ATSAM4SA16CA-CFU - SAM4S 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4SA16CA-CFU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.45 | $9.45 |
| 10 | $8.71 | $87.10 |
| 100 | $7.42 | $742.00 |
| 500 | $6.55 | $3,275.00 |
| 1,000 | $5.88 | $5,880.00 |
ATSAM4SA16CA-CFU Overview
An ARM Cortex-M4 microcontroller is a 32-bit processor core that pairs the Cortex-M3 feature set with single-precision FPU and DSP extensions, suitable for mixed signal-and-control workloads. Within Microchip's portfolio, the SAM4S series sits between the lower-cost SAM3S (Cortex-M3) and the SAM4E (with Ethernet) lines, targeting general-purpose industrial, consumer, and IoT applications requiring moderate compute density and rich connectivity. The ATSAM4SA16CA-CFU is pin-to-pin compatible with SAM3N/SAM3S 100-pin variants and SAM7S legacy 100-pin packages, simplifying migration.
Key features include 120 MHz core clock with 2 KB instruction cache, 1 MB embedded Flash with read-look-ahead accelerator, 128 KB SRAM, and 16-bit External Bus Interface (EBI). Peripherals include a 12-bit ADC up to 1 Msps, multiple USART/UART/SPI/TWI interfaces, USB 2.0 Full-Speed Device, CAN 2.0B, I2S, and a 16-bit Timer Counter block. Cryptographic accelerators are not integrated; secure applications must add external elements.
The SAM4S architecture uses a Harvard-style multi-layer AHB bus matrix to keep DMA, CPU, and peripherals contention-free, supporting the high data-rate communication peripherals simultaneously without CPU stalls. DSP instructions accelerate FFT, FIR, and motor-control loops, while the single-precision FPU handles complex control math.
Typical applications include industrial automation controllers, building HVAC and smart-energy concentrators, USB peripherals such as Human Interface Devices (HID), automotive body and gateway modules, and graphical user interfaces with TFT displays driven by the integrated EBI. The wide operating temperature range (-40C to +85C for this -CFU industrial grade) suits both indoor and outdoor enclosures.
When designing with this part, ensure the VFBGA-100 PCB land pattern uses NSMD pads with via-in-pad or tented-via escape for reliable manufacturing. Decouple each VDD/VDDIO supply pair with a 100 nF X7R plus a 4.7 uF bulk capacitor within 2 mm of the pin. Boot configuration straps (BMS, JTAG_SEL) must be tied to valid logic states before NRST deassertion.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, with all claims cross-referenced to Microchip's official SAM4S datasheet family.
Drop-in alternatives for ATSAM4SA16CA-CFU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SA16CA-CFU (same form factor and footprint) — differing in ADC, Package, Core Architecture, Operating Temperature, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4S8CA-CFU
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →ATSAM4S4CA-CFU
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →ATSAM4SD32CA-CFU
✅ Drop-In✓ In Stock
$7.74 / Unit
View Datasheet →ATSAM4S8CA-CFUR
✅ Drop-In✓ In Stock
$3.95 / Unit
View Datasheet →ATSAM4S8CB-CFNR
✅ Drop-In✓ In Stock
$6.85 / Unit
View Datasheet →ATSAM4SA16CA-CFU Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M4 with FPU and DSP extensions |
| Maximum Core Clock | 120 MHz |
| Instruction Cache | 2 KB |
| Flash Memory | 1 MB (1M x 8) |
| Package | 100-VFBGA (7x7 mm) |
| Operating Temperature | -40C to +85C (industrial grade) |
| ADC | 12-bit, up to 1 Msps |
| USB | USB 2.0 Full-Speed Device |
| CAN | CAN 2.0B |
| External Bus Interface (EBI) | 16-bit data, up to 16 MB addressable |
| Serial Interfaces | USART/UART/SPI/TWI/I2S |
| Pin Count | 100 pins |
| Mounting Type | Surface Mount (BGA) |
| Memory Protection Unit (MPU) | Yes |
| Pin-to-Pin Compatibility | SAM3N, SAM3S 100-pin, SAM7S legacy 100-pin |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
ATSAM4SA16CA-CFU 100-vfbga (7x7 mm) Pin Configuration Guide
Pin configuration for ATSAM4SA16CA-CFU (100-vfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4SA16CA-CFU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4SA16CA-CFU is suitable for 6 applications: Industrial Automation Controllers, USB Human Interface Devices (HID), Building Automation Gateways, Automotive Body and Gateway Modules, TFT HMI Panels with EBI, IoT Edge Sensor Hubs.
Industrial Automation Controllers
The ATSAM4SA16CA-CFU's 120 MHz Cortex-M4 core, 1 MB Flash, and CAN 2.0B controller make it well suited for industrial PLC and field-bus controller roles. The 1 MB Flash accommodates ladder-logic interpreters and Modbus/CANopen stacks, while the multi-layer AHB bus matrix keeps deterministic response under heavy peripheral traffic. The -40C to +85C industrial grade handles unconditioned cabinet environments. Recommended companion MPNs: ATSAM4SA16CA-CFU as main MCU; MCP2515 external CAN transceiver for isolated bus; MCP23017 I/O expander for digital I/O.
Recommended
USB Human Interface Devices (HID)
The ATSAM4SA16CA-CFU integrates a USB 2.0 Full-Speed Device port with on-chip transceiver and dedicated FIFO, eliminating the need for an external ULPI bridge. The 120 MHz Cortex-M4 with DSP extensions handles HID report processing plus media-key or multi-touch parsing in software, freeing designers from a separate hub MCU. The 1 MB Flash stores HID descriptor tables, multi-language firmware, and bootloader. Recommended companion MPNs: ATSAM4SA16CA-CFU as USB MCU; USBLC6-2SC6 for ESD protection on D+/D- lines; 24 MHz crystal for USB SOF accuracy.
Recommended
Building Automation Gateways
For BACnet, Modbus, or KNX gateways bridging HVAC and lighting subsystems, the ATSAM4SA16CA-CFU's 1 MB Flash stores gateway protocol stacks plus configuration web pages served over Ethernet via an external MAC/PHY. The Cortex-M4 DSP instructions accelerate FFT-based audio annunciation for voice prompts, while the multi-layer bus matrix allows concurrent USB, UART, and SPI traffic without DMA stalls. The 12-bit 1 Msps ADC samples analog sensor inputs directly. Recommended companion MPNs: ATSAM4SA16CA-CFU as gateway MCU; LAN8720A for 10/100 Ethernet PHY; AT25DF321A 32 Mbit SPI Flash for web assets.
Recommended
Automotive Body and Gateway Modules
Although the ATSAM4SA16CA-CFU is industrial grade (-40C to +85C) rather than AEC-Q100 qualified, it is widely used in non-safety automotive body controllers and CAN-based gateway prototypes. The on-chip CAN 2.0B, 1 MB Flash, and DSP extensions allow audio ANC algorithms to run alongside CAN stack processing. Production vehicle deployments require the SAM V71 or SAMS70 family for AEC-Q100 environments. Recommended companion MPNs: ATSAM4SA16CA-CFU as gateway MCU; TJA1050 CAN transceiver; LM2596 step-down for 12V to 5V conversion.
Recommended
TFT HMI Panels with EBI
The ATSAM4SA16CA-CFU integrates a 16-bit External Bus Interface capable of driving 320x240 to 800x480 TFT displays without an external controller. Combined with the DMA-fed SPI port for touch sensing and the 1 MB Flash for GUI assets, the MCU supports a complete HMI controller on a single chip. The Cortex-M4 DSP instructions accelerate JPEG decode for splash screens. Recommended companion MPNs: ATSAM4SA16CA-CFU as HMI MCU; ILI9341 TFT controller (via SPI); XPT2046 resistive touch controller.
Recommended
IoT Edge Sensor Hubs
For battery-powered or energy-harvesting IoT edge hubs aggregating multiple sensor inputs, the ATSAM4SA16CA-CFU's 12-bit ADC with up to 16 channels handles analog sensor arrays while the multi-layer AHB keeps USB and SPI sensor traffic isolated. The 1 MB Flash hosts LoRaWAN or Thread stacks locally, and the Cortex-M4 DSP accelerates vibration analysis FFTs at the edge. Recommended companion MPNs: ATSAM4SA16CA-CFU as edge MCU; SX1276IMLTRT LoRa transceiver; BME280 temperature/humidity/pressure sensor.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SA16CA-CFU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4S8CA-CFU | ATSAM4S4CA-CFU | ATSAM4SD32CA-CFU | ATSAM4S8CA-CFUR | ATSAM4S8CB-CFNR |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz |
| Flash | 1 MB | 512 KB (-50%) | 256 KB (-75%) | 2 MB (+100%) | 512 KB (-50%) | 512 KB (-50%) |
| ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
| USB | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Highest Flash density in 100-VFBGA SAM4S family while keeping pin compatibility (vs ATSAM4S8CA-CFU)
- Lower cost than the 2 MB variant for typical applications (vs ATSAM4SD32CA-CFU)
- Industrial temperature grade with full SAM4S peripheral set in compact BGA (vs ATSAM4S4CA-CFU)
Design Notes
The 100-VFBGA 7x7 mm package requires NSMD pads (non-solder-mask defined) with a typical pad diameter of 0.30 mm and a pitch of 0.65 mm. Use via-in-pad (VIP) or microvia escape for the inner-row balls to maintain 100% yield; tented vias are acceptable for the outer rows. Maintain a controlled-impedance layer stack with 50 ohm single-ended traces for USB D+/D- and 90 ohm differential for CAN_H/CAN_L. Place a 4-layer stack-up with continuous ground plane under the BGA for thermal spreading and return-path integrity.
Decouple each VDDIO and VDDCORE pair with a 100 nF X7R ceramic placed within 2 mm of the ball, plus a 4.7 uF bulk capacitor per supply rail. The SAM4S has separate analog (VDDANA) and digital (VDDCORE) domains - isolate VDDANA with an LC filter (10 ohm ferrite + 10 uF) to keep ADC reference clean. Power-on reset requires NRST to be held low until both rails stabilize; use the on-chip POR but add an external 10 kohm pull-up and 100 nF to NRST for noise immunity.
Boot mode straps BMS and JTAG_SEL must be in valid logic states before NRST deassertion; floating straps cause boot from internal ROM in random mode and can brick the part into a SAM-BA bootloader state. The 12-bit ADC reference voltage must be tied to VDDANA, not VDDIO, or the ADC readings will scale incorrectly. Do not enable the USB peripheral without a 24 MHz HSE crystal or 12 MHz external clock - the on-chip PLL cannot generate USB-friendly 48 MHz from an internal RC.
Estimated: at 120 MHz core clock with all peripherals active, the SAM4S draws roughly 30-40 mA from VDDCORE (1.2V), giving 40-50 mW core dissipation. The VFBGA-100 thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board, so junction rise above ambient is on the order of 1.5-2 C. This is comfortable inside the -40C to +85C envelope; no heatsink needed unless the application runs sustained heavy DSP at high ambient.
Compliance Information
RoHS and lead-free per Microchip product page; not AEC-Q100 qualified - choose SAM V71/S70 family for AEC-Q100 automotive applications.
