EP4CE6U14I7N
EP4CE6U14I7N - 6,272-LUT Cyclone IV E FPGA, 256-LFBGA | Intel
The Intel EP4CE6U14I7N is a Cyclone IV E field-programmable gate array (FPGA) containing 6,272 logic elements, 179 maximum user I/O pins, and 276,480 bits of embedded memory, housed in a 256-ball fine-pitch BGA (256-LFBGA / U14 / UBGA-256) package. The device is fabricated on a 60 nm process and operates from a 1.2 V core supply with PLL support for clock management. The ordering code suffix I7N identifies the device's speed grade and industrial temperature rating, and the U14 segment identifies the UFBGA-256 package variant with 1.0 mm ball pitch.
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than fixed mask-level fabrication. In the system hierarchy, an FPGA sits under programmable logic, which itself is a branch of digital integrated circuits. Unlike an ASIC, an FPGA is fully reprogrammable in the field, allowing iterative development, in-system upgrades, and last-minute design changes. Configurable logic blocks, embedded memory blocks, multiplier blocks, PLLs, and programmable I/O together let one hardware platform implement glue logic, state machines, DSP pipelines, custom peripheral bridges, and even soft processor cores. FPGAs are most useful when interface requirements change frequently, when parallel processing throughput is required, when time-to-market is critical, or when production volume does not yet justify a custom ASIC.
Key features of the EP4CE6U14I7N include 6,272 logic elements for combinational and sequential logic, 276,480 bits of embedded RAM for FIFOs and packet buffers, 179 maximum user I/O pins for parallel external interfacing, a 1.2 V core supply with on-chip voltage regulation, multi-standard I/O support (LVTTL, LVCMOS, SSTL, LVDS, and other common single-ended and differential standards), JTAG-based configuration via the standard IEEE 1149.1 boundary-scan interface, and industrial-grade operating temperature. The 256-LFBGA package enables dense board layouts but requires microvia-compatible PCB stack-ups for fan-out escape routing.
The Cyclone IV E architecture is built on a 60 nm low-power process. Logic elements are organized into logic array blocks with embedded memory bits distributed across M9K memory blocks. The exact number of PLLs, 18x18 multipliers, configuration modes, and supported I/O standards are not provided in the supplied data excerpts and must be confirmed against the manufacturer datasheet before schematic release.
Typical applications include industrial control and factory automation, communications infrastructure, test and measurement equipment, video and image processing pipelines, motor-control interfaces, parallel sensor aggregation, and general-purpose digital prototyping. The 179 I/O count makes the device well suited to custom peripheral bridges and control-logic consolidation that would otherwise require multiple discrete ICs.
When designing with this device, verify the complete power, I/O, configuration, and timing requirements from the manufacturer datasheet. A 256-LFBGA package requires controlled PCB stack-up, microvia or via-in-pad escape design, and thermal analysis; do not infer unsupported architectural details from the short product excerpts.
This page combines verified ordering, package, resource, and distributor information with practical selection guidance, separating confirmed facts from datasheet items that require further documentation.
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