DSPIC33FJ12GP202-E/ML - 16-bit DSC, 40 MIPS, 12KB Flash | Microchip
MPN: DSPIC33FJ12GP202-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.28 | $4.28 |
| 10 | $3.81 | $38.10 |
| 100 | $3.42 | $342.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.74 | $2,740.00 |
DSPIC33FJ12GP202-E/ML Overview
A Digital Signal Controller is a hybrid architecture that combines the deterministic interrupt response and rich peripheral set of a microcontroller with the single-cycle MAC (multiply-accumulate) engine of a DSP. Within the broader taxonomy, the dsPIC33F sits between general-purpose PIC24 MCUs and high-end dsPIC30F devices, optimized for embedded control loops that also require real-time signal processing - motor control, power conversion, and sensor fusion being canonical examples.
The DSPIC33FJ12GP202 integrates a 16-bit timer/capture/compare module, multiple 10/12-bit ADCs with on-chip sample-and-hold, I2C, SPI, and UART peripherals, plus a nanoWatt power management unit that drops quiescent current below typical values during Sleep. The 40 MIPS core enables single-cycle 16x16-bit MAC operations and supports fractional (Q15) arithmetic natively for efficient DSP filter implementations.
The "-E" suffix denotes the Extended industrial temperature grade (-40C to +125C), and the "/ML" suffix designates the 28-pin QFN surface-mount package. The device is part of a migration-friendly family: code can move to PIC24F, PIC24H, or dsPIC30F parts with compatible peripheral pin select mappings.
Typical applications include sensor signal conditioning, BLDC/PMSM motor control (note: dsPIC33FJ12MC202 is the dedicated motor-control variant), digital power conversion, audio processing, and industrial automation control loops. The exposed pad on the QFN package is the primary thermal dissipation path and must be soldered to a sufficient copper pour on the PCB.
Designers should plan for code-development using Microchip's MPLAB X IDE with the XC16 compiler, plus the dsPIC DSP library for filter and transform primitives. Note that the 'GP' (General Purpose) suffix here is distinct from the 'MC' (Motor Control) family - choose MC variants for advanced motor-control PWM with up to 6 outputs and complementary PWMs.
This page synthesizes distributor pricing, same-family pin-compatible alternatives, and practical QFN PCB-layout guidance not aggregated elsewhere.
Drop-in alternatives for DSPIC33FJ12GP202-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ12GP202-E/ML (same form factor and footprint) — differing in Core Architecture, Package, Operating Temperature, ADC, DSP Engine.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ12GP201-E/SO
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.18 / Unit
View Datasheet →DSPIC33FJ12GP202-I/ML
✅ Drop-In✓ In Stock
$2.69 / Unit
View Datasheet →DSPIC33FJ12GP202T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ12GP202-E/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ12MC202-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.66 / Unit
View Datasheet →DSPIC33FJ12GP202-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC33F (16-bit DSC) |
| Program Memory (Flash) | 12 KB (12K x 8) |
| Data RAM | 1 KB (1024 bytes) |
| Maximum CPU Speed | 40 MIPS (MIPS, 16-bit) |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (Extended, -E grade) |
| Package | 28-pin QFN (6x6 mm) with exposed thermal pad |
| Package Suffix | /ML |
| Mounting Type | Surface Mount |
| Communication Peripherals | I2C, SPI, UART |
| DSP Engine | Single-cycle 16x16 MAC, Q15 fractional arithmetic |
| Power-Saving Modes | nanoWatt (Sleep, Idle, Doze) |
| MSL Level | 1 (per JEDEC J-STD-020, typical for QFN) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
DSPIC33FJ12GP202-E/ML Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, drive low to reset the device |
| Pin 2 | AN0/VREF+/RA0 — Analog input 0 / positive voltage reference / Port A bit 0 |
| Pin 3 | AN1/VREF-/RA1 — Analog input 1 / negative voltage reference / Port A bit 1 |
| Pin 4 | RA2 — Port A bit 2 (digital I/O) |
| Pin 5 | RA3 — Port A bit 3 (digital I/O) |
| Pin 6 | RA4 — Port A bit 4 (digital I/O) |
| Pin 7 | AVDD — Analog supply voltage (3.0-3.6V) |
| Pin 8 | AVSS — Analog ground |
| Pin 9 | OSC1/RC12 — Oscillator crystal input / Port C bit 12 |
| Pin 10 | OSC2/RC15 — Oscillator crystal output / Port C bit 15 |
| Pin 11 | RB0 — Port B bit 0 (digital I/O, programmable) |
| Pin 12 | RB1 — Port B bit 1 (digital I/O, programmable) |
| Pin 13 | RB2 — Port B bit 2 (digital I/O, programmable) |
| Pin 14 | RB3 — Port B bit 3 (digital I/O, programmable) |
| Pin 15 | RB4 — Port B bit 4 (digital I/O, programmable) |
| Pin 16 | RB5 — Port B bit 5 (digital I/O, programmable) |
| Pin 17 | RB6 — Port B bit 6 (digital I/O, programmable) |
| Pin 18 | RB7 — Port B bit 7 (digital I/O, programmable) |
| Pin 19 | VSS — Digital ground |
| Pin 20 | VDD — Digital supply voltage (3.0-3.6V) |
| Pin 21 | RC0 — Port C bit 0 (digital I/O) |
| Pin 22 | RC1 — Port C bit 1 (digital I/O) |
| Pin 23 | RC2 — Port C bit 2 (digital I/O) |
| Pin 24 | RC3 — Port C bit 3 (digital I/O) |
| Pin 25 | RC4 — Port C bit 4 (digital I/O) |
| Pin 26 | RC5 — Port C bit 5 (digital I/O) |
| Pin 27 | RC6 — Port C bit 6 (digital I/O) |
| Pin 28 | RC7 — Port C bit 7 (digital I/O) |
| Pin 29 | EP — Exposed thermal pad - solder to PCB ground plane for thermal dissipation |
Typical Applications
DSPIC33FJ12GP202-E/ML is suitable for 6 applications: Sensor Signal Conditioning, BLDC Fan / Pump Motor Control, Digital Power Conversion (DC-DC), Audio Effects Processing, Industrial Sensor Hub / IoT Edge, Consumer Appliance Control.
Sensor Signal Conditioning
The DSPIC33FJ12GP202-E/ML's 40 MIPS dsPIC33F core and single-cycle 16x16 MAC engine make it well-suited for sensor-signal conditioning front-ends. The 12 KB Flash and 1 KB SRAM are sufficient to host digital IIR/FIR filters (4th-order at typical sample rates), running alongside UART/I2C housekeeping code. The 28-pin QFN (6x6 mm) footprint fits sensor modules with constrained PCB area, and the Extended -40C to +125C temperature grade supports industrial and outdoor deployments. Designers typically stream ADC samples through on-chip filters using Q15 fractional arithmetic for deterministic throughput, then output cleaned data over SPI to a host MCU or display.
Recommended
BLDC Fan / Pump Motor Control
While the GP variant lacks the dedicated MC PWM peripheral, the DSPIC33FJ12GP202-E/ML can still drive small 1-quadrant BLDC fans and DC pumps using software PWM on the dsPIC33F core. The 40 MIPS throughput easily handles trapezoidal commutation at speeds up to ~10 krpm, while the 12 KB Flash fits state-machine control loops with margin for thermal compensation. The nanoWatt power-saving mode reduces quiescent current during standby, valuable for battery-powered or solar-driven pumps. The 28-pin QFN (ML) package suits thermally-constrained fan housings, with the exposed pad providing direct thermal coupling to a copper pour.
Recommended
Digital Power Conversion (DC-DC)
The DSPIC33FJ12GP202-E/ML's high MIPS-per-mW and hardware peripherals support digital control loops for DC-DC converters and power-factor correction stages. The 40 MIPS core executes voltage-mode or current-mode control loops with sub-microsecond update rates at switching frequencies up to 250 kHz, while the on-chip ADC samples feedback voltages and currents. The 12 KB Flash accommodates compensator coefficients, soft-start ramp tables, and fault handlers. The Extended -40C to +125C temperature range supports telecom and industrial 48V bus applications, and the QFN-28 package is well-suited to high-density point-of-load designs with exposed-pad cooling.
Recommended
Audio Effects Processing
The dsPIC33F MAC engine enables real-time audio-effects processing such as parametric EQ, reverb, and dynamics compression. The DSPIC33FJ12GP202-E/ML at 40 MIPS can run a 2-band stereo EQ plus simple reverb within its 1 KB SRAM budget at 32 kHz sample rate. Its 3.0-3.6V operation aligns with common audio CODEC supply rails, and the SPI peripheral drives external DACs such as the MCP49xx series. The 28-pin QFN fits compact pedal/amp modules, and the nanoWatt power management is beneficial for pedalboard battery life. For richer DSP (FFT, multi-band compression), consider larger dsPIC33F variants with more SRAM.
Recommended
Industrial Sensor Hub / IoT Edge
The DSPIC33FJ12GP202-E/ML serves as a low-power edge-sensor hub, aggregating multiple sensor inputs over I2C/SPI and applying on-board digital filtering before transmitting summaries over UART or SPI to a wireless co-processor. The 40 MIPS performance, 12 KB Flash, and nanoWatt Sleep mode (microamp-range idle current) suit battery-powered IoT endpoints. The Extended -40C to +125C temperature grade enables deployment in unheated outdoor enclosures or industrial cabinets. The 28-pin QFN footprint and 3.3V operation integrate cleanly with RN2483 LoRa or NINA-B3 BLE modules for wireless connectivity.
Recommended
Consumer Appliance Control
The DSPIC33FJ12GP202-E/ML is well-suited to white-goods and small-appliance controllers - washing-machine pumps, dishwasher dispensers, and coffee-machine heaters. The Extended -40C to +125C temperature range meets appliance reliability standards, and the 12 KB Flash holds user-interface state machines plus sensor processing. The 28-pin QFN (6x6 mm) is small enough for compact appliance PCBAs, and the nanoWatt power-saving mode supports standby-power targets below 0.5 W mandated by EU regulations. Designers can leverage Microchip's application notes for capacitive-touch sensing via the IC's peripheral pin select for human-interface buttons.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ12GP202-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ12GP202-I/ML | DSPIC33FJ12GP202T-E/ML | DSPIC33FJ12MC202-I/ML |
|---|---|---|---|---|
| Package | QFN-28 (6x6 mm) with EP | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same | QFN-28 (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 12 KB | 12 KB | 12 KB | 12 KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Temperature Grade | Extended (-40C to +125C) | Industrial (-40C to +85C) | Extended (-40C to +125C) | Industrial (-40C to +85C) |
| Variant Type | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB |
Key Differentiators
- Extended industrial temperature grade in compact QFN-28 (vs DSPIC33FJ12GP202-I/ML)
- General-purpose DSP architecture optimized for sensor processing (vs DSPIC33FJ12MC202-I/ML)
- Tape-and-reel packaging for high-volume SMT assembly (vs DSPIC33FJ12GP202T-E/ML)
Design Notes
The 28-pin QFN package exposes a thermal pad (EP, pin 29) on the underside that is the primary heat-dissipation path. Estimate: with 12 KB Flash typically drawing 20-30 mA at 40 MIPS from 3.3V, power dissipation is ~70-100 mW - manageable but the EP must be soldered to a continuous ground copper pour of at least 25 mm^2 to maintain the theta_JA rating. Without proper EP soldering, junction temperature can rise 20-30C above rated, especially at +125C ambient. Use multiple thermal vias under the EP to the inner/ground planes.
Place a 0.1 uF decoupling capacitor as close as possible to the VDD pin (pin 20) and a 10 uF bulk capacitor on the same supply trace; similarly decouple AVDD (pin 7) with 0.1 uF and 10 uF on the analog supply. Keep the analog and digital ground returns separated to one point near the device to avoid digital noise coupling into ADC references. The exposed pad should connect to the digital ground plane with at least 5 thermal vias (0.3 mm drill, 0.6 mm pitch) for adequate heat sinking.
Pin 1 is identified by the dot marker on the top side of the QFN. Route the crystal traces (OSC1/OSC2, pins 9 and 10) as short as possible with a guard ground on both sides to minimize EMI pickup. If using the internal FRC oscillator instead of a crystal, tie OSC1 to ground and leave OSC2 floating per the datasheet. Place the MCLR pull-up resistor (typically 10 kohm) close to the MCLR pin to avoid spurious resets from noise.
Common pitfalls: (1) Forgetting to solder the exposed pad causes thermal runaway at high ambient temperatures. (2) Powering the device above 3.6V (the absolute maximum is 4.0V per datasheet 70264E) destroys the dsPIC33F core. (3) Using PIC24 configuration bits instead of dsPIC33F bits traps the device in reset. (4) Neglecting the configuration of the JTAG/PGD/PGC pins as digital I/O by default - they must be unlocked via the JTAGEN_OFF fuse. (5) Programming voltage mismatch when using older debug tools that default to 5V signals - the device is 3.3V only.
Compliance Information
RoHS compliant per Microchip product declaration. Not AEC-Q100 qualified (no automotive-specific variant available for this part). For automotive applications, consider AEC-Q100 qualified dsPIC33F variants in larger packages.