ATSAME51G18A-MU-EFP - SAM E51 120MHz Cortex-M4F MCU | Microchip
MPN: ATSAME51G18A-MU-EFP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.95 | $69.50 |
| 100 | $6.21 | $621.00 |
| 500 | $5.68 | $2,840.00 |
| 1,000 | $5.14 | $5,140.00 |
ATSAME51G18A-MU-EFP Overview
A 32-bit ARM Cortex-M4 microcontroller is a RISC-based processor core that combines high-performance digital signal processing (DSP) instructions with a single-precision floating point unit, enabling deterministic real-time control in embedded systems. Within the taxonomy, it sits at microcontroller -> embedded processor -> semiconductor -> integrated circuit. The SAM E51 series adds Microchip's proprietary peripheral set, dual-bank Flash for over-the-air (OTA) firmware updates, and hardware cryptography for secure connected applications.
Key differentiating features of the ATSAME51G18A-MU-EFP include 120 MHz CPU with FPU and DSP extensions, 256 KB SRAM with ECC, a 12-bit 1 MSPS ADC, multiple SERCOM modules configurable as UART/SPI/I2C, USB 2.0 Full-Speed device/host, CAN-FD, and the SAM E51 Event System for hardware-triggered peripheral interconnects without CPU intervention. The integrated FPU simplifies control-loop math for motor control and power conversion algorithms.
Architecturally, the part uses a Cortex-M4F core coupled with a 5-stage pipeline, tightly-coupled memory, and a multi-layer AHB bus matrix giving simultaneous access to Flash, SRAM, and peripherals. The dual-panel Flash supports read-while-write, allowing firmware updates without halting application code. Hardware AES, true RNG, and secure boot features accelerate IoT security implementations.
Typical applications include industrial automation controllers, USB peripherals and HID devices, CAN-FD node ECUs, motor control FOC drives, IoT sensor hubs, and HMI touch panels. The combination of Cortex-M4F DSP, CAN-FD, and USB makes it especially well-suited to automotive body electronics and connected industrial gateways where real-time deterministic performance is required.
Designers should note that the 48-VQFN exposed pad must be soldered to the PCB ground plane for thermal dissipation and signal integrity. Decoupling requires at least one 100 nF ceramic capacitor per VDD pin and a bulk 4.7 uF capacitor near the VDDCORE pin. Programming is supported through Microchip Studio, Atmel Studio 7, MPLAB X IDE, and the SAMD/SAME driver library.
This page synthesizes current distributor pricing, same-package drop-in alternatives, and practical PCB design notes that are not consolidated in the manufacturer datasheet, enabling faster part selection and supply-chain resilience.
Drop-in alternatives for ATSAME51G18A-MU-EFP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME51G18A-MU-EFP (same form factor and footprint) — differing in ADC, Package, SRAM, DAC, Flash Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME51G18A-MU
✅ Drop-In✓ In Stock
$4.35 / Unit
View Datasheet →ATSAME51G18A-MUT-EFP
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAME51G19A-MU-EFP
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.2 / Unit
View Datasheet →ATSAMD51G18A-MFT
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →ATSAMD51J19A-MU-EFP
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →ATSAMD51G18A-MUT-EFP
✅ Drop-In✓ In Stock
$4.42 / Unit
View Datasheet →ATSAME51G18A-MU-EFP Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with single-precision FPU and DSP instructions |
| Maximum CPU Frequency | 120 MHz |
| Program Flash Memory | 256 KB (256K x 8) with ECC, dual-panel |
| SRAM | 256 KB with ECC |
| Operating Voltage Range | 1.71 V to 3.63 V |
| ADC | 12-bit, up to 1 MSPS |
| USB | USB 2.0 Full-Speed Device and Host |
| CAN | CAN 2.0B and CAN-FD |
| SERCOM Modules | Configurable as UART/SPI/I2C (peripheral count allowed) |
| DMA Channels | 32 |
| Timers/Counters | 8 (TC) plus 5 SCC, 4 TCC |
| Package | 48-VQFN (7x7 mm) with exposed pad |
| Operating Temperature Range | -40 C to +125 C (industrial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Series | SAM E51 |
ATSAME51G18A-MU-EFP Pin Configuration
| Pin 1 | PB30 — GPIO / SERCOM alternate function |
| Pin 2 | PB31 — GPIO / SERCOM alternate function |
| Pin 3 | PB00 — GPIO / SERCOM alternate function |
| Pin 4 | PB01 — GPIO / SERCOM alternate function |
| Pin 5 | PB02 — GPIO / SERCOM alternate function (AIN10) |
| Pin 6 | PB03 — GPIO / SERCOM alternate function (AIN11) |
| Pin 7 | PA00 — GPIO / SERCOM alternate function |
| Pin 8 | PA01 — GPIO / SERCOM alternate function (XIN) |
| Pin 9 | GND — Ground |
| Pin 10 | PA02 — GPIO / SERCOM alternate function (XOUT) |
| Pin 11 | PA03 — GPIO / SERCOM alternate function (AIN1) |
| Pin 12 | VBAT — Battery supply domain |
| Pin 13 | PA04 — GPIO / SERCOM alternate function (AIN2) |
| Pin 14 | PA05 — GPIO / SERCOM alternate function (AIN3) |
| Pin 15 | PA06 — GPIO / SERCOM alternate function (AIN4) |
| Pin 16 | PA07 — GPIO / SERCOM alternate function (AIN5) |
| Pin 17 | PA08 — GPIO / SERCOM alternate function (AIN6) |
| Pin 18 | PA09 — GPIO / SERCOM alternate function (AIN7) |
| Pin 19 | GND — Ground |
| Pin 20 | VDDIO — I/O supply voltage |
| Pin 21 | VDDIO — I/O supply voltage |
| Pin 22 | PA10 — GPIO / SERCOM alternate function |
| Pin 23 | PA11 — GPIO / SERCOM alternate function |
| Pin 24 | PA12 — GPIO / SERCOM alternate function |
| Pin 25 | PA13 — GPIO / SERCOM alternate function |
| Pin 26 | PA14 — GPIO / SERCOM alternate function |
| Pin 27 | PA15 — GPIO / SERCOM alternate function |
| Pin 28 | PA16 — GPIO / SERCOM alternate function |
| Pin 29 | PA17 — GPIO / SERCOM alternate function |
| Pin 30 | PA18 — GPIO / SERCOM alternate function |
| Pin 31 | PA19 — GPIO / SERCOM alternate function |
| Pin 32 | PA20 — GPIO / SERCOM alternate function |
| Pin 33 | PA21 — GPIO / SERCOM alternate function |
| Pin 34 | PA22 — GPIO / SERCOM alternate function |
| Pin 35 | PA23 — GPIO / SERCOM alternate function |
| Pin 36 | PA24 — USB DM (USB Full-Speed data minus) |
| Pin 37 | PA25 — USB DP (USB Full-Speed data plus) |
| Pin 38 | GND — Ground |
| Pin 39 | VDDIO — I/O supply voltage |
| Pin 40 | VDDCORE — Core voltage (decoupling) |
| Pin 41 | RESET — Reset input (active-low) |
| Pin 42 | SWDIO — Serial Wire Debug I/O |
| Pin 43 | SWCLK — Serial Wire Debug clock |
| Pin 44 | PA27 — GPIO / SERCOM alternate function |
| Pin 45 | PA28 — GPIO / SERCOM alternate function |
| Pin 46 | PA29 — GPIO / SERCOM alternate function |
| Pin 47 | PA30 — GPIO / SERCOM alternate function |
| Pin 48 | PA31 — GPIO / SERCOM alternate function |
Typical Applications
ATSAME51G18A-MU-EFP is suitable for 6 applications: Industrial CAN-FD Node ECU, USB HID Peripherals and Hubs, BLDC / PMSM Motor Control, IoT Sensor Hub with Secure Boot, HMI Touch Panel Controller, Automotive Body Electronics.
Industrial CAN-FD Node ECU
The ATSAME51G18A-MU-EFP is well suited to industrial CAN-FD node ECUs because its Cortex-M4F core runs at 120 MHz with hardware floating point, deterministic interrupt latency, and integrated CAN-FD controller. The 256 KB SRAM with ECC supports J1939 stacks plus dual CAN-FD message buffers without external memory. Compared to lower-end MCUs, the part's 12-bit 1 MSPS ADC and Event System allow precise closed-loop control of sensors and actuators without CPU intervention. Use the device between the CAN bus transceiver (e.g., MCP2562FD) and the sensor I/O, with isolated DC-DC and isolated CAN for industrial bus compliance.
Recommended
USB HID Peripherals and Hubs
For USB Full-Speed HID devices such as industrial keypads, custom input controllers, or USB-to-UART bridges, the ATSAME51G18A-MU-EFP integrates a USB 2.0 Full-Speed controller with on-chip transceiver, eliminating external PHY cost. The 120 MHz core handles HID report parsing, debouncing, and USB stack with sub-millisecond latency, while 256 KB Flash holds the USB stack and application logic without external memory. Place a 1uF bulk capacitor on VBUS and follow USB 2.0 DP/DM trace length matching; the exposed pad must be soldered to a continuous ground pour.
Recommended
BLDC / PMSM Motor Control
Field-Oriented Control (FOC) of BLDC and PMSM motors demands deterministic PWM with sub-microsecond jitter and DSP-class math, both of which the ATSAME51G18A-MU-EFP provides through its Cortex-M4F core, 120 MHz operation, and TCC timers with hardware dead-time insertion. The 256 KB SRAM holds Park/Clarke transform tables and speed PI controller state. The QDEC peripheral can decode encoder feedback in hardware, freeing CPU cycles. Place the MCU between the gate driver (e.g., dsPIC33 or external MOSFET driver) and the Hall/encoder inputs.
Recommended
IoT Sensor Hub with Secure Boot
The ATSAME51G18A-MU-EFP's hardware AES, true random number generator, and secure boot features enable tamper-resistant IoT sensor hubs for industrial or commercial deployment. Its SERCOM ports configure as I2C, SPI, or UART to read multiple sensors concurrently, while the 32-channel DMA offloads data movement. The integrated 12-bit ADC handles analog sensor front-ends. Connect sensors via SERCOM/I2C and route secure OTA updates through the Ethernet or Wi-Fi companion module.
Recommended
HMI Touch Panel Controller
In HMI touch panels, the ATSAME51G18A-MU-EFP serves as a co-processor that drives TFT LCDs via SERCOM+SPI, scans capacitive touch via PTC, and reports touches over CAN or USB to a host processor. The 120 MHz Cortex-M4F renders simple UI animations while the dedicated Event System routes touch interrupts without CPU wake-ups. 256 KB SRAM holds frame buffers for small QVGA panels. Provide at least 4-layer PCB stack-up with separate digital/analog ground pour under the VQFN exposed pad.
Recommended
Automotive Body Electronics
Body electronics modules such as door zone nodes, mirror controllers, and ambient lighting drivers benefit from the ATSAME51G18A-MU-EFP's AEC-Q100-grade equivalent industrial temperature range, CAN-FD bus interface, and PWM-rich TCC timers. The Cortex-M4F at 120 MHz runs AUTOSAR-class scheduling and LIN/CAN stacks concurrently. 256 KB Flash holds protocol stacks plus application logic. Use with an automotive-qualified CAN-FD transceiver and watch the device's ambient temperature limits when placed behind a dashboard heat sink.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME51G18A-MU-EFP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME51G18A-MU | ATSAME51G18A-MUT-EFP | ATSAME51G19A-MU-EFP | ATSAMD51G18A-MFT | ATSAMD51J19A-MU-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7) | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| USB | FS Device + Host | FS Device + Host | FS Device + Host | FS Device + Host | FS Device + Host | |
| CAN | CAN-FD | CAN-FD | CAN-FD | CAN-FD | CAN-FD | |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | |
| Extended Flash Performance (EFP) | Yes | No | Yes | Yes | Yes | Yes |
Key Differentiators
- Extended Flash Performance (EFP) variant for faster code execution (vs ATSAME51G18A-MU)
- Larger Flash upgrade path without changing PCB (vs ATSAME51G19A-MU-EFP)
- Pin-compatible SAM D51 upgrade for richer peripherals (vs ATSAMD51J19A-MU-EFP)
Design Notes
The 48-VQFN exposed thermal pad MUST be soldered to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to the inner ground layers for proper thermal dissipation and low-impedance ground return. Use 4-layer PCB stack-up with dedicated ground and power planes; do not route signal traces under the exposed pad.
Place one 100 nF X7R 0402 ceramic decoupling capacitor as close as possible to every VDDIO pin (3 pins total on the 48-VQFN). Add one 4.7 uF X5R bulk capacitor near the VDDCORE pin within 5 mm. Ferrite beads on VDDIO are NOT recommended unless noise injection from external sources is measured; clean star-ground topology gives lowest MCU supply noise.
Do not enable the Brown-Out Detector (BOD) without first configuring the VDDCORE regulator properly - on reset, the internal 1.2V LDO must settle before code runs. Always configure the NVMCTRL peripheral to use the dual-panel Flash with the wait-state settings appropriate for 120 MHz (3 wait-states for VDDIO > 2.7V). Without these settings, Flash reads will silently corrupt.
USB DP/DM traces must be 90-ohm differential, length-matched within 150 mils, and routed over a continuous ground plane with no splits. Place the 15 kohm pull-down resistors on DP/DM as close to the MCU pins as possible. Keep CAN TX/RX traces short and use twisted-pair wiring with 120 ohm bus terminators at each end of the CAN-FD bus.
Compliance Information
RoHS and REACH compliance per Microchip product page. Industrial -40C to +125C temperature grade; AEC-Q100 not specifically stated - contact Microchip for automotive-grade part numbers.
