DSPIC33CH64MP505T-I/M4 - 16-bit Dual-Core DSC 180MHz | Microchip
MPN: DSPIC33CH64MP505T-I/M4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.5 | $5.50 |
| 10 | $5.12 | $51.20 |
| 100 | $4.65 | $465.00 |
| 500 | $4.3 | $2,150.00 |
| 1,000 | $3.95 | $3,950.00 |
DSPIC33CH64MP505T-I/M4 Overview
A digital signal controller combines the deterministic control of a microcontroller with the DSP math acceleration of a digital signal processor. The dsPIC33CH family extends this concept with two independent dsPIC DSC cores on a single die: one core is designed to function as the main (master) core running general-purpose control and communication tasks, while the secondary core is dedicated to time-critical code such as power-conversion loops. This master/slave architecture lets system developers partition high-end embedded control applications and independently re-program the secondary core.
Key features include 16-bit dual-core dsPIC architecture with DSP engine, core-independent peripherals, CAN 2.0B for industrial networking, multiple PWM and ADC resources for digital power, and operation from a 3V to 3.6V supply. The I-grade temperature range of -40C to +125C suits industrial environments, and the compact 6x6 mm UQFN keeps PCB footprint small. The device is part of the dsPIC33CH Functional Safety (FuSa) portfolio per DigiKey classification.
Typical applications include digital power supplies and PFC stages, brushless DC and PMSM motor field-oriented control (FOC), automotive and industrial CAN nodes, wireless charging, and UPS/inverter systems. Dual-core partitioning allows one core to run safety supervision while the other executes fast control loops.
Design consideration: the two cores share a communication interface with dedicated mailboxes; partition code so the secondary core handles the highest-rate tasks to minimize inter-core latency. Verify supply decoupling on all VDD pins of the 48-pin UQFN.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical dual-core design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CH64MP505T-I/M4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH64MP505T-I/M4 (same form factor and footprint) — differing in Core Architecture, Package, ADC, CAN, DMA Channels.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH64MP505-I/M4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH64MP505T-E/M4
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH128MP505-E/M4
✅ Drop-In✓ In Stock
$4.5 / Unit
View Datasheet →DSPIC33CH512MP505T-I/M4
✅ Drop-In✓ In Stock
$5.71 / Unit
View Datasheet →DSPIC33CH128MP505T-I/M4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH64MP505T-I/M4 Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dual-core dsPIC DSC |
| Core Speed | 180 MHz / 200 MHz (per DigiKey listing) |
| Clock Frequency | 100 MHz (Mouser listing, MIPS-class) |
| Program Memory | 64 KB Flash |
| Total FLASH + PRAM | 88 KB (88K x 8) per DigiKey |
| RAM | 16 KB + 4 KB |
| Supply Voltage | 3 V to 3.6 V |
| Connectivity | CAN |
| Package | 48-UQFN (6x6 mm) |
| Pin Count | 48 |
| Operating Temperature | -40C to +125C (I grade) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Series | dsPIC 33CH, Functional Safety (FuSa) |
| Technology | CMOS |
| RoHS Status | Compliant |
DSPIC33CH64MP505T-I/M4 48-uqfn (6x6 mm) Pin Configuration Guide
Pin configuration for DSPIC33CH64MP505T-I/M4 (48-uqfn (6x6 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CH64MP505T-I/M4.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CH64MP505T-I/M4 is suitable for 6 applications: Digital Power Supplies and PFC, Brushless Motor Control (FOC), Industrial CAN Networking Nodes, Wireless Charging Transmitters, UPS and Inverter Systems, Embedded Control with Core Partitioning.
Digital Power Supplies and PFC
The DSPIC33CH64MP505T-I/M4 fits digital power and PFC designs because its secondary dsPIC core can run the fast voltage and current compensation loops up to 200 MHz while the main core manages housekeeping, telemetry, and communication. Integrated high-resolution PWM resources provide the phase-shifted or interleaved drive signals needed by LLC, buck, boost, and totem-pole topologies, and fast ADC sampling captures current and voltage feedback with low latency. Unlike analog control, firmware-based control adapts easily across product variants. Place the controller close to the power stage, use short gate-drive traces, and sample synchronously with PWM to reduce switching-noise error in the feedback path.
Recommended
Brushless Motor Control (FOC)
Field-oriented control of BLDC and PMSM motors benefits directly from the dual-core architecture of the DSPIC33CH64MP505T-I/M4: the secondary core executes the fast current-loop FOC math at up to 200 MHz, while the main core handles the speed loop, CAN or UART communication, and fault supervision. High-resolution PWM outputs drive three-phase inverters with fine duty resolution, reducing current ripple and acoustic noise, and the 3V-3.6V logic interfaces cleanly with gate-driver ICs. The -40C to +125C I-grade rating covers industrial drive environments. Route ADC sense lines differentially from shunt amplifiers and synchronize sampling to PWM center to avoid switching transients corrupting current readings.
Recommended
Industrial CAN Networking Nodes
With an integrated CAN peripheral, the DSPIC33CH64MP505T-I/M4 serves as an intelligent industrial CAN 2.0B node for automation, HVAC, and factory sensing systems. The main core runs protocol stacks and application logic while the secondary core executes deterministic local control, and the 16 KB plus 4 KB RAM buffers message queues without external memory. The -40C to +125C temperature rating and 3V-3.6V operation suit industrial cabinets, and the 6x6 mm UQFN conserves board area in dense I/O modules. Designers should add a proper CAN transceiver and common-mode choke at the transceiver, terminate the bus at both ends with 120 ohm resistors, and verify worst-case bus load timing in firmware.
Recommended
Wireless Charging Transmitters
Wireless power transmitters demand precise, high-frequency PWM control of the resonant inverter plus fast closed-loop power regulation, a task matched to the dsPIC33CH64MP505T-I/M4 dual-core design. The secondary core regulates coil current and foreign-object detection algorithms at high rate, while the main core communicates with the receiver over the power protocol and manages status LEDs and protection logic. High-resolution PWM adjusts operating frequency around resonance efficiently, and fast ADC inputs monitor coil voltage, current, and temperature. Firmware-based control simplifies compliance with evolving wireless power standards. Keep the control ground reference star-connected to the power stage, and sample feedback synchronously with the inverter switching to minimize ripple-induced measurement error.
Recommended
UPS and Inverter Systems
Uninterruptible power supplies and DC-AC inverters require simultaneous, coordinated control of multiple conversion stages, which the dual-core DSPIC33CH64MP505T-I/M4 partitions naturally: the secondary core runs the fast sinusoidal current-control loop for the inverter bridge while the main core manages battery charging, transfer-switch logic, CAN/RS-485 monitoring, and fault handling. High-resolution PWM produces low-distortion sinusoidal drive with fine phase control, and abundant ADC channels track bus voltage, output voltage, current, and temperature simultaneously. The I-grade temperature range and 3.3V logic simplify integration into industrial power cabinets. Implement layered protections in hardware limits plus firmware, and verify dead-time margins against the gate-driver propagation delays.
Recommended
Embedded Control with Core Partitioning
General high-end embedded control applications, as described by Microchip, benefit from the dsPIC33CH master/secondary architecture: one core functions as the main core running real-time operating system tasks and communication, while the secondary core can be independently re-programmed to isolate proprietary or safety-related algorithms. The DSPIC33CH64MP505T-I/M4 offers 64 KB flash with 16 KB plus 4 KB RAM and 48 pins of mixed-signal I/O in 6x6 mm, ideal for space-constrained controllers, sensor fusion nodes, and instrumentation front ends. Its Functional Safety (FuSa) family membership supports regulated-product development. Partition code by rate and criticality between cores, use the inter-core mailboxes for command exchange, and keep ISR loads on the core owning the corresponding peripheral to avoid cross-core latency.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH64MP505T-I/M4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH64MP505-I/M4 | DSPIC33CH64MP505T-E/M4 | DSPIC33CH128MP505-E/M4 | DSPIC33CH512MP505T-I/M4 |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6) | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 64 KB | 64 KB | 64 KB | 128 KB | 512 KB |
| Core Speed | 180 MHz / 200 MHz | 180 MHz / 200 MHz | 180 MHz / 200 MHz | 180 MHz / 200 MHz | 180 MHz / 200 MHz |
| Operating Temperature | -40C to +125C (I grade) | -40C to +125C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (I grade) |
| CAN | Yes | Yes | Yes | Yes | Yes |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel |
Key Differentiators
- Baseline cost-optimized memory point of the MP505 line (vs DSPIC33CH512MP505T-I/M4)
- I-grade temperature qualification at standard price point (vs DSPIC33CH64MP505T-E/M4)
- Identical footprint enables free memory upgrades (vs DSPIC33CH128MP505-E/M4)
Design Notes
Supply the DSPIC33CH64MP505T-I/M4 from a regulated 3.3V rail within the 3V-3.6V operating window per LCSC specification data. Decouple every VDD pin of the 48-pin UQFN with 100 nF X7R ceramic capacitors placed within 2 mm of the pin, plus 4.7-10 uF of bulk capacitance shared per power domain. Because both cores run at high frequency, core switching current can induce supply bounce; a solid ground return via the UQFN center pad (soldered to a grounded copper pour with multiple vias) is essential for low-inductance power delivery.
Dual-core partitioning is the most common source of integration trouble: the main (master) core loads and starts the secondary core, and each core has its own memory map and reset behavior. Assign the highest-rate task (e.g., FOC current loop or power-stage control) to the secondary core and reserve mailbox traffic for low-rate commands. Also configure Peripheral Pin Select (PPS) deliberately - many PWM, UART, and CAN functions share candidate pins, so lock pin assignments early and freeze them in hardware configuration bits before PCB release.
For motor-control and digital-power use, keep the fast ADC inputs away from PWM output traces on the 6x6 mm UQFN breakout; a 48-pin, 0.5 mm-pitch footprint permits 4 mil clearance routing with 2-layer boards but a 4-layer stack (signal - ground - power - signal) is recommended. Place shunt-sense filtering (approximately 100 ohm plus 1 nF per input) directly at the pin, synchronize ADC sampling to PWM period boundaries in firmware, and route the CAN differential pair with 120 ohm controlled impedance to the transceiver.
Compliance Information
RoHS compliant per current Microchip production status on DigiKey/Mouser listings. Obtain formal REACH and conflict-minerals declarations from Microchip product compliance documentation.
