ATSAM3N0AA-MUR - 48MHz ARM Cortex-M3 MCU 32KB Flash | Microchip
MPN: ATSAM3N0AA-MUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.14 | $3.14 |
| 10 | $2.9 | $29.00 |
| 100 | $2.6 | $260.00 |
| 500 | $2.3 | $1,150.00 |
| 1,000 | $2 | $2,000.00 |
ATSAM3N0AA-MUR Overview
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest tier of the embedded processing hierarchy: MCU -> embedded processor -> application processor -> system-on-chip. MCUs execute real-time control tasks in power-sensitive and cost-sensitive designs where a full application processor is unnecessary. The SAM3N series belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio, which also includes the SAM4N, SAM L, and megaAVR families.
Key features of the ATSAM3N0AA-MUR include the ARM Cortex-M3 core with Thumb-2 instruction set, integrated DMA controller for low-CPU-overhead data transfers, PWM channels for motor and lighting control, and a watchdog timer (WDT) for system reliability. The nested vectored interrupt controller (NVIC) provides deterministic low-latency interrupt response, while the low-power modes support battery-operated designs.
Architecturally, the Cortex-M3 Harvard-structure core separates instruction and data buses, sustaining 1.25 DMIPS/MHz performance. Flash memory is accessible in a single wait state at full speed, and the peripheral bus structure allows independent peripheral clocking for aggressive power gating.
Typical applications include industrial automation nodes, consumer appliance control boards, sensor hubs, metering front ends, and low-cost connectivity accessories. The 48 MHz ceiling and rich peripheral set fit control loops and human-interface tasks without paying for higher-speed cores.
For design, budget the 32 KB flash carefully - application code plus bootloader must fit within the single erase-page management scheme, and pin-count planning should reserve pins for SWD programming and debug.
This page synthesizes verified distributor pricing, drop-in family alternatives, and practical design notes not found on the manufacturer datasheet page alone.
Drop-in alternatives for ATSAM3N0AA-MUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3N0AA-MUR (same form factor and footprint) β differing in Package, Packaging.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM3N1AA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N0BA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2.4 / Unit
View Datasheet βATSAM3N2AA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N3AA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N0AA-MUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| Maximum Clock Frequency | 48 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 32 KB (32K x 8) |
| SRAM Size | 8 KB |
| Peripherals | DMA, PWM, WDT |
| Package | 48-QFN (7x7 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Series | SAM3N |
| Data Bus Width | 32 bit |
| RoHS Status | Compliant (Green package per Mouser listing) |
| Packaging | Tape & Reel (TR) |
| Product Status | Active |
ATSAM3N0AA-MUR 48-qfn (7x7 mm) exposed pad Pin Configuration Guide
Pin configuration for ATSAM3N0AA-MUR (48-qfn (7x7 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3N0AA-MUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3N0AA-MUR is suitable for 6 applications: Industrial Automation Nodes, Consumer Appliance Control, Sensor Hubs and Data Acquisition, Metering and Utility Front Ends, Motor and Lighting Control, Portable and Battery-Operated Devices.
Industrial Automation Nodes
The ATSAM3N0AA-MUR fits industrial automation nodes because its industrial temperature grade (-40C to +85C), watchdog timer, and DMA-driven peripherals meet the reliability and real-time requirements of factory-floor equipment. A typical node uses the Cortex-M3 core at 48 MHz to poll sensors, service a PWM stage for actuators, and buffer data via DMA without CPU intervention, reducing jitter in control loops. Placed on a compact 48-QFN footprint, the MCU keeps board area small for distributed I/O modules. The watchdog timer guarantees autonomous recovery from software faults, and the 32 KB flash accommodates protocol stacks for Modbus RTU or simple fieldbus slaves.
Recommended
Consumer Appliance Control
Consumer appliance control boards - coffee machines, fans, small pumps - benefit from the ATSAM3N0AA-MUR's balance of cost and capability. The 48 MHz Cortex-M3 core runs user-interface code and control loops with headroom, while PWM outputs directly drive motor drivers, heater triac triggers, or LED dimming stages. The DMA controller streams ADC samples into the 8 KB SRAM so button debouncing and display refresh proceed in parallel. At a distributor floor price near $1.25 (as of 2026-09-19), the device is cost-competitive in volume. The green RoHS 48-QFN package suits reflow assembly, and the 32 KB flash stores UI logic, calibration tables, and fault logs comfortably.
Recommended
Sensor Hubs and Data Acquisition
In sensor hub designs, the ATSAM3N0AA-MUR aggregates multiple analog and digital sensor streams. The DMA controller moves ADC conversion results into the 8 KB SRAM buffer at fixed intervals, keeping the 48 MHz Cortex-M3 free for filtering, averaging, and threshold detection. The nested vectored interrupt controller gives deterministic latency for time-critical sampling interrupts. Because the hub often sleeps between samples, the SAM3N power-management features allow peripheral clock gating to reduce average current in battery-backed installations. The 48-QFN (7x7 mm) package exposes enough GPIO for I2C, SPI, and UART sensor buses simultaneously, and the industrial temperature rating supports outdoor and equipment-mounted deployments.
Recommended
Metering and Utility Front Ends
Metering front ends - energy, water, and flow meters - use the ATSAM3N0AA-MUR for sampling and computation. The DMA plus ADC path captures measurement samples into SRAM continuously, while the 32-bit core performs RMS, energy accumulation, and linearization arithmetic more efficiently than 8-bit alternatives. Watchdog supervision meets utility-equipment expectations for unattended reliability across the -40C to +85C industrial range. Firmware including calibration and communication routines fits in 32 KB flash; designs needing logging headroom can drop in the pin-compatible ATSAM3N1AA-MUR or ATSAM3N2AA-MUR without PCB changes. The exposed-pad QFN improves thermal and ground performance on the measurement PCB.
Recommended
Motor and Lighting Control
The ATSAM3N0AA-MUR's PWM channels make it a compact controller for small motor drives and LED lighting systems. At 48 MHz, the Cortex-M3 executes closed-loop speed or current control at multi-kilohertz update rates with deterministic interrupt latency from the NVIC. PWM outputs drive MOSFET gate drivers or LED strings directly at the logic level, and the watchdog timer provides fail-safe shutdown if firmware stalls - important in luminaires and pumps. The 8 KB SRAM buffers telemetry for UART reporting to a host. The 48-QFN (7x7 mm) package integrates into compact driver boards, and the same footprint scales upward to ATSAM3N2AA-MUR if field-updatable feature sets grow.
Recommended
Portable and Battery-Operated Devices
Battery-operated products such as handheld meters, remotes, and portable instruments use the ATSAM3N0AA-MUR for its power-managed Cortex-M3 architecture. Peripherals can be individually clock-gated, and the core can enter low-power wait states between events, stretching battery life in duty-cycled applications. Wake-up interrupts from the NVIC or peripheral events return the 48 MHz core to active execution quickly, so the device reacts instantly to button presses or sensor triggers. The 8 KB SRAM holds state across sleep periods, and the 32 KB flash retains firmware and calibration without external memory. The compact 7x7 mm 48-QFN suits slim handheld enclosures and two-layer PCBs.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3N0AA-MUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3N1AA-MUR | ATSAM3N0BA-MUR | ATSAM3N2AA-MUR | ATSAM3N3AA-MUR |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 32 KB | 64 KB | 64 KB | 128 KB | 192 KB |
| SRAM | 8 KB | 12 KB | 12 KB | 24 KB | 24 KB |
| Peripherals | DMA, PWM, WDT | DMA, PWM, WDT | DMA, PWM, WDT | DMA, PWM, WDT | DMA, PWM, WDT |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Lowest cost entry point in the 48-QFN SAM3N family (vs ATSAM3N1AA-MUR)
- ARM Cortex-M3 performance in a compact 7x7 mm QFN (vs ATMEGA8A-MUR)
- DMA offload reduces CPU burden versus DMA-less competitors (vs ATSAM3N0BA-MUR)
Design Notes
Estimated: budget supply decoupling with at least one 100 nF ceramic capacitor per VDD pin pair placed within 2 mm of the package, plus a bulk 10 uF capacitor near the 48-QFN exposed pad, which must be soldered to a ground pour for both thermal and ground integrity. Verify the exact VDD/VDDIO supply domains and voltage ranges in the SAM3N datasheet electrical characteristics chapter before finalizing the power tree, as the verified web data does not specify the supply voltage range for this exact part.
The exposed pad on the 48-QFN (7x7 mm) package should connect to a solid ground plane through an array of thermal vias (typically 3x3 or 4x4 at 1 mm pitch). This improves heat spreading during reflow and lowers junction-to-ambient thermal resistance in continuous operation. Follow Microchip's QFN land-pattern recommendations: slightly oversized pads with solder-mask-defined openings help solder wicking and inspection. Keep the SWDIO/SWCLK debug traces short and reserve test points for programming access in production fixtures.
The 32 KB flash fills quickly once a bootloader plus a communication stack is added - keep a flash budget map during development. Note that higher-memory SAM3N variants (ATSAM3N1AA/2AA/3AA) share the same 48-QFN footprint, so leave your BOM open to upgrade without a PCB respin. Also remember the -MUR suffix defines industrial temperature and tape-and-reel packing; ordering the -MUT or other suffix variants changes packing, not silicon. Always program the watchdog period conservatively to avoid spurious resets during flash self-write operations.
Compliance Information
Mouser lists the package as GREEN (Microchip green/RoHS-compliant, halogen-free packaging). REACH and conflict-minerals status not stated in verified data.