ATSAM4S8BA-MU - 120MHz Cortex-M4 MCU 512KB Flash 64-QFN | Microchip
MPN: ATSAM4S8BA-MU β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.42 | $9.42 |
| 10 | $8.58 | $85.80 |
| 100 | $7.31 | $731.00 |
| 500 | $6.48 | $3,240.00 |
| 1,000 | $5.79 | $5,790.00 |
ATSAM4S8BA-MU Overview
What is a Cortex-M4 microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The Cortex-M4 is an ARM processor core that adds DSP instructions and a single-precision floating-point unit (FPU), making it suitable for signal-processing tasks while maintaining the low-power and deterministic interrupt behaviour of the Cortex-M family. Within the broader taxonomy, the ATSAM4S8BA-MU belongs to the SAM4S series, which sits in Microchip's SMART ARM-based Flash MCU family, bridging industrial control and connected-embedded applications.
Key features of the ATSAM4S8BA-MU include up to 120 MHz core speed with DSP extensions, 512 KB Flash, 128 KB SRAM, an MPU for OS-level memory isolation, and pin-to-pin compatibility with SAM3N, SAM3S, and SAM7S legacy devices in the 64-pin and 100-pin variants. The device supports up to 47 I/O lines, multiple communication peripherals (USART, SPI, TWI, USB 2.0 Full-Speed), and analog blocks including a 12-bit ADC and a 12-bit DAC.
From an architectural perspective, the SAM4S uses a Harvard bus architecture with separate instruction and data paths, enabling zero-wait-state Flash execution up to 120 MHz when configured with the on-chip cache. The integrated voltage regulator with on-chip decoupling reduces external BOM, while the brown-out detector and watchdog timer improve field reliability in industrial environments.
Typical applications include industrial control panels, smart metering, point-of-sale terminals, consumer white goods, USB peripherals, and motor-control subsystems. The combination of Cortex-M4 DSP performance, generous SRAM, and a wide operating voltage range also suits low-power connected sensor hubs. According to Microchip, the SAM4S family is designed for scalable performance and memory density with low active and standby power.
When designing with this MCU, ensure that decoupling capacitors are placed close to the VDDCORE and VDDIO pins, and that the NRST reset circuit meets the minimum pulse-width specification. Developers using Atmel Studio 7 / Microchip Studio and the ASF / Harmony framework will benefit from existing peripheral drivers for the SAM4S platform.
This page synthesises distributor pricing, drop-in alternatives, pin-compatibility notes, and practical design guidance not found in the standalone manufacturer datasheet.
Drop-in alternatives for ATSAM4S8BA-MU β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4S8BA-MU (same form factor and footprint) β differing in Package, RoHS Status, SRAM, Flash Memory, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM4S16BA-MU
β Drop-Inβ In Stock
$5.15 / Unit
View Datasheet βATSAM4S4BA-MU
β Drop-Inπ Reference alternative (not in catalog)
ATSAM4S8BA-MUR
β Drop-Inπ Reference alternative (not in catalog)
ATSAM4S8BA-MU Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum Clock Speed | 120 MHz |
| Instruction Cache | 2 KB |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Supply Voltage (VDDIO/VDDCORE) | 1.62 V to 3.6 V |
| Active Power Consumption | 200 uA/MHz (typ, all peripherals enabled) |
| Memory Protection Unit (MPU) | Yes |
| Instruction Set | Thumb-2, DSP extensions |
| Number of I/O Lines | Up to 47 |
| Package | 64-pin QFN (9x9 mm) |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount |
| Lifecycle Status | Active |
| RoHS Status | Compliant |
ATSAM4S8BA-MU 64-pin qfn (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM4S8BA-MU (64-pin qfn (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4S8BA-MU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4S8BA-MU is suitable for 6 applications: Industrial Control Panels, Smart Metering and Energy Monitoring, USB Peripherals and HID Devices, Point-of-Sale (POS) Terminals, Motor Control and BLDC Drivers, Connected Sensor Hubs and IoT Gateways.
Industrial Control Panels
The ATSAM4S8BA-MU suits industrial control panels where its 120 MHz Cortex-M4 core delivers fast deterministic loop execution for PID control and HMI updates. The 512 KB Flash accommodates full Modbus/TCP, FreeRTOS, and custom GUI stacks, while 128 KB SRAM supports Ethernet buffers and large lookup tables. The 1.62 V to 3.6 V supply range tolerates 24 V industrial rails after a buck regulator, and the -40C to +85C industrial temperature grade ensures reliable operation on factory floors. Built-in DSP extensions accelerate filtering of analog sensor inputs and motor-control maths.
Recommended
Smart Metering and Energy Monitoring
For smart electricity, gas, and water meters, the ATSAM4S8BA-MU's Cortex-M4 DSP engine performs real-time power-quality calculations including RMS, THD, and harmonic analysis up to the 31st harmonic. The 12-bit ADC integrated in the SAM4S family supports simultaneous voltage and current sampling at rates suitable for class-1 metering accuracy. The 200 uA/MHz active current keeps total power consumption below 30 mW at full load, helping meet stringent meter battery-life targets. AES hardware in the SAM4S also secures OTA firmware updates over wireless M-Bus or NB-IoT links.
Recommended
USB Peripherals and HID Devices
The ATSAM4S8BA-MU integrates a USB 2.0 Full-Speed device controller with on-chip PHY, eliminating the need for external transceivers in HID, CDC, and custom-class peripherals. The 120 MHz Cortex-M4 plus DSP engine handles bulk USB transfers with minimal CPU overhead, leaving headroom for application processing. Designers benefit from the SAM4S USB device stack in ASF/Harmony, plus 512 KB Flash for composite USB device firmware. The 64-QFN's small footprint is ideal for compact dongles and POS accessories.
Recommended
Point-of-Sale (POS) Terminals
POS terminals benefit from the ATSAM4S8BA-MU's combination of Cortex-M4 DSP performance, 128 KB SRAM, and USB Full-Speed controller for magstripe, EMV, and printer interfaces. The wide 1.62 V to 3.6 V supply allows direct operation from a single Li-ion cell with buck-boost regulation, while the industrial temperature grade supports kitchen and outdoor kiosk environments. Built-in crypto accelerators (AES, TRNG) and Secure Boot from SAM4S firmware protect cardholder data per PCI PTS requirements.
Recommended
Motor Control and BLDC Drivers
The Cortex-M4 core with FPU and DSP instructions in the ATSAM4S8BA-MU executes field-oriented control (FOC) algorithms for BLDC and PMSM motors with deterministic loop times well under 10 microseconds at 120 MHz. The integrated 12-bit ADC provides fast current-sense sampling required for sensorless control schemes, and PWM outputs from the SAM4S timer/counter blocks drive 3-phase inverter bridges. The 512 KB Flash accommodates complex control state machines and parameter-tuning UI.
Recommended
Connected Sensor Hubs and IoT Gateways
In IoT sensor hubs, the ATSAM4S8BA-MU aggregates data from I2C/SPI sensors, performs on-device DSP filtering (FFT, Kalman), and forwards results over Wi-Fi, BLE, or NB-IoT modules. The 128 KB SRAM accommodates TLS handshake buffers and packet reassembly, while the 512 KB Flash holds multiple sensor drivers and OTA bootloader slots. The 200 uA/MHz active current extends battery life in solar-powered edge nodes.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4S8BA-MU β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4S16BA-MU | ATSAM4S4BA-MU | ATSAM4S8BA-MUR | ATSAM4S8CA-MU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 100-LQFP (14x14 mm) - different footprint |
| Core | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP | ARM Cortex-M4 + FPU + DSP |
| Maximum Clock Speed | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 1 MB (+100%) | 256 KB (-50%) | 512 KB (same) | 512 KB (same) |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Packaging Format | Tray | Tray | Tray | Tape & Reel | Tray |
| Pin-to-Pin Compatible | Yes (with SAM3N/SAM3S/SAM7S 64-pin) | Yes | Yes | Yes | Different footprint (100-pin) |
Key Differentiators
- Upgrades Flash to 1 MB without changing footprint (vs ATSAM4S4BA-MU)
- Cortex-M4 DSP/FPU vs legacy Cortex-M3 (vs ATSAM3S8BA-MU)
- Pin-to-pin compatible with SAM3S, SAM3N, and SAM7S 64-pin variants (vs Other Cortex-M4 MCUs (STM32, LPC))
Design Notes
Place a 100 nF X7R decoupling capacitor within 2 mm of each VDDCORE pin and a 4.7 uF bulk capacitor near the main VDDIO pin. The SAM4S internal 1.2 V regulator supplies VDDCORE from VDDIO; according to the SAM4S datasheet, the bulk capacitor on VDDCORE must be at least 4.7 uF with ESR below 0.5 ohm to maintain regulation during core load transients. Use a star-ground topology with the GND paddle of the QFN tied directly to a continuous ground plane.
Do not skip the NRST reset network. The SAM4S requires a minimum 10 ns pulse on NRST for a clean cold-start, and floating NRST can cause latch-up at power-up. Use the recommended 10 kohm pull-up with a 10 nF capacitor to ground, or an external reset supervisor for noisy industrial environments. Per the SAM4S datasheet, leaving NRST floating violates the application's operating conditions.
The 64-QFN exposed thermal pad (EP) must be soldered to the PCB ground plane for both electrical grounding and thermal dissipation. Per IPC-7351 land-pattern guidelines for 9x9 mm QFN with 0.5 mm pitch, design the land pattern with a 1:1 pad-to-pitch ratio and add thermal vias in a 3x3 array under the EP. The thermal via pattern should use 0.3 mm drilled vias with 0.6 mm pads for optimal solder wicking.
Compliance Information
RoHS and lead-free confirmed by Microchip product page and DigiKey listing as of 2026-09-20. AEC-Q100 not applicable for industrial-grade MCUs; no automotive-qualified SAM4S variant exists in this footprint.
