficiently large copper area. The 80-pin TQFP-80 (HTFQFP) footprint requires a 0.5 mm pitch land pattern; reflow profile must respect the moisture-sensitivity level printed on the reel label. Always refer to the Infineon AURIX TC22xL datasheet family for full register definitions and HSM provisioning steps. This page synthesizes distributor pricing tiers, drop-in AURIX family alternatives, and practical automotive-ECU design notes not collected in any single manufacturer datasheet revision.

見積もり お問い合わせ
TC222S16F133FACKXUMA1 - AURIX TC22xL 32-Bit MCU 1MB Flash | Infineon
TC222S16F133FACKXUMA1

TC222S16F133FACKXUMA1 - AURIX TC22xL 32-Bit MCU 1MB Flash | Infineon

The Infineon TC222S16F133FACKXUMA1 is a 32-bit single-core TriCore AURIX TC22xL microcontroller operating at 133 MHz, integrating 1 MB of embedded Flash and 96 KB of SRAM (including cache) in an 80-pin PG-TQFP-80-7 surface-mount package with exposed thermal pad. The device belongs to Infineon's AURIX TC2xx family and is qualified for automotive use, providing up to 3 CAN nodes along with a rich set of peripherals targeting safety-critical embedded control. AURIX (Automotive Realtime Embedded Next-generation Multiprocessor) is Infineon's automotive-grade 32-bit MCU family that combines one or more TriCore CPUs, on-chip Flash, SRAM, and dedicated safety/security peripherals in a single die. Each TriCore combines a RISC processor, DSP, and microcontroller into one Harvard-style architecture, making AURIX MCUs well suited to powertrain, chassis, body, ADAS, and gateway ECUs that need real-time deterministic control plus signal processing. The TC22xL series is the entry-level 1D single-core tier of the AURIX TC2xx lineup. Key features include 133 MHz maximum core clock, 1 MB (1M x 8) program Flash, 96 KB SRAM, 3 hardware CAN nodes, on-chip debug and trace, and an extended automotive operating temperature range. The PG-TQFP-80-7 package integrates an exposed pad (EP) to lower thermal resistance and improve heat removal, enabling the IC to sustain full peripheral activity at ambient temperatures within automotive specifications. The TriCore architecture pairs DSP-class arithmetic with deterministic interrupt response, enabling sensor-fusion and field-oriented motor control from a single chip. On-chip safety modules (ECC, watchdog, power-on reset) and hardware security (HSM or memory protection) support ASIL-D functional-safety designs. With 1 MB Flash and 96 KB SRAM, the TC222 fits medium-complexity automotive applications where cost and footprint matter more than dual-core redundancy. Typical applications include automotive body controllers, CAN gateway nodes, electric power steering peripherals, sensor-fusion pre-processors, and industrial CAN-connected motor drives. The 3 CAN node count is appropriate for use as a sub-bus bridge between in-vehicle network segments. When designing with this device, allocate proper decoupling on every supply pin and tie the exposed pad to a solid ground copper pour. Verify that the chosen debugger supports TriCore OCDS / DAP and that your compiler (e.g., HighTec, GCC, Tasking) supports the TC222 derivative before committing to firmware. This page synthesizes Infineon datasheet parameters, distributor pricing, and verified package information to help engineers evaluate the TC22xL family quickly.

見積もり お問い合わせ
TC265D40F200WBCKXUMA1 - AURIX 32-bit MCU, 2.5MB Flash, 200MHz, LQFP-176 | Infineon
TC265D40F200WBCKXUMA1

TC265D40F200WBCKXUMA1 - AURIX 32-bit MCU, 2.5MB Flash, 200MHz, LQFP-176 | Infineon

The Infineon TC265D40F200WBCKXUMA1 is an AURIX TC26xD family 32-bit dual-core TriCore microcontroller running at 200 MHz with 2.5 MB of embedded Flash and 176-pin LQFP-EP packaging, qualified to AEC-Q100 for automotive applications. The device integrates a high-performance TriCore v1.6 CPU subsystem with DSP and addressable SRAM, on-chip flash, and a peripheral set tailored to powertrain, chassis, and safety ECUs. A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash + SRAM), peripherals, and I/O on one silicon die. The AURIX TC2xx family is engineered for safety-critical embedded systems, combining lockstep TriCore cores, hardware security modules, and ASIL-D capable peripherals. Within the broader taxonomy, the TC265D40F200WBCKXUMA1 belongs to: MCU -> 32-bit MCU -> TriCore architecture -> AURIX family -> TC26xD sub-family -> automotive-grade MCU. Key features include 2.5 MB of program Flash, on-chip SRAM, a 200 MHz dual-core TriCore CPU with DSP instructions, and a rich peripheral mix including multiple CAN-FD nodes, SPI, LIN, QSPI, ASCLIN, and timers. The part also embeds a Programmable HSM (Hardware Security Module) for secure boot, key storage, and EVITA-Full cryptography, along with a GTM (Generic Timer Module) for complex PWM and motor-control tasks. The TC26xD implements Infineon's TriCore instruction set, which fuses RISC, DSP, and microcontroller paradigms in a single load/store architecture with deterministic interrupt latency. Built on a 40 nm embedded Flash process, it operates from a 3.3 V / 5 V supply with internal core logic on a separate voltage domain. Memory protection, ECC on Flash/SRAM, and lockstep compare logic support ASIL-D safety integrity when configured in dual-core lockstep mode. Typical applications include automotive body domain controllers, electric power steering, airbag ECUs, battery management systems, and industrial servo drives. The wide temperature range and integrated peripherals make it suitable for chassis, powertrain, and ADAS sensor fusion subsystems where deterministic performance and hardware security are mandatory. When designing with this part, provide at least four decoupling capacitors (100 nF + bulk) near each supply pin, follow Infineon PCB layout guidelines for the LQFP-176 EP package, and configure the HSM for secure boot before deploying production firmware. Use Infineon's AURIX Development Studio and the iLLD (Infineon Low-Level Driver) libraries to shorten firmware bring-up.

見積もり お問い合わせ
TC275T64F200WDCKXUMA1 - 32-Bit TriCore AURIX MCU, 200MHz, 4MB Flash | Infineon
TC275T64F200WDCKXUMA1

TC275T64F200WDCKXUMA1 - 32-Bit TriCore AURIX MCU, 200MHz, 4MB Flash | Infineon

The Infineon TC275T64F200WDCKXUMA1 is a 32-bit TriCore AURIX TC27xT microcontroller operating at up to 200 MHz with 4 MB of Flash memory, packaged in a 176-pin LQFP exposed-pad housing. It is built on Infineon's second-generation AURIX 1G-PSE architecture and integrates three independent TriCore CPU cores to deliver deterministic real-time performance for safety-critical automotive applications. An AURIX microcontroller (Automotive Realtime Embedded Integrated Processor Unit) is a family of multi-core 32-bit MCUs designed to meet the highest levels of functional safety (ISO 26262 ASIL-D) and information security (EVITA, HSM) in vehicles. Within the broader hierarchy, AURIX sits at the intersection of automotive microcontroller, safety MCU, and powertrain control processor, serving as the silicon backbone for domain and zonal controllers. The TC27xT family specifically targets powertrain, chassis, and advanced driver-assistance systems (ADAS) requiring deterministic interrupt latency, lockstep cores, and hardware security modules. Key specifications include 200 MHz maximum clock frequency across three TriCore v1.6 cores, 4 MB (4M x 8) of embedded Flash, 472 KB SRAM inclusive of cache, four CAN nodes, multiple LIN and FlexRay interfaces, and a hardware security module. The 1.3 V/5 V supply domain supports both low-voltage logic and 5 V peripheral interfacing without external level shifters. The PG-LQFP-176-22 package includes an exposed thermal pad that lowers junction-to-ambient thermal resistance for high-temperature under-hood operation. The TC275T64F200WDCKXUMA1 leverages Infineon's lockstep architecture to support ISO 26262 functional safety up to ASIL-D, making it suitable for systems where faults must be detected within a single clock cycle. Compared to single-core MCUs, the three-core TriCore arrangement separates application processing, peripheral control, and safety monitoring tasks, eliminating the need for an external watchdog or companion safety MCU. According to the Infineon AURIX 1G-PSE datasheet, the device is qualified to AEC-Q100 Grade 0 for automotive environments. Typical applications include engine management ECUs, transmission control units (TCUs), chassis domain controllers, electric vehicle (EV) inverter control, braking and stability systems, and zonal vehicle compute platforms. The combination of CAN FD, FlexRay, and LIN connectivity makes it a strong fit for legacy and modern in-vehicle networking topologies. When designing with this part, allocate adequate PCB copper under the exposed pad to meet the theta_JA thermal budget; without a minimum 100 mm² copper pour the maximum operating temperature becomes derated. Program Flash in production via the integrated bootloader or via JTAG using an Infineon DAS device. Always validate the AURIX safety case against the latest Infineon application note package. This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found on the manufacturer datasheet, helping procurement and design engineers make informed sourcing decisions.

見積もり お問い合わせ
TC297TP128F300SBCKXUMA1 - 300MHz TriCore AURIX 8MB MCU | Infineon
TC297TP128F300SBCKXUMA1

TC297TP128F300SBCKXUMA1 - 300MHz TriCore AURIX 8MB MCU | Infineon

The Infineon TC297TP128F300SBCKXUMA1 is a 32-bit TriCore automotive microcontroller from the AURIX TC29xT family, integrating three independent TriCore CPUs running at up to 300 MHz, 8 MB of embedded Flash and 728 KB of SRAM (including cache), in a PG-LFBGA-292-6 package. It is qualified to ISO 26262 ASIL-D functional-safety standards and AEC-Q100 for automotive use, with an operating voltage range of 3.3 V to 5 V and a junction temperature range of -40 °C to +125 °C. The device integrates the Generic Timer Module (GTM), six CAN nodes, and an Ethernet MAC, targeting powertrain, chassis, and ADAS domain controllers. Background Knowledge: AURIX (Automotive Realtime Integrated NeXt-generation architecture) is Infineon's second-generation TriCore microcontroller family designed for safety-critical automotive applications. TriCore combines the real-time capability of a microcontroller, the computational power of a DSP, and the interrupt responsiveness of a RISC CPU in a single core ISA. Within the AURIX taxonomy, TC29xT sits in the upper-performance tier: multicore (up to 3 TriCore CPUs), large Flash (8 MB), and abundant peripherals, supporting ISO 26262 ASIL-D system designs without external lockstep companion chips. Key features include three independent 300 MHz TriCore v1.6 CPUs, 8 MB program Flash with ECC, 728 KB SRAM, hardware security module (HSM) and EVITA-Full support, GTM for motor and timer orchestration, six CAN FD nodes, and 1 Gbit Ethernet. The 292-ball LFBGA package exposes the full peripheral set, including multiple SENT, PSI5, SPI, and LIN interfaces. Hardware over/under-voltage monitors and a built-in self-test (BIST) engine support ISO 26262 decomposition to ASIL-D at the system level. Architecturally, the TC297T uses lockstep and delayed-lockstep CPU pairs (depending on configuration) and dedicated checker cores to detect soft errors; the GTM provides parallel PWM and capture channels independent of CPU load, which is critical for deterministic motor control and fuel-injection timing. Memory is protected by ECC on Flash and parity/ECC on SRAM, and a Hardware Security Module isolates cryptographic keys for secure boot and OTA updates. Typical applications include automotive zone and domain controllers, electric-vehicle inverter and battery management controllers, ADAS sensor fusion pre-processors, chassis ECUs (braking, steering, suspension), and industrial safety controllers requiring IEC 61508 SIL-3. The combination of three cores and rich peripherals makes it well suited to chassis-domain ECUs where sensor acquisition, motor control, and vehicle-network gateway tasks run concurrently. When designing with this part, allocate generous PCB copper for the 292-ball LFBGA (a 4-layer minimum stack-up is recommended), keep analog 3.3 V supplies quiet (the EVRA regulator pin is noise-sensitive), and follow Infineon AURIX Application Note AP32267 for oscillator and PLL layout. The HSM must be provisioned before secure boot is enabled, so plan factory key injection in your manufacturing flow. This page synthesizes distributor pricing (DigiKey, Mouser, Octopart), same-brand TC29xT and TC3xx alternatives found in the Infineon cross-reference data, and design considerations not assembled in the bare manufacturer datasheet.

見積もり お問い合わせ
TC3220 - 1932-Channel eDP Tcon Embedded Driver | Parade
TC3220

TC3220 - 1932-Channel eDP Tcon Embedded Driver | Parade

The Parade Technologies TC3220 is a highly integrated eDP Timing Controller (Tcon) Embedded Driver (TED) IC developed for thin-profile LCD display panels. It supports all panel resolutions up to 1920×1200 using an 18-bit or 24-bit color format, providing a complete source-driver plus timing-control solution for embedded DisplayPort (eDP) panel designs in laptops, monitors, and all-in-one PCs. A Timing Controller (Tcon) is a semiconductor device that sits between a graphics controller and the LCD panel's source driver gates, translating display protocol packets into row/column timing signals and gamma-corrected pixel data. The TC3220 integrates the Tcon with source-driver outputs (the "Embedded Driver" or "TED" topology), eliminating the need for a separate source-driver chip and shrinking PCB real-estate, BOM count, and EMI emissions at the panel interface. This architecture sits in the broader hierarchy of: Tcon -> display controller -> video interface IC -> interface IC -> semiconductor IC. Key features include 1932 channels of source-driver output, native support for panel resolutions up to 1920×1200 (WUXGA), selectable 18-bit (262K colors) or 24-bit (16.7M colors) color depth, embedded DisplayPort (eDP) 1.x receive interface, integrated programmable gamma correction, on-chip charge-pump based bias generation, and wide-bus LVDS-style serial output to the gate driver. The integration of bias generation and gamma reduces external component count, which is critical for ultra-thin panel mechanical designs. The eDP interface (standardized by VESA as an internal panel display link) allows the TC3220 to receive uncompressed video directly from a GPU or eDP transmitter without the high-frequency external LVDS routing that legacy LCD panels required. Combined with the embedded source-driver architecture, the TC3220 minimizes the number of PCB layers and inter-chip flex cables, enabling notebook panel thicknesses below 3mm. Typical applications include WUXGA notebook LCD panels, ultrabook and 2-in-1 convertible displays, thin-profile all-in-one desktop monitors, embedded industrial HMI panels, and medical/diagnostic imaging displays. Designers choose the TC3220 over legacy Tcon-plus-source-driver pairs when panel thickness, BOM cost, and EMI margin are critical, and the panel resolution falls within the WUXGA envelope. When designing with the TC3220, ensure the upstream eDP transmitter supports the panel's required lane count and data rate. Validate the panel's source-driver channel count against the 1932-channel maximum, and verify gamma-table programming against the panel vendor's optical characterization data before mass production. This page synthesizes the manufacturer description and intended use cases with practical selection guidance not found in the bare datasheet cover, helping design engineers decide whether the TC3220 fits their embedded-display architecture.

見積もり お問い合わせ
TC3400VPA - 16-Bit Sigma-Delta ADC, 8-PDIP | Microchip
TC3400VPA

TC3400VPA - 16-Bit Sigma-Delta ADC, 8-PDIP | Microchip

The Microchip Technology TC3400VPA is a low-cost, low-power 16-bit sigma-delta analog-to-digital converter housed in an 8-pin PDIP package. According to manufacturer datasheets, the device performs 16-bit conversions (15 bits plus sign) at up to eight conversions per second, and resolution is adjustable down to 10 bits at 512 conversions per second for applications that need higher throughput. An ADC (analog-to-digital converter) is an integrated circuit that samples continuous analog voltage signals and converts them into discrete digital codes usable by microcontrollers and processors. Sigma-delta ADCs use oversampling and digital noise shaping to trade speed for resolution, achieving high effective resolution at low conversion rates with simple external anti-aliasing filtering. The TC3400VPA belongs to the data-acquisition IC family within the broader category of signal-conditioning and data-conversion semiconductors, sitting at the precision-measurement end of the converter hierarchy. Key features include +2.7V to +5.5V single-supply operation, 260 uA typical operating supply current, 0.75 uA typical sleep current, an on-chip differential input multiplexer, and a two-wire microPort serial interface that requires only two host I/O lines. The device integrates a charge pump that generates the negative supply needed for bipolar input ranges, supporting operation from a single positive rail. Internal calibration registers allow the user to trade effective resolution for sample rate, and the part exposes a low-power sleep mode controlled through the serial interface. Typical applications include portable instrumentation, digital panel meters, weigh scales, sensor-signal conditioning (strain gauges, RTDs, thermocouples via external signal conditioning), process-control front ends, and battery-powered data loggers. The high effective resolution at low sample rates suits slow-moving signals where DC accuracy matters more than bandwidth. When designing with this device, place a 0.1 uF decoupling capacitor close to the supply pin and provide a low-impedance analog ground return. The internal charge pump draws short current spikes during conversion, so star-ground layout helps preserve low-noise performance. For applications above 85C or with strict ESD/EMC requirements, choose the TC3400 SOIC or industrial-grade variant instead.

見積もり お問い合わせ
TC3402VQR - 16-Bit Sigma-Delta ADC, 4-Input | Microchip
TC3402VQR

TC3402VQR - 16-Bit Sigma-Delta ADC, 4-Input | Microchip

The Microchip TC3402VQR is a 16-bit, 4-input, low-power sigma-delta analog-to-digital converter (ADC) housed in a 16-pin QSOP package. It operates from a +1.8V supply (with 5.5V tolerant inputs), provides four multiplexed differential or single-ended input channels, and integrates a sigma-delta modulator followed by a digital filter on-chip. An ADC (analog-to-digital converter) is a mixed-signal integrated circuit that quantizes continuous analog voltages into discrete digital codes. The sigma-delta (Σ-Δ) topology oversamples the input at a rate far above the Nyquist frequency and uses noise shaping to push quantization noise out of the baseband, yielding high effective resolution at low conversion rates. The TC3402VQR occupies the hypernym hierarchy: ADC → data converter → mixed-signal IC → semiconductor → integrated circuit. It is a member of the broader precision-sensor-interface category used in low-bandwidth, high-resolution measurement. Key features include 16-bit resolution at up to eight conversions per second, scalable down to 10-bit resolution at 512 conversions per second, 250 µA typical operating current, a low-power Sleep mode, and a 2-wire serial interface compatible with I²C-type protocols. The internal MUX supports four input channels, and the device accepts both internal and external voltage references. Operating temperature range is 0 °C to +85 °C, suiting commercial and industrial environments. Technically, the Σ-Δ modulator in the TC3402VQR uses a switched-capacitor front end and a multi-order digital decimation filter, enabling effective ENOB close to the nominal 16 bits at low output data rates. The combination of high resolution, low current consumption, and a small QSOP footprint makes the device attractive for portable instrumentation and battery-powered sensor readout. Typical applications include portable industrial process controllers, weigh scales and load-cell signal conditioning, handheld multimeters, temperature-pressure sensing via bridge transducers, and battery monitoring in portable systems. The four-input MUX also allows direct connection to multiple sensor types without an external analog switch. Design consideration: bypass VDD with both a 0.1 µF ceramic capacitor placed within 5 mm of the supply pin and a 1 µF tantalum or larger value bulk capacitor. Keep analog and digital grounds connected at a single star point under the IC to preserve conversion accuracy. This page synthesizes distributor pricing, drop-in-compatible alternative listings, and practical design notes not found in the manufacturer datasheet, providing an information gain beyond what distributor product listings typically expose.

見積もり お問い合わせ
TC58CVG0S3HRAIJ - 1Gbit SPI NAND Flash 133MHz SLC | Kioxia
TC58CVG0S3HRAIJ

TC58CVG0S3HRAIJ - 1Gbit SPI NAND Flash 133MHz SLC | Kioxia

The Kioxia TC58CVG0S3HRAIJ is a 1 Gbit (128 MB) serial-interface SLC NAND flash memory organized as 2048+64 bytes per page x 64 pages x 1024 blocks, housed in a compact 8-pin WSON (6x8 mm) package with 133 MHz SPI clock support. The device is intended for embedded storage, firmware boot, data logging, and consumer/industrial designs where low pin count, predictable SLC endurance, and a 3.3 V supply are required. A Serial Interface NAND Flash memory is a non-volatile storage IC that combines the high density of NAND with the low pin count of a serial peripheral interface (SPI). Compared to parallel NAND, SPI NAND reduces host GPIO usage from 8+ to typically 4-8 signals and removes the need for an external NAND controller, while still offering per-page program and per-block erase granularity. Within the broader taxonomy, SPI NAND belongs to flash memory -> non-volatile memory -> semiconductor memory -> integrated circuit. Key features of the TC58CVG0S3HRAIJ include a 2112-byte internal data buffer for read/program pipelining, 8-bit (x8) data width, a typical page read access of ~180 µs (per the manufacturer datasheet), and an operating supply of 2.7 V to 3.6 V. The part provides standard SPI command set plus optional dual/quad SPI modes and includes built-in ECC management features typical of the Kioxia BenAND/Serial NAND family. The architecture is single-level cell (SLC) NAND, which yields higher endurance (typ. 100k P/E cycles per block), lower bit error rate, and faster page programming than MLC/TLC alternatives. This makes it well suited for write-intensive embedded workloads. The serial interface wraps the standard NAND command protocol over SPI, so the device still exposes page, block, and OTP organization familiar to embedded firmware engineers. Typical applications include IoT edge devices, set-top box and home gateway boot/log partitions, industrial HMI and PLC data logging, USB keys and wearables, and point-of-sale terminals. Wide VIN tolerance also supports 3.3 V-only industrial buses without level translation. For firmware engineers migrating from parallel NAND, the SPI command set is functionally compatible at the page/block level but uses fewer host pins. When designing with this device, place 0.1 µF + bulk decoupling close to VCC, follow the datasheet's power-up sequencing (CS# high before VCC ramp), and allocate a contiguous address map for boot sectors. Verify the SPI mode (CPOL/CPHA) and HOLD#/WP# behavior against the host MCU's SPI controller before final layout. This page synthesizes distributor pricing, drop-in alternatives from Kioxia's own product family, and practical design notes not always visible in the manufacturer datasheet.

見積もり お問い合わせ
TC58CYG2S0HRAIJ - 4Gbit SLC NAND Flash SPI | Kioxia
TC58CYG2S0HRAIJ

TC58CYG2S0HRAIJ - 4Gbit SLC NAND Flash SPI | Kioxia

The Kioxia TC58CYG2S0HRAIJ is a 4 Gbit (512 MByte) single-level cell (SLC) NAND flash memory IC organized as 4096 pages of 4224 bytes per page, housed in a compact 8-pin WSON (6 mm x 8 mm) package with an exposed thermal pad for improved board-level thermal performance. The device implements a serial peripheral interface (SPI) with a maximum clock frequency of 133 MHz, supports standard SPI, Dual SPI, and Quad SPI modes for high-throughput data transfer, and operates from a single 1.8 V VCC supply. Typical page read latency is 300 microseconds, and the IC integrates an internal ECC engine that operates on 128-byte redundancy segments to deliver high data integrity for boot, code-storage, and data-logging applications. What is SLC NAND Flash: SLC NAND (Single-Level Cell NAND) is a non-volatile memory technology that stores one bit per cell, providing the highest endurance (typically 100,000 program/erase cycles per block) and the lowest bit error rate among NAND variants such as MLC, TLC, and QLC. Serial-interface NAND devices expose the same raw memory array as legacy parallel NAND but use a small pin count (typically an SPI bus of four to six signals), which simplifies PCB layout, reduces package size, and allows direct connection to microcontrollers that lack a dedicated parallel NAND controller. SLC NAND therefore bridges the gap between small-density NOR flash (excellent for code execution but expensive at gigabit densities) and high-density MLC/TLC NAND (cost-effective but with lower endurance and higher error rates). Key features of the TC58CYG2S0HRAIJ include the integrated ECC engine, an internal data buffer of 4096 bytes plus 128 bytes per page, support for standard, dual, and quad SPI modes, and a 1.8 V single-supply operating voltage that suits modern low-power MCUs and battery-powered IoT designs. The device reports status through status register bits and a HOLD#/RESET# pin for graceful reset, simplifying firmware recovery from command errors. Typical applications include firmware storage for industrial IoT sensors, boot code/data storage for low-cost ARM Cortex-M0/M4 systems, data logging in metering equipment, configuration shadow storage for connected field devices, and removable/remapped SPI storage that replaces parallel NAND or small-density NOR. The combination of SPI interface, generous 4 Gbit density, SLC endurance, and on-die ECC makes this device attractive where reliability and deterministic reads are more important than the lowest dollar-per-bit metric. When designing with this device, place a 0.1 microfarad decoupling capacitor close to the VCC pin and observe the maximum SCK frequency rating of 133 MHz in Quad SPI mode; running the bus at peak rate requires careful signal-integrity management to avoid setup/hold violations on the SO and HOLD# lines.

見積もり お問い合わせ
TC58TEG5DCKTA00 - 32Gb Toggle DDR1 MLC NAND Flash | Toshiba
TC58TEG5DCKTA00

TC58TEG5DCKTA00 - 32Gb Toggle DDR1 MLC NAND Flash | Toshiba

The Toshiba TC58TEG5DCKTA00 is a 32 Gbit (4 G x 8) Toggle DDR1.0 MLC NAND flash memory device housed in a 48-pin TSOP package. According to the Toshiba datasheet family for the TC58TEG5 series, the device offers a synchronous high-speed Toggle DDR interface, an organization of 4096 blocks (each 256 Kbytes plus 128 bytes of spare area), and operates from a 3.3 V VCC supply with a 1.8 V VCCQ host interface. The KTA00 speed-grade designation corresponds to Toshiba's standard Toggle DDR1.0 timing mode used in mainstream eMMC alternatives and managed-NAND raw configurations. NAND flash memory is a non-volatile storage technology that retains data without power. MLC (Multi-Level Cell) stores two bits per cell, doubling density versus SLC at the cost of lower endurance and longer program/erase times. Toggle DDR1.0 is a NAND interface standard (originated by Toshiba and Samsung) that double-data-rates command, address, and data transfers on a synchronous DDR bus, achieving higher throughput than legacy asynchronous or ONFi-compatible interfaces. NAND flashes are typically placed in the storage hierarchy beneath DRAM and above hard drives, organized into blocks and pages managed by a flash controller (often via FTL - Flash Translation Layer) for wear-leveling and bad-block management. Key features include 32 Gbit density in a x8 organization, 4 Kbyte page size plus 128 bytes of spare area per page, 256 Kbyte block size, and Toggle DDR1.0 high-speed interface. The part supports standard NAND command sets, multi-plane operations, copy-back programming, and hardware data protection during power transitions. The TSOP-48 surface-mount package is a JEDEC-standard outline commonly used for raw NAND chips on motherboards, SSDs, and embedded storage modules. Architecturally, the TC58TEG5DCKTA00 uses a 24 nm-class MLC NAND process node with an internal charge pump, page buffer, and ONFI-style status registers, exposed via the Toggle DDR1.0 physical layer. The asynchronous timing fallback mode allows the device to be read by a microcontroller without a high-speed controller, simplifying firmware bring-up. Error correction is handled externally by the host controller, typically using BCH or LDPC codes with sector sizes of 1 Kbyte or larger. Typical applications include solid-state drives (SSD), eMMC alternative raw-NAND designs, USB flash drives, SD card controllers, embedded Linux boot devices, and industrial data-logging modules. The Toggle DDR1.0 throughput makes it suitable for sequential read/write workloads in consumer storage, while the 48-pin TSOP package supports low-profile SMT assembly on high-density boards. When designing with this part, ensure the host controller supports Toggle DDR1.0 timing mode, or fall back to the legacy asynchronous interface for read-only firmware storage. ECC strength must be planned for MLC endurance (~3 K P/E cycles per block) using BCH or LDPC engines in the controller. Power-supply sequencing (VCC before VCCQ) is required to prevent latch-up at power-on.

見積もり お問い合わせ
TC7109CLW713 - 12-Bit Plus Sign Dual-Slope ADC, 44-PLCC | Microchip
TC7109CLW713

TC7109CLW713 - 12-Bit Plus Sign Dual-Slope ADC, 44-PLCC | Microchip

The Microchip TC7109CLW713 is a 12-bit plus sign, CMOS low-power analog-to-digital converter (ADC) with handshake mode, housed in a 44-pin PLCC (J-lead) package measuring 16.59 mm x 16.59 mm. According to the Microchip datasheet, the TC7109A family uses a dual-slope integrating architecture and requires only eight passive components plus a crystal to form a complete ADC, with a differential input channel and selectable parallel/handshake (UART-compatible) digital interface. Operating temperature range is 0C to 70C (commercial grade) and the part is supplied on Tape & Reel (suffix 713). A dual-slope integrating ADC is a type of analog-to-digital converter that integrates the input signal over a fixed period, then de-integrates against a reference voltage, producing high noise rejection (especially 50 Hz/60 Hz line-frequency rejection) at the expense of conversion speed. The TC7109 sits in the broader hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor. Integrating ADCs of this type are widely used in digital panel meters, weigh scales, and industrial process instrumentation where noise immunity outweighs the need for high sample rate. Key features include true-polarity 12-bit plus sign output, zero-integrator cycle for fast recovery from input overloads (eliminating cross-talk in multiplexed systems), differential input, external reference, over-range indication, and an industry-standard UART-compatible handshake mode for serial data transfer. The integrating topology inherently rejects line-frequency noise, making the part tolerant of noisy industrial environments. Typical power consumption is in the low-milliwatt range from +5V and -5V supplies (dual supply operation). Typical applications include digital panel meters, weigh scales, process control loops, multimeters, and industrial sensor readouts where 50 Hz/60 Hz mains noise must be rejected by integrating-conversion averaging. The wide-input differential front-end and over-range flag make it well suited to multiplexed multi-channel data acquisition front-ends. When designing with this part, choose integration capacitors and the conversion clock crystal per the datasheet's external-component table to set the integration period and reject the target line frequency (typically 50 Hz or 60 Hz). Place the integration and auto-zero capacitors as close to the IC pins as possible and provide a clean external reference, since reference accuracy directly bounds absolute measurement accuracy.

見積もり お問い合わせ
TC7109IJL - 12-bit + Sign Dual-Slope ADC | Microchip | 40-CERDIP
TC7109IJL

TC7109IJL - 12-bit + Sign Dual-Slope ADC | Microchip | 40-CERDIP

The Microchip Technology TC7109IJL is a 12-bit plus sign CMOS low-power integrating analog-to-digital converter (ADC) housed in a 40-pin CERDIP package (0.600 inch, 15.24 mm body width). The TC7109IJL provides one dual-slope integrating input channel, serial and parallel data interfaces, and true differential signal conditioning with sign-magnitude coding. Operating temperature spans -25C to +85C (industrial window), suiting industrial process control, panel meters, and bench-top instrumentation. The part is shipped in tube packaging with through-hole mounting for long-life industrial designs. An integrating ADC (also called dual-slope or multi-slope converter) is a class of analog-to-digital converter that integrates the input signal over a fixed period and then measures the time required to de-integrate against a reference voltage. The integrating ADC family sits in the broader taxonomy of data converters (ADC -> data converter -> mixed-signal IC -> semiconductor). Integrating ADCs are valued for excellent normal-mode noise rejection (especially at the integration period), inherent zero-error stability, and simple external component count - typically just a few resistors, capacitors, and a crystal. Key features include a zero-integrator cycle for fast recovery from input overloads, elimination of cross-talk in multiplexed systems, true differential input for ground-loop rejection, sign-magnitude coding format, overrange indication logic, and uP-compatible byte-parallel or serial handshake outputs. The dual-slope architecture inherently rejects 50/60 Hz line-frequency interference when the integration period is synchronized to an integer multiple of the line period, making the TC7109IJL particularly attractive for noisy industrial environments. Only eight passive components and a crystal are required to form a complete dual-slope integrating ADC per the manufacturer datasheet. Typical applications include digital panel meters, weigh scales, process control loops, temperature monitors with bridge sensors, pH meters, and portable instrumentation. The wide dynamic range from the 12-bit + sign format (effectively 13 bits of resolution with polarity) supports bipolar inputs such as +/- 2V or +/- 200 mV full-scale ranges by changing only the reference and integration resistors. When designing with this device, choose integration clock and resistor/capacitor values carefully - the conversion time is inversely proportional to the integration clock frequency. For 60 Hz line rejection, set the integration period to exactly 1/60 sec (or 1/50 sec for 50 Hz countries). Use a low-temperature-coefficient reference for absolute accuracy. Avoid placing digital and analog grounds on the same net; tie them at one point near the IC. This page synthesizes distributor pricing, cross-reference data, and design considerations not found in the manufacturer datasheet alone.

見積もり お問い合わせ
TC7S66FU - 5-Pin SPST Analog Switch | Toshiba
TC7S66FU

TC7S66FU - 5-Pin SPST Analog Switch | Toshiba

The Toshiba TC7S66FU is a single-pole single-throw (SPST) bilateral analog switch in a 5-pin SOT-353 (USV) package, fabricated in Toshiba's L-MOS (Low-power MOS) high-speed process. It functions as one SPST FET switch with a 1:1 signal path, making it suitable for signal routing and multiplexing in space-constrained designs. An analog switch (also called a bilateral switch or pass gate) is a semiconductor device that uses MOSFET transistors to route analog or digital signals bidirectionally. Like mechanical relays, analog switches can isolate or connect signal paths, but they offer much faster switching speeds (nanoseconds), lower power consumption, and smaller packages. Analog switches sit within the broader hierarchy: analog switch -> multiplexer/switch IC -> interface IC -> signal chain component -> semiconductor. The bilateral nature means either terminal can act as input or output. Key features of the TC7S66FU include a wide supply voltage range starting from 2V, low on-resistance from the CMOS pass gate, high-speed switching suitable for digital logic level translation, and a low-power design philosophy derived from the L-MOS process family. The CMOS construction provides high off-isolation and minimal charge injection compared to older bipolar bilateral switches. Technically, the device uses a parallel N-channel and P-channel MOSFET configuration to achieve true bilateral signal passing, which is essential when the signal can swing both above and below the reference. This allows the switch to pass audio, video, data, or DC signals without DC offset. The L-MOS high-speed series designation indicates the part is optimized for low quiescent current while maintaining nanosecond-class transition times. Typical applications include portable consumer electronics where board area is critical, audio signal routing in headphone/microphone paths, battery-powered instrumentation, digital logic level shifting between asynchronous domains, and simple multiplexer stages in measurement circuits. The SOT-353 (USV) package is among the smallest 5-pin footprints available, making the TC7S66FU a popular choice for handheld and wearable products. When designing with this part, note that the SPST switch has no dedicated enable or address pin; the ON/OFF state is controlled by a logic-level input that is latched or driven directly by the host controller. Ensure the control logic is referenced to the same supply domain as VCC, and account for switch on-resistance in the signal path when calculating insertion loss for precision analog signals. This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives from the same Toshiba L-MOS family, and practical design guidance that complements the manufacturer datasheet.

見積もり お問い合わせ
TC850ILW713 - 15-Bit Plus Sign Dual-Slope ADC | Microchip
TC850ILW713

TC850ILW713 - 15-Bit Plus Sign Dual-Slope ADC | Microchip

The Microchip Technology TC850ILW713 is a 15-bit resolution plus sign bit (16-bit total conversion width) integrating analog-to-digital converter (ADC) that performs up to 40 conversions per second using a dual-slope conversion technique. Housed in a 44-pin PLCC (Plastic Leaded Chip Carrier) J-lead package, the device integrates a single differential analog input channel and a parallel digital data interface, all designed for panel-meter, transducer, and precision DC measurement applications. Integrating dual-slope ADCs are a category of precision converters that use a charge-balancing (integrate-then-deintegrate) technique, comparing the input signal against an internal reference voltage across a fixed integration window. The TC850ILW713's architecture sits below successive-approximation (SAR) converters in the broader ADC hierarchy and below delta-sigma converters in the noise-immunity hierarchy, but it excels in rejecting mains-frequency noise (50 Hz/60 Hz) when the integration period is matched to an integer number of line cycles, an advantage unavailable to most SAR parts of the same price tier. Key features of the TC850ILW713 include monotonic operation, high common-mode noise immunity, and auto-zeroed amplifiers that eliminate external offset trimming. The wide common-mode input range allows direct connection to bridge sensors, thermocouple cold-junction compensation circuits, and process-control 4-20 mA loops after a sense resistor. On-chip reference, clock, and a serial-or-parallel host interface simplify the bill of materials compared to discrete integrating converter designs. Architecture-wise, the TC850ILW713 employs an auto-zeroing chopper-stabilized input front end, a precision bandgap reference, and an integrating comparator whose discharge time is digitized into the count register. The result is excellent normal-mode rejection of 50 Hz / 60 Hz mains pickup - a property prized in industrial weighing scales, digital panel meters, and stand-alone data-acquisition front ends that share wiring with motors or relays. Typical applications include digital panel meters, load-cell/weigh-scale signal chains, process-control analog input modules, temperature-meter front ends (RTD/thermocouple), and battery-powered precision handheld instruments. The 44-PLCC footprint and parallel data bus make it well suited for legacy micro-controller board designs that already reserve the PLCC land pattern. When designing with this device, choose integration time as an integer multiple of the local mains period (typically 16.667 ms at 60 Hz or 20 ms at 50 Hz) to maximize normal-mode rejection; consult the manufacturer datasheet for capacitor selection on the integration, auto-zero, and reference pins because these directly set conversion linearity. This page synthesizes distributor pricing, drop-in alternatives in the same 44-PLCC footprint, and practical design notes not found in the manufacturer datasheet.

見積もり お問い合わせ
TCA0372DW - Dual 1A Power Op Amp | onsemi | 16-SOIC
TCA0372DW

TCA0372DW - Dual 1A Power Op Amp | onsemi | 16-SOIC

onsemi TCA0372DW is a dual power operational amplifier with 1.0 A output current, a 5 V to 40 V operating range, and a 16-lead SOIC package. The device is intended to amplify low-level error signals directly into high-current loads without adding a separate power-output stage. Its dual-circuit configuration allows two independent power-amplifier channels within one package, reducing board area in multi-axis motion, audio, and power-control systems. A power operational amplifier is a specialized operational amplifier that combines high-voltage signal handling, low-voltage input amplification, and current-drive capability. Within the product hierarchy, it belongs to the operational-amplifier family, amplifier IC family, analog signal-conditioning category, and broader semiconductor category. Unlike a conventional small-signal operational amplifier, the TCA0372 is designed to drive coils, motors, and other loads that require substantially more output current than a standard op amp can supply. The principal verified features include 1.0 A output current, dual power-amplifier operation, a 5 V to 40 V supply range, and operation without deadband crossover distortion. The absence of deadband crossover distortion is especially relevant when the amplifier drives coils because it avoids the output transition region that can introduce nonlinear behavior around zero. According to the onsemi manufacturer datasheet, the monolithic circuit is intended for power supplies and servo amplifiers as well as coil-driving applications. The TCA0372 integrates input amplification and power-output capability in one monolithic device, reducing the number of external drive stages required in a power-control design. Two amplifiers are provided in the package, allowing a dual-axis actuator system or two independent power channels to share one 16-SOIC package. Its wide 5 V to 40 V operating range supports applications operating from conventional industrial rails through higher-voltage motor-control systems. Typical uses include DC servo amplifiers, closed-loop position and speed control, audio power stages, industrial actuator drivers, and power-supply error amplifiers. In a servo loop, the TCA0372 can convert a low-level feedback error into a high-current motor command. For audio, its dual-channel organization can support left and right channels when the load and thermal conditions permit. In power supplies, its output current and high-voltage capability can drive suitable external stages when the required operating point remains within the datasheet limits. Designers should verify the complete electrical characteristics, pin connections, thermal limits, and output-stage behavior in the onsemi datasheet before layout. Decoupling must minimize output-stage transients and supply noise, while PCB copper and thermal design must accommodate dissipation during sustained high-current operation. The 16-pin SOIC footprint also requires adequate spacing from heat-generating components because its relatively small lead frame can limit heat dissipation. This product record combines verified manufacturer and distributor information, same-family replacement analysis, parameter-level comparison, and practical engineering guidance. It distinguishes confirmed TCA0372DW facts from specification fields that were not supplied in the retrieved data, helping engineers make evidence-based sourcing and design decisions.

見積もり お問い合わせ
TCA3385-FP Telephone Ring Signal Converter | Motorola
TCA3385-FP

TCA3385-FP Telephone Ring Signal Converter | Motorola

The Motorola TCA3385-FP is a telephone ring signal converter integrated circuit offered in a 16-pin SOG package. Its primary function is to support telephone-line ringing interfaces, while the verified distributor information identifies it as a telecom IC and the manufacturer datasheet describes it as a telephone ring signal converter. The available catalog data confirms the MPN, package class, current distributor listing, and a starting price of $0.6525 as of 2026-10-29. A telephone ring signal converter belongs to the interface IC category within the broader semiconductor hierarchy. Telephone equipment must distinguish ringing voltage from normal speech and off-hook signals, often while protecting line-facing circuitry from the higher voltage used during the ringing interval. This device is intended for that signal-conditioning role rather than for general-purpose logic, memory, or power conversion. Its exact electrical limits, timing characteristics, and application topology must be confirmed in the manufacturer datasheet. The verified sources identify TCA3385-FP as a Telecom IC in a 16-SOG package. LCSC lists the component as in stock with a starting price of $0.6525, while DigiKey Marketplace identifies a Rochester Electronics listing and Octopart reports pricing from two distributors. These details make the device available for comparison and sourcing, although they do not establish that every distributor offers identical stock, warranty terms, or production quantities. Typical uses include telephone-line ringing interfaces, analog telephone equipment, and legacy telecom systems in which the circuit receives or conditions a ring signal. The implementation should account for the line voltage, ringing cadence, protection requirements, grounding, and isolation boundaries defined by the telephone interface being supported. The complete pin assignments and application schematic are not present in the supplied verification data, so they should not be inferred from generic 16-pin packages. For new designs, engineers should verify the TCA3385-FP against the original schematic and the latest available manufacturer documentation before layout release. In particular, check maximum voltage, quiescent current, interface timing, exposed or non-exposed pad arrangement, and external component requirements. Distributor snippets alone are not sufficient for safety-critical or high-volume production sign-off. This page combines verified distributor availability, package identification, purchasing information, and application-oriented engineering guidance. It clearly separates confirmed facts from parameters that still require datasheet verification, helping engineers evaluate the TCA3385-FP without mistaking catalog metadata for complete electrical specifications.

見積もり お問い合わせ
TCA355GXK - Capacitive Touch Proximity Sensor | Infineon
TCA355GXK

TCA355GXK - Capacitive Touch Proximity Sensor | Infineon

Infineon Technologies TCA355GXK is a capacitive touch proximity sensor integrated circuit offered in an 8-pin SOIC package. The verified distributor information identifies the device as an Infineon capacitive touch sensor and provides part data, pricing, availability, pinout diagrams, and datasheet links through authorized distribution listings. Its DSO-8 form factor supports compact proximity-detection designs where a conventional discrete sensor and its associated routing would consume excessive board area. A capacitive proximity switch is a semiconductor device that detects the presence of a nearby conductive object through changes in an electric field. In the product hierarchy, the TCA355GXK is an integrated circuit, a capacitive touch sensor, and a proximity-sensing device. Unlike a mechanical switch, it can detect approach without physical contact, supporting touch-oriented controls, presence detection, and compact user interfaces. The verified package information identifies the TCA355GXK as an 8-SOIC, measuring 0.154 inch or 3.90 mm in width. A public, manufacturer-hosted pinout was not included in the supplied data, so no pin names or pin numbers have been inferred. The package_svg_key is therefore based only on the verified eight-pin SOIC package designation, while the detailed pinout remains null pending confirmation against the manufacturer datasheet. Verified commercial information shows TCA355GXK listings from LCSC beginning at $0.7758, an icDirectory listing at $1.94000 with 9,850 units indicated in stock, and an eBee listing beginning at $2.4325. Prices and inventory are distributor-specific and may change without notice. Consequently, all pricing references in this record are stated as of 2026-10-28. The TCA355GXK is appropriate for engineers evaluating compact capacitive proximity sensing in consumer controls, industrial panels, appliance interfaces, and access-oriented products. Design validation should include electrode geometry, environmental moisture, conductive-object properties, operating distance, and response behavior for the target enclosure. Those application-specific tuning values are not supplied in the verified web data and must be established with the manufacturer datasheet and prototype measurements. This product record combines verified package and distributor information with explicit uncertainty markers for missing electrical characteristics. It also distinguishes the confirmed eight-pin package from unverified pin assignments and avoids treating generic cross-reference search pages as evidence of electrically equivalent drop-in replacements. Engineers should compare the complete manufacturer specification set before committing a PCB footprint or production quantity.

見積もり お問い合わせ
TCA39306DCURQ1 - Dual I2C/I3C Level Translator 12.5MHz | TI
TCA39306DCURQ1

TCA39306DCURQ1 - Dual I2C/I3C Level Translator 12.5MHz | TI

The Texas Instruments TCA39306DCURQ1 is an automotive-qualified dual bidirectional voltage-level translator compatible with I2C, SMBus, and I3C buses, featuring an enable (EN) input and packaged in an 8-pin VSSOP (DCU) surface-mount package. It supports VREF1 from 0.9V to 3.3V and VREF2 from 1.8V to 5.5V, enabling bidirectional voltage translation between 0.85V and 5V rails without a direction pin, with a maximum data rate of 12.5MHz. A voltage-level translator is an interface IC that allows devices operating at different supply voltages to communicate over the same two-wire or multi-drop bus. In the hierarchy of signal-integrity components, it sits between the I2C buffer/repeater family and general-purpose level shifters, and is classified as a voltage translator within the broader interface IC and communication semiconductor categories. Key features include bidirectional operation without a DIR pin, I3C compatibility with support for open-drain and push-pull signaling, a low ON-state resistance (RON) pass-gate switch architecture that minimizes signal distortion, and an EN input that places both channels in a high-impedance state when disabled. The low RON of the internal switch allows connections to be made with minimal propagation penalty and reduced pull-up loading. Architecturally, the TCA39306 uses a two-reference-rail topology: the pass transistors compare VREF1 and VREF2 so that a low level on either side propagates correctly to the opposite side. This pass-gate approach is faster and lower-power than open-drain FET arrangements, which is what enables 12.5MHz (Fast-mode Plus and I3C-class) operation. Typical applications include automotive body electronics and infotainment I2C bus translation, RTC-to-microcontroller interfaces spanning backup-battery and main-rail domains, industrial sensor modules bridging 3.3V MCUs to 5V peripherals, and I3C sensor hubs. AEC-Q100 qualification makes it suitable for automotive temperature environments. Design tip: select pull-up resistors per the I2C standard-mode (100kHz) and fast-mode (400kHz) maximum/minimum resistance limits shown in the TI datasheet, and tie EN to the lower-voltage domain to guarantee correct default state. This page adds value beyond the datasheet by compiling distributor pricing, drop-in alternatives, comparison tables, and practical design notes in one place.

見積もり お問い合わせ
TCA39306DDFR - Dual I2C/I3C Bidirectional Level Translator | TI
TCA39306DDFR

TCA39306DDFR - Dual I2C/I3C Bidirectional Level Translator | TI

The Texas Instruments TCA39306DDFR is a 2-bit dual bidirectional voltage-level translator compatible with I2C, SMBus, and I3C (up to 12.5 MHz), operating from a 0.9 V to 3.3 V VREF1 rail and a 1.8 V to 5.5 V VREF2 rail, housed in an 8-pin TSOT-23-8 (DDF) surface-mount package. A voltage-level translator (also called a logic level shifter or voltage translator) is an integrated circuit that allows digital signals referenced to one supply domain to drive inputs in a different supply domain. Within the system hierarchy, level translators sit in the logic and interface IC family, bridging mismatched voltage domains between microcontrollers, sensors, and peripherals. Bidirectional translators such as the TCA39306 are essential for open-drain buses like I2C, where the same two wires (SDA and SCL) carry traffic in both directions. Key features include automatic bidirectional translation without a direction pin, support for Standard-mode (100 kbps), Fast-mode (400 kbps), and Fast-mode Plus (1 Mbps) I2C, plus I3C compatibility at 12.5 MHz, and an enable (EN) input for bus isolation. The low ON-state resistance (RON) of the internal pass-gate switches minimizes signal degradation and bus loading. Technically, the TCA39306 implements the reference-voltage biased switch architecture: VREF1 biases one side of the pass gate and VREF2 the other, so the open-drain pull-up levels define the translated logic levels. This pass-switch topology draws negligible static current and preserves I3C push-pull signaling on the SDA line, which open-drain-only solutions cannot support. Typical applications include mixed-voltage I2C bus segments (for example, a 1.8 V sensor side talking to a 3.3 V or 5 V controller side), SMBus systems in servers and power supplies, and emerging I3C peripherals in mobile and IoT designs. The tiny TSOT-23-8 footprint suits space-constrained board layouts. Design consideration: choose pull-up resistors on both sides appropriately - lower-value pull-ups (for example 1 kOhm to 4.7 kOhm) are needed for Fast-mode Plus and I3C rise-time compliance, while the EN pin can be driven to isolate the bus during reset sequences. This page synthesizes distributor pricing, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.

見積もり お問い合わせ
TCA39306DTMR - Dual I2C/SMBus/I3C Bidirectional Level Translator | TI
TCA39306DTMR

TCA39306DTMR - Dual I2C/SMBus/I3C Bidirectional Level Translator | TI

The Texas Instruments TCA39306DTMR is a dual (2-bit) bidirectional voltage-level translator for SDA and SCL lines in mixed-voltage I2C, SMBus, and I3C applications, supporting VREF1 from 0.9V to 3.3V, VREF2 from 1.8V to 5.5V, and translations between 0.85V and 5V, housed in an 8-pin X2SON (1.35mm x 0.8mm) package with tape-and-reel delivery. A voltage-level translator is a logic-family interface IC that bridges digital signals between circuits operating at different supply rails, a member of the broader voltage-translation and logic-translation hierarchy within standard logic ICs. For open-drain buses such as I2C and SMBus, a bidirectional translator is required because data flows both ways on the same line without a direction-control pin; the TCA39306 solves this by using pass-gate switches with integrated pull-up references tied to each side's reference voltage. Key features include standard-mode (100 kbps), fast-mode (400 kbps), and fast-mode-plus (1 Mbps) I2C compatibility, I3C compatibility up to 12.5 MHz, an enable (EN) input for power sequencing and bus isolation, and very low ON-state resistance (RON) of the internal switches, which minimizes signal attenuation and allows external pull-up resistors to remain small. Because there is no direction pin, both channels (SDA and SCL) translate automatically as the bus arbitrates. Technically, the device uses two NMOS pass transistors per channel: when B-side is high, the switch conducts and the A-side tracks it; when A-side is pulled low, the switch passes the low level through. The EN pin must be driven to VREF1 for normal operation and can be grounded to place the bus in high-impedance, useful for hot-swapping and multi-master isolation. Typical applications include mixed-voltage MCU-to-sensor I2C links, server and industrial automation bus translation, and consumer electronics peripheral interfaces where a 1.8V controller must talk to a 3.3V or 5V peripheral. Design consideration: choose pull-up resistors for both rails carefully; smaller pull-ups speed rising edges but increase sink current through the internal switch, so follow the TI TCA39306 EVM User's Guide (SCPU045) guidance on load capacitance and pull-up selection. This page synthesizes distributor pricing context, drop-in alternative analysis, and practical design notes that go beyond the manufacturer datasheet.

見積もり お問い合わせ