ATSAM3N1CB-AUR - 48MHz Cortex-M3 MCU 64KB Flash | Microchip
MPN: ATSAM3N1CB-AUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.54 | $3.54 |
| 10 | $3.3 | $33.00 |
| 100 | $3.05 | $305.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.7 | $2,700.00 |
ATSAM3N1CB-AUR Overview
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, memory, and programmable peripherals into one chip, forming the lowest layer of the embedded-system hierarchy: MCU -> embedded processor -> system-on-chip -> computing platform. The SAM3N series belongs to Microchip (formerly Atmel) ARM-based flash MCU family, targeting cost-sensitive, low-power industrial and consumer designs.
Key features include the ARM Cortex-M3 RISC core at up to 48 MHz, 64KB (64K x 8) of flash program memory, 8KB of SRAM, and connectivity peripherals including I2C, SPI, UART/USART, and IrDA. Analog capability is a highlight: 16 channels of 10-bit ADC and one 10-bit DAC, unusual at this price point and valuable for sensor-interface designs.
The device operates from a 1.62V to 3.6V supply (1.8V/3.3V nominal) across an industrial temperature range of -40C to +85C. The 100-LQFP (14x14) package provides gull-wing leads for surface mounting and sufficient I/O for displays, keypads, and multiple communication buses. The flash-based program memory supports in-system programming via the Serial Wire Debug and JTAG-style debug interfaces standard to Cortex-M3 devices.
Typical applications include industrial control panels, consumer appliances, metering, building automation, and portable battery-powered instruments where the wide 1.62V-3.6V supply range and 16-channel ADC reduce external component count.
Design consideration: budget SRAM carefully - 8KB is adequate for bare-metal C code and lightweight RTOS kernels such as FreeRTOS, but restricts large buffers, so plan memory allocation early.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-19.
Drop-in alternatives for ATSAM3N1CB-AUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3N1CB-AUR (same form factor and footprint) β differing in Package, Packaging, RoHS Status, Supply Voltage, Core Size.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM3N1CA-AUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N2CB-AUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N4CB-AUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N1CB-AU
β Drop-Inβ In Stock
$0.18 / Unit
View Datasheet βATSAM3N1CB-CUR
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$2.98 / Unit
View Datasheet βATSAM3N1CB-AUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 48 MHz |
| Program Memory Size | 64KB (64K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 8KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 100-LQFP (14x14 mm) |
| ADC Resolution | 10-bit |
| ADC Channels | 16 |
| DAC Resolution | 10-bit |
| DAC Channels | 1 |
| Connectivity | I2C, IrDA, SPI, UART/USART |
| Mounting Type | Surface Mount |
| Terminal Form | Gull Wing |
| Packaging | Tape & Reel (TR) |
| Series | SAM3N |
| RoHS Status | Green / RoHS compliant (per FindIC: LQFP, GREEN, IND TEMP) |
ATSAM3N1CB-AUR 100-lqfp (14x14 mm) Pin Configuration Guide
Pin configuration for ATSAM3N1CB-AUR (100-lqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3N1CB-AUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3N1CB-AUR is suitable for 6 applications: Industrial Control Panels, Sensor Data Acquisition, Metering and Building Automation, Portable Battery-Powered Instruments, Consumer Appliance Control, Embedded Communication Nodes.
Industrial Control Panels
The ATSAM3N1CB-AUR fits industrial control panels because its industrial temperature rating of -40C to +85C, 16-channel 10-bit ADC, and multiple UART/USART, SPI, and I2C interfaces cover the typical I/O mix of a panel controller in a single chip. The 48 MHz Cortex-M3 core executes control loops and HMI scan code with ample margin, while the 64KB flash holds protocol stacks such as Modbus RTU. In a typical design the MCU reads limit switches and analog transducers through the ADC, drives relays or indicators via GPIO, and reports status over RS-485 through a USART; the wide 1.62V-3.6V supply range simplifies integration with 3.3V logic rails. Tape & Reel packaging supports automated production.
Recommended
Sensor Data Acquisition
The ATSAM3N1CB-AUR is well suited to multi-channel sensor data acquisition because its 16-channel 10-bit ADC can digitize sixteen sensor inputs directly without an external multiplexer, and the integrated 10-bit DAC can generate reference or actuator control voltages. The 1.62V to 3.6V supply range allows operation from regulated 3.3V or battery rails, and the 48 MHz Cortex-M3 core handles filtering and scaling of sampled data in real time. A typical topology connects resistive or voltage-output sensors to the ADC channels, uses the SPI or I2C bus for external EEPROM or display, and streams results over USART. The 8KB SRAM constrains buffer depth, so designers should implement streaming or windowed averaging rather than storing long capture records on-chip.
Recommended
Metering and Building Automation
The ATSAM3N1CB-AUR serves energy metering and building automation nodes well: the 16-channel ADC reads multiple current shunts, voltage dividers, and temperature sensors simultaneously, while USART/IrDA interfaces support both wired and optical (IR) meter-reading schemes common in utility products. Its green RoHS-compliant LQFP-100 package and active lifecycle status support long-production-run meter designs, and the -40C to +85C industrial range covers outdoor meter cabinets. The 48 MHz Cortex-M3 provides enough throughput for sampling, energy accumulation math, and communication simultaneously. Designers should allocate the 64KB flash carefully between application code, metering calibration tables, and bootloader space; the pin-compatible ATSAM3N2C/4C variants offer a migration path if code grows beyond 64KB.
Recommended
Portable Battery-Powered Instruments
The ATSAM3N1CB-AUR suits portable, battery-powered instruments because its 1.62V to 3.6V operating range tolerates a discharging battery directly, and ARM Cortex-M3 sleep modes let the design enter low-power standby between measurements. The 16-channel 10-bit ADC digitizes user controls and sensor inputs while the integrated 10-bit DAC can drive an analog meter output or bias circuits. The 100-LQFP (14x14 mm) footprint fits compact handheld PCBs while still offering enough GPIO for keypads and segment LCD driving through GPIO bit-banging or external drivers. Compared with a switching-regulator-fed 5V design, running the MCU at 3V from a single-cell chemistry via an LDO reduces quiescent losses; designers should verify sleep-mode currents in the Microchip datasheet when constructing the power budget.
Recommended
Consumer Appliance Control
The ATSAM3N1CB-AUR fits consumer appliance control boards such as washing machines, air conditioners, and small kitchen appliances, where a 3.3V Cortex-M3 MCU with generous GPIO, multiple UART/SPI/I2C buses, and an industrial temperature rating simplifies BOM consolidation. The 16-channel ADC reads temperature sensors (NTC), user potentiometers, and mains-synchronized sensing circuits, while GPIO and PWM-capable pins drive triacs, relays, or brushless motor drivers. The 48 MHz core supports simultaneously scanning a keypad, updating an LED/LCD display, and running the control loop. Its active lifecycle status and Tape & Reel packaging support high-volume automated assembly. Because appliances have strong EMC environments, layout with attention to ground returns around the ADC is important for measurement stability.
Recommended
Embedded Communication Nodes
The ATSAM3N1CB-AUR works as an embedded communication node or protocol converter because it provides multiple independent UART/USART channels plus SPI and I2C, enabling translation between field buses (RS-485, RS-232, IrDA) and board-level buses in one 100-LQFP device. The 48 MHz Cortex-M3 comfortably sustains 115.2 kbps-class links with buffering, and the 64KB flash holds two or more lightweight protocol stacks. Typical topology: one USART to an RS-485 transceiver, another USART to a service/debug port, and SPI to flash for parameter storage. The 8KB SRAM is the limiting factor for deep packet buffering, so implement ring buffers and flow control. The industrial temperature range and 1.62V-3.6V supply allow deployment in unconditioned enclosures.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3N1CB-AUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3N1CA-AUR | ATSAM3N2CB-AUR | ATSAM3N4CB-AUR | ATSAM3N1CB-AU |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M3, 48 MHz | ARM Cortex-M3, 48 MHz | ARM Cortex-M3, 48 MHz | ARM Cortex-M3, 48 MHz | ARM Cortex-M3, 48 MHz |
| Flash Memory | 64KB | 32KB | 128KB | 256KB | 64KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packaging | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel | Tray |
Key Differentiators
- Balanced 64KB flash for mid-size firmware (vs ATSAM3N1CA-AUR)
- Lowest cost per pin-compatible footprint (vs ATSAM3N2CB-AUR)
- Industrial temperature grade standard (vs ATSAM3N1CB-CUR)
Design Notes
Decouple the 1.62V-3.6V supply with a 0.1uF ceramic capacitor at each VDD pin pair plus one bulk 4.7uF-10uF capacitor near the LQFP-100 package, placed within 2 mm of the pins. The core is fed by an internal regulator - follow the Microchip SAM3N datasheet for the required VDDCORE capacitor value and do not load that pin externally. Wide supply tolerance (down to 1.62V) permits direct battery connection, but ADC accuracy degrades near the minimum voltage, so regulate to 3.0V-3.3V when analog precision matters.
Keep the 16 ADC input traces short and away from UART/SPI switching lines; dedicate a quiet ground area under the analog pin cluster. Each unused ADC channel should be tied to ground or driven - floating high-impedance inputs crosstalk into active channels. The 10-bit DAC output needs a low-ESR buffer capacitor per the datasheet typical application circuit. Use the exposed standard LQFP-100 footprint per JEDEC outline with gull-wing leads; 0.5 mm pitch requires solder-mask-defined pads checked against the Microchip land-pattern drawing.
The most frequent SAM3N design errors: (1) underestimating the 8KB SRAM - a FreeRTOS kernel plus moderate task stacks can exhaust it, so measure stack high-water marks during development; (2) ignoring flash wait-state settings - at 48 MHz the correct flash wait states must be programmed or code will fail intermittently at temperature extremes; (3) overlooking debug access - reserve SWD pins (SWCLK/SWDIO) on a test header, since the 100-LQFP cannot be reprogrammed in-circuit otherwise.
Compliance Information
FindIC product data describes the part as 'LQFP, GREEN, IND TEMP, MRL', indicating green (RoHS/lead-free/halogen-free) packaging. REACH and conflict-minerals declarations not found in provided data - request certificates from Microchip.