DSPIC33EV64GM106-E/MR - 16-Bit 60MIPS 5V DSC 64KB | Microchip
MPN: DSPIC33EV64GM106-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.59 | $4.59 |
| 10 | $4.36 | $43.60 |
| 100 | $4.1 | $410.00 |
| 500 | $3.9 | $1,950.00 |
| 1,000 | $3.7 | $3,700.00 |
DSPIC33EV64GM106-E/MR Overview
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded control, the DSC sits between a general-purpose MCU and a dedicated DSP, making it a single-chip solution for real-time control loops such as field-oriented motor control, digital power conversion, and sensor signal processing.
Key features of the dsPIC33EV64GM106 include 5V-tolerant operation that removes the need for level shifting in noisy 12V/24V industrial and automotive environments, ECC (error-correcting code) Flash for functional-safety-critical designs, and a rich peripheral set including multiple PWM modules, high-speed 12-bit ADCs, comparators, UART/SPI/I2C communication ports, and DMA channels. The -E/ extended temperature suffix plus AEC-Q100 qualification targets automotive and harsh-environment applications.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, dual operand fetch, and hardware division support, enabling deterministic single-cycle MAC execution for control algorithms. On-chip oscillators with PLL support clock-less boot without an external crystal, reducing BOM cost and failure points.
Typical applications include brushless DC and PMSM motor drives, automotive body and sensor control units, appliance power control, industrial power supplies, and touch or noise-immune sensing front ends. The 5V I/O directly interfaces with automotive load-dump-tolerant subsystems.
Design consideration: because this is a VQFN-64 with exposed pad, thermal and ground performance depend on a well-soldered center pad; plan the PCB land pattern and via array under the pad before layout freeze.
This page adds value beyond the manufacturer datasheet by consolidating distributor pricing, same-package drop-in variants, application pairings, and practical layout guidance in one AI-citable reference.
Drop-in alternatives for DSPIC33EV64GM106-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV64GM106-E/MR (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, Peripherals, Product Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV64GM106-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV256GM106T-I/MR
✅ Drop-In✓ In Stock
$3.72 / Unit
View Datasheet →DSPIC33EV256GM006-I/MR
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33EV64GM106-E/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum CPU Speed | 60 MIPS (per DigiKey listing) |
| Program Memory | 64 KB (22K x 24) ECC Flash |
| RAM | 8 KB |
| Supply Voltage | 5 V |
| Package | 64-VQFN (9x9 mm), exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40C to +125C (-E/ extended grade) |
| Qualification | AEC-Q100 qualified (automotive grade) |
| Functional Safety Support | Yes (FuSa, per DigiKey listing) |
| Timers | 7 timers (per Microchip USA series description) |
| DMA Channels | 4 DMA channels |
| Technology | CMOS |
| Low-Power Modes | Supported |
| Typical Applications | Automotive, industrial control, motor control, appliances |
DSPIC33EV64GM106-E/MR 64-vqfn (9x9 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV64GM106-E/MR (64-vqfn (9x9 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV64GM106-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV64GM106-E/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Body and Sensor Control Units, Appliance Power and Motor Control, Industrial Digital Power Supplies, Touch Sensing and Noise-Immune HMI, Industrial Control and Automation Nodes.
BLDC/PMSM Motor Control
The DSPIC33EV64GM106-E/MR is well suited to brushless DC and permanent-magnet synchronous motor control because its 16-bit dsPIC33E core executes single-cycle multiply-accumulate instructions needed for field-oriented control (FOC) loops, reaching up to 60 MIPS per distributor listings. The multiple high-resolution PWM modules generate complementary outputs with dead-time insertion for three-phase inverters, while fast 12-bit ADCs sample phase currents synchronously with PWM triggers. The 4 DMA channels offload ADC result transfers so the CPU sustains control-loop rates in the tens of kilohertz. Running from a single 5V supply with AEC-Q100 qualification and the -E/ grade, the controller sits directly in noisy 12V/24V drive environments without level shifting, and the ECC Flash protects control firmware against bit upsets from motor switching transients.
Recommended
Automotive Body and Sensor Control Units
The DSPIC33EV64GM106-E/MR fits automotive sensor, touch, and control unit designs because Microchip explicitly targets the dsPIC33EV GM family at these nodes in harsh environments with noise and vibration. The AEC-Q100 qualification and -40C to +125C operating range of the -E/ grade cover under-hood and chassis locations, while the 5V I/O rails tolerate the electrical noise typical of vehicle harnesses. The 64KB ECC Flash provides error-corrected code storage for functional-safety-relevant firmware, a feature DigiKey highlights with the family's FuSa listing. LIN-capable UART, SPI, and I2C ports connect to vehicle networks and external sensor front ends, and 7 timers support time-triggered diagnostics. Placed near sensors, its on-chip comparators and ADC reduce external component count in compact 9x9 mm VQFN packages.
Recommended
Appliance Power and Motor Control
Home appliances such as washing machines, dishwashers, fans, and compressors combine universal or BLDC motors with harsh 220V-adjacent electrical environments, exactly the operating profile Microchip cites for the dsPIC33EV family. The DSPIC33EV64GM106-E/MR contributes 5V-tolerant I/O for direct interaction with triac drivers and relay coils through transistor stages, plus PWM modules for motor speed regulation and ADC inputs for current, voltage, and temperature monitoring. The 64KB ECC Flash accommodates appliance firmware including UI handling, safety interlocks, and communication, while the extended -E/ temperature grade tolerates hot enclosure interiors. The on-chip oscillator with PLL removes the external crystal, improving vibration reliability. The 4 DMA channels keep ADC sampling continuous without CPU intervention during high-rate current monitoring.
Recommended
Industrial Digital Power Supplies
Digitally controlled AC-DC and DC-DC power supplies benefit from the DSPIC33EV64GM106-E/MR's combination of a 60 MIPS DSP core, high-speed PWM with fine duty-cycle resolution, and fast ADC sampling synchronized to the switching period. Voltage- and current-mode compensators execute as PID loops inside the ADC end-of-conversion interrupt, achieving bandwidths suitable for server and telecom brick converters. The 5V core supply matches legacy industrial rail architectures and simplifies gate-drive interfacing for low-side MOSFET control. ECC Flash protects control code in electrically noisy switch-mode environments, and UART or I2C links report telemetry (VOUT, IOUT, temperature) to a supervisory system. Because the dsPIC33EV family is also listed with Functional Safety support, it can serve in power systems where firmware integrity documentation is requested.
Recommended
Touch Sensing and Noise-Immune HMI
Microchip positions the dsPIC33EV GM family for automotive touch and control units, and the DSPIC33EV64GM106-E/MR extends this into industrial and appliance human-machine interfaces. Capacitive touch sensing is implemented by measuring charge time on CVD-enabled ADC channels under CPU control, with the 60 MIPS core executing ratio-metric and filtering algorithms that reject moisture, glove, and EMI-induced false triggers. The 5V operation increases touch signal amplitude relative to 3.3V systems, improving sensitivity in thick-panel designs. Multiple timers generate scan sequences autonomously, while the 8KB RAM holds per-channel baseline and filter state. The -40C to +125C grade permits touch panels behind ovens, dashboards, and outdoor equipment, and ECC Flash protects stored calibration parameters against power-rail transients common in appliance environments.
Recommended
Industrial Control and Automation Nodes
The DSPIC33EV64GM106-E/MR serves as a compact automation node handling sensing, local control, and communications on factory equipment. The 16-bit 60 MIPS core closes PID loops for actuators, valves, and small drives, while UART, SPI, and I2C ports link to PLC backplanes, displays, and industrial sensors. With 7 timers, 4 DMA channels, and on-chip comparators, the controller manages multi-channel sequencing without external glue logic, and the 5V supply interfaces directly with legacy 24V-referenced industrial I/O through simple resistive scaling. The -E/ extended temperature range and AEC-Q100 qualification exceed typical industrial requirements, adding margin for sealed enclosures with limited airflow, and ECC Flash safeguards firmware integrity in electrically noisy cabinets. The 9x9 mm VQFN suits compact distributed I/O modules mounted near actuators.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV64GM106-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV64GM106-E/ML | DSPIC33EV256GM106T-I/MR | DSPIC33EV256GM006-I/MR |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-QFN (ML) | 64-QFN 9x9 (MR) - same | 64-QFN 9x9 (MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (ECC Flash) | 64 KB (22K x 24) | 64 KB (22K x 24) | 256 KB | 256 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Core Speed | 60 MIPS (16-bit) | 60 MIPS (16-bit) | 60 MIPS (16-bit) | 60 MIPS (16-bit) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
| Temperature Grade | -40C to +125C (-E/, AEC-Q100) | -40C to +125C (-E/, AEC-Q100) | Industrial (-I/) grade | Industrial (-I/) grade |
Key Differentiators
- Automotive extended temperature grade in 64-pin QFN footprint (vs DSPIC33EV256GM106T-I/MR)
- 4x less Flash at lower cost with identical footprint (vs DSPIC33EV256GM106T-I/MR)
- VQFN (MR) thermal performance on a shared die (vs DSPIC33EV64GM106-E/ML)
Design Notes
The 64-pin VQFN (9x9) exposes a central thermal/ground pad. Design the land pattern with a solder-mask-defined opening and a 3x3 or 4x4 via array (0.3 mm drills, filled or tented) connecting the pad to the ground plane. Insufficient pad wetting is the most common cause of intermittent ground returns and elevated junction temperature on MR-package dsPIC33EV boards. Follow the land pattern dimensions in the family datasheet DS70005144H rather than copying generic QFN-64 footprints, and verify paste stencil segmentation (60-70% coverage) to avoid tombstoning during reflow.
The dsPIC33EV family runs from a 5V supply with internal regulation; follow the datasheet's minimum decoupling set - low-ESR capacitors on VDD and on the internal core-regulator output - placed within a few millimeters of the pins. Do not share the core regulator capacitor with switching-load traces. When the controller sits on a 12V/24V automotive rail, use a load-dump-rated upstream regulator and TVS protection, since the MCU's own 5V absolute maximum does not tolerate transients. sequencing of VDD relative to programming-tool connections (PICkit 4/ICD 4) should follow the Flash Programming Specification to avoid partial-erase issues.
Three recurring pitfalls: (1) Assuming the /MR VQFN-64 and /ML QFN-64 packages share an identical land pattern - verify both mechanical drawings before qualifying a substitution. (2) Leaving peripheral pin-select (PPS) remapping of UART/PWM pins unconfigured, which produces peripherals that 'run' with no external signal. (3) Choosing the industrial -I/ grade (e.g., DSPIC33EV256GM106T-I/MR) for an under-hood position where the -E/ 125C grade is required; the silicon is identical but the qualification envelope is not. Also budget Flash: 64KB fills quickly with FOC libraries plus a bootloader.
Compliance Information
AEC-Q100 automotive qualification and -E/ extended temperature grade confirmed from Jotrin and Microchip listings. RoHS/REACH/lead-free status not stated in the provided verified data - confirm on the Microchip product page or distributor environmental data sheet.
