JHL7540-S-LMHR
JHL7540-S-LMHR - Dual-Port Thunderbolt 3 Controller | Intel
The Intel JHL7540-S-LMHR is a dual-port host controller for Thunderbolt 3 connectivity, supplied as the S-LMHR ordering variant in a 337-ball FC-CSP package measuring 10.7 mm by 10.7 mm. Verified listings identify the component as an I/O controller interface IC and Thunderbolt 3 controller, but the supplied sources do not publish a complete electrical parameter table. Consequently, unverified values such as supply voltage, lane count, power consumption, operating temperature, and maximum data rate are not asserted here.
A Thunderbolt 3 host controller is a system-level I/O interface semiconductor that coordinates a computer or platform with Thunderbolt-compatible peripherals. It belongs to the I/O controller class, within interface ICs and semiconductors. Thunderbolt technology combines high-bandwidth data transfer, display connectivity, and power delivery over a physical connection, while the controller supplies the platform-facing logic required to manage those functions. The JHL7540 is particularly relevant to desktop, workstation, and embedded Thunderbolt-capable platforms.
The verified JHL7540-S-LMHR ordering information establishes dual-port host functionality, Thunderbolt 3 controller classification, FC-CSP construction, tray packaging, and a 10.7 mm by 10.7 mm package. The suffix “S-LMHR” identifies the specific orderable configuration, but its decode and environmental qualifiers are not present in the supplied evidence and should not be inferred. Intel support and specifications pages provide authoritative sources for architecture, platform support, and lifecycle information, while distributor records provide sourcing and package details.
Because this controller supports a differential, high-speed interface, PCB design must prioritize short matched routes, continuous reference planes, controlled impedance, and careful connector-to-controller escape routing. BGA assembly also requires stencil, reflow-profile, pad-array, and solder-joint validation appropriate to the manufacturer’s package documentation. Exact layer count, ball-map details, and assembly process requirements must be obtained from the official package drawing before layout release.
Potential uses include Thunderbolt expansion chassis, high-resolution external-display systems, professional storage arrays, multi-display workstations, capture systems, and compact desktop platforms. Selection should begin with the host platform’s supported controller generation, firmware support, connector requirements, and Intel platform validation. A different Thunderbolt controller should not be substituted solely because its bandwidth appears similar; electrical, pin, firmware, and platform compatibility must be demonstrated first.
This page distinguishes verified ordering and product facts from unknown technical fields instead of filling gaps with assumptions. It also combines the supplied distributor evidence, Intel product resources, and a strict review of available cross-reference results. No pin-compatible replacement was established from the provided data, so any alternative MPN would be misleading until its footprint, pinout, electrical limits, firmware support, and platform behavior are independently verified.
The practical sourcing position is straightforward: confirm the Intel documentation revision and platform support, validate the complete 337-ball pin map and FC-CSP land pattern, and compare lead time against the production schedule before committing volume. The known tray package also requires procurement attention because large BGA components can be sensitive to moisture handling, solder-ball condition, and shipping exposure. Engineering release should include distributor traceability, assembly-yield testing, and firmware interoperability checks.
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