DSPIC33EP512GP806T-E/PT - 16-Bit DSC 512KB 60MIPS | Microchip
MPN: DSPIC33EP512GP806T-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.72 | $117.20 |
| 100 | $10.44 | $1,044.00 |
| 500 | $9.38 | $4,690.00 |
| 1,000 | $8.62 | $8,620.00 |
DSPIC33EP512GP806T-E/PT Overview
A Digital Signal Controller is a hybrid device that combines the real-time control peripherals and interrupt behavior of a microcontroller with the single-cycle multiply-accumulate (MAC) datapath of a digital signal processor. In the product taxonomy, a DSC sits between a general-purpose MCU and a dedicated DSP: it is a member of the microcontroller family, a subclass of embedded processors, and a component of the broader semiconductor IC category. The dsPIC33E family targets closed-loop control, digital filtering, and mixed-signal applications where deterministic latency matters more than raw throughput.
The DSPIC33EP512GP806T-E/PT integrates dual CAN (CANbus) controllers, I2C, IrDA, LINbus, SPI, and UART/USART interfaces, plus DMA, PWM, and a watchdog timer (WDT). Its analog subsystem includes multiple 10-bit/12-bit ADC modules with up to 24 analog channels on 64-pin devices, sample-and-hold circuits, and up to three analog comparator modules with programmable 32-point voltage references. The 70 MIPS-class core executes digital filter algorithms and high-speed precision control loops in a single cycle per MAC.
The 'T' suffix denotes tape-and-reel packaging, the 'E' suffix denotes the extended -40C to +125C temperature range, and the '/PT' suffix denotes the 64-pin TQFP (10x10) package. The automotive AEC-Q100 qualification makes this variant suitable for under-hood and body-control electronics, while the general-purpose 'GP' peripheral mix (dual CAN, rich ADC, no dedicated motor-control PWM) suits industrial gateways, sensor fusion nodes, and multi-axis control boards.
Typical applications include automotive body control modules, industrial CAN gateways, digital power conversion, motor control, and instrumentation. Designers should note the 3.3 V core/supply requirement, the need for proper VDD/VSS decoupling on every supply pin pair, and the ICSP programming constraint that PGECx and PGEDx must be used as a matched pair. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512GP806T-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP806T-E/PT (same form factor and footprint) — differing in Package, Operating Temperature, Packaging, Core Architecture, RAM.
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DSPIC33EP512GP806-I/PT
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View Datasheet →DSPIC33EP512GP806T-I/PT
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$6.72 / Unit
View Datasheet →DSPIC33EP512GP806T-E/MR
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DSPIC33EP512GP504T-E/PT
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View Datasheet →DSPIC33EP256MC504-I/PT
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$4.6 / Unit
View Datasheet →DSPIC33EP512GP806T-E/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC RISC |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 24 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature Range | -40C to +125C (extended) |
| Package / Case | 64-TQFP (10x10 mm) |
| Mounting Type | Surface Mount |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT |
| ADC Modules | Dual 10-bit/12-bit ADC with sample-and-hold |
| Analog Channels | 24 (64-pin devices) |
| Analog Comparators | Up to 3 modules with programmable 32-point references |
| Timers/Counters | 9 x 16-bit |
| CAN Controllers | Dual CAN |
| Automotive Qualification | AEC-Q100 |
| Packaging | Tape & Reel |
| RoHS Status | Compliant |
DSPIC33EP512GP806T-E/PT 64-tqfp (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512GP806T-E/PT (64-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP806T-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP806T-E/PT is suitable for 6 applications: Automotive Body Control Module, Industrial CAN Gateway, Digital Power Conversion, Motor Control and Drive, Precision Instrumentation, Sensor Fusion Node.
Automotive Body Control Module
The DSPIC33EP512GP806T-E/PT fits automotive body control modules because its AEC-Q100 qualification and -40C to +125C extended temperature range cover the harsh thermal environment of door, seat, and lighting controllers. Its dual CAN controllers allow simultaneous connection to a high-speed powertrain bus and a lower-speed body bus, while the 512 KB (170K x 24) Flash provides ample room for diagnostic stacks and bootloaders. The 60 MIPS dsPIC core executes control loops deterministically, and the dual 10/12-bit ADC with up to 24 analog channels digitizes switch matrices, current shunts, and temperature sensors without external multiplexing. Placed on a 64-TQFP land pattern, the device dissipates modest power at 3.3 V, but designers must still provide per-pin VDD/VSS decoupling and confirm that the 'E' grade is retained for any under-hood location.
Recommended
Industrial CAN Gateway
The DSPIC33EP512GP806T-E/PT is well suited to industrial CAN gateways because it integrates dual CAN controllers alongside I2C, SPI, UART/USART, and LINbus interfaces, letting a single 64-pin device bridge fieldbus segments without external transceivers on the logic side. The 60 MIPS core and 24 KB RAM are sufficient to buffer and route CAN frames between two networks, while DMA offloads serial transfers from the CPU. The 512 KB Flash accommodates protocol stacks, configuration tables, and firmware update images. Operating from a 3.0-3.6 V rail, the device interfaces to 3.3 V CAN transceivers directly. Designers should note that the dual CAN modules share the dsPIC33E DMA engine, so buffer allocation must be planned to avoid contention under heavy gateway load.
Recommended
Digital Power Conversion
The DSPIC33EP512GP806T-E/PT supports digital power conversion because its dsPIC33E core performs single-cycle multiply-accumulate operations, enabling real-time PID and filter loops for DC-DC and AC-DC stages. The integrated PWM module generates the gate-drive waveforms, and the dual 10/12-bit ADC with sample-and-hold captures inductor current and output voltage with independent trigger sources, which is essential for cycle-by-cycle control. The 60 MIPS throughput allows loop rates in the tens of kilohertz while leaving CPU headroom for communication and protection logic. The 512 KB Flash stores multiple control profiles and calibration tables. A key trade-off is that the 3.3 V supply and 64-TQFP package limit direct high-voltage interfacing, so external gate drivers and isolation are required.
Recommended
Motor Control and Drive
The DSPIC33EP512GP806T-E/PT can serve motor control and drive applications because the dsPIC33E core executes field-oriented control math in real time at 60 MIPS, and the integrated PWM module produces complementary outputs with dead-time insertion for three-phase inverters. The dual ADC modules sample phase currents and DC-bus voltage, while analog comparators with programmable 32-point references provide fast overcurrent trip without CPU intervention. The extended -40C to +125C rating and AEC-Q100 qualification make the part viable in automotive auxiliary drives such as pumps and fans. The 512 KB Flash holds motor parameter tables and field-weakening maps. Designers should verify that the GP806 peripheral mix provides enough PWM channels for their specific motor topology.
Recommended
Precision Instrumentation
The DSPIC33EP512GP806T-E/PT suits precision instrumentation because its dual 10/12-bit ADC modules with sample-and-hold and up to 24 analog channels allow multi-sensor acquisition without external multiplexers, and the 60 MIPS core can run digital filtering and linearization in real time. The 512 KB Flash stores calibration coefficients and measurement histories, while I2C, SPI, and UART/USART connect to host processors and displays. The extended temperature range supports field-deployed instruments in industrial environments. A practical consideration is that the on-chip ADC resolution is 10/12-bit; applications needing 16-bit or higher accuracy must use external converters and treat the DSC as a controller and filter engine rather than the primary measurement front end.
Recommended
Sensor Fusion Node
The DSPIC33EP512GP806T-E/PT works well as a sensor fusion node because it combines a 60 MIPS MAC-capable core with dual CAN, SPI, I2C, and UART interfaces, allowing it to aggregate data from inertial, pressure, and temperature sensors and publish fused results onto a vehicle or industrial network. The 24 KB RAM is adequate for ring buffers and Kalman-filter state vectors, and the 512 KB Flash holds fusion algorithms and configuration. The AEC-Q100 qualification and -40C to +125C rating support automotive and outdoor deployments. Designers should budget RAM carefully, since 24 KB is modest for multi-sensor fusion, and should use DMA to move sensor data without stalling the control loop.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP806T-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP806-I/PT | DSPIC33EP512GP806T-I/PT | DSPIC33EP512GP806T-E/MR | DSPIC33EP512GP504T-E/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10) | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-QFN - different | 64-TQFP (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB (170K x 24) | 512 KB (170K x 24) | 512 KB (170K x 24) | 512 KB (170K x 24) | 512 KB (170K x 24) |
| RAM Size | 24 KB | 24 KB | 24 KB | 24 KB | 24 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Grade | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +125C (extended) |
| AEC-Q100 Qualification | Qualified | Not qualified | Not qualified | Qualified | Qualified |
| CAN Controllers | Dual CAN | Dual CAN | Dual CAN | Dual CAN | Single CAN |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Key Differentiators
- Extended temperature and automotive qualification (vs DSPIC33EP512GP806-I/PT)
- Dual CAN controllers in a 64-pin TQFP (vs DSPIC33EP512GP504T-E/PT)
- Full 512 KB Flash with dual ADC (vs DSPIC33EP256MC504-I/PT)
- Tape-and-reel packaging for automated assembly (vs DSPIC33EP512GP806-I/PT)
Design Notes
Decouple every VDD pin to its adjacent VSS pin with a 0.1 uF ceramic capacitor placed within 2 mm of the package, and add a bulk 10 uF capacitor per supply domain. The DSPIC33EP512GP806T-E/PT runs from 3.0 V to 3.6 V, so a 3.3 V rail with less than 5% ripple is recommended. Estimated: at 60 MIPS and 3.3 V, core current is typically in the tens of milliamps, so a 100 mA LDO with low output impedance is adequate for a single-device design.
Route the ICSP programming pair as a matched set: if PGEC2 is used for ICSPCLK, ICSPDAT must be connected to PGED2. Microchip's dsPIC33E programming specification requires that PGECx and PGEDx be used as a pair, and mixing pairs will prevent in-circuit programming. Keep the ICSP traces short and away from the PWM and CAN switching nodes to avoid corrupting the programming clock.
Place the ADC sample-and-hold reference decoupling capacitor as close as possible to the VREF pins and use a dedicated analog ground plane under the 64-TQFP. The dual 10/12-bit ADC modules share the analog input multiplexer, so high-impedance sensor sources should be buffered with an external op-amp to keep acquisition time within specification. Keep digital PWM return currents out of the analog ground region to preserve effective resolution.
The 64-TQFP (10x10 mm) package has a modest thermal pad area, so at 3.3 V and 60 MIPS the device typically dissipates well under 1 W and needs no heatsink. Estimated: with a theta_JA on the order of 50 C/W for a 64-TQFP on a 4-layer board, a 0.5 W dissipation raises the junction about 25 C above ambient, which is acceptable within the -40C to +125C rating. Provide a thermal via array under the exposed pad if the device is co-located with power stages.
Do not substitute the industrial-grade DSPIC33EP512GP806-I/PT into an automotive design that requires AEC-Q100 and -40C to +125C operation, even though it is pin-compatible. Also verify the 'T' tape-and-reel and '/PT' TQFP suffixes when ordering, because the same die is offered in QFN (/MR) and other memory densities; a wrong suffix yields a part that will not fit the land pattern or will not meet the temperature requirement.
Compliance Information
AEC-Q100 automotive qualification and RoHS compliance are confirmed by distributor listings (datasheets.com, Hotenda). REACH, lead-free, halogen-free, and conflict-minerals status were not stated in the provided web data and are marked unknown rather than assumed.