ATSAME51J19A-MU - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
MPN: ATSAME51J19A-MU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.45 | $7.45 |
| 10 | $6.71 | $67.10 |
| 100 | $5.96 | $596.00 |
| 500 | $5.2 | $2,600.00 |
| 1,000 | $4.65 | $4,650.00 |
ATSAME51J19A-MU Overview
A microcontroller (MCU) is a compact integrated circuit that combines a CPU core, program memory (Flash), data memory (SRAM), and a wide range of peripherals on a single die. The SAM E51 belongs to the 32-bit MCU category, sitting within the hierarchy ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The M4F core adds DSP extensions and hardware FPU for sensor fusion and signal-processing workloads.
Key features include 512 KB Dual-Panel Flash, 192 KB SRAM, a 12-bit 1 MSPS ADC with up to 16 channels, a 12-bit DAC, USB 2.0 Full-Speed device/host with on-chip PHY, CAN-FD, SERCOM, I2S, and advanced 32-bit timers. The device operates from 1.71V to 3.63V, making it compatible with both 1.8V and 3.3V rails, and supports the industrial temperature range of -40C to +85C. The VQFN-64 footprint includes an exposed thermal pad.
The ATSAME51J19A-MU integrates an 8-channel Event System, a Peripheral Touch Controller (PTC), and a high-speed 80 MHz SERCOM for flexible serial communication. It is supported by the Atmel Studio / MPLAB X IDE ecosystem and the Harmony 3 software framework, with TrustZone-M support in the same family.
Typical applications include industrial control boards, USB-CAN sensor hubs, smart home gateways, building automation, HMI panels, and portable instrumentation. Its 1 MSPS ADC and on-chip DAC simplify mixed-signal designs without external converters.
When designing with this part, place decoupling capacitors as close to each VDD pin as possible, and stitch the VQFN exposed pad to a solid ground copper pour for thermal dissipation. Verify errata sheets for the device revision in production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAME51J19A-MU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAME51J19A-MU (same form factor and footprint) — differing in USB, ADC, Package, DAC, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME51J19A-MU-EFP
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →ATSAME51G19A-MU
✅ Drop-In✓ In Stock
$5.65 / Unit
View Datasheet →ATSAME51J18A-MU
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMD51J19A-MU
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →ATSAMD51J19A-MU-EFP
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →ATSAME51J19A-MF
✅ Drop-In✓ In Stock
$4.05 / Unit
View Datasheet →ATSAME51J19A-MU Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with FPU |
| Core Architecture | 32-bit RISC |
| Maximum Clock Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB |
| SRAM | 192 KB |
| Package | 64-VQFN (9x9 mm) with exposed pad |
| Operating Voltage Range | 1.71 V to 3.63 V |
| Operating Temperature Range | -40 C to +85 C (industrial) |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 12-bit |
| USB | USB 2.0 Full-Speed device/host with on-chip PHY |
| CAN | CAN-FD |
| SERCOM Channels | 8 (configurable UART/SPI/I2C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Series | SAM E51 |
ATSAME51J19A-MU 64-vqfn (9x9 mm) with exposed pad Pin Configuration Guide
Pin configuration for ATSAME51J19A-MU (64-vqfn (9x9 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAME51J19A-MU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAME51J19A-MU is suitable for 7 applications: Industrial Control Boards, USB-CAN Sensor Hubs, Smart Home Gateways, Building Automation HMI Panels, Portable Medical Instrumentation, Audio Processing and DAC Front-End, Robotics and Drone Motor Controllers.
Industrial Control Boards
The ATSAME51J19A-MU fits industrial control boards because its 120 MHz Cortex-M4F core with FPU executes PID control loops and floating-point sensor fusion in microseconds, while 512 KB Flash and 192 KB SRAM accept full Modbus and CANopen stacks alongside application logic. Its 12-bit 1 MSPS ADC captures multiple current and voltage channels for motor or power-converter feedback, and CAN-FD provides a deterministic fieldbus link to drives and remote I/O. Industrial -40C to +85C support matches factory-floor deployments, and the VQFN-64 footprint exposes a thermal pad for continuous-duty CPU loads. Result: a single-chip solution for PLC slice cards, servo amplifiers, and process controllers.
Recommended
USB-CAN Sensor Hubs
USB-CAN sensor hubs leverage the ATSAME51J19A-MU's integrated USB 2.0 Full-Speed device/host controller with on-chip PHY and CAN-FD peripheral to bridge a USB host (PC, HMI) to a CAN sensor network without external interface ICs. The 120 MHz M4F core can run protocol translation in real time, while 192 KB SRAM buffers bulk USB-CDC traffic and CAN-FD frames without loss. Eight configurable SERCOM channels let the hub talk to I2C sensors and SPI ADCs simultaneously, and the 12-bit 1 MSPS ADC captures analog inputs such as temperature or vibration. The 64-VQFN package keeps the hub compact enough for DIN-rail mounting.
Recommended
Smart Home Gateways
The ATSAME51J19A-MU is well suited to smart home gateways because it consolidates Wi-Fi/BLE co-processor control, multi-protocol sensor aggregation, and local automation logic in one MCU. The Cortex-M4F core runs Zigbee or Matter stack fragments locally for low-latency responses, while 512 KB Flash holds full BLE Mesh libraries plus OTA image slots. Eight SERCOM channels let the gateway interface SPI flash, I2C sensors, UART radios, and PWM lighting strips concurrently, and the 12-bit DAC provides audio prompts for voice assistants. Low 1.71 V minimum supply supports battery-backed designs with coin-cell RTC retention.
Recommended
Building Automation HMI Panels
Building automation HMI panels use the ATSAME51J19A-MU to drive TFT displays, read capacitive touch via the integrated Peripheral Touch Controller, and coordinate BACnet or KNX fieldbus traffic. The Cortex-M4F core renders HMI graphics with Microchip's MPLAB Harmony Graphics Suite while leaving CPU headroom for protocol handling, and the 12-bit DAC delivers audio alerts. 192 KB SRAM prevents frame buffer thrashing on moderate-resolution displays, and 512 KB Flash stores localized strings plus multiple languages. The industrial temperature range and wide 1.71 V to 3.63 V supply ease HVAC power-rail tolerance design.
Recommended
Portable Medical Instrumentation
The ATSAME51J19A-MU is appropriate for portable medical instrumentation such as handheld pulse oximeters, glucose meters, and ECG front-ends, where the Cortex-M4F DSP instructions accelerate FFT-based heart-rate variability and filter computations. The 12-bit 1 MSPS ADC captures photoplethysmography and ECG signals with simultaneous sampling, and the 12-bit DAC generates low-jitter stimulus waveforms. 192 KB SRAM holds rolling waveform buffers without external memory, while 512 KB Flash stores firmware with secure OTA capability. Low active power and 1.71 V minimum supply extend battery life on 2xAA or Li-ion designs.
Recommended
Audio Processing and DAC Front-End
Audio applications such as networked speakers and USB headsets use the ATSAME51J19A-MU's I2S peripheral to interface external 24-bit codecs while the Cortex-M4F DSP executes biquad filters, mixing, and dynamic-range compression in real time. The 12-bit on-chip DAC delivers beep tones and voice prompts without external parts, while 8 SERCOM channels stream control data to amplifiers and front-panel buttons. USB Full-Speed with on-chip PHY accepts direct UAC1 audio streams from PCs and mobile devices. 192 KB SRAM comfortably holds audio buffers plus RTOS context, and the wide operating voltage simplifies battery management for portable speakers.
Recommended
Robotics and Drone Motor Controllers
Robotics and small-drone motor controllers exploit the ATSAME51J19A-MU's Cortex-M4F vector instructions to run field-oriented control (FOC) on multiple BLDC motors in parallel, while 192 KB SRAM absorbs the high-speed timer update loops. The 12-bit 1 MSPS ADC samples three-phase current simultaneously with the integrated op-amp front-end, and SERCOM channels drive external gate-driver boards via SPI. CAN-FD supports daisy-chained joint modules in robot arms, while USB Full-Speed offers a debugging console. The 64-VQFN exposed pad dissipates the heat from high CPU utilization during aggressive motor transients.
Recommended
Recommended Products Summary
Engineering reference data for ATSAME51J19A-MU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME51J19A-MU-EFP | ATSAME51G19A-MU | ATSAME51J18A-MU | ATSAMD51J19A-MU | ATSAMD51J19A-MU-EFP | ATSAME51J19A-MF |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB | 192 KB |
| USB | USB 2.0 FS device/host | USB 2.0 FS device/host | USB 2.0 FS device/host | USB 2.0 FS device/host | USB 2.0 FS device/host | USB 2.0 FS device/host | USB 2.0 FS device/host |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Extended Flash Performance silicon revision available in same footprint (vs ATSAME51J19A-MU-EFP)
- Higher Flash density than J18A sibling while sharing footprint (vs ATSAME51J18A-MU)
- Latest SAM E51 silicon with refreshed peripheral set (vs ATSAMD51J19A-MU)
Design Notes
Place 100 nF X7R decoupling capacitors as close as possible to every VDD and VDDIO pin, and add a bulk 4.7 uF to 10 uF ceramic near the package. The VQFN-64 exposed pad must be soldered to a continuous ground copper pour with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch) to keep junction temperature within safe limits under sustained 120 MHz operation. Star-trace the analog VDDCORE supply if the design uses the internal LDO; otherwise add a 1 uH ferrite and 4.7 uF cap on the buck output.
Route the SWD signals (SWDIO, SWCLK) as short as possible and away from switching nodes like the USB DP/DM pair or the CAN-FD TX/RX lines. Use a 4-layer stack with a continuous ground plane beneath the MCU; avoid routing traces under the package. Keep the 32.768 kHz crystal traces short and symmetric, and place the load capacitors within 2 mm of the XIN/XOUT pins to avoid duty-cycle distortion.
Estimated: do not enable brown-out detection below 1.8 V if the system uses USB, because the USB PHY requires a stable 3.3 V rail and may latch up under voltage dips. Always program the GCLK generator prescaler correctly before switching the CPU to PLL source, otherwise the MCU can hang on the first PLL lock. Verify the device errata document for the specific silicon revision before locking production firmware.
Compliance Information
RoHS and REACH compliant per Microchip product page; industrial temperature grade only - AEC-Q100 automotive qualified variants require the automotive suffix family. Lead-free and halogen-free packaging confirmed by Microchip environmental data.
