EP20K200CF672C8ES
EP20K200CF672C8ES - APEX 20K 200K Gate FPGA 672-BGA | Intel
The Intel (formerly Altera) EP20K200CF672C8ES is a member of the APEX 20K family of programmable logic devices, delivering approximately 200,000 system gates in a 672-ball FineLine BGA package. It integrates up to 106,400 logic elements, 212,992 RAM bits, and a MultiCore architecture that combines look-up table (LUT) logic with embedded memory blocks, making it suitable for high-density, memory-rich designs in networking, telecommunications, and DSP applications.
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers can configure after manufacturing to implement arbitrary digital circuits. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers and ASICs as flexible digital platforms. APEX 20K belongs to Intel's (Altera's) earlier-generation PLD portfolio, positioned between CPLDs (smaller, non-volatile, lower-density) and modern high-end FPGAs (millions of logic elements, multi-Gbps transceivers). The MultiCore architecture combines logic elements (LEs), embedded system blocks (ESBs) for memory and specialized functions, and a high-bandwidth interconnect fabric.
Key features of the EP20K200CF672C8ES include a maximum of 212,992 bits of embedded RAM distributed across embedded system blocks, 1,064 maximum user I/O pins, and an LVTTL/LVCMOS-compatible I/O standard set. The device supports in-system programmability via SRAM configuration, requires a separate configuration device (e.g., EPC2) for standalone boot, and operates on a 1.8V core supply with I/O banks supporting multiple voltage standards. The "C8" speed grade corresponds to commercial temperature range (-0°C to +85°C) and an 8 ns pin-to-pin delay, while the "ES" suffix indicates an engineering sample.
The APEX 20K architecture uses a four-input look-up table (LUT4) per LE, with dedicated carry chains for arithmetic and dedicated cascade chains for wide fan-in functions. Embedded system blocks can be configured as RAM, ROM, or CAM (Content-Addressable Memory), allowing the device to implement true dual-port memories, FIFOs, and lookup-table-based DSP operations without external memory. The high I/O count (1,064 maximum) is achieved through the FineLine BGA package, which uses an array-style footprint.
Typical applications include 10/100/Gigabit Ethernet bridging, ATM/SONET/SDH framer implementations, custom DSP datapaths, and high-speed bus interface logic for PCI, PCI-X, and proprietary backplanes. The high embedded-memory density makes the EP20K200CF672C8ES particularly attractive for designs that require on-chip packet buffering, look-up tables for routing, or large register files. The 672-pin FineLine BGA package provides signal integrity advantages for high-frequency interfaces.
When designing with this device, plan for configuration memory (typically an EPC2 or EPC16 companion PROM), a JTAG boundary-scan chain for board-level testability, and careful power-rail decoupling because the 1.8V core can draw substantial current during simultaneous-switching events on output pins. The engineering sample (ES) status means this specific part number is intended for prototyping and qualification; production builds should target the equivalent commercial suffix without "ES".
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that complement the manufacturer datasheet. Pricing references are stated as of 2026-09-07.
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