CMD199 - 26-35 GHz GaAs Driver Amplifier Die | Qorvo
MPN: CMD199 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $280 | $2,800.00 |
| 100 | $265 | $26,500.00 |
| 500 | $248 | $124,000.00 |
| 1,000 | $235 | $235,000.00 |
CMD199 Overview
A driver amplifier MMIC is a radio-frequency integrated circuit that provides gain and power boosting between a signal source, such as a synthesizer or upconverter, and a final power amplifier stage. Within the RF signal-chain hierarchy, the driver amplifier sits between low-level gain blocks and the high-power PA, and is a key subcategory of RF/microwave amplifiers within power management of the transmit path.
Key features include 50 ohm internally matched input and output, which eliminates the need for external DC blocks and RF port matching networks, full passivation for increased reliability and moisture protection, and a balanced topology that improves output match and linearity across the band.
Technically, the balanced amplifier architecture uses two 90-degree hybrid-coupled gain stages, which yields good input/output return loss and graceful degradation. GaAs pHEMT process technology supports the high-frequency gain and high linearity needed at Ka and Q band frequencies, where small size and high dynamic range are critical design requirements.
Typical applications include military and defense radar and communications systems, space payloads, satellite communications (SATCOM) uplinks, point-to-point microwave backhaul, and test equipment operating in K, Ka, and Q bands, where the die format enables compact module integration.
A key design consideration is die-level assembly: the CMD199 requires chip-and-wire bonding or equivalent hybrid assembly with controlled bond-wire inductance, proper RF grounding via via-holes, and thermal design for the dissipating FETs; supplied DC blocking and bias decoupling must follow the manufacturer datasheet recommendations.
This page synthesizes distributor availability, pricing context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for CMD199 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
CMD192
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
CMD198
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
CMD209
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
CMD199 Maximum Ratings & Electrical Characteristics
| Frequency Range | 26 GHz to 35 GHz |
| Gain | 15 dB at 30 GHz |
| Output P1dB | +19.5 dBm at 30 GHz |
| Noise Figure | 3.5 dB at 30 GHz |
| Technology | GaAs pHEMT MMIC |
| Topology | Balanced driver amplifier |
| Impedance | 50 ohm matched (no external matching required) |
| RF Ports | Internally DC-blocked / 50 ohm matched design |
| Package Type | Unpackaged die (chip for hybrid assembly) |
| Passivation | Full passivation for reliability and moisture protection |
| Application Bands | K, Ka, Q band |
| Primary Use | Driver amplifier for military, space, and communications systems |
CMD199 unpackaged die (chip for hybrid assembly) Pin Configuration Guide
Pin configuration for CMD199 (unpackaged die (chip for hybrid assembly) package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for CMD199.
Refer to the datasheet for full pin configuration.
Typical Applications
CMD199 is suitable for 6 applications: Ka-Band SATCOM Uplink Driver, Military Radar Transmit Driver, Point-to-Point Microwave Backhaul, Test and Measurement Signal Chains, Space Payload Communications Equipment, Electronic Warfare and Jamming Systems.
Ka-Band SATCOM Uplink Driver
The CMD199's 26-35 GHz coverage directly spans Ka-band uplink allocations used by military and commercial satellite terminals, and its +19.5 dBm P1dB at 30 GHz provides the linear drive power required by downstream GaN solid-state power amplifier stages. In a typical upconverter chain, the MMIC is placed after the transmit gain block with 50 ohm microstrip interconnect on a low-loss substrate; because it is internally matched, no external tuners are needed, which keeps module size small and band-flat. The 3.5 dB noise figure preserves link margin on shared transceiver apertures, while the balanced topology improves return loss toward the duplex filter, protecting linearity under modulated QAM waveforms. Designers should budget bond-wire inductance and verify bias decoupling per the Qorvo datasheet for stable, spurious-free operation across temperature.
Recommended
Military Radar Transmit Driver
Phased-array radar transceiver modules operating in K, Ka, and Q bands require compact, linear driver amplifiers between the waveform generator and the high-power stage. The CMD199 fits this role with 15 dB of gain and +19.5 dBm P1dB at 30 GHz in a bare-die format that can be eutectically attached directly inside the tile or brick module, saving the area a packaged part would consume. Its full passivation supports the reliability and moisture protection demanded in defense environments, and the 50 ohm matched ports let designers interconnect it with other 50 ohm MMIC die withoutcustom matching networks, shortening array development cycles. Because the balanced architecture tolerates single-stage variation gracefully, gain consistency across thousands of T/R channels is easier to hold. Thermal design of the die attach and RF grounding via substrate via-holes are the main layout considerations, per the Qorvo application guidance.
Recommended
Point-to-Point Microwave Backhaul
Millimeter-wave point-to-point backhaul radios in the Ka and Q bands use driver amplifiers to bring the modulated IF-upconverted signal to the level required by the transmitter PA. The CMD199's flat 15 dB gain over 26-35 GHz supports wide-channel-count E-band-adjacent links, and its +19.5 dBm P1dB at 30 GHz allows operation with backoff for high-order QAM (e.g., 1024QAM) where linearity sets error-vector magnitude. Because the die is 50 ohm matched and DC-blocked, integration into the radio's hybrid multichip module requires only bias routing and bond-wire interconnect, reducing tune-and-test iterations. The 3.5 dB noise figure also benefits transceiver architectures where the same module hosts low-noise receive circuitry nearby. Designers should verify supply sequencing and decoupling to avoid bias-line oscillation, following the Qorvo datasheet bias recommendations.
Recommended
Test and Measurement Signal Chains
Instrument-grade signal sources, upconverters, and port extension modules working at 26-35 GHz need broadband, well-matched gain blocks with predictable compression behavior. The CMD199 provides 15 dB gain, +19.5 dBm P1dB, and 3.5 dB noise figure at 30 GHz in a balanced topology whose improved input and output return loss reduces measurement ripple when cascaded with couplers, filters, and switches. The internal 50 ohm match removes the need for external DC blocks at the RF ports, simplifying fixture design in swing-arm or wafer-level test setups. Because the part is a die, instrument OEMs integrate it on alumina or soft substrates within chip-and-wire assemblies, achieving better repeatability than connectorized module cascades. Thermal characterization of the die attach and calibration of bond-wire transitions are the key steps before production calibration routines are defined.
Recommended
Space Payload Communications Equipment
Spaceborne transmitters and payloads operating in Ka and Q bands value the CMD199's combination of small die size, full passivation for moisture protection, and linear +19.5 dBm P1dB drive capability at 30 GHz. In a payload upconverter chain, the MMIC is bonded onto a ceramic hybrid with screen-printed microstrip lines, and its balanced topology helps maintain stable gain across the thermal vacuum environment where substrate constants and bond-wire behavior shift with temperature. Qorvo's passivation increases reliability against humidity during ground handling and integration. Space programs typically require screening, lot acceptance, and radiation assessment beyond the standard datasheet flow, so the CMD199 die should be procured with the manufacturer's hi-rel options where offered. Engineers should confirm bias conditions and derate the channel temperature per Qorvo's reliability guidelines for the mission profile.
Recommended
Electronic Warfare and Jamming Systems
Broadband EW receivers and responsive jamming transmitters in the 26-35 GHz window demand driver amplifiers that combine gain flatness, linearity under wideband modulated or swept threats, and compact die-level integration into transmit modules. The CMD199's balanced 15 dB gain block with +19.5 dBm P1dB gives system engineers a robust intermediate power stage between the synthesis source and a GaN final amplifier, maintaining linearity when driving with multi-carrier or fast-hopping waveforms thanks to backoff headroom. The 50 ohm matched, DC-blocked ports allow quick cascade design with switched filter banks, while full passivation aids handling reliability in fielded equipment manufacturing. Because EW platforms operate across wide temperature extremes, designers must validate gain and current drift across the qualified temperature range using the Qorvo datasheet curves and apply appropriate bias regulation for consistent output power.
Recommended
Recommended Products Summary
Engineering reference data for CMD199 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CMD192 | CMD198 | CMD209 |
|---|---|---|---|---|
| Package | Unpackaged die | Unpackaged die - same format | Unpackaged die - same format | Unpackaged die - same format |
| Brand | Qorvo | Qorvo | Qorvo | Qorvo |
| Technology | GaAs pHEMT MMIC | GaAs pHEMT MMIC | GaAs pHEMT MMIC | GaAs pHEMT MMIC |
| 50 Ohm Matched / DC-Blocked Ports | Yes | Yes | Yes | Yes |
| Typical Application | K/Ka/Q band driver for military, space, communications | Wideband Ka driver | Lower-band driver | Family band driver |
Key Differentiators
- Exact 26-35 GHz band alignment for Ka/Q systems (vs CMD192)
- Fully 50 ohm matched, DC-blocked ports (vs CMD198)
- Balanced topology with high linearity (vs CMD209)
Design Notes
Because the CMD199 is an unpackaged die, the hybrid substrate layout is the 'PCB'. Use chip-and-wire assembly on alumina or a low-loss soft substrate with via-hole grounding directly at the die ground pads. Keep bond wires to the RF pads short (target under 0.3 mm single wires or use ribbon) to limit series inductance at 35 GHz; every 0.1 mm of excess wire adds measurable mismatch. Follow the die orientation and pad map in the Qorvo datasheet and verify with the manufacturer's reference hybrid layout before production tooling.
Apply gate and drain bias per the Qorvo CMD199 datasheet recommended operating conditions and include RF-shunted decoupling capacitors (e.g., 100 pF in parallel with 1000 pF) placed close to the bias pads on the hybrid substrate. Sequence the negative gate voltage before drain voltage to protect the pHEMT FETs from uncontrolled drain current at turn-on. Add small series resistors in the gate bias line if bias-line oscillation is observed at low frequencies during bring-up.
Estimated: the CMD199 delivers +19.5 dBm (~89 mW) of RF output; with roughly 15 dB gain and typical MMIC drain efficiencies for this class, DC dissipation is on the order of a few hundred milliwatts, concentrated in the FET fingers. Use a eutectic or high-conductivity epoxy die attach into a thermally conductive carrier (e.g., CuMo or AlN) and verify channel temperature against Qorvo's reliability derating guidelines for the mission life and environment. Confirm exact DC power from the datasheet bias tables.
Do not treat the CMD199 like a packaged part: there is no standard pin-numbered pinout, and substitution by another MMIC die is never footprint-compatible because bond-pad maps differ. Do not omit DC blocking in test fixtures if the port bias conditions require it - while the die is a 50 ohm matched design that eliminates external DC blocks per the datasheet, always confirm the internal blocking against the datasheet bias diagram before connecting to DC-coupled equipment.
Compliance Information
Compliance status not stated in the verified web data for this die product; request compliance documentation from Qorvo or the distributor.
