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EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel
EP3C40F324I7N

EP3C40F324I7N - Cyclone III FPGA, 39.6K LE, 324-BGA | Intel

The Intel (formerly Altera) EP3C40F324I7N is a Cyclone III low-cost, low-power field-programmable gate array (FPGA) offering 39,600 logic elements (39600 cells / 39600 4-input LUTs as logic resources), 1,161,216 bits of embedded memory, and 195 user I/O pins in a 324-ball FineLine BGA (FBGA-324) package at 19 x 19 mm with 2.2 mm height. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built from a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened blocks such as embedded RAM, multipliers (DSP blocks), PLLs, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) and sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design-flexibility vs. unit-cost spectrum. They are typically used to implement custom digital logic, high-speed parallel processing, glue logic, and hardware acceleration that would be too expensive, slow, or power-hungry on a CPU or MCU. The EP3C40F324I7N is fabricated on TSMC's low-power 65 nm process and operates from a 1.15 V to 1.25 V core supply (VCCINT), giving it the lowest static and dynamic power envelope of the Cyclone III family. It integrates 126 embedded 18 x 18 multipliers, 4 general-purpose PLLs, and supports configuration via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. Maximum internal clock frequency is 437.5 MHz and the maximum user I/O count is 195. Typical applications include industrial motor control and factory automation, video processing and display bridges, telecom line cards and baseband preprocessing, low-cost ASIC prototyping, and software-defined radio (SDR) front-end glue logic. The device's combination of logic density and DSP block count makes it well-suited for parallel signal-processing pipelines. When designing, ensure that the 324-ball FBGA land pattern meets JEDEC MS-034 tolerances and that at least four PCB layers are dedicated to GND/VCCINT planes for power integrity. JTAG chain ordering must place the FPGA before or after other JTAG devices without signal-integrity stubs to avoid boundary-scan failures. This page synthesizes distributor pricing as of 2026-09-09, same-package drop-in alternatives, and engineering design notes that are not aggregated in any single manufacturer datasheet.

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EP3C40F484C6 - 39,600 Logic Cell Cyclone III FPGA | Intel
EP3C40F484C6

EP3C40F484C6 - 39,600 Logic Cell Cyclone III FPGA | Intel

The Intel EP3C40F484C6 is a Cyclone III field-programmable gate array with 39,600 logic cells, 2,475 logic array blocks, and 535 I/Os in a 484-pin FBGA package. It operates from a 1.15 V to 1.25 V core supply and supports an operating temperature range from -40°C to 125°C. These characteristics place it in the low-cost FPGA category, where programmable logic implements digital control, interface, signal-processing, and system-integration functions without requiring a fixed application-specific integrated circuit. A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture. Within the broader hierarchy, an FPGA is a programmable logic device, a reconfigurable digital integrated circuit, and a semiconductor. Its configuration memory and programmable interconnect allow one physical design to support multiple logic functions through a revised bitstream. Cyclone III devices combine embedded logic resources with configurable I/O blocks, making them suitable for industrial controls, communications equipment, embedded processors, and test systems. The EP3C40F484C6 provides 39,600 logic cells across 2,475 logic array blocks, a useful density level for designs that exceed basic programmable-logic devices while avoiding the resource requirements of much larger FPGAs. Its maximum operating frequency is listed as 315 MHz, although the achieved system clock also depends on the selected design, device speed grade, I/O path, external memory interface, timing constraints, and board implementation. The device uses a 1.15 V to 1.25 V operating supply range and is packaged in a 484-pin fine-pitch ball grid array. A large FBGA package supports a high pin count and dense board routing, but it also requires careful PCB layout, thermal analysis, and assembly planning. The manufacturer documentation describes the device as lead-free and moisture-sensitive, making controlled handling, dry storage, reflow-profile management, and solderability inspection important manufacturing considerations. Typical uses include industrial control logic, communication protocol conversion, embedded processing systems, instrumentation, and general-purpose digital prototyping. Engineers can implement parallel data paths, state machines, interfaces, memory controllers, and custom accelerators in the programmable fabric. The 535 I/O resources offer substantial connectivity, although actual usable I/O count depends on the power-supply arrangement, voltage standards, dedicated configuration pins, and selected device resources. The primary engineering consideration is that the 484-pin FBGA footprint makes PCB changes difficult once layout is committed. Confirm the exact ball assignments, voltage rails, configuration interface, clock requirements, decoupling, and pin-termination guidance in the manufacturer datasheet before release. Budget adequate copper and thermal spreading for the package, and validate signal integrity on every high-speed interface because external routing can determine whether a design closes timing successfully. This product page consolidates the device identity, package characteristics, technical-search coverage, related family members, and practical implementation guidance. It is intended to help engineers determine whether the EP3C40F484C6 fits a 484-pin Cyclone III design before moving into detailed datasheet review, Quartus design compilation, PCB validation, and prototype testing.

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EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera
EP3C40F484C6N

EP3C40F484C6N - Cyclone III 39.6K LE FPGA, 484-FBGA | Altera

The Intel (formerly Altera) EP3C40F484C6N is a Cyclone III family low-cost FPGA delivering 39,600 logic elements in a 484-ball FineLine BGA (FBGA) package. Built on a 65 nm low-k dielectric process, the device integrates 1,161,216 bits of embedded memory, 4 PLLs, 396 embedded 18x18 multipliers, and up to 331 general-purpose user I/O pins. According to the Cyclone III Device Handbook, the part is offered in the commercial C6 speed grade targeting cost-sensitive high-volume applications. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. FPGAs occupy a tier above general-purpose microcontrollers for parallel data processing and below ASICs for design flexibility, making them a core building block of digital logic design. The Cyclone III family sits within Altera/Intel's low-cost FPGA portfolio, optimized for price/performance in applications where high-end transceivers and SerDes are not required. The EP3C40F484C6N ships in the F484 package (23x23 mm, 1.0 mm ball pitch) and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through dedicated I/O banks. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. Four user PLLs provide clock synthesis with multiply, divide, phase shift, and duty-cycle control, while the 18x18 multipliers enable DSP operations up to 250 MHz. The device operates from a 1.2 V core supply with separate VCCIO rails for I/O bank voltage flexibility. Typical applications for the EP3C40F484C6N include industrial control and motor drive, video processing pipelines, telecommunications line cards, automotive driver assistance pre-processing, and software-defined radio baseband logic. The combination of ample logic, dedicated multipliers, and flexible I/O makes it well-suited for designs previously requiring multiple CPLDs or smaller FPGAs. When designing with this device, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin, and follow Intel's PCB layout guidelines for FBGA breakout. The Quartus II / Quartus Prime design suite is required for synthesis, place-and-route, and configuration bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting sourcing engineers and FPGA design teams in component selection.

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EP3C40F484C7 - 39,600-Cell Cyclone III FPGA | Altera
EP3C40F484C7

EP3C40F484C7 - 39,600-Cell Cyclone III FPGA | Altera

The Altera EP3C40F484C7 is a Cyclone III field-programmable gate array with 39,600 logic cells, 331 I/Os, a maximum frequency of 437.5 MHz, and a 484-pin FBGA package. The device uses 65 nm fabrication technology and operates from a 1.2 V core supply, combining programmable logic capacity with a high pin count in a surface-mount package. A field-programmable gate array, or FPGA, is a programmable logic device whose digital circuits can be configured after manufacture. An FPGA sits within the broader semiconductor and programmable-logic hierarchy, connecting general-purpose processors, fixed-function ASICs, and reconfigurable digital logic. Its combination of parallel processing, programmable I/O, and deterministic hardware behavior makes it useful for communications, control, signal processing, and embedded systems. The Cyclone III device provides 39,600 logic cells and 331 I/Os in the EP3C40F484C7 configuration. Its stated maximum frequency is 437.5 MHz, while its 65 nm process and 1.2 V core supply define the physical and electrical implementation. The 484-FBGA package supports dense board routing and is intended for surface-mount assembly rather than a through-hole installation. Because an FPGA implements its logic through a configurable fabric, designers can implement parallel datapaths, control functions, interface bridging, and fixed digital algorithms in one device. The 331 available I/Os allow the device to interface with external memory and multiple digital peripherals, although the usable signal count depends on the selected configuration, voltage standards, bank assignments, and power-management scheme. Typical applications include industrial control systems, communication interfaces, data acquisition, embedded video processing, test equipment, and digital signal-processing front ends. For designs requiring deterministic timing, parallel channels, or programmable logic, the device provides dedicated hardware rather than relying exclusively on sequential software execution. It can also be paired with external processors or transceivers when system-level partitioning is preferable to a single-device implementation. PCB implementation requires careful attention to the 484-ball FBGA escape routing, power delivery, and thermal management. The 1.2 V core rail should be decoupled according to the Cyclone III power-supply recommendations, while interface supplies should use suitable voltage-tolerant I/O banks. Ball-pitch routing should be checked against the manufacturer footprint before PCB release. This page combines the device’s programming, package, and ordering characteristics with application guidance, comparison parameters, and practical migration considerations. It is intended to help engineers confirm footprint compatibility, evaluate the 39,600-cell Cyclone III resource level, and plan power, routing, and configuration requirements before committing a board design.

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EP3C40F484C7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel
EP3C40F484C7N

EP3C40F484C7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel

The Intel / Altera EP3C40F484C7N is a Cyclone III field-programmable gate array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 331 user I/Os in a 484-ball fine-pitch BGA (FBGA-484) package. It belongs to the Cyclone III family, built on a low-power 65 nm process, and is specified for commercial-grade operating temperatures with lead-free / RoHS-compliant packaging. A Field-Programmable Gate Array (FPGA) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, multipliers, and I/O serdes. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below ASICs in terms of integration density, and they belong to the broader integrated-circuit / semiconductor category. Unlike microcontrollers, FPGAs implement logic in hardware gates, which provides deterministic timing and parallel execution suitable for high-throughput DSP, video bridging, and custom interface glue. Key features of the EP3C40F484C7N include 4 embedded PLL clock managers, 126 embedded 18x18 multipliers for DSP, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The 484-FBGA package offers a 1.0 mm ball pitch and an exposed-die thermal management approach, supporting up to 331 user I/Os that allow dense parallel bus implementations. Cyclone III devices also embed configuration memory and a dedicated JTAG configuration interface, eliminating the need for external configuration PROMs in most designs. The Cyclone III architecture combines an SRAM-based logic fabric with hard DSP blocks and dedicated memory, allowing engineers to implement custom pipelines, bus bridges, motor-control loops, and video processing functions. Compared with earlier Cyclone II devices, Cyclone III reduces dynamic power by approximately 50 percent and adds true LVDS support on more pins, enabling low-cost industrial, consumer, and automotive infotainment designs. Typical applications for the EP3C40F484C7N include motor control and drive, industrial machine vision, video-format conversion (HDMI/DVI/VGA bridging), software-defined radio front ends, low-cost ASIC prototyping, and LED video-wall controllers. The combination of moderate logic density, abundant block RAM, and a high pin count makes it well suited for parallel video pipelines and embedded control boards. When designing with this device, pay attention to power sequencing for the core (VCCINT) and I/O (VCCIO) rails, and use the dedicated JTAG or Active Serial configuration scheme. Because the configuration memory is SRAM-based, designs that must retain logic across power cycles should use a Cyclone III-compatible configuration device (EPCS) or a soft-processor bootloader. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III and Cyclone IV families, and practical design notes not found in the manufacturer datasheet alone.

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EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel
EP3C40F484C8

EP3C40F484C8 - Cyclone III FPGA, 39.6K LE, 484-BGA | Intel

The Intel (formerly Altera) EP3C40F484C8 is a Cyclone III family Field-Programmable Gate Array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers into a 484-ball FineLine BGA package. It supports up to 331 user I/O pins and is built on a low-power 60-nm process, drawing as little as 0.25 W of dynamic power at typical operation. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic functions after PCB fabrication. The Cyclone III FPGA belongs to the broader taxonomy of semiconductor devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs sit alongside microcontrollers and DSPs in the digital signal processing hierarchy, offering parallel hardware execution that microcontrollers cannot match. Key specifications of the EP3C40F484C8 include 4 PLL outputs for clock management, 56 embedded 18x18 multipliers (Cyclone III value line), 20 global clock networks, and 20 M9K memory blocks. The C8 speed grade denotes a commercial temperature range with mid-tier timing closure, while the F484 package uses Intel's FBGA-484 footprint with 1.0 mm ball pitch. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards for interfacing with DDR/DDR2 memory and high-speed parallel peripherals. The Cyclone III architecture combines an LAB (Logic Array Block) structure of 16 logic elements per LAB with MultiTrack interconnect, providing efficient routing for medium-density designs. The 60-nm process node gives a favorable power-performance ratio versus earlier Cyclone II devices, making Cyclone III suitable for power-sensitive applications such as handheld test equipment and battery-powered industrial controllers. Typical applications include motor control and industrial automation, video processing and image aggregation, software-defined radio (SDR) baseband, low-cost digital signal processing, and PCI/PCI Express endpoint bridging. The 484-BGA package offers ample I/O and signal integrity for multi-lane parallel buses, while the embedded M9K memory blocks simplify FIFO and dual-port buffer implementation. Designers should consult the Cyclone III Device Handbook (Volume 1: Logic Elements, Volume 2: I/O and Memory) for Quartus II pin assignment and SignalTap II debugging guidance. When migrating from Cyclone II, verify I/O standard compatibility and re-validate timing in Quartus II version 9.0 or later. This page synthesizes distributor pricing, drop-in same-package alternatives (EP3C16F484C8N, EP3C25F484C8N), and practical design notes not found in the manufacturer datasheet.

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EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel
EP3C40F484C8N

EP3C40F484C8N - Cyclone III FPGA 39.6K LEs 484-FBGA | Intel

The Intel EP3C40F484C8N is a low-power 65nm Cyclone III FPGA integrating 39,600 logic elements, 1,161,216 bits of embedded memory (M9K blocks totaling 1134 Kbit × 9 = approximately 1.16 Mbit), 126 embedded 18×18 multipliers, and 331 user I/Os in a 484-ball FineLine BGA package. Speed grade 8 designates a commercial temperature-range device targeting -40C to +85C operation. Per the Altera/Intel Cyclone III Device Handbook, the device is built on a TSMC 65nm low-power process and supports core voltages of 1.15V–1.25V with multi-voltage I/O banks. A Cyclone III FPGA is a programmable logic device that allows hardware designers to implement arbitrary digital circuits - from glue logic and bus bridges to soft-core processors and DSP pipelines - on a single silicon die. FPGAs sit between fixed-function ASICs (Application-Specific Integrated Circuits) and microcontrollers in the digital design hierarchy: they offer higher integration density than discrete logic ICs but lower per-unit cost than full-custom ASICs at low-to-medium volumes. Cyclone III, released in 2007, is the third-generation low-cost Cyclone family and is widely used as a stepping stone between discrete logic and high-end FPGAs. Key features of the EP3C40F484C8N include 4 PLLs for clock management, 20 global clock networks, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and dedicated LVDS pairs on every I/O pin with data rates up to 875 Mbps. The 484-FBGA (23×23 mm, 1.0 mm pitch) package provides ample routing density for memory-rich designs. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes with the dedicated EPCS serial configuration device family. Architecturally, the EP3C40F484C8N uses Altera's Logic Array Block (LAB) structure with each LAB containing 16 Logic Elements (LEs). Each LE combines a 4-input LUT, a programmable register, and dedicated carry-chain logic. Embedded multiplier blocks support 18×18 signed or unsigned multiplication natively, enabling single-cycle DSP operations at speeds up to 260 MHz. The M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers with byte enables for parity/ECC support. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, telecom line cards, and low-volume ASIC prototyping. Designers frequently pair the EP3C40 with external DDR/DDR2 SDRAM, EPCS configuration memory, and a 100 MHz LVCMOS clock source. The 484-BGA package is also suitable for designs migrating to Cyclone IV E (EP4CE40F484) via the Quartus II Cyclone III to Cyclone IV migration guide. When designing with this part, ensure proper bank voltage supply for each I/O group, keep VCCINT within 1.15V–1.25V with at least 4 bulk ceramic decoupling capacitors placed within 5 mm of the package, and verify signal-integrity on LVDS links since the 1.0 mm BGA pitch requires controlled-impedance routing on a 6+ layer PCB. Quartus II Web Edition (free) supports the EP3C40 with full synthesis, place-and-route, and timing analysis. This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives (same 484-FBGA footprint, including variants within the Cyclone III family and pin-compatible Cyclone IV E migrations), and practical hardware design notes not found in the manufacturer datasheet alone.

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EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA
EP3C40F484I7

EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA

The Intel (formerly Altera) EP3C40F484I7 is a low-power Cyclone III FPGA with 39,600 logic elements, 1,161,216 bits of embedded memory and 331 user I/Os, housed in a 484-ball FineLine BGA (FBGA-484) package. Fabricated on a 65 nm CMOS process and operating from a 1.2 V core supply, this device targets cost-sensitive, high-volume applications that require moderate logic density and a generous I/O count without the power penalty of higher-end families. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks and PLLs. FPGAs are reprogrammable, allowing engineers to implement custom digital logic, glue functions, parallel processing pipelines, and high-speed I/O protocols. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They complement microcontrollers and ASICs by trading unit cost for flexibility, parallelism and time-to-market. Key features of the EP3C40F484I7 include 4 PLLs, 126 multipliers (18 x 18 hardware multipliers for DSP), support for LVDS, LVTTL, LVCMOS, SSTL and HSTL I/O standards, and a configurable Logic Array Block (LAB) architecture of 2,475 LABs. The device operates over the industrial -40C to +125C temperature range, making it suitable for harsh-environment and industrial designs. Cyclone III devices use a low-k, 65 nm process and a small die footprint relative to logic capacity, delivering one of the lowest static power profiles in the FPGA market at the time of release. Designers typically pair the FPGA with DDR/DDR2 SDRAM memory controllers (using the dedicated DQS pins) and external configuration memory (such as EPCS or EPCQ serial flash). Configuration is loaded via JTAG or the active/passive serial (AS/PS) scheme. Typical applications include industrial motor control and automation, video processing pipelines, software-defined radio (SDR) baseband, test and measurement front-ends, and protocol bridging cards (PCI Express, Ethernet MACs, custom LVDS links). The 484-FBGA footprint provides enough I/O for memory buses, high-speed transceivers-like interfaces (via LVDS), and parallel expansion connectors. When designing with this FPGA, ensure that the JTAG chain and configuration mode pins (MSEL[3..0]) are correctly strapped, and verify that the chosen I/O bank voltages match the logic levels of connected peripherals. The Quartus Prime (or legacy Quartus II) toolchain is required for synthesis, place-and-route, and bitstream generation. Use the Altera/Intel PowerPlay early power estimator before PCB layout to size decoupling, planes, and any required thermal management. This page synthesizes distributor pricing, verified same-family drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers make an informed second-source decision.

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EP3C40F484I7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel / Altera
EP3C40F484I7N

EP3C40F484I7N - Cyclone III FPGA, 39.6K LE, 484-FBGA | Intel / Altera

The Intel (formerly Altera) EP3C40F484I7N is a low-cost Cyclone® III Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 484-ball FineLine BGA package. It operates from a 1.2 V core supply and supports I/O standards including LVDS, LVCMOS, SSTL, and HSTL through eight I/O banks. The device targets cost-sensitive high-volume applications while delivering 437.5 MHz maximum core performance. What is a Cyclone III FPGA? The Cyclone III family is a low-power, low-cost SRAM-based programmable logic family from Altera (now Intel FPGA) that sits in the broader hierarchy of programmable logic devices (PLD) between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices are built on a TSMC 65 nm low-power process and integrate logic, multipliers, memory, PLLs, and high-speed I/O into a single device, making them suitable for I/O expansion, glue-logic replacement, parallel DSP, and mid-density state-machine designs. Key features of the EP3C40F484I7N include 4 PLLs, 331 user I/O pins distributed across 8 banks, 1.161 Mbit of RAM, and full industrial temperature range support from -40 °C to +125 °C (the I7N speed/temperature grade). The device supports up to 1 Gbps LVDS with external serializer/deserializer logic, provides 2.5 Gbps external memory interfaces, and includes dedicated DDR/DDR2/QDRII memory controller hard IP. Configuration is supported through passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes using industry-standard Altera/Intel EPCS or EPCQ configuration flash devices. Typical applications for the EP3C40F484I7N span industrial motor control, video processing and image aggregation, automotive infotainment controllers, software-defined radio baseband, low-density ASIC prototyping, and consumer display controllers. The 484-FBGA package offers 1.0 mm ball pitch and excellent signal integrity for high-speed LVDS and DDR2 interfaces, while the industrial temperature grade suits factory automation and outdoor deployments. When designing with this device, ensure proper decoupling (100 nF + 10 µF bulk per bank) and follow Intel's Cyclone III pin connection guidelines for unused pins. Configuration flash selection is critical — pair with an EPCS16 or EPCQ16 for typical 39.6 K LE designs. The QFP-484 BGA requires X-ray inspection in production, so design for manufacturability with clear pad geometry.

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EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera
EP3C40F780C6

EP3C40F780C6 - Cyclone III FPGA 39.6K LE 780-BGA | Altera

The Altera EP3C40F780C6 is a Cyclone III Field-Programmable Gate Array (FPGA) housed in a 780-pin FineLine BGA package, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/O pins. Built on a low-power 60 nm process, the Cyclone III family targets cost-sensitive, high-volume applications where designers need FPGA density without the power budget of high-end FPGAs. The 'C6' speed grade places it in the mid-speed bin of the family, and the 'F' package descriptor indicates a leaded, RoHS-compliant FineLine BGA. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device whose logic fabric, routing, and I/O behavior are defined after manufacture through a configuration bitstream. FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices) in the programmable-logic taxonomy: ASIC > FPGA > CPLD > SPLD > standard logic. Cyclone III is positioned as a low-cost, low-power alternative to Stratix within Altera's portfolio, and is a direct competitor to Xilinx Spartan-6 and Lattice ECP3 families. Key features include 4 embedded 18x18 hardware multipliers (DSP blocks), up to 4 PLLs per device for clock management, and 396 Kbits of M9K embedded SRAM. The 780-BGA package provides 535 general-purpose user I/Os supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, with 8 transceiver channels (where present) and dedicated global clock networks. Cyclone III supports configuration through AS, PS, JTAG, and Fast Passive Parallel modes, and integrates the Altera Cyclone III Configuration scheme. Architecturally, the EP3C40F780C6 uses a logic-element (LE) fabric of 4-input look-up tables (LUTs) and dedicated carry chains, surrounded by a perimeter I/O ring and column-based M9K memory blocks. The four embedded multipliers enable single-clock-cycle 18x18 signed multiplications, while the PLL blocks provide frequency synthesis, phase shifting, and clock deskew. Compared to its predecessor Cyclone II, the Cyclone III family roughly doubles logic density and adds DSP blocks at a lower static power budget. Typical applications include industrial motor control, video processing pipelines, telecom line cards, automotive driver assistance, and low-cost prototyping. The combination of high I/O count and embedded multipliers makes the EP3C40F780C6 well suited for parallel sensor aggregation, custom peripheral bridging, and image preprocessing tasks. When designing with this device, allocate sufficient PCB area for the 29 mm x 29 mm 780-BGA with 1.0 mm pitch; layer stackup with buried vias and at least 6 layers is recommended to fan out the package. Confirm Quartus II software support for the C6 speed grade before final timing closure. This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III family, and practical design notes not consolidated in any single manufacturer or distributor listing.

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EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)
EP3C40F780C6N

EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)

The Altera (now Intel) EP3C40F780C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 maximum user I/O pins, housed in a 780-ball FineLine BGA package with 1.0 mm pitch. Operating at a core speed grade of -6 (commercial), it is fabricated on a 60 nm low-power CMOS process and is targeted at cost-sensitive, high-volume designs that previously required ASICs. A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O behavior after PCB fabrication, in contrast to an Application-Specific Integrated Circuit (ASIC) which is fixed at mask production. FPGAs occupy the IC hierarchy at programmable logic -> logic IC -> integrated circuit -> semiconductor. The Cyclone III family specifically targets the cost/performance sweet spot, offering ASIC-level density at FPGA-level flexibility for applications like motor control, video processing, and telecommunications line cards. Key specifications include 39,600 logic elements distributed across 4,065 Logic Array Blocks (LABs) and 126 M9K embedded memory blocks totaling 1,161,216 bits (113 Kbytes of true SRAM). The device integrates 4 phase-locked loops (PLLs) for clock synthesis, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on its 535 user I/O pins, and provides up to 4 integrated hard memory controllers plus a wide range of soft IP cores from Altera/Intel. The Cyclone III architecture uses 60 nm process technology with a 1.2 V core supply and hot-socketing support, achieving typical power consumption of roughly 0.4 W to 1.5 W depending on design utilization. Its SRAM-based configuration requires external flash or a configuration device, while the built-in Cyclic Redundancy Check (CRC) circuitry catches configuration bitstream errors. The device also supports partial reconfiguration for in-field updates without system downtime. Typical applications include industrial motor control, LED display controllers, machine vision and video bridging, automotive infotainment, and low-cost telecommunications line cards. The 535 I/O count and 780-FBGA footprint make it suitable for medium-density designs requiring many parallel interfaces such as LVDS or DDR2 memory. Designers should evaluate the 780-ball FBGA routing complexity and use a minimum 6-layer PCB with controlled-impedance traces. The 1.0 mm pitch keeps the BGA manageable for standard assembly, but X-ray inspection after reflow is mandatory. JTAG programming via USB-Blaster is the standard configuration path. This page synthesizes distributor pricing, drop-in alternative FPGAs, and practical PCB/design notes not aggregated in any single Altera datasheet or distributor listing.

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EP3C40F780C7 - Cyclone III FPGA 39.6K LE 780-FBGA | Intel
EP3C40F780C7

EP3C40F780C7 - Cyclone III FPGA 39.6K LE 780-FBGA | Intel

The Intel (formerly Altera) Cyclone III EP3C40F780C7 is a low-power, high-volume FPGA fabricated on a 60 nm TSMC process, integrating 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers in a 780-ball fine-pitch BGA package. The device operates with a core voltage of 1.2 V and supports I/O standards from 1.2 V to 3.3 V through eight I/O banks that deliver up to 535 user I/O pins. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that implements custom digital logic through configurable logic blocks (CLBs), routing interconnect, and dedicated hardware such as block RAM and DSP blocks. FPGAs sit within the hierarchy of programmable logic devices (PLDs), bridging the gap between fixed-function ASICs and software-defined microcontrollers, and are widely used in parallel processing, hardware acceleration, and rapid-prototyping applications. Key features of the EP3C40F780C7 include support for high-speed external memory interfaces such as DDR2, DDR, QDRII, and SDRAM, four phase-locked loops (PLLs) for clock management, and Cyclone III's proprietary low-power architecture that reduces dynamic power consumption versus earlier Cyclone generations. The 780-FBGA package (29 x 29 mm, 1.0 mm pitch) supports commercial temperature grades (0C to +85C) and is rated for the C7 speed grade, balancing timing margin and cost. The Cyclone III family targets cost-sensitive high-volume applications such as industrial automation, video processing, and telecommunications. With 39,600 logic elements and ample DSP and memory resources, the EP3C40F780C7 supports medium-complexity algorithmic implementations, multiple soft processor cores, and rich memory buffering for streaming data pipelines. Typical applications include motor control and industrial networking, HD video bridging, software-defined radio (SDR) front ends, machine vision, and PCI Express endpoint bridging. The wide I/O count and embedded multipliers also make it suitable for custom display controllers and ASIC prototyping. When designing with this device, designers must respect the 1.0 mm BGA pitch constraint and apply standard JTAG-based configuration via the Altera/Intel Quartus Prime design suite. Power sequencing of VCCINT (1.2 V) and VCCIO banks is required to avoid inrush damage; the device supports both active serial and passive parallel configuration schemes. This page combines Intel/Altera datasheet parameters, distributor pricing, and drop-in same-package alternatives into a single reference - information not consolidated in any single source. Engineers seeking a Cyclone III device with 39.6K logic elements, 1.16 Mbit of embedded memory, and 535 user I/Os in a 780-FBGA will find the EP3C40F780C7 datasheet, pinout, and pricing summary below.

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EP3C40F780C7N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
EP3C40F780C7N

EP3C40F780C7N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C7N is a Cyclone III family Field-Programmable Gate Array (FPGA) containing 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/Os, housed in a 780-ball FineLine BGA package with industrial temperature grade support. The trailing 'C7' in the part number designates the 7 speed grade at commercial operating conditions, while 'N' indicates a lead-free / RoHS-compliant package finish. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit at the apex of digital logic integration, bridging the gap between fixed-function ASICs and software-driven microcontrollers. Cyclone III specifically targets low-power, high-volume applications where designers need substantial logic density without the power and cost penalty of high-end FPGAs. The Cyclone III family is built on a 65 nm TSMC low-power process, enabling static power as low as a few milliwatts in standby and a typical power reduction of more than 50% compared to the prior-generation Cyclone II. The 780-FBGA package supports the largest Cyclone III device with 535 user I/Os, providing ample connectivity for parallel data buses, memory interfaces, and high-speed peripherals. Embedded memory totals 1,161,216 bits (RAM bits) distributed across M9K blocks, and 126 embedded 18x18 multipliers serve DSP workloads. The device is supported by the Altera / Intel Quartus II / Quartus Prime design suite, with free Web Edition license entry points. Designers can leverage IP cores for DDR/DDR2 memory controllers, Ethernet MACs, PCIe (soft IP), and common serial protocols. Configuration is typically via JTAG or active/passive serial flash, with built-in decompression and encryption options for secure bitstream handling. Typical applications include industrial machine vision, factory automation controllers, video processing pipelines, motor control, test and measurement equipment, and as a glue-logic aggregator in telecom line cards. The 535 I/Os make the device attractive for high-pin-count bridging designs, including LCD/OLED display controllers and multi-port memory hubs. The combination of low power, high I/O count, and large logic capacity makes it a long-running favorite for cost-sensitive embedded platforms. When designing with this FPGA, pay close attention to power architecture: even at modest toggle rates the 780-FBGA can draw several watts, so a multi-rail supply with proper decoupling and a thermally-aware PCB layout are essential. Use Quartus Prime PowerPlay early estimates to size your regulators and copper pours before layout, and verify signal-integrity on the high-speed LVDS pairs using IBIS models. The N-variant of the package finish is lead-free, so JEDEC J-STD-020 MSL3 handling is mandatory at assembly.

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EP3C40F780C8 - Cyclone III FPGA, 40K LEs, 780-FBGA | Intel
EP3C40F780C8

EP3C40F780C8 - Cyclone III FPGA, 40K LEs, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C8 is a Cyclone III low-power Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 126 embedded 18x18 multipliers, housed in a 780-ball FineLine BGA (FBGA) package with 535 user I/O pins. Built on a 65 nm low-power process, the device targets cost- and power-sensitive high-volume applications while delivering DSP-rich programmable logic. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as memory blocks, multipliers, PLLs, and high-speed transceivers. Within the broader taxonomy, the EP3C40F780C8 sits in the low-power, low-cost segment (Cyclone family) of the programmable logic hierarchy: FPGA -> programmable logic -> logic IC -> semiconductor. The 'drop-in' family pedigree lets designers add parallel processing, custom I/O protocols, and hardware-accelerated DSP without an ASIC redesign. Key features of the EP3C40F780C8 include four general-purpose PLLs, 20 global clock networks, and support for external memory interfaces such as DDR/DDR2/QDRII SRAM via dedicated PHY blocks. The 780-FBGA package enables 535 user I/O for high pin-count glue-logic, motor-control, and video/display bridging designs. The Cyclone III architecture lowers static and dynamic power compared with earlier Cyclone generations, making the part well-suited to thermally constrained embedded systems. The Cyclone III fabric combines LUT-based logic with embedded M9K memory blocks and 18x18 multipliers, allowing efficient implementation of finite impulse response (FIR) filters, FFT engines, and Nios II embedded processor subsystems. The high I/O count (535) is a strong fit for parallel buses, camera/display interfaces, and industrial control planes that need many LVCMOS/LVDS lanes. Typical applications include industrial motor control and factory automation, video surveillance image processing, automotive infotainment prototypes, low-cost software-defined radio front ends, and embedded vision/display bridges. The combination of DSP blocks and abundant logic resources also suits medical imaging pre-processing and portable test and measurement equipment. Designers should plan thermal management around the 780-FBGA and use Intel's Quartus Prime design software (with the Cyclone III device support installed) for synthesis, place-and-route, and timing closure. A multi-layer PCB with continuous power and ground planes plus proper decoupling is mandatory for signal-integrity on high-toggle-rate pins. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not collected in the manufacturer datasheet, giving engineers a single, citable reference for the EP3C40F780C8.

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EP3C40F780C8N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel
EP3C40F780C8N

EP3C40F780C8N - Cyclone III FPGA, 39.6K LE, 780-FBGA | Intel

The Intel (formerly Altera) EP3C40F780C8N is a low-power Cyclone® III Field Programmable Gate Array (FPGA) delivering 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/Os in a 780-ball FineLine Ball-Grid Array (FBGA) package. It operates from a 1.15V to 1.25V core supply with commercial 0°C to +85°C temperature grade and a speed grade 8 (C8) timing bin, targeting cost-sensitive high-volume applications. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory blocks that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven processors: unlike ASICs they require no fabrication mask, and unlike microcontrollers they execute logic in dedicated hardware rather than sequential firmware. Cyclone III belongs to Intel's low-cost, low-power FPGA family, succeeding Cyclone II with a 65nm process that drops static power roughly 50% and dynamic core power roughly 25%, while adding hardware multipliers and a richer memory hierarchy. Key features include 126 embedded 18x18 multipliers (up to 396 9x9 multipliers), four general-purpose PLLs for clock synthesis and skew management, and support for external memory interfaces including DDR/DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The device offers 20 global clock networks, 535 maximum user I/Os arranged in 9 I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, plus configuration via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes. Architecturally the EP3C40F780C8N uses a 65nm TSMC low-power process, an M9K memory block tile of 9 Kbit each (with parity), and dedicated hardware multiplier blocks routed through adjacent logic array blocks (LABs) of 16 LEs each. The C8 speed bin is the slowest commercial Cyclone III grade and trades fMAX for cost reduction in non-timing-critical designs. Typical applications include industrial motor control and factory automation, video surveillance and image processing pipelines, automotive infotainment subsystems, low-cost software-defined radio front-ends, and consumer display controllers. The combination of hardware multipliers and embedded memory makes it well suited to digital signal processing (DSP) and protocol bridging tasks. When designing with the EP3C40F780C8N, ensure 1.15V-1.25V core and 2.5V/3.3V I/O supplies are properly decoupled with 100nF + 10uF ceramic caps near each supply pin, route all global clocks through PLL outputs where possible, and confirm PCB BGA escape routing supports 1.0mm ball pitch microvia stacks. This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/IV family, and practical design notes not consolidated in the manufacturer datasheet.

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EP3C40F780I7 - 39.6K LEs Cyclone III FPGA 780-BGA | Intel
EP3C40F780I7

EP3C40F780I7 - 39.6K LEs Cyclone III FPGA 780-BGA | Intel

The Intel (formerly Altera) EP3C40F780I7 is a Cyclone® III family Field-Programmable Gate Array (FPGA) housing 39,600 logic elements (LEs) in a 780-ball FineLine BGA package with industrial temperature grade (-40C to +100C). The device integrates 1,161,216 bits of embedded RAM (234 M9K blocks of 9 Kbits each plus 112,500 bits of MLAB) and 535 (9-bit) multipliers, giving it roughly 1.1 Mbit of on-chip memory and ~172 GMAC/s of DSP throughput at a maximum internal clock of 472.5 MHz. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the engineer programs after manufacture, making the FPGA a re-programmable equivalent of an application-specific integrated circuit (ASIC). FPGAs sit hierarchically between general-purpose microcontrollers and hard-wired ASICs: microcontrollers run software sequentially, while FPGAs execute parallel custom logic in hardware. The Cyclone III family specifically targets cost-sensitive, high-volume applications such as industrial control, video processing, and communications line cards where the engineer needs true parallelism at a fraction of the cost and power of high-end FPGAs. Key features of the EP3C40F780I7 include 4 PLLs for clock synthesis and skew management, support for external memory interfaces such as DDR/DDR2/QDRII SRAM, dedicated LVDS pairs for high-speed differential signaling, and a 1.2 V core voltage (VCCINT) with separate VCCIO banks for mixed-voltage I/O. The F780 package provides 780 balls on a 29x29 mm FineLine BGA substrate suitable for high-density SMT assembly. The Cyclone III architecture is built on a low-power 65 nm process with a 1.2 V core that minimizes dynamic power; the 'I7' suffix indicates the industrial temperature range. Typical applications include motor control, video bridging, industrial Ethernet, software-defined radio (SDR), and low-cost ASIC prototyping. When designing with this device, pay close attention to bank-based VCCIO planning, decoupling strategy for VCCINT/VCCPLL, and the JTAG configuration pinout; the Quartus II / Quartus Prime toolchain is required for synthesis and place-and-route. The 780-BGA package is large but the industrial temperature grade and abundant DSP blocks make this part well-suited to factory automation and outdoor telecom equipment.

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EP3C40F780I7N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I7N

EP3C40F780I7N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel

The Intel (Altera) EP3C40F780I7N is a low-power Cyclone III Field Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, and 535 user I/O pins, housed in a 780-ball FineLine BGA package with 1.2 V core operation. It belongs to the Cyclone III family fabricated on a 65 nm TSMC low-power process, balancing logic density, DSP capability, and static power consumption for cost-sensitive embedded and industrial designs. A Field Programmable Gate Array (FPGA) is a programmable logic device that uses configurable logic blocks (CLBs), programmable interconnects, and embedded memory/DSP blocks to implement arbitrary digital circuits after manufacturing. FPGAs sit hierarchically below ASICs (fixed-function custom silicon) and above general-purpose microcontrollers in compute density, and they occupy the reconfigurable-logic layer of modern digital systems. The Cyclone III family specifically targets volume applications where designers need DSP, memory, and moderate logic capacity without paying Stratix-tier prices. Key features include 126 embedded 18x18 multipliers (DSP blocks) for high-throughput arithmetic, four phase-locked loops (PLLs) for clock management, 39600 logic elements wired through a multi-level interconnect fabric, and 1,161,216 bits of embedded SRAM arranged in M9K blocks. The 780-pin FBGA (F780) package exposes 535 user I/Os and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards, making it suitable for parallel memory buses and high-speed sensor interfaces. The Cyclone III architecture separates logic, memory, and DSP into dedicated columns connected by a hierarchical routing network. Embedded multipliers can be cascaded to build wider arithmetic units, while M9K memory blocks can be configured as RAM, ROM, or FIFO. The four PLLs provide up to nine output clocks each with programmable phase shift, enabling complex multi-clock designs without external clock-generation ICs. Typical applications include industrial motor control, video processing pipelines, communications protocol bridging, and embedded DSP for test and measurement. With 39.6K logic elements and 126 DSP blocks, the device fits mid-range signal-processing tasks such as FIR filtering, FFT computation, and image preprocessing. Designers evaluating this FPGA should plan power sequencing, decoupling, and configuration-memory selection (EPCS or EPCQ) during board bring-up.

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EP3C40F780I8N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel
EP3C40F780I8N

EP3C40F780I8N - Cyclone III FPGA, 39.6K LE, 780-BGA | Intel

The Intel EP3C40F780I8N is a member of the Cyclone III family of high-volume, low-cost, low-power Field Programmable Gate Arrays (FPGAs), featuring 39,600 logic elements organized into 2,475 Logic Array Blocks (LABs/CLBs), 1,161,216 bits of embedded memory, and 126 multipliers, housed in a 780-ball FBGA package with industrial temperature grade. The device operates from a nominal 1.2 V core supply (range 1.15 V to 1.25 V) and supports up to 4 PLLs with 4 dedicated clock pins per bank for flexible clock tree synthesis across up to 20 I/O banks. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets designers configure arbitrary digital logic through SRAM-based configuration cells. FPGAs sit at the intersection of ASIC efficiency and processor flexibility: they offer hardware parallelism and deterministic timing that microcontrollers cannot match, while allowing in-system reconfiguration that fixed-function ASICs cannot deliver. The Cyclone III family specifically targets cost-sensitive, power-constrained high-volume applications where designers need ASIC-class logic density without ASIC NRE cost, making it a workhorse for industrial control, video, and communications infrastructure. Key features of the EP3C40F780I8N include 39,600 logic elements, 1,161,216 bits of embedded SRAM (approximately 135 KBytes), 4 PLLs, 20 global clock networks, 535 user I/O pins, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 780-BGA package provides generous I/O count for high-pin-count parallel interfaces such as parallel video, RGMII, or PCI/PCI-X bus bridging, and the industrial temperature range (-40 °C to 100 °C) suits outdoor, factory-floor, and automotive-cabin deployments. The EP3C40F780I8N is fabricated in TSMC's low-power 65 nm process, which is the foundation of the Cyclone III family's industry-leading static power profile (typically under 100 mW quiescent). The device supports configuration via passive serial, active serial (EPCS), JTAG, and Fast Passive Parallel modes, enabling flexible boot from low-cost EPCS flash or microprocessor host. On-chip termination (OCT) calibration and LVDS signaling up to 875 Mbps simplify board design. Typical applications include industrial motor control and PLCs, broadcast video processing (HD-SDI/SDI bridges, LCD/TFT controllers), wireline telecom line cards, military/aerospace avionics, medical imaging pre-processing, and software-defined radio baseband. The combination of high logic density and large embedded memory makes it well suited for buffering full HD frames in video pipelines and for protocol adaptation in telecom backplanes. When designing with the EP3C40F780I8N, allocate configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL) carefully and follow the Cyclone III pin connection guidelines for unused pins and bank VCCIO selection. Quartus II Web Edition (free) supports the full Cyclone III device family, but designers targeting high-utilization designs with timing closure benefit from the subscription edition's TimeQuest and Chip Planner. The 780-BGA's 1.0 mm ball pitch requires 4-layer minimum PCB stack-up with microvia-in-pad at HDI processes. This page synthesizes distributor pricing, real-time stock signals, drop-in alternatives from the same Cyclone III family, and practical board-level design notes not found in any single manufacturer datasheet.

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EP3C40Q240C8 - Cyclone III, 39.6K LE FPGA, 240-PQFP | Intel
EP3C40Q240C8

EP3C40Q240C8 - Cyclone III, 39.6K LE FPGA, 240-PQFP | Intel

The Intel (formerly Altera) EP3C40Q240C8 is a low-power Cyclone III Field-Programmable Gate Array (FPGA) housed in a 240-pin Plastic Quad Flat Pack (PQFP / 240-BFQFP) package. According to the distributor listings, the device integrates 39,600 logic elements, 1,161,216 bits of embedded memory (M9K blocks totaling 113,664 bytes per block), four phase-locked loops, 126 embedded 18x18 multipliers, and 128 maximum user I/O pins. The 'C8' speed grade corresponds to a commercial temperature rating of 0C to +85C with an 8 ns internal timing specification. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells can be programmed in-system to implement arbitrary digital circuits. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and microcontrollers, offering hardware parallelism, high I/O counts, and deterministic timing. The Cyclone III family specifically targets low static and dynamic power consumption, enabling FPGA adoption in cost- and power-sensitive applications such as video processing, motor control, and portable instrumentation that were previously dominated by microcontrollers or DSPs. The EP3C40Q240C8 leverages TSMC's 65 nm low-power process, achieving up to 70% lower power than the prior Cyclone II generation. The 240-PQFP package offers 128 usable I/O across eight I/O banks with support for multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The four PLLs provide robust clock management, while 4,608 Kbits of embedded RAM enable on-chip buffering and FIFO structures. Compared with other Cyclone III variants, the EP3C40Q240C8 strikes a balance between logic density, I/O count, and package cost. Typical applications include industrial control and factory automation, video surveillance and image processing, motor and servo control, software-defined radio front-ends, and high-volume consumer electronics. The Cyclone III architecture supports Nios II embedded processor cores, making the EP3C40Q240C8 suitable as a system-on-chip host for embedded designs that need deterministic hardware acceleration alongside firmware control. When designing with the EP3C40Q240C8, ensure that the Quartus II design tool supports the 'C8' speed grade and the Q240 package. The PQFP package is a through-hole-friendly surface-mount format; thermal performance is dominated by the 1.2V core supply and a separate PLL analog supply, both of which require multi-layer PCB decoupling. This page synthesizes distributor pricing, drop-in alternative FPGAs in the same QFP footprint, and practical design notes not duplicated from the manufacturer datasheet.

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EP3C40Q240C8N - Cyclone III FPGA, 39.6K LEs, 240-BFQFP | Intel
EP3C40Q240C8N

EP3C40Q240C8N - Cyclone III FPGA, 39.6K LEs, 240-BFQFP | Intel

The Intel (formerly Altera) EP3C40Q240C8N is a Cyclone III low-power Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements (LEs), 1,161,216 bits of embedded memory (1134 Kb), and 126 embedded 18 x 18 multipliers, housed in a 240-pin Plastic Enhanced Quad Flat Pack (240-BFQFP) package with 128 user I/Os. The device operates from a 1.15 V to 1.25 V core supply and is specified for the commercial 0 C to 85 C temperature range (speed grade 8). A Cyclone III FPGA is a programmable logic device built on a TSMC 65 nm low-power process that combines lookup tables (LUTs), embedded memory blocks (M9K), embedded multipliers, and a flexible I/O ring into a single fabric. Cyclone III sits within Intel's FPGA hierarchy below Cyclone IV and Cyclone V, optimized for cost-sensitive, power-sensitive applications such as industrial control, video processing, and communication bridging. The fabric is configured at power-up from an external flash memory or via JTAG. Key features include 4 phase-locked loops (PLLs) for flexible clock synthesis, support for multiple I/O standards (LVDS, LVCMOS, SSTL, HSTL), and 20 global clock networks. The Cyclone III family emphasizes low static and dynamic power compared with Cyclone II while maintaining a comparable logic density. The 240-BFQFP package enables conventional surface-mount assembly with no fine-pitch BGA handling, simplifying prototyping and low-volume manufacturing. Typical applications include industrial motor control, video surveillance and image processing pipelines, automotive infotainment pre-production prototypes, low-cost software-defined radio front-ends, and protocol bridging between legacy and modern serial interfaces. The combination of 126 hardware multipliers and 1134 Kb of block RAM makes the EP3C40 well suited to DSP-style filtering and buffering tasks that would otherwise require a discrete DSP. Designers should plan for at least 4-layer PCB stack-up with dedicated power planes for VCCINT (1.2 V) and VCCIO (1.2 V to 3.3 V) to maintain signal integrity across the 128 user I/Os. Quartus II Web Edition (or later) is required for synthesis, place-and-route, and bitstream generation; configuration can be loaded via JTAG or through an Altera-compatible serial flash. This page synthesizes current distributor pricing, same-family Cyclone III drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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EP3C40U484A7N - Cyclone III FPGA 39.6K LE | Intel | Automotive
EP3C40U484A7N

EP3C40U484A7N - Cyclone III FPGA 39.6K LE | Intel | Automotive

The Intel (formerly Altera) EP3C40U484A7N is a Cyclone III family Field-Programmable Gate Array (FPGA) integrating 39,600 logic elements, 1,161,216 bits of embedded SRAM, and 4 PLLs in a 484-ball Plastic Ultra-FineLine BGA (UFBGA) package. Built on a low-power 65 nm process, it supports a core voltage of 1.2 V and offers up to 331 user I/O pins with high-speed LVDS interfaces, making it suitable for cost-sensitive, power-aware applications. The part is graded for the automotive temperature range and targets applications requiring deterministic logic density and flexible DSP blocks. A Cyclone III FPGA is a reprogrammable semiconductor device based on an SRAM lookup-table architecture that allows engineers to implement arbitrary digital logic, DSP functions, memory controllers, and high-speed serial/parallel interfaces after PCB fabrication. The Cyclone III family is positioned in Intel's low-end FPGA portfolio, bridging the gap between fixed-logic ASICs and higher-density FPGAs such as Cyclone IV, Cyclone V, and Stratix families. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs in the digital IC hierarchy. Key features include 39,600 logic elements, 126 embedded multipliers (18x18), 4 general-purpose PLLs, 1.161 Mbits of embedded memory, and support for external memory interfaces including DDR, DDR2, SDRAM, and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration can be carried out via passive serial (PS), fast passive parallel (FPP), or JTAG, supporting in-system reprogrammability through Altera/Intel Quartus design software. From an architectural standpoint, Cyclone III devices use a logic-element fabric built around 4-input LUTs and dedicated carry chains, with embedded memory blocks distributed throughout the array. The 65 nm process delivers substantially lower static power than the prior Cyclone II generation while preserving deterministic timing closure. Each PLL provides up to nine output taps with independent frequency synthesis, useful for clock domain management across heterogeneous interfaces. Typical applications include automotive driver-assistance and infotainment pre-processing, industrial motor control, video surveillance and image processing, software-defined radio front ends, and portable test instrumentation. The UFBGA-484 package supports high I/O count designs while maintaining a compact board footprint suitable for space-constrained modules. The combination of logic density, embedded memory, and DSP blocks makes the EP3C40 suitable for mid-complexity digital signal pipelines. When designing with this device, plan I/O bank assignments carefully because the LVDS pairs and PLL clock inputs have fixed pin locations in the UFBGA package. Decoupling capacitance and PCB stack-up directly impact the integrity of DDR memory interfaces; consult the Cyclone III device handbook for board-design guidelines. Quartus Prime or Quartus II design software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and practical design considerations not found in the standalone datasheet, giving engineers a faster path to sourcing and integrating the EP3C40U484A7N into production designs.

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EP3C40U484C6 - Cyclone III FPGA 39.6K LE 484-UBGA | Altera
EP3C40U484C6

EP3C40U484C6 - Cyclone III FPGA 39.6K LE 484-UBGA | Altera

The Altera (Intel) EP3C40U484C6 is a member of the Cyclone III family of low-power, high-volume Field-Programmable Gate Arrays (FPGAs), delivering 39,600 logic elements and 1,161,216 bits of embedded memory in a 484-ball UFBGA (UBGA) package with 0.8 mm ball pitch and 19 mm × 19 mm body. The device integrates 396 logic array blocks, 4 PLLs, 20 global clock networks, and 331 maximum user I/O pins, making it suitable for cost-sensitive, high-volume digital logic applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP such as block RAM, DSP blocks, and phase-locked loops (PLLs). FPGAs occupy a unique position in the digital design hierarchy: more flexible than application-specific integrated circuits (ASICs) yet offering higher performance per watt than general-purpose microcontrollers for parallel DSP, video bridging, and custom interface work. The Cyclone III family specifically targets the low-power end of the FPGA market, leveraging a 65 nm TSMC process and 1.2 V core to optimize dollar-per-logic-element. Key features of the EP3C40U484C6 include 126 embedded 18×18 multipliers suitable for DSP-intensive functions, 4 PLLs for clock management and frequency synthesis, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device operates across a commercial temperature grade (the C6 suffix indicates a 6-speed grade), with a core supply of 1.15 V to 1.25 V and I/O banks that can be independently powered for mixed-voltage designs. The non-volatile configuration is loaded from external serial or parallel flash, supported by Altera's Quartus II design software. The Cyclone III architecture uses an SRAM-based lookup table (LUT) fabric paired with M9K block RAM tiles. The 1,161,216 bits of embedded RAM can be configured as true dual-port, simple dual-port, or single-port memory at widths from ×1 to ×36 bits. Multiplier blocks can be combined with adjacent logic to build DSP filters and FFT engines without consuming general fabric resources. Typical applications include industrial motor control, video processing bridges, software-defined radio front-ends, and embedded prototyping platforms. In motor control, the EP3C40's DSP blocks accelerate Park/Clarke transforms and space-vector PWM generation. In display bridging, the device converts between camera, HDMI, and LVDS data streams at line-rate. The 484-UBGA package supports up to 331 user I/Os, enabling dense parallel interfaces such as DDR2 memory buses and high-speed LVDS links. When designing with this part, plan the power-decoupling network carefully: each PLL requires its own filtered analog supply, and the core supply must be sequenced with the I/O supplies per Altera's Cyclone III Handbook. The UFBGA-484 PCB footprint demands 0.8 mm-pitch via-in-pad or dog-bone fan-out, with controlled-impedance routing for LVDS and DDR2 interfaces. JTAG and Active Serial configuration should be brought out to a header for in-system programming and debug. This page synthesizes distributor pricing, drop-in alternatives, and engineering design guidance not found in the standalone manufacturer datasheet, including same-package same-family variants that share the 484-UBGA footprint.

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EP3C40U484C6N - 39.6KLE Cyclone III FPGA, 484-FBGA | Intel
EP3C40U484C6N

EP3C40U484C6N - 39.6KLE Cyclone III FPGA, 484-FBGA | Intel

The Intel (formerly Altera) EP3C40U484C6N is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 39,600 logic elements, 1,161,216 bits of embedded memory, 126 embedded 18x18 multipliers, and 331 maximum user I/O pins, housed in a 484-ball FineLine BGA (UFBGA) package. It is built on a low-power 65 nm process, operates from a 1.2 V core supply, and is rated for the commercial 0 °C to +85 °C temperature range with -6 speed grade performance. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that belongs to the broader semiconductor category of integrated circuits. In the device hierarchy, an FPGA sits between a fixed-function Application-Specific Integrated Circuit (ASIC) and a general-purpose microprocessor: like an ASIC it implements custom digital logic, but unlike an ASIC its function is defined by a user-loadable configuration bitstream rather than at fabrication time. FPGAs contain configurable logic blocks (CLBs), programmable routing, embedded memory, DSP blocks, and I/O serdes, and they are used to prototype designs, accelerate parallel workloads, and ship low-to-mid volume products where ASIC NRE is uneconomical. Key features of the EP3C40U484C6N include support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), four general-purpose PLLs for clock management, up to 4 Mb of M9K embedded SRAM, and Cyclone III series static power approximately 50 % lower than Cyclone II. The device supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) interfaces using the industry-standard Altera/Intel configuration scheme. Architecturally, the Cyclone III device fabric comprises LABs (Logic Array Blocks) of 16 logic elements each, distributed M9K memory blocks, embedded multiplier blocks for DSP, and per-I/O bank supply pins for mixed-voltage interfacing. The -6 speed grade places this part in the mid-tier of the Cyclone III family, balancing timing margin against cost. Typical applications include industrial motor control, video processing pipelines, telecom baseband preprocessing, military/aerospace ruggedized subsystems, and ASIC prototyping for mid-complexity designs. Designers choose the U484 (484-pin FBGA) variant when their design requires the maximum 331 user I/O of the EP3C40 die, beyond what smaller packages expose. When designing with this part, observe the 484-ball BGA fan-out: route all 8 user-I/O bank supplies (VCCIO) and the 1.2 V core (VCCINT) with at least one decoupling capacitor per bank, place a 100 MHz or lower reference clock into a PLL-clean CLK pin, and use Altera Quartus II (legacy) or Intel Quartus Prime for synthesis and place-and-route to guarantee timing closure. This page synthesizes distributor pricing, drop-in-compatible Cyclone III alternatives, and PCB layout guidance that the manufacturer datasheet alone does not consolidate in a single view.

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EP3C40U484C7 - Cyclone III FPGA 39.6K LEs 484-FBGA | Altera
EP3C40U484C7

EP3C40U484C7 - Cyclone III FPGA 39.6K LEs 484-FBGA | Altera

The Altera EP3C40U484C7 is a Cyclone III family Field-Programmable Gate Array (FPGA) IC with 39,600 logic elements, 1,161,216 bits of embedded memory, and 331 user I/O pins, packaged in a 484-ball FineLine BGA (UBGA). Built on a 65 nm TSMC low‑low power process, it operates from a 1.2 V core supply with industrial temperature grade support. The device integrates 126 embedded 18x18 multipliers, 4 PLLs, and a global clock network to support digital logic, DSP, and basic video bridging designs. A Cyclone III FPGA is a SRAM-based programmable logic device that allows designers to implement arbitrary digital logic, glue functions, and parallel processing through configurable logic blocks (LEs), dedicated DSP blocks, embedded memory blocks, and programmable I/O. Within the broader taxonomy, FPGAs sit in the programmable logic family between simple CPLDs and high-end SoC FPGAs. Cyclone III specifically targets low-static-power applications such as industrial control, video bridging, and cost-sensitive communications equipment. Key features include 39,600 logic elements, 1,161,216 bits (approximately 113 KBytes) of embedded RAM arranged in M9K blocks, 126 dedicated 18x18 multipliers providing up to approximately 21 GMACs DSP throughput, 4 phase-locked loops for clock management, and 331 single-ended user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm low-power process gives the family its hallmark sub-0.5 W static power consumption, far below previous Cyclone generations. Typical applications include industrial motor control, video surveillance IP cameras, video format converters, low-cost ASIC prototyping, embedded vision, point-of-sale terminals, and portable test equipment. The high multiplier count and large memory make it well matched to moderate-performance DSP pipelines and parallel sensor aggregation. When designing with the EP3C40U484C7, ensure that the Quartus II toolchain (13.0 or older) supports the device because later Quartus releases dropped legacy Cyclone III support. Plan JTAG/AS configuration circuitry, and respect the differential pair placement rules for LVDS channels.

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