MPC8379EVRAGD
MPC8379EVRAGD - PowerPC e300c4s MPU 400MHz 689-TEPBGA II | NXP
The NXP MPC8379EVRAGD is a PowerPC e300c4s microprocessor IC in the MPC83xx family, integrating a single 32-bit core running at 400 MHz, a 32 KB L1 data and instruction cache with parity, hardware-accelerated security engines, dual 10/100/1000 Ethernet MACs, a 32- or 64-bit DDR1/DDR2 memory controller, and PCI Express support into a 689-ball TEPBGA II (31x31 mm) package designed for embedded networking and industrial control. The 'V' suffix denotes the -40C to +125C extended temperature grade, and the 'RAGD' suffix encodes the package speed, revision, and lead-free TEPBGA-II lead-free ball configuration.
A microprocessor (MPU) is the central processing unit of an embedded computer system; the MPC8379EVRAGD sits at the top of the NXP (formerly Freescale) MPC83xx PowerQUICC II Pro family, itself part of the broader Power Architecture / PowerPC ecosystem that influenced modern Power Architecture and ARM-based networking SoCs. MPU performance is governed by clock frequency, cache hierarchy, MMU/virtualization, and integrated peripherals - on all four axes the MPC8379EVRAGD is engineered for deterministic packet processing at wire speed.
Key features include a 400 MHz e300c4s core with integrated single-precision floating-point and dual integer units, 32 KB L1 cache with parity on both instruction and data paths, a dedicated security engine for IPSec, SSL/TLS, and 3DES/AES/SHA acceleration, dual Gigabit Ethernet controllers with MII/RGMII/RTBI/SGMII support, one PCI Express x1 lane, a 32/64-bit DDR1/DDR2 memory controller at up to 400 MHz data rate, four UARTs, two I2C controllers, two SPI controllers, local bus, and dual DMA controllers. The 689-TEPBGA-II package exposes 689 balls on a 1 mm pitch in a 31x31 mm body, with controlled impedance ball-out for high-speed DDR and SerDes signals.
Architecturally, the MPC8379EVRAGD leverages the e300 core built on Power Architecture technology, tightly coupling the CPU to a programmable QUICC Engine datapath for protocol offload (Ethernet, ATM, HDLC, PPP). The internal coherency and snoop logic, combined with a write-back L1 cache, allow sustained throughput for routing, firewalling, and VPN termination workloads. Engineering the system to its limits requires careful DDR2 topology, length-matched address/command traces, solid power-rail decoupling, and thermal relief on the large flip-chip BGA.
Typical applications include secure routers and VPN gateways, industrial automation controllers, networked storage NAS/SAN adapters, factory-floor PLCs and SCADA gateways, point-of-sale terminals, and embedded control planes in aerospace/defense subsystems where extended-temperature screening and long-life silicon are mandatory. When designing with this part, prioritize PCB stack-up selection to maintain 50 ohm single-ended and 100 ohm differential controlled impedance for DDR2 and SGMII; budget ample decoupling near every Vdd ball pair; and follow the NXP hardware reference manual for boot, reset, and JTAG bring-up sequencing.
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