ADTF3175BMLZ - 1MP Time-of-Flight Module | Analog Devices
MPN: ADTF3175BMLZ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $310 | $310.00 |
| 10 | $285 | $2,850.00 |
| 100 | $263 | $26,300.00 |
| 500 | $251 | $125,500.00 |
| 1,000 | $243.52 | $243,520.00 |
ADTF3175BMLZ Overview
What is a Time-of-Flight module? A ToF module is a depth-sensing subsystem that emits modulated near-infrared light and measures the phase shift of the reflected wave on every pixel of a dedicated imager. The iToF technique used by ADTF3175BMLZ uses a modulated 940 nm source and computes per-pixel phase to recover sub-centimeter depth over the full 1024 x 1024 frame. ToF modules sit in the broader taxonomy of depth sensors -> image sensors -> optical/optoelectronic subsystems -> semiconductor modules, blending status differentiation of analog/mixed-signal and digital SoC integration.
Key feature highlights include the 1024 x 1024 ToF imager, 75° x 75° FOV optics with 940 nm narrow-band filter, eye-safe hardware interlocks in the illumination block, 4-lane MIPI CSI-2 at up to 6 Gbps aggregate, and embedded regulators that supply both the imager rails and the illumination driver rails from a single host supply. The on-board NVM stores the module boot sequence so that the imager and illumination block initialize autonomously after reset, blending status differentiation of plug-and-play integration.
Architecturally, the ADSD3100 imager inside the module is fabricated in a CMOS back-illuminated process and integrates per-pixel demodulation taps that produce quadrature samples per modulation cycle. The host-side ADSD3500 depth ISP (used in the EVAL-ADTF3175D-NXZ kit) consumes those samples and runs depth, amplitude and confidence pipelines at sensor rate. The 940 nm VCSEL/LED illumination is modulated at the imager's modulation frequency and is gated by hardware interlocks required for Class 1 eye safety.
Typical applications include 3D face authentication and presence detection on AR/VR headsets, gesture recognition on industrial HMIs, robotic vacuum and AMR SLAM, volumetric scanning in logistics and warehousing, and people-counting in smart-building analytics. The wide 75° x 75° field of view makes the module particularly suited to short-range indoor scenes such as conference rooms and retail aisles, blending status differentiation of the indoor depth-sensing application class.
When designing with the ADTF3175BMLZ, treat it as a complete optical subsystem rather than a bare imager: thermal coupling between the illumination block and the imager PCB must be considered, and the host must allocate a 4-lane MIPI CSI-2 receiver plus an I2C/SPI master to drive configuration. Designers evaluating MIMO ASIM should confirm eye-safety classification with the chosen illumination drive mode before integration. Designers should also leave firmware headroom for calibration data stored per-unit serial.
This page synthesizes the manufacturer datasheet Rev. SpA, distributor pricing (1ku starting at $243.52 as of 2026-10-05), the EVAL-ADTF3175D-NXZ evaluation kit information, and the ADSD3100/ADSD3500 ecosystem context - a combination of facts not available from any single distributor page.
Drop-in alternatives for ADTF3175BMLZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ADTF3175BMLZ (same form factor and footprint) — differing in Product Type.
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ADTF3175BMLZ
✅ Drop-In✓ In Stock
$243.52 / Unit
View Datasheet →EVAL-ADTF3175D-NXZ
✅ Drop-In📋 Reference alternative (not in catalog)
ADTF3175BMLZ Maximum Ratings & Electrical Characteristics
| Product Type | Time-of-Flight (ToF) Camera Module |
| Underlying Imager | ADSD3100 (1 MP CMOS indirect ToF) |
| Resolution (Active Pixels) | 1024 H x 1024 V |
| Pixel Size | 3.5 µm x 3.5 µm |
| Field of View | 75° x 75° |
| Wavelength / Optical Filter | 940 nm band-pass |
| Illumination Subassembly | Integrated, with eye-safety support |
| Host Video Interface | MIPI CSI-2, 4-lane, 1.5 Gbps per lane |
| Host Control Interface | 4-wire SPI and 2-wire I2C |
| On-module Memory | NVM (Flash) for module boot-up sequence |
| On-module Power | Integrated regulators for imager and illumination rails |
| Mounting / Form Factor | Open-frame module, 75 mm x 75 mm class (ToF Module) |
| 1ku List Price (starting) | $243.52 (as of 2026-10-05) |
| Manufacturer Lifecycle Note | RECOMMENDED FOR NEW DESIGNS (Rev. SpA datasheet) |
| Evaluation Kit | EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) |
| Depth ISP Companion | ADSD3500 |
| Operating Mode | Indirect Time-of-Flight (iToF) |
ADTF3175BMLZ standard Pin Configuration Guide
Pin configuration for ADTF3175BMLZ (standard package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for ADTF3175BMLZ.
Refer to the datasheet for full pin configuration.
Typical Applications
ADTF3175BMLZ is suitable for 6 applications: AR/VR Face Authentication & Presence Detection, Industrial Robotics & AMR SLAM, Smart Building People Counting & Analytics, Gesture Recognition on Industrial HMIs, Logistics Volumetric Scanning & Cubic Measurement, Automotive In-Cabin Monitoring (Prototype).
AR/VR Face Authentication & Presence Detection
The ADTF3175BMLZ provides 1 MP iToF depth at 75° x 75° FOV with 940 nm illumination, which is ideal for short-range face authentication on AR/VR HMDs where sub-centimeter depth is needed to defeat 2D spoofing. The MIPI CSI-2 4-lane at 1.5 Gbps/lane streams full-resolution depth frames into the headset SoC without bottleneck, while the integrated SPI/I2C control plane lets the host retrieve calibration NVM data on every boot. Designers evaluating MIMO ASIM should verify eye-safety classification with the chosen illumination drive mode; the module's on-board NVM stores the ADSD3100 boot sequence so depth capture is available within milliseconds of power-on, eliminating the long calibration warm-up that bare imagers require.
Recommended
Industrial Robotics & AMR SLAM
Autonomous Mobile Robots and industrial manipulators need dense, wide-FOV depth maps for SLAM and obstacle avoidance. The ADTF3175BMLZ delivers 1024 x 1024 depth at 75° x 75°, allowing an AMR to perceive an entire room corner with a single frame and feed the on-board navigation SoC through a 4-lane MIPI CSI-2 link at 6 Gbps aggregate. The integrated 940 nm narrow-band filter rejects ambient warehouse lighting, improving depth SNR under mixed illumination. On-module regulators supply both the ADTF3 and IL-x illumination rails from a single host rail, simplifying power-tree design in 24 V industrial buses; designers should validate thermal coupling between the illumination block and the imager PCB at the chosen duty cycle per Analog Devices datasheet Rev. SpA.
Recommended
Smart Building People Counting & Analytics
Ceiling-mounted people-counting sensors need wide FOV, eye-safe illumination and high enough depth resolution to count heads accurately in retail aisles and conference rooms. The ADTF3175BMLZ provides 75° x 75° FOV with 940 nm eye-safe illumination, and the 1024 x 1024 imager array yields ~1000x1000 depth samples per frame - far more than typical 200x200 ToF sensors. The integrated regulator tree simplifies PoE-powered ceiling installations, while the on-board NVM lets the host recover the ADSD3100 boot sequence after a brownout. Combine the module with a low-cost edge-AI host and the ADSD3500 depth ISP to extract counting events at a fraction of the cost of stereo-camera alternatives.
Recommended
Gesture Recognition on Industrial HMIs
Operator-facing HMIs in cleanrooms and factories increasingly rely on mid-air gesture control rather than touch panels. The ADTF3175BMLZ's 1 MP iToF depth map captures a hand's full 3D skeleton at 75° x 75° FOV, enabling reliable pinch/swipe gestures at arm's-length distances. The 940 nm band is invisible to operators but rejects visible-light interference from factory fluorescent and LED fixtures, increasing gesture-recognition accuracy in mixed-illumination environments. Host integration is straightforward - the module's 4-lane MIPI CSI-2 connects directly to most application processors, while the integrated regulators eliminate a multi-rail discrete LDO tree; designers should still budget firmware headroom for the per-unit calibration data stored in the on-module NVM.
Recommended
Logistics Volumetric Scanning & Cubic Measurement
Warehouse cubing systems need fast, accurate 3D scans of boxes on conveyors to compute dimensional weight and shipping volume. The ADTF3175BMLZ provides 1024 x 1024 iToF depth at MIPI CSI-2 rates that are sufficient to scan a 60 x 60 x 60 cm parcel in a single frame, replacing mechanical line-scan profilers with a single solid-state module. The 940 nm illumination with eye-safety interlocks is interoperable with operator-handling workflows in EU/US logistics hubs per Class 1 limits. Use the ADSD3500 depth ISP and an edge-class host SoC to compute volume in real time, and use the on-module NVM to recover the ADSD3100 boot sequence after each conveyor power-cycle without re-flashing.
Recommended
Automotive In-Cabin Monitoring (Prototype)
Concept in-cabin monitoring systems for child-presence detection and driver-attention analytics benefit from wide-FOV 940 nm depth. The ADTF3175BMLZ provides 75° x 75° FOV and Class-1-capable 940 nm illumination, both of which are compatible with automotive in-cabin optical safety requirements. Note that for production automotive deployment, designers typically need AEC-Q100 qualified variants - the ADTF3175BMLZ carries a 'RECOMMENDED FOR NEW DESIGNS' industrial/consumer lifecycle marker, not AEC-Q100, so it is best used as a prototype/engineering reference. Pair the module with the ADSD3500 depth ISP and a host SoC running occupant-classification algorithms to validate the optical concept before committing to a qualified design.
Recommended
Recommended Products Summary
Engineering reference data for ADTF3175BMLZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EVAL-ADTF3175D-NXZ |
|---|---|---|
| Brand | Analog Devices | Analog Devices |
| Package | Open-frame ToF Module 75x75 | Evaluation Board Kit (same ADTF3175 module + ADSD3500) |
| Resolution | 1024 x 1024 (1 MP) | 1024 x 1024 (1 MP) - same module |
| Pixel Size | 3.5 µm x 3.5 µm | 3.5 µm x 3.5 µm - same module |
| Field of View | 75° x 75° | 75° x 75° - same module |
| Wavelength | 940 nm | 940 nm - same module |
| Host Interface | MIPI CSI-2 4-lane + SPI + I2C | MIPI CSI-2 4-lane + SPI + I2C + Ethernet-over-USB bridge |
| Lifecycle Status | Active (RECOMMENDED FOR NEW DESIGNS) | Active evaluation kit |
Key Differentiators
- 1 MP iToF resolution with integrated 940 nm optics and illumination (vs EVAL-ADTF3175D-NXZ)
- On-module NVM for boot calibration (vs EVAL-ADTF3175D-NXZ)
- RECOMMENDED FOR NEW DESIGNS lifecycle status with active distributor stock (vs EVAL-ADTF3175D-NXZ)
Design Notes
Estimated: the ADTF3175BMLZ integrates an illumination block that dissipates heat proportional to the modulation duty cycle and LED drive current. At continuous 100% duty and worst-case VIN, the illumination block can add several hundred mW on top of the imager's steady dissipation. Mount the module on a host PCB with at least 1 square inch of copper under the illumination subassembly and provide thermal vias to an internal plane, otherwise the imager temperature can rise and degrade depth accuracy. Always check the eye-safety classification at the chosen drive mode before increasing output. Reference: EVAL-ADTF3175D-NXZ evaluation board layout.
The ADTF3175BMLZ exposes a 4-lane MIPI CSI-2 link that is sensitive to impedance discontinuities. Route the MIPI lanes as 100-ohm differential pairs on the host side with length-matched traces within the timing budget of the chosen SoC, and keep the lanes away from switching power inductors to avoid coupled noise into the depth stream. The SPI and I2C lines should be pulled up to the same rail as the host MCU; place the pull-ups within 25 mm of the module connector. Reference: ADTF3175 datasheet Rev. SpA.
Do not assume the ADTF3175BMLZ is AEC-Q100 qualified - the manufacturer lifecycle marker is RECOMMENDED FOR NEW DESIGNS (industrial/consumer), not automotive. For in-cabin or other automotive use, plan for a separate qualified module rather than treating the ADTF3175BMLZ as drop-in. Also budget firmware headroom for the per-unit calibration data stored in on-module NVM; without it, depth accuracy degrades noticeably. Reference: Analog Devices ADTF3175 product page.
Estimated: at 30 fps full-resolution depth capture, the ADTF3175BMLZ's MIPI CSI-2 4-lane link at 1.5 Gbps/lane draws the dominant share of module power. Provide a low-noise 1.8 V or 1.2 V rail to the host-side MIPI PHY, and keep the module's integrated regulator input clean - a noisy upstream rail degrades the ADSD3100's demodulation SNR. Place a 10 µF ceramic + 0.1 µF ceramic bypass network at the host supply pin of the module connector, within 5 mm of the pin.
Compliance Information
Per Analog Devices ADTF3175 product page, the module is RoHS compliant and is marked RECOMMENDED FOR NEW DESIGNS. It is not AEC-Q100 qualified - do not use it as a drop-in for production automotive in-cabin designs. Halogen-free status not explicitly stated in the verified web data.
