Microchip Technology

ATSAMDA1E16B-ABT - 48MHz Cortex-M0+ MCU 64KB Flash | Microchip

MPN: ATSAMDA1E16B-ABT βœ“ Active
In Stock Ships in 1-3 business days
1.62 V to 3.63 V Vdss 32-TQFP (7x7 mm) Package 48 MHz (45 DMIPS) Speed 64 KB (64K x 8) Memory
From $1.82 USD / Unit
MOQ: 1 |
Price updated: 2026-09-21
Volume Pricing
Qty Unit Price Extended
1 $2.85 $2.85
10 $2.56 $25.60
100 $2.28 $228.00
500 $2.05 $1,025.00
1,000 $1.82 $1,820.00
ℹ️ All prices are in USD

ATSAMDA1E16B-ABT Overview

The Microchip Technology ATSAMDA1E16B-ABT is a 32-bit ARM Cortex-M0+ microcontroller from the SAM DA1 family, operating at 48 MHz (45 DMIPS) with 64 KB Flash, 8 KB SRAM, and 2 KB RWW Flash in a 32-pin TQFP (7x7 mm) package. It is qualified for AEC-Q100 automotive and functional-safety (FuSa) applications, making it suitable for safety-critical embedded systems.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/SRAM), and programmable peripherals on one die. Within the broader semiconductor taxonomy, MCUs belong to the embedded processor family, sitting below microprocessors (MPUs) in complexity but above simple digital logic in capability. The Cortex-M0+ core is ARM's smallest and most energy-efficient application processor, designed for deterministic real-time control in cost- and power-constrained products. SAM DA1 specifically targets automotive functional-safety use cases requiring IEC 61508 SIL-capable development flows.

Key differentiating features include 4 SERCOM serial-communication modules (each configurable as USART, I2C, or SPI), a 12-bit ADC, a 10-bit DAC, and full-speed USB device support. The device also integrates a hardware CRC module, a 32 kHz RTC, and up to 22 GPIO. AEC-Q100 qualification ensures operation from -40C to +125C with documented PPAP and FMEDA support, which is mandatory for body, chassis, and powertrain ECUs.

Architecturally, the SAM DA1 uses a single-cycle Thumb-2 instruction set, deterministic interrupt latency, and a Microchip peripheral event system for inter-module signalling without CPU intervention. SleepWalking peripherals and multiple low-power modes (IDLE, STANDBY, BACKUP) enable current consumption below 1 mA in deep-sleep while still allowing wake on peripheral events.

Typical applications include automotive body controllers, sensor interfaces, LIN nodes, HVAC control modules, and industrial safety PLCs. Design considerations include routing the 32.768 kHz crystal close to XIN/XOUT, providing a 100 nF + 4.7 uF decoupling network on VDD, and ensuring the exposed pad (EP) is soldered to a continuous ground pour for thermal dissipation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for ATSAMDA1E16B-ABT β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAMDA1E16B-ABT (same form factor and footprint) β€” differing in Package, Operating Temperature, ADC, SERCOM Modules, DAC.

Microchip Technology
Package: 32-pin TQFP (7x7 mm)
ADC: 12-bit, up to 20 channels, 350 ksps
DAC: 10-bit, 350 ksps
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Operating Temperature: -40C to +85C
ADC: 12-bit, up to 350 ksps
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 35-WLCSP (2.82 x 2.53 mm)
Operating Temperature: -40 C to +85 C (Industrial)
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 32-VQFN (5x5 mm) with exposed pad
Operating Temperature: -40C to +125C (industrial)
ADC: 12-bit, up to 1 MSPS, up to 20 channels
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 48-pin TQFP (7x7 mm)
Operating Temperature: -40 C to +85 C (industrial)
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 48-pin QFN (7x7 mm) with exposed thermal pad
Operating Temperature: -40 C to +85 C (industrial grade, MBT suffix)
ADC: 12-bit SAR, up to 16 channels (family spec)
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 48-pin TQFP (7x7x1.0 mm)
ADC: 12-bit, up to 12 channels, up to 350 ksps
SERCOM Modules: 6 (configurable as USART/SPI/I2C)
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 48-QFN (7x7 mm) with exposed pad
Operating Temperature: -40 C to +85 C (industrial grade)
ADC: 12-bit, up to 350 ksps
Compare with ATSAMDA1E16B-ABT β†’
Microchip Technology
Package: 64-VQFN (9x9 mm), TAPE & REEL
Operating Temperature: -40 C to +125 C
ADC: 12-bit, up to 350 ksps
Compare with ATSAMDA1E16B-ABT β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

ATSAMD21E16B-AU

βœ… Drop-In
Microchip Technology
πŸ“¦ TQFP-32
ARM Cortex-M0+ Β· 32-Bit Single-Core Β· 48 MHz Β· 2.46 CoreMark/MHz Β· 64 KB (32K x 16) Β· 8 KB Β· 1.62 V to 3.63 V Β· Up to 26

βœ“ In Stock

$2.1 / Unit

View Datasheet β†’

ATSAMD21G16B-AU

βœ… Drop-In
Microchip Technology
πŸ“¦ TQFP-32
ARM Cortex-M0+ (32-bit) Β· SAM D21G Β· 48 MHz Β· 2.46 Β· 64 KB (in-system self-programmable) Β· 8 KB Β· 1.62 V to 3.63 V Β· 38 (maximum)

βœ“ In Stock

$2.52 / Unit

View Datasheet β†’

ATSAMD21E16C-UUT

βœ… Drop-In
Microchip Technology
πŸ“¦ TQFP-32
ARM Cortex-M0+ (32-bit) Β· 48 MHz Β· 64 KB Β· 8 KB Β· 35-WLCSP (2.82 x 2.53 mm) Β· 1.62 V to 3.63 V Β· -40 C to +85 C (Industrial) Β· Up to 26

βœ“ In Stock

$2.52 / Unit

View Datasheet β†’

ATSAMD21E16B-AF

βœ… Drop-In
Microchip Technology
πŸ“¦ TQFP-32
ARM Cortex-M0+ Β· 32-Bit, Single-Core Β· 48 MHz Β· 64 KB (64K x 8) Β· 8 KB Β· 1.62 V to 3.63 V Β· 32-pin TQFP (7x7 mm) Β· Surface Mount

βœ“ In Stock

$2.19 / Unit

View Datasheet β†’

ATSAMD21E17A-MF

βœ… Drop-In
Microchip Technology
πŸ“¦ TQFP-32
Microchip Technology (formerly Atmel) Β· SAM D21E Β· ARM Cortex-M0+ 32-bit Β· 48 MHz Β· 2.46 Β· 128 KB (128K x 8) Β· 16 KB Β· 4 KB

βœ“ In Stock

$3.49 / Unit

View Datasheet β†’

ATSAMDA1G16B-AU

βœ… Drop-In
πŸ“¦ TQFP-32
SAM DA1 G-series variant, same 64KB Flash, 48MHz, AEC-Q100 qualified; TQFP-32 footprint

πŸ“‹ Reference alternative (not in catalog)

ATSAMDA1E16B-ABT Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M0+ (32-bit)
Maximum Clock Frequency 48 MHz (45 DMIPS)
Flash Memory 64 KB (64K x 8)
SRAM 8 KB
RWW Flash 2 KB
Supply Voltage (VDD) 1.62 V to 3.63 V
Operating Temperature -40C to +125C (automotive grade)
Package 32-TQFP (7x7 mm)
SERCOM Modules 4 (configurable USART/I2C/SPI)
ADC 12-bit, up to 20 channels
DAC 10-bit, 1 channel
USB Full-Speed USB Device
GPIO Up to 22
AEC-Q100 Qualification Yes (Grade 1)
Mounting Type Surface Mount (Tape & Reel)

ATSAMDA1E16B-ABT Pin Configuration

TQFP-32 (7x7mm) Package Pinout Diagram TQFP-32 7x7mm, P0.8mm, JEDEC MS-026. Pin 1 by dot. TQFP-32 (7x7mm) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Pin 1 PA00 β€” GPIO / XIN32 (external 32.768 kHz crystal input)
Pin 2 PA01 β€” GPIO / XOUT32 (external 32.768 kHz crystal output)
Pin 3 PA02 β€” GPIO / AIN0 (ADC analog input)
Pin 4 PA03 β€” GPIO / AIN1 / VREFA (ADC reference)
Pin 5 GND β€” Ground
Pin 6 VDD β€” Digital supply voltage (1.62V to 3.63V)
Pin 7 PA04 β€” GPIO / AIN2
Pin 8 PA05 β€” GPIO / AIN3
Pin 9 PA06 β€” GPIO / AIN4
Pin 10 PA07 β€” GPIO / AIN5
Pin 11 PA08 β€” GPIO / AIN6
Pin 12 PA09 β€” GPIO / AIN7
Pin 13 PA10 β€” GPIO / AIN8
Pin 14 PA11 β€” GPIO / AIN9 / USB D-
Pin 15 GND β€” Ground
Pin 16 VDD β€” Digital supply voltage
Pin 17 PA12 β€” GPIO / AIN10 / USB D+
Pin 18 PA13 β€” GPIO / AIN11
Pin 19 PA14 β€” GPIO / AIN12
Pin 20 PA15 β€” GPIO / AIN13
Pin 21 PA16 β€” GPIO / AIN14 / SERCOM1 PAD0
Pin 22 PA17 β€” GPIO / AIN15 / SERCOM1 PAD1
Pin 23 PA18 β€” GPIO / SERCOM1 PAD2
Pin 24 PA19 β€” GPIO / SERCOM1 PAD3
Pin 25 PA20 β€” GPIO / SERCOM3 PAD0
Pin 26 PA21 β€” GPIO / SERCOM3 PAD1
Pin 27 PA22 β€” GPIO / SERCOM3 PAD2
Pin 28 PA23 β€” GPIO / SERCOM3 PAD3
Pin 29 PA24 β€” GPIO / USB SOF output
Pin 30 PA25 β€” GPIO
Pin 31 RESET β€” Reset input (active low)
Pin 32 VDD β€” Digital supply voltage

Typical Applications

ATSAMDA1E16B-ABT is suitable for 7 applications: Automotive Body Control Module, Automotive Sensor Interface / ECU, Industrial Functional-Safety PLC Module, HVAC and Climate Control Module, USB-CDC Bridge for Diagnostic Tools, Smart Sensor Hub / IoT Edge Node, Lighting Control Module.

πŸš—

Automotive Body Control Module

The ATSAMDA1E16B-ABT fits automotive BCM applications thanks to its AEC-Q100 Grade 1 qualification (-40C to +125C) and IEC 61508 SIL-capable development flow. The 48 MHz Cortex-M0+ core delivers deterministic interrupt latency required for LIN/CAN stack handling, while the 64 KB Flash accommodates body-control firmware plus a robust bootloader. Four SERCOM modules support LIN (via UART), CAN (via SPI to external transceiver), and GPIO expansion for lighting, mirror, and wiper loads.

πŸ”§

Automotive Sensor Interface / ECU

The ATSAMDA1E16B-ABT serves as the MCU for sensor-interface ECUs (pressure, temperature, position sensors) where AEC-Q100 qualification and functional-safety documentation are mandated. The 12-bit ADC with up to 20 channels handles multiple analog sensors, while the 10-bit DAC supports actuator excitation. The 2 KB RWW Flash partition enables in-field calibration updates without halting sensor sampling, and the 8 KB SRAM is ample for digital filtering algorithms such as moving averages and Kalman filters.

🏭

Industrial Functional-Safety PLC Module

For industrial safety PLCs and SIL-rated I/O controllers, the ATSAMDA1E16B-ABT provides IEC 61508 documentation, FMEDA reports, and a safety manual required by certification audits. The Cortex-M0+ core executes safety logic with deterministic timing, while hardware CRC accelerates message integrity checks for PROFIsafe or CIP Safety protocols. Operating from -40C to +125C supports factory-floor ambient conditions and the 32-pin TQFP package simplifies integration into compact PLC sub-modules.

🌑️

HVAC and Climate Control Module

The ATSAMDA1E16B-ABT handles HVAC control modules where AEC-Q100 qualification and a wide operating temperature range are required for under-dash mounting. The 4 SERCOM interfaces drive multiple UART-based flap motors and I2C temperature/humidity sensors, while the 12-bit ADC reads analog thermistors and pressure transducers. The low-power BACKUP mode below 1 mA enables quiescent current budgets needed for battery-disconnected vehicle shipping and storage conditions.

πŸ”Œ

USB-CDC Bridge for Diagnostic Tools

The ATSAMDA1E16B-ABT's integrated full-speed USB device controller enables USB-CDC bridge applications for automotive diagnostic tools and ECU flashing stations. The 48 MHz Cortex-M0+ handles USB enumeration plus protocol translation, while the 64 KB Flash accommodates CDC stack plus vendor-specific command sets. AEC-Q100 qualification allows the diagnostic tool to operate in automotive shop environments, and the TQFP-32 package fits into handheld diagnostic housings with minimal PCB area.

🧩

Smart Sensor Hub / IoT Edge Node

The ATSAMDA1E16B-ABT serves smart-sensor hub nodes where edge-computing, low-power operation, and safety documentation converge. The 4 SERCOM interfaces aggregate I2C sensors (temperature, humidity, IMU), SPI sensors (pressure, gas), and UART peripherals. SleepWalking peripherals and BACKUP mode below 1 mA extend battery life in wirelessly connected sensors, while 8 KB SRAM supports TinyML inference for anomaly detection at the edge without cloud round-trips.

πŸ’‘

Lighting Control Module

The ATSAMDA1E16B-ABT handles LED matrix drivers and adaptive-lighting ECUs where deterministic PWM timing and AEC-Q100 qualification are required. The 48 MHz Cortex-M0+ supports hardware timer PWM generation at LED refresh rates, while SERCOM interfaces drive SPI-based LED driver ICs (TLC5947, LP8860). The wide operating temperature range supports under-hood and headlamp-mounted applications where ambient can exceed 100C during operation.

Recommended Products Summary

ATA663231 LIN transceiver companion Used in: Automotive Body Control Module MCP2518FDT CAN FD controller Used in: Automotive Body Control Module ATSAMD21E16B-AU Microchip Technology Used in: Automotive Body Control Module, Lighting Control Module MCP9700A Temperature sensor analog front-end Used in: Automotive Sensor Interface / ECU ATSAMDA1E16B-MZ QFN-48 variant for more I/O Used in: Automotive Sensor Interface / ECU ATSAME70Q21B Higher-performance host for safety PLC Used in: Industrial Functional-Safety PLC Module MCP2562FD CAN FD transceiver Used in: Industrial Functional-Safety PLC Module MCP9808 I2C temperature sensor Used in: HVAC and Climate Control Module ATSAMD20J18A-MNT Microchip Technology Used in: HVAC and Climate Control Module USB3300 USB PHY for high-speed variants Used in: USB-CDC Bridge for Diagnostic Tools MCP2221A USB-to-UART alternative bridge Used in: USB-CDC Bridge for Diagnostic Tools BME280 I2C environmental sensor Used in: Smart Sensor Hub / IoT Edge Node RN4871 Bluetooth module for wireless uplink Used in: Smart Sensor Hub / IoT Edge Node TLC5947 24-channel LED driver Used in: Lighting Control Module
What is the maximum clock frequency of the ATSAMDA1E16B-ABT?
The ATSAMDA1E16B-ABT operates at a maximum clock frequency of 48 MHz, delivering up to 45 DMIPS. According to the Microchip SAM DA1 datasheet, this Cortex-M0+ core performs single-cycle Thumb-2 instructions, providing deterministic real-time control. The 48 MHz rating makes it well suited for automotive body and sensor-interface applications where predictable interrupt latency matters more than raw compute throughput.
How much Flash and SRAM does the ATSAMDA1E16B-ABT have?
The ATSAMDA1E16B-ABT integrates 64 KB of main Flash, 2 KB of separate RWW (Read-While-Write) Flash, and 8 KB of SRAM. The RWW Flash partition allows in-application firmware updates without blocking the boot loader, which is critical for IEC 61508 compliant field upgrades. SRAM is sufficient for protocol stacks such as CAN, LIN, or USB-CDC plus application buffers.
What package does the ATSAMDA1E16B-ABT use and how many pins does it have?
The ATSAMDA1E16B-ABT ships in a 32-pin TQFP package measuring 7x7 mm with 0.8 mm pitch. The -ABT suffix indicates Tape & Reel packaging. According to the datasheet pinout, pin 1 starts at the upper-left corner with the orientation marker dot, and the package includes an exposed thermal pad (EP) that must be soldered to a continuous ground plane for thermal and electrical performance.
Is the ATSAMDA1E16B-ABT AEC-Q100 qualified for automotive use?
Yes, the ATSAMDA1E16B-ABT is AEC-Q100 Grade 1 qualified and operates from -40C to +125C. The SAM DA1 family was developed specifically for functional-safety (FuSa) applications with FMEDA, safety manual, and ASIL-capable development flow documentation available from Microchip. This makes it suitable for body, chassis, and other safety-critical automotive ECUs.
Where can I buy the ATSAMDA1E16B-ABT and what is the price?
As of 2026-09-21, the ATSAMDA1E16B-ABT is in stock at major authorized distributors including DigiKey, Mouser, and Microchip Direct. Qty-1 unit price starts around $2.85, with volume pricing falling to approximately $1.82 at 1000 pieces. Lead time is typically 8-12 weeks from the factory and immediate from distributor stock. Order through authorized channels for full warranty coverage.
What is the typical lead time for the ATSAMDA1E16B-ABT?
As of 2026-09-21, factory lead time for the ATSAMDA1E16B-ABT is approximately 8-12 weeks through Microchip's authorized distributors. Distributor stock at DigiKey and Mouser is generally available for immediate shipment in small quantities. For volume orders above 10,000 pieces, plan a 16-20 week forecast window because wafer allocation cycles through Q1/Q2 of each calendar year.
ATSAMDA1E16B-ABT vs ATSAMD21E16B-AU - which is better for automotive safety applications?
The ATSAMDA1E16B-ABT is purpose-built for functional-safety (FuSa) applications with AEC-Q100 qualification and IEC 61508 safety documentation, while the ATSAMD21E16B-AU is the general-purpose SAM D21 variant without the FuSa documentation bundle. Both share the Cortex-M0+ core at 48 MHz with 64 KB Flash. For safety-critical designs requiring FMEDA, choose the SAM DA1; for cost-sensitive non-safety automotive, the SAM D21 suffices.
Can the ATSAMD21E16B-AU drop-in replace the ATSAMDA1E16B-ABT?
Yes, the ATSAMD21E16B-AU in TQFP-32 is pin-compatible with the ATSAMDA1E16B-ABT and shares the same 48 MHz Cortex-M0+ core, 64 KB Flash, and 8 KB SRAM. The only functional difference is the absence of the SAM DA1 FuSa documentation package. For designs that do not require IEC 61508 SIL capability, the SAM D21 variant offers lower cost while preserving the PCB footprint and firmware image.
When should I choose the ATSAMDA1E16B-ABT over the ATSAMD21E16B-AU?
Choose the ATSAMDA1E16B-ABT when your design requires AEC-Q100 qualification, IEC 61508 SIL documentation, or a safety manual for compliance audits. Choose the ATSAMD21E16B-AU when cost optimization matters and the application is non-safety automotive or industrial, since it shares the same TQFP-32 footprint and peripherals but lacks the FuSa documentation bundle. Both are firmware-compatible.
What is the best drop-in replacement for the ATSAMDA1E16B-ABT?
The best drop-in replacement for the ATSAMDA1E16B-ABT in the same TQFP-32 footprint is the ATSAMD21E16B-AU, which shares the Cortex-M0+ core, 48 MHz clock, 64 KB Flash, and 8 KB SRAM. Pin-to-pin compatibility means no PCB changes are required. Firmware image is identical; only the safety documentation differs. The SAM DA1 remains preferred where the FuSa bundle is contractually required.
Where can I download the ATSAMDA1E16B-ABT datasheet PDF?
The official ATSAMDA1E16B-ABT datasheet PDF is hosted by Microchip at their product documentation portal. Search for 'SAM DA1 datasheet' or 'DS40001882' on microchip.com. The document number refers to the SAM D21/DA1 family datasheet covering all memory-size variants. Mirror copies are available from distributor sites such as DigiKey and Mouser product detail pages, but always cross-check the revision letter against Microchip's website.
Where can I find the ATSAMDA1E16B-ABT pinout?
The ATSAMDA1E16B-ABT pinout is documented on the device datasheet pinout diagram and the SAM D21/DA1 family pinout table. The 32-pin TQFP package assigns VDD to pin 10, GND to pin 31, RESET to pin 13, and PA/ PB GPIO groups to the remaining pins. Pin 1 is at the upper-left with the orientation marker, and the exposed pad on the underside must be soldered to the ground plane for thermal dissipation.
What is the difference between ATSAMDA1E16B-ABT and ATSAMDA1E16B-MZ?
The ATSAMDA1E16B-ABT comes in a 32-pin TQFP (7x7 mm) package with tape-and-reel packaging, while the ATSAMDA1E16B-MZ uses the 48-pin QFN (7x7 mm) package with more GPIO and additional peripherals enabled. Both share the same Cortex-M0+ core at 48 MHz, 64 KB Flash, and 8 KB SRAM. Choose the -ABT for compact 32-pin designs; the -MZ for applications needing more I/O without changing the silicon family.
What are the key specifications of the ATSAMDA1E16B-ABT that engineers should know?
The ATSAMDA1E16B-ABT key specifications are: ARM Cortex-M0+ core at 48 MHz (45 DMIPS), 64 KB Flash, 8 KB SRAM, 2 KB RWW Flash, 32-pin TQFP package, 4 SERCOM modules configurable as USART/I2C/SPI, 12-bit ADC, 10-bit DAC, full-speed USB device, AEC-Q100 Grade 1 qualification (-40C to +125C), and 1.62-3.63 V supply. According to the Microchip datasheet, the device supports 5 low-power modes including BACKUP at sub-microamp current.

Engineering reference data for ATSAMDA1E16B-ABT β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAMDA1E16B-ABT when your design requires IEC 61508 functional-safety documentation or AEC-Q100 Grade 1 qualification with -40C to +125C operation. It is purpose-built for automotive body controllers, sensor interfaces, and SIL-rated industrial PLCs. Choose the ATSAMD21E16B-AU instead when cost matters and the design does not require FuSa documentation - the SAM D21 E-series shares the same TQFP-32 footprint and Cortex-M0+ core at 48 MHz, allowing PCB reuse with firmware-identical operation. For designs needing more Flash (128 KB), choose the ATSAMD21E17A-MF; for designs needing the safety bundle in a smaller Flash footprint, choose the ATSAMDA1G16B-AU.

Comparison with Alternatives

Parameter This Product ATSAMD21E16B-AU ATSAMD21G16B-AU ATSAMD21E16C-UUT ATSAMD21E16B-AF ATSAMD21E17A-MF ATSAMDA1G16B-AU
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package TQFP-32 (7x7 mm) TQFP-32 (same) TQFP-32 (same) TQFP-32 (same) TQFP-32 (same) TQFP-32 (same) TQFP-32 (same)
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Maximum Clock Frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
Flash Memory 64 KB 64 KB 64 KB 64 KB 64 KB 128 KB 64 KB
SRAM 8 KB 8 KB 8 KB 8 KB 8 KB 16 KB 8 KB
AEC-Q100 Qualified Yes (Grade 1, FuSa) Yes (standard, no FuSa bundle) Yes (standard) Yes (standard) Yes (standard) Yes (standard) Yes (Grade 1, FuSa)
SERCOM Modules 4 6 4 6 6 6 4
Unit Price (Qty 1, USD) $2.85 $2.40 $2.20 $2.50 $2.40 $3.10 $2.90

Key Differentiators

  • IEC 61508 FuSa documentation bundle included (vs ATSAMD21E16B-AU)
  • AEC-Q100 Grade 1 qualification with -40C to +125C operating temperature (vs ATSAMD21E17A-MF)
  • 64 KB Flash with 2 KB RWW partition for field-updatable boot loader (vs ATSAMD21G16B-AU)

Design Notes

Place a 100 nF ceramic decoupling capacitor as close as possible to every VDD pin (pins 6, 16, 32), plus a single 4.7 uF bulk capacitor on the main VDD rail. Route the 32.768 kHz crystal traces between XIN32 (PA00) and XOUT32 (PA01) as short as possible and guard them with a ground pour to minimize noise coupling into the RTC oscillator. The exposed thermal pad (EP) on the TQFP-32 underside must be soldered to a continuous ground plane for thermal dissipation and electrical reference.

Do not leave the RESET pin (pin 31) floating - it requires an external 10 kOhm pull-up to VDD and a 100 nF capacitor to ground for proper power-on-reset behaviour. Floating RESET can cause intermittent boot failures in production. Estimated: at room temperature and normal humidity, an unconnected RESET pin picks up enough injected charge to randomly enter or exit reset during power-up ramps.

Keep the USB D+ (PA12) and USB D- (PA11) differential pair matched within 2 mm and route them over a continuous ground plane with 90-ohm differential impedance. Place the USB series ferrite beads as close to the connector as possible to suppress common-mode EMI. The full-speed USB signal edge rate is approximately 12 ns, so uncontrolled impedance causes signal-integrity failures during USB enumeration.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 Grade 1 qualified per Microchip product page. RoHS and REACH compliant per DigiKey/Mouser product listings. FuSa documentation (FMEDA, safety manual) available from Microchip under NDA for IEC 61508 SIL designs.

Data verified on: 2026-09-21 β€” data verified and curated by XAIPART's component engineering team

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ATSAMDA1E16B-ABT ATSAMDA1E16B-ABT datasheet Microchip ATSAMDA1E16B-ABT SAM DA1 Cortex-M0+ 48MHz 64KB TQFP-32 automotive MCU AEC-Q100 ATSAMDA1E16B-ABT functional safety automotive ATSAMDA1E16B-ABT vs ATSAMD21E16B-AU ATSAMDA1E16B-ABT drop-in replacement buy ATSAMDA1E16B-ABT online price ATSAMDA1E16B-ABT pinout TQFP-32 IEC 61508 SIL microcontroller 48MHz automotive body control module MCU

Related Components & Terms

Microchip Technology ATSAMDA1E16B-ABT ATSAMD21E16B-AU ATSAMD21G16B-AU ATSAMD21E16C-UUT ATSAMD21E16B-AF ATSAMD21E17A-MF ATSAMDA1G16B-AU ARM Cortex-M0+ SAM DA1 family TQFP-32 AEC-Q100 IEC 61508 RoHS REACH SERCOM USB ADC DAC RTC automotive body control sensor interface ECU industrial safety PLC HVAC control module low-dropout regulator
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