MPC8247ZQTIEA - PowerQUICC II 400MHz MPU | NXP | 516-FPBGA
部品番号: MPC8247ZQTIEA ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $65.85 | $6,585.00 |
| 500 | $61.4 | $30,700.00 |
| 1,000 | $58.9 | $58,900.00 |
MPC8247ZQTIEA 概要
A PowerQUICC II processor is a highly integrated MPU that combines a general-purpose PowerPC core with a hardware communications processor module (CPM). The CPM executes serial protocols (Ethernet, ATM, HDLC, UART, I2C, SPI) via microcode-driven SCCs and FCCs, offloading the core and enabling simultaneous line-rate traffic on multiple ports. In the system hierarchy this places the MPC8247ZQTIEA above standalone MCUs (because it integrates DMA, PCI, and multi-channel serial logic) yet below high-end PowerQUICC III and QorIQ devices, which add gigabit Ethernet and faster cores. The architecture is well documented in the MPC8272 PowerQUICC II Family Hardware Specifications reference manual.
Key features include a 32-bit PowerPC 603e core at 400 MHz, an integrated CPM supporting Fast Ethernet MAC, USB 1.1, PCI 2.2 host/agent, HDLC/ATM, and DDR/memory controller. The device is offered in the extended temperature grade (suffix "T") and is a RoHS-incompatible (non-green) HiP7 process member of the PowerQUICC II family.
Typical applications include industrial routers, DSLAM line cards, customer-premises equipment (CPE), VoIP gateways, network printers, and embedded telecom control boards. The combination of PCI, Ethernet, USB and synchronous serial interfaces eliminates several companion chips and reduces board area in cost-sensitive designs.
When designing with the MPC8247ZQTIEA, the 27x27 mm FPBGA requires a multilayer PCB with controlled-impedance routing for the DDR memory bus and matched-length PCI/USB pairs. The "Z" suffix denotes the original 1.5 V core, while later "VR" revisions switched to 1.4 V; designers porting from Z to VR silicon must re-validate their power tree and timing budgets.
ドロップイン代替品: MPC8247ZQTIEA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC8247ZQTIEA （同一形状・フットプリント） — 相違点: Core Architecture, Operating Temperature, Manufacturer, Package, Ethernet.
クイック比較ツール — 並列比較する代替部品を選択:
MPC8247VRTIEA
✅ ドロップイン✓ 在庫あり
$58.25 / 個
データシートを見る →MPC8247VRMIBA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8247CVRMIBA
✅ ドロップイン✓ 在庫あり
$19.95 / 個
データシートを見る →MPC8245TZQPIEA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8247ZQTIEA 最大定格＆電気的特性
| Manufacturer | NXP (formerly Freescale) |
| Product Category | Microprocessors (MPU) |
| Series | PowerQUICC II (MPC82xx) |
| Core | PowerPC G2_LE (603e compatible) |
| データバス幅 | 32 bit |
| 最大クロック周波数 | 400 MHz |
| Number of Cores | 1 |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| 動作温度 | 0 C to +105 C |
| パッケージ | 516-FPBGA (27x27 mm) |
| 実装タイプ | Surface Mount |
| Ethernet | 10/100 Mbps Fast Ethernet MAC |
| USB | USB 1.1 (per datasheet feature list) |
| PCI | PCI 2.2 (32-bit, host/agent) |
| RoHS ステータス | Not RoHS compliant (non-green, per datasheet category listing) |
MPC8247ZQTIEA 516-fpbga (27x27 mm) ピン配置ガイド
MPC8247ZQTIEA (516-fpbga (27x27 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC8247ZQTIEA.
詳細は データシート をご参照ください。
主な用途
MPC8247ZQTIEA の用途: 6 件s: Industrial Router Platform, DSLAM Line Card Controller, VoIP Media Gateway, Network Printer Controller, Embedded Telecom Control Board, Customer Premises Equipment (CPE) Gateway.
Industrial Router Platform
The MPC8247ZQTIEA's integrated dual 10/100 Ethernet MACs and PCI 2.2 host controller make it well suited for industrial router mainboards that aggregate multiple fieldbus uplinks into a single WAN interface. At 400 MHz the 603e core can sustain TCP/IP forwarding at wire rate for Fast Ethernet ports while the CPM offloads packet DMA, leaving headroom for routing daemons or IPSec without an external TCAM. Place the part adjacent to the DDR-1 memory with matched-length traces to keep the memory controller inside its 167 MHz single-data-rate timing window; the 27x27 mm FPBGA footprint demands at least a six-layer stack-up to escape BGA balls cleanly.
おすすめ
DSLAM Line Card Controller
The MPC8247ZQTIEA's hardware Communications Processor Module (CPM) executes HDLC and ATM AAL in microcode, providing sustained DSL line-card throughput without taxing the host PowerPC core. Designers typically pair it with a multi-channel DSL framer over the local bus and use the PCI 2.2 interface to feed aggregated traffic to the uplink. The integrated USB 1.1 channel is available for diagnostics or a craft interface. With 400 MHz of compute and four SCCs available, one device can drive hundreds of subscriber lines while meeting telecom-grade reliability and the 0 C to +105 C operating range.
おすすめ
VoIP Media Gateway
VoIP media gateways benefit from the MPC8247ZQTIEA's combination of PCI, Ethernet MACs, and time-division-multiplexed serial channels handled entirely in the CPM. At 400 MHz the 603e core can run a VxWorks or Linux RTP stack while the CPM handles PCM highway and HDLC signaling to T1/E1 framer chips. With deterministic interrupt latency from the CPM and the extended 0 C to +105 C temperature grade, the part is comfortable in carrier-class environments where consumer-grade MPUs would struggle.
おすすめ
Network Printer Controller
Office network printers need an MPU that can drive a high-bandwidth print engine while simultaneously handling Ethernet, USB, and print-job spooling. The MPC8247ZQTIEA's Fast Ethernet MAC, USB 1.1 port, and PCI bus connect directly to typical printer ASICs without glue logic. The 400 MHz core executes PostScript or PCL rasterization at engine speed while the CPM manages the network and peripheral IO concurrently. Designers can reuse the same board layout across printer SKUs by substituting other MPC82xx family members in the same 516-FPBGA footprint.
おすすめ
Embedded Telecom Control Board
Telecom control boards for base stations and small-cell backhaul require a deterministic MPU with proven software support. The MPC8247ZQTIEA running VxWorks with the BSP published by NXP provides a hardened platform with real-time response, ECC-protected memory bus support, and a CPM that handles backhaul serial links. The 0 C to +105 C temperature grade and the long-life HiP7 silicon technology deliver an MTBF profile appropriate for outdoor enclosures. Designers can migrate to the MPC8347 or MPC8377 for newer designs without changing the BGA footprint if a compatible package option exists.
おすすめ
Customer Premises Equipment (CPE) Gateway
Customer-premises gateways combining DSL/cable modem, Ethernet switch, and Wi-Fi host controller benefit from the MPC8247ZQTIEA's integrated peripheral set. The CPM handles DSL PPPoE traffic and the Ethernet MAC feeds the LAN switch, while PCI connects to the Wi-Fi card and the USB 1.1 port supports external storage or printers. At 400 MHz the processor runs Linux BusyBox and netfilter without compromising the data-plane throughput promised by service providers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC8247ZQTIEA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8247VRTIEA | MPC8247VRMIBA | MPC8247CVRMIBA | MPC8245TZQPIEA |
|---|---|---|---|---|---|
| Package | 516-FPBGA (27x27) | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same | 516-FPBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Voltage | 1.5 V | 1.4 V | 1.4 V | 1.4 V | 1.5 V |
| Core Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) | PowerPC G2_LE (603e) |
| RoHS Status | Not RoHS compliant | Not RoHS compliant | RoHS compliant | RoHS compliant | Not RoHS compliant |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +85 C (industrial, MIBA grade) | -40 C to +85 C (industrial, MIBA grade) | 0 C to +105 C |
| Ethernet MACs | 2 (10/100 Fast Ethernet) | 2 (10/100 Fast Ethernet) | 2 (10/100 Fast Ethernet) | 2 (10/100 Fast Ethernet) | 2 (10/100 Fast Ethernet) |
| USB Interface | USB 1.1 | USB 1.1 | USB 1.1 | USB 1.1 | USB 1.1 |
| PCI Interface | PCI 2.2 (32-bit) | PCI 2.2 (32-bit) | PCI 2.2 (32-bit) | PCI 2.2 (32-bit) | PCI 2.2 (32-bit) |
主な差別化要因
- Original 1.5 V core silicon in non-green finish （vs MPC8247VRMIBA)
- Integrated dual Fast Ethernet MAC plus USB 1.1 （vs MPC8245TZQPIEA)
- Drop-in pin compatibility within the MPC8247 family （vs MPC8247VRTIEA)
設計ノート
The 516-FPBGA at 27x27 mm demands a six-layer PCB minimum with dedicated power and ground planes placed directly under the BGA footprint to provide low-inductance returns. Escape routing for the outer two rows of the BGA can use 0.5 mm pitch micro-via stacks (laser-drilled stacked vias) or HDI structures; inner rows should fan out through internal signal layers using via-in-pad only on BGA breakouts that need it for power balls. Match the DDR memory traces within 50 mil length tolerance and keep the DDR clock pair to within 25 mil of the data strobe length to satisfy the MPC8272 PowerQUICC II DDR controller timing.
Supply the core at 1.5 V using a switching regulator followed by an LDO post-regulator with at least 1 uF of ceramic decoupling placed within 5 mm of every power ball pair. The I/O domain runs at 3.3 V and should be derived from the same 3.3 V rail as the DDR memory; do not power the I/O plane from a different source or you risk IO-toggling glitches. Use decoupling balls for both AVDD and OVDD inside the BGA footprint, and add 10 uF + 1 uF + 0.1 uF capacitors at each supply pin cluster to suppress transients during CPM DMA bursts.
Place series-termination resistors within 1 inch of the PCI bus driver outputs and keep the PCI clock signal length matched to within 100 mil of any PCI control signal. For USB routing use 45 ohm differential impedance with no more than two vias per leg and keep the differential pair within 8 mil spacing. The Ethernet MII/RMII traces should be controlled to 50 ohm single-ended and isolated from the DDR bus by at least 3W to avoid crosstalk during simultaneous operation.
Estimated: at 400 MHz with all four SCCs active and the USB and PCI buses simultaneously active, the MPC8247ZQTIEA dissipates about 2.0 W typical. With theta_JA in the range of 18-22 C/W for the 516-FPBGA on a 4-layer JEDEC test board, the junction temperature rise is approximately 36-44 C above ambient. In a forced-air enclosure or with bottom-side PCB cooling, the case temperature should remain within the 0 C to +105 C operating range; no dedicated heatsink is required.
When migrating designs from the Z-suffix silicon to the VR-suffix silicon (MPC8247VRTIEA) the core voltage drops from 1.5 V to 1.4 V but the power sequencing and PLL configuration differ. A common pitfall is reusing the Z firmware settings on VR silicon, which can leave the CPM in a non-functional state after reset. Always regenerate the POR configuration word from the latest MPC8247 PowerQUICC II family migration guide before swapping silicon revisions, and verify the reset release timing against the new datasheet revision.
コンプライアンス情報
RoHS status derived from datasheet category listing (RoHS: No). Reach, halogen, and conflict-mineral declarations not present in verified web data.
