PIC24F16KM104-E/MV
PIC24F16KM104-E/MV - 32MHz 16-Bit Low-Power MCU | Microchip
The Microchip Technology PIC24F16KM104-E/MV is a 16-bit PIC XLP low-power microcontroller rated at 32 MHz, with 16 KB of Flash program memory, 1 KB of RAM, and 512 bytes of EEPROM in a 48-UQFN 6 x 6 mm package with an exposed pad. It integrates a 12-bit ADC, DAC, and operational amplifiers for compact analog-control designs.
A microcontroller is a programmable semiconductor that combines a processor core, memory, and peripherals on one integrated circuit. The PIC24F16KM104 belongs to the PIC24F family of low-power 16-bit microcontrollers, positioned above general-purpose 8-bit devices for applications requiring greater processing performance, analog integration, and configurable control peripherals. Its nanoWatt XLP design approach targets low-power embedded systems operating from 1.8 V to 5.5 V.
Key features include a 16-bit PIC core, 5.5K x 24-word Flash organization, 1 KB of SRAM, and 512 bytes of EEPROM. The analog subsystem combines a 12-bit ADC with a DAC and operational amplifiers, reducing the need for separate components in sensor, control, and signal-conditioning systems. Flexible capture, compare, and PWM modules support timing, motor-control, and waveform-generation tasks.
The device uses a compact 48-UQFN package, making it suitable for space-constrained products while still exposing a substantial peripheral set. Its operating-voltage range supports both 3 V and 5 V equipment, while low-power features suit battery-operated instruments, environmental monitors, industrial sensing nodes, and consumer controls. The integrated analog functions make it particularly relevant to designs that require measurement, control output, and programmable gain or signal conditioning in one device.
Typical uses include industrial sensor interfaces, compact data-acquisition modules, environmental monitors, building-control nodes, motor and actuator controllers, and low-power consumer products. Designers can connect external sensors to the ADC, generate an analog reference or control voltage through the DAC, and use the operational amplifiers for local signal conditioning.
PCB implementation should follow the manufacturer pin-description table and place bypass capacitors close to the power pins. The exposed thermal pad must be connected to the intended ground plane according to the package drawing, with adequate copper area for heat dissipation. Decoupling, analog grounding, and signal-routing decisions are especially important when the ADC, DAC, and operational amplifiers operate in the same compact assembly.
This product page combines the device specifications, ordering information, package details, practical application guidance, and a constrained drop-in comparison. Because the MCU integrates program memory, RAM, EEPROM, ADC, DAC, and operational amplifiers, firmware and board validation should verify the complete peripheral mix before it replaces a less integrated design.
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