DSPIC33CK256MP502-E/SS - 100MHz 16-bit DSC 256KB | Microchip
MPN: DSPIC33CK256MP502-E/SS ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.7 | $370.00 |
| 500 | $3.33 | $1,665.00 |
| 1,000 | $2.96 | $2,960.00 |
DSPIC33CK256MP502-E/SS Overview
A digital signal controller combines the computational throughput of a digital signal processor with the deterministic control and peripheral integration of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits between general-purpose MCUs and dedicated digital power ASICs, offering a modified Harvard architecture with DSP engine, making it a popular choice for closed-loop power conversion and motor control where both fast math and flexible I/O are needed.
Key features include operation from 3.0V to 3.6V at up to 100 MIPS (DC to 100 MHz), 256 KB of program flash with error correction code and dual-partition live update for field firmware upgrades, and a high-resolution PWM module purpose-built for switching power supplies. The integrated CAN FD controller, on-chip op-amps and 12-bit ADCs reduce external component count in digitally controlled converters.
Technical depth comes from the modified Harvard architecture with a 24-bit instruction word, single-cycle MAC and barrel shifter, plus four DMA channels that offload data movement from the CPU. The peripheral trigger generator (PTG) provides up to 15 trigger sources, and nine MCCP/SCCP modules offer 16/32-bit timer, capture, compare and PWM functions with fully asynchronous operation.
Typical applications include digital power supplies (AC-DC, DC-DC), PFC stages, brushless and PMSM motor control, and advanced sensing systems where the 150C extended-temperature rating supports automotive under-hood and industrial environments.
Design consideration: the E/SS extended temperature grade runs to +150C ambient, but designers must derate flash endurance and verify timing at full clock speed in high-temperature designs; the dual-partition flash enables live update to mitigate field reprogramming risk.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK256MP502-E/SS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK256MP502-E/SS (same form factor and footprint) — differing in Data SRAM, CAN Interface, Package, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK256MP502-I/SS
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →DSPIC33CK256MP502-H/SS
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK256MP202-I/SS
✅ Drop-In✓ In Stock
$3.15 / Unit
View Datasheet →DSPIC33CK256MP502-E/SS Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC |
| Maximum Clock Frequency | 100 MHz |
| Performance | DC to 100 MIPS |
| Program Memory Size | 256 KB (dual-partition flash with ECC and Live Update) |
| Data SRAM | 24 KB with MBIST |
| Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +150C (extended grade) |
| CAN Interface | CAN FD |
| ADC | 12-bit ADCs |
| Analog | Integrated op-amps |
| PWM | High-Resolution PWM |
| Timers | Nine MCCP/SCCP modules (Timer, Capture/Compare, PWM) |
| Package | 28-SSOP |
| Mounting Type | Surface Mount |
| Architecture | Modified Harvard with DSP engine, 24-bit instruction word |
| DMA Channels | 4 |
| RoHS Status | Compliant |
DSPIC33CK256MP502-E/SS 28-ssop Pin Configuration Guide
Pin configuration for DSPIC33CK256MP502-E/SS (28-ssop package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP502-E/SS.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP502-E/SS is suitable for 6 applications: Digital Power Supplies (AC-DC / DC-DC), Brushless Motor Control (BLDC/PMSM FOC), Automotive and Industrial Sensing Nodes, Power Factor Correction (PFC) Stages, Industrial Automation and Control Nodes, High-Temperature Embedded Control.
Digital Power Supplies (AC-DC / DC-DC)
The DSPIC33CK256MP502-E/SS fits digital power conversion because its 100 MHz (100 MIPS) core closes voltage and current loops fast enough for switching converters, while the high-resolution PWM delivers fine duty-cycle resolution for precise regulation. The 12-bit ADCs sample output voltage and inductor current, and the on-chip op-amps condition shunt or current-transformer signals without external amplifiers, cutting BOM cost. Placed as the sole controller of a PFC or LLC stage, the DSC replaces fixed-function analog controllers and adds programmable compensation, soft-start profiles and CAN FD telemetry for supervisory communication. The dual-partition flash with Live Update lets field firmware improve control law coefficients without downtime. Trade-off: at large PWM resolution settings, verify loop latency budget at 100 MIPS against the target switching frequency.
Recommended
Brushless Motor Control (BLDC/PMSM FOC)
For field-oriented control of PMSM and BLDC motors, the DSPIC33CK256MP502-E/SS provides complementary high-resolution PWM outputs with hardware dead-time, 12-bit ADC sampling of phase currents synchronized to PWM, and a DSP engine executing single-cycle MAC instructions for Park/Clarke transforms. At 100 MIPS, the device sustains inner current-loop bandwidths needed for servo and industrial drives. The on-chip op-amps can amplify low-level current-shunt signals directly, and the PTG triggers ADC conversions without CPU intervention, reducing jitter. The CAN FD interface links the drive to a higher-level automation bus. The extended -40C to +150C rating of the E grade suits motor-adjacent mounting in thermally harsh enclosures, though designers should derate for junction temperature near the drive's power stage.
Recommended
Automotive and Industrial Sensing Nodes
The E/SS grade operates from -40C to +150C, making the DSPIC33CK256MP502-E/SS appropriate for under-hood, on-engine and high-temperature industrial sensing nodes where standard +85C MCUs cannot survive. The 12-bit ADCs digitize analog sensor channels, the on-chip op-amps buffer bridge or ratiometric sensors, and the DSP engine applies digital filtering at line rate. MBIST on the 24 KB SRAM and ECC on the 256 KB flash support functional-safety (FuSa) development flows noted by distributors for this family. CAN FD connectivity integrates the node into modern vehicle or industrial networks at data rates beyond classic CAN. Firmware images can be updated in the field using dual-partition Live Update without dropping off the bus, important for remotely deployed sensing equipment.
Recommended
Power Factor Correction (PFC) Stages
In switch-mode PFC front ends, the DSPIC33CK256MP502-E/SS executes average-current-mode control with its 100 MHz core while the high-resolution PWM adjusts duty cycle with fine granularity across the AC line cycle. The 12-bit ADC samples input voltage, inductor current and bus voltage; the on-chip op-amps condition current-shunt feedback. Fast ADC-to-PWM latency, supported by four DMA channels and peripheral trigger generation, keeps the inner current loop stable at switching frequencies typical of totem-pole and boost PFC designs. The extended temperature grade suits power supplies mounted in hot enclosures, and CAN FD or UART telemetry reports bus health to a system supervisor. Live Update firmware capability allows tuning of compensation coefficients after deployment as load profiles change.
Recommended
Industrial Automation and Control Nodes
As a general industrial controller, the DSPIC33CK256MP502-E/SS combines a deterministic 100 MIPS DSC core with rich connectivity: CAN FD for factory fieldbuses, multiple SCCP/MCCP timer modules for encoders and actuator timing, and the Peripheral Trigger Generator providing up to 15 hardware trigger sources for sequenced I/O. The 256 KB dual-partition flash accommodates substantial control logic with room for bootloaders, and ECC protects code integrity in electrically noisy factory environments. The DSP engine accelerates FFT-based condition monitoring or digital filtering of sensor streams. Operating on a single 3.0V to 3.6V rail simplifies integration into standard 3.3V control boards. The -40C to +150C range covers both cold warehouses and heat-adjacent cabinet locations.
Recommended
High-Temperature Embedded Control
When electronics must sit where ordinary industrial parts fail - near engines, inside solar inverters, next to heating elements - the DSPIC33CK256MP502-E/SS offers a -40C to +150C operating range in a compact 28-SSOP package. Its single 3.0V to 3.6V supply, 256 KB ECC-protected flash and MBIST-equipped SRAM support reliable long-term operation at temperature extremes, while flash Live Update permits remote firmware maintenance on hardware that is difficult to physically access. The high-resolution PWM and 12-bit ADCs let one device handle both local control (heating, pumping, actuation) and telemetry over CAN FD. Designers should verify maximum clock derating and flash endurance at 150C per the family datasheet and manage self-heating with adequate PCB copper.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP502-E/SS — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP502-I/SS | DSPIC33CK256MP502-H/SS | DSPIC33CK256MP202-I/SS |
|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max Clock Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) |
| Data SRAM | 24 KB | 24 KB | 24 KB | 24 KB |
| Operating Temperature | -40C to +150C | -40C to +85C | -40C to +125C | -40C to +85C |
| Peripheral Set (op-amps / HR-PWM) | Op-amps + high-resolution PWM (MP502 peripheral set) | Op-amps + high-resolution PWM (same) | Op-amps + high-resolution PWM (same) | Reduced peripheral set - verify before substitution |
Key Differentiators
- Extended -40C to +150C operating range (vs DSPIC33CK256MP502-I/SS)
- Dual-partition flash with ECC and Live Update (vs DSPIC33CK256MP202-I/SS)
- Integrated digital-power peripheral set (vs DSPIC33CK256MP502-H/SS)
Design Notes
The DSPIC33CK256MP502-E/SS requires a single 3.0V to 3.6V supply for VDD and AVDD. Decouple each VDD/AVDD pair with a 0.1 uF ceramic capacitor placed within 2 mm of the pin, plus a bulk 10 uF capacitor per device. When the DSC is mounted near a switching power stage (its typical use), provide a local ferrite bead and pi-filter on the analog AVDD rail so switching noise does not degrade the 12-bit ADC effective number of bits.
Estimated: the E grade is rated to +150C ambient, so thermal headroom is limited. If the core runs at 100 MHz with active peripherals, assume tens of milliwatts of core dissipation as a baseline and calculate junction temperature as Tj = Ta + Pd * theta_JA (theta_JA from the datasheet for 28-SSOP on a standard JEDEC board). In a +125C enclosure even small self-heating consumes margin - add PCB copper pour under the leads and verify max clock operation at temperature per Microchip's high-temperature guidance.
dsPIC33CK I/O is highly multiplexed through Peripheral Pin Select - do not assume a datasheet block diagram maps directly to the 28-SSOP pinout; verify each pin assignment in the family datasheet pin tables before routing the PCB. Also note the dual-partition flash requires the linker to place code in the active partition; misconfigured partition settings can leave the device unable to boot after a Live Update. Use Microchip's MPLAB Code Configurator to generate valid pin and configuration setups.
For digital power applications, keep the PWM output traces to gate drivers short and symmetric to minimize propagation skew between phases, and route the analog current-sense lines differentially away from PWM switching nodes. Place the PGD/PGC programming pins on a header for in-circuit reprogramming, and reserve access to MCLR for debug tools; losing ICSP access on a densely packed 28-pin board complicates field service.
Compliance Information
DigiKey lists this family under Functional Safety (FuSa) category; RoHS/lead-free per current Microchip production packaging. Formal REACH and conflict-minerals statements should be requested from Microchip compliance documentation.
