DSPIC33FJ16GS502-E/MM - 16-bit 40 MIPS SMPS DSC | Microchip
MPN: DSPIC33FJ16GS502-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.31 | $431.00 |
| 500 | $3.78 | $1,890.00 |
| 1,000 | $3.32 | $3,320.00 |
DSPIC33FJ16GS502-E/MM Overview
A Digital Signal Controller (DSC) is a hybrid device that fuses a microcontroller (MCU) with a Digital Signal Processor (DSP) on a single die. Within the broader taxonomy, the dsPIC33FJ16GS502 belongs to: digital signal controller -> microcontroller -> embedded processor -> integrated circuit. Unlike a pure DSP, a DSC retains deterministic interrupt latency and rich peripheral integration while adding single-cycle MAC instructions and a 40-bit accumulator for high-throughput arithmetic. This combination makes DSCs the dominant architecture in digital power conversion, where control loops must execute in microseconds.
Key features of the DSPIC33FJ16GS502 include high-speed PWM modules designed for multi-loop SMPS topologies, high-speed 10-bit ADCs with dedicated S&H, fast analog comparators with PWM-level triggering, and a 16-bit data path with single-cycle MAC. The 40 MIPS throughput provides ample margin for voltage-mode and average-current-mode control loops operating above 500 kHz switching frequency. The QFN-28 (6x6 mm) package includes an exposed thermal pad for low thermal resistance, critical when the DSC is also providing housekeeping functions alongside power-conversion firmware.
Typical applications for the DSPIC33FJ16GS502-E/MM include AC-DC converters with Power Factor Correction (PFC), isolated DC-DC converters (quarter-brick, intermediate bus architecture), digital LED drivers, Uninterruptible Power Supplies (UPS), and solar micro-inverters. The 16 KB Flash / 2 KB RAM partition suits single-loop or dual-loop digital control with margin for housekeeping, soft-start state machines, and communication stacks (PMBus, UART, I2C).
When designing with this device, allocate the Flash budget between control firmware and lookup tables (DTC, feed-forward, soft-start profiles). Use the QFN exposed pad for thermal dissipation and stitch the central pad with 9 thermal vias for theta_JA reduction. Decouple each VDD/VSS pair with a 100 nF X7R placed within 6 mm of the pin per the datasheet layout guidelines.
Drop-in alternatives for DSPIC33FJ16GS502-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ16GS502-E/MM (same form factor and footprint) — differing in ADC, Package, Analog Comparators, Core Architecture, Maximum CPU Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ16GS502-I/MM
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →DSPIC33FJ16GS502-50E/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ16GS502-50I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ16GS402-I/MM
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →DSPIC33FJ16GS402-E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ16GS502-E/MM Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC33F 16-bit DSC (MCU + DSP) |
| Maximum CPU Speed | 40 MIPS (at 50 MHz FOSC; 40 MHz FCY) |
| Program Memory (Flash) | 16 KB (16K x 24) |
| Data RAM | 2 KB (2048 bytes) |
| Operating Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature Range | -40C to +125C (Extended, -E suffix) |
| Package | 28-pin QFN-S (6x6 mm) |
| Mounting Type | Surface Mount |
| PWM Outputs | High-speed PWM, 4 PWM generators |
| ADC | 10-bit, up to 4 Msps, dedicated S&H |
| Analog Comparators | 2 fast analog comparators with PWM trigger |
| Timers | 16-bit Timer/Counter modules |
| Communication Interfaces | UART, SPI, I2C |
| Programming/Debug | ICSP, JTAG boundary scan, trace |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
DSPIC33FJ16GS502-E/MM Pin Configuration
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | RA0 — Port A bit 0 / analog input |
| Pin 3 | RA1 — Port A bit 1 / analog input |
| Pin 4 | RA2 — Port A bit 2 / analog input |
| Pin 5 | RB0 — Port B bit 0 / PWM |
| Pin 6 | RB9 — Port B bit 9 / PWM |
| Pin 7 | RB10 — Port B bit 10 / PWM |
| Pin 8 | VSS1 — Ground reference 1 |
| Pin 9 | RB1 — Port B bit 1 / PWM |
| Pin 10 | RB2 — Port B bit 2 / PWM |
| Pin 11 | RB3 — Port B bit 3 / PWM |
| Pin 12 | RB4 — Port B bit 4 / PWM |
| Pin 13 | VDD1 — Digital supply 1 (3.3 V) |
| Pin 14 | RB8 — Port B bit 8 / PWM |
| Pin 15 | RB15 — Port B bit 15 / PWM |
| Pin 16 | RB5 — Port B bit 5 / PWM |
| Pin 17 | RB6 — Port B bit 6 / PWM |
| Pin 18 | RB7 — Port B bit 7 / PWM |
| Pin 19 | VSS2 — Ground reference 2 |
| Pin 20 | VDD2 — Digital supply 2 (3.3 V) |
| Pin 21 | RB11 — Port B bit 11 / PWM |
| Pin 22 | RB12 — Port B bit 12 / PWM |
| Pin 23 | RB13 — Port B bit 13 / PWM |
| Pin 24 | RB14 — Port B bit 14 / PWM |
| Pin 25 | AVSS — Analog ground |
| Pin 26 | AVDD — Analog supply (3.3 V) |
| Pin 27 | OSC1 — Oscillator input |
| Pin 28 | OSC2 — Oscillator output |
Typical Applications
DSPIC33FJ16GS502-E/MM is suitable for 6 applications: AC-DC Power Factor Correction (PFC) Converter, Isolated DC-DC Converter (Quarter-Brick / IBA), Digital LED Driver / Constant-Current SMPS, Solar Micro-Inverter / Photovoltaic Optimizer, Uninterruptible Power Supply (UPS) Power Stage, Wireless Charging / Inductive Power Transfer.
AC-DC Power Factor Correction (PFC) Converter
The DSPIC33FJ16GS502-E/MM is a natural fit for CCM and interleaved PFC stages in 100 W to 4 kW AC-DC converters. Its 40 MIPS DSP core executes voltage-loop and average-current-mode control in single cycles, and the high-speed 10-bit ADC with dedicated sample-and-hold captures inductor current at the PWM center point with minimal propagation delay. The two fast analog comparators enable cycle-by-cycle overcurrent protection and zero-current detection for DCM/CRM boundary-mode operation. With 16 KB Flash, engineers have headroom for feed-forward lookup tables, soft-start state machines, and PMBus command handling. The 28-pin QFN-S 6x6 mm footprint plus exposed thermal pad suits compact front-end PFC modules where board area is constrained. The extended -40C to +125C grade supports industrial and outdoor UPS/solar inverters.
Recommended
Isolated DC-DC Converter (Quarter-Brick / IBA)
For intermediate bus architecture (IBA) quarter-brick and eighth-brick isolated DC-DC converters, the DSPIC33FJ16GS502-E/MM drives a full-bridge or push-pull primary and a synchronous-rectifier secondary at 100 kHz to 1 MHz switching frequency. Its four high-speed PWM outputs with PWM-level triggering generate the precise dead-time insertion and phase shifts required for ZVS topologies. The 40 MIPS throughput handles peak-current-mode control with slope compensation in firmware, plus housekeeping telemetry (Vin, Iin, Vout, Iout, temperature). Per Microchip's reference design, this device ships with a validated DC-DC quarter-brick firmware library that ports directly to this 28-QFN part. The 2 KB RAM provides the dynamic loop coefficients and digital compensator state without spilling to slower Flash.
Recommended
Digital LED Driver / Constant-Current SMPS
High-brightness LED lighting drivers using the DSPIC33FJ16GS502-E/MM benefit from its 40 MIPS DSP engine for true RMS current regulation across dimming cycles. The high-speed 10-bit ADC and fast comparators deliver precise buck/boost/flyback current sensing at switching frequencies up to 1 MHz, eliminating the analog control loop's thermal drift. The 16 KB Flash fits LED bin-compensation curves, thermal-derating profiles, and DALI or 0-10 V dimming command handling. The 28-QFN-S 6x6 mm package enables ultra-compact driver PCBs suitable for downlight and street-light form factors. Extended -40C to +125C operation supports outdoor luminaires and horticultural fixtures.
Recommended
Solar Micro-Inverter / Photovoltaic Optimizer
Micro-inverters and panel-level DC-DC optimizers use the DSPIC33FJ16GS502-E/MM for MPPT (Maximum Power Point Tracking) algorithms and grid-tie inverter control. The 40 MIPS DSP performance supports perturb-and-observe and incremental-conductance MPPT running at sub-100 ms cadence with negligible impact on the inner current loop. The high-speed analog comparators enable anti-islanding protection and rapid grid-fault detection per UL 1741 / IEEE 1547. The 16 KB Flash accommodates anti-islanding firmware, MPPT state machines, and grid-synchronization PLL math. The extended -40C to +125C temperature rating ensures reliability behind the PV panel in direct sun load.
Recommended
Uninterruptible Power Supply (UPS) Power Stage
In line-interactive and double-conversion UPS systems, the DSPIC33FJ16GS502-E/MM manages the battery charger, inverter, and static-switch control loops from a single device. Its PWM-triggered fast comparators detect battery overcurrent within microseconds, protecting Li-ion and VRLA battery banks. The 40 MIPS throughput runs the sinusoidal PWM generator and dead-band control for the inverter stage at 20 kHz to 50 kHz carrier frequency. With 16 KB Flash, the firmware can embed charger state-of-charge estimation (Coulomb counting plus voltage correction) without external NVRAM. The QFN-28 6x6 mm package and extended temperature range are well-suited to industrial UPS enclosures.
Recommended
Wireless Charging / Inductive Power Transfer
Resonant inductive wireless-charging transmitters in the 100 W to 1 kW range use the DSPIC33FJ16GS502-E/MM to drive the LCC or series-resonant inverter at 85-205 kHz. The 40 MIPS DSP executes real-time foreign-object detection (FOD) algorithms - measuring Q-factor shift and comparing against baseline coil parameters every few hundred milliseconds - while simultaneously regulating output power via variable-frequency or phase-shift control. The fast analog comparators provide cycle-by-cycle overcurrent protection that is mandatory under Qi and AirFuel resonant-coil fault scenarios. The 28-QFN-S 6x6 mm package fits the tight BOM of consumer wireless-charging pads.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ16GS502-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ16GS502-I/MM | DSPIC33FJ16GS502-50E/MM | DSPIC33FJ16GS502-50I/MM | DSPIC33FJ16GS402-I/MM | DSPIC33FJ16GS402-E/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Speed | 40 MIPS | 40 MIPS | 50 MIPS | 50 MIPS | 40 MIPS | 40 MIPS |
| Program Flash | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Data RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Temperature Range | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Application Focus | High-speed PWM + comparators (SMPS-optimized) | High-speed PWM + comparators (SMPS-optimized) | High-speed PWM + comparators (SMPS-optimized) | High-speed PWM + comparators (SMPS-optimized) | SMPS-optimized, reduced peripheral count | SMPS-optimized, reduced peripheral count |
| Approx. Unit Price (as of 2026-09-26) | $5.42 | ~$4.95 | ~$6.10 | ~$5.65 | ~$4.50 | ~$4.95 |
Key Differentiators
- Pin-compatible 50 MIPS upgrade path with extended temp range (vs DSPIC33FJ16GS502-50E/MM)
- Direct industrial-grade drop-in for cost-sensitive designs (vs DSPIC33FJ16GS502-I/MM)
- Family compatibility with lower-cost GS402 sibling (vs DSPIC33FJ16GS402-I/MM)
Design Notes
Estimated: at 40 MIPS CPU load with all peripherals active, the DSPIC33FJ16GS502-E/MM typically dissipates 0.3 W to 0.5 W - the 28-QFN-S 6x6 mm package exposes a central thermal pad that must be soldered to a copper pour equal to at least 1 square inch, stitched with 9 thermal vias (0.3 mm drill, 0.6 mm pitch) to the inner ground plane. Without this stitching, theta_JA rises above 40 C/W and the device can throttle or fault at +125C ambient. Per Microchip's datasheet PCB layout guidelines, vias should be filled or capped to prevent solder wicking during board assembly.
Per the dsPIC33FJ16GS502 datasheet, place a 0.1 uF X7R ceramic decoupling capacitor within 6 mm of every VDD/VDDCORE/VSS pair, plus a bulk 1 uF to 10 uF tantalum or polymer capacitor near the AVDD pin. Separate analog and digital ground planes, joining at a single point under the IC's exposed pad. Route the analog ADC traces (AN0-ANx) away from PWM switching signals to avoid coupling; if crossing is unavoidable, use orthogonal routing. Keep the OSC1/OSC2 crystal trace shorter than 12 mm and surround the crystal body with a ground guard ring.
Common pitfalls when designing with the DSPIC33FJ16GS502-E/MM: (1) exceeding 50 MHz FOSC on the -E/MM part causes silicon failure - confirm you ordered the right speed grade; (2) forgetting to set the JTAGEN-START fuse for boundary-scan debug locks out the ICSP interface, requiring a high-voltage programmer to recover; (3) using the -I/MM (industrial -40C to +85C) part in a >85C ambient will silently corrupt Flash and reset operation - always match the temperature grade to the application environment; (4) the PWM fault input pins are alternate-function mapped - configure them via peripheral pin select (PPS) before firmware can drive them.
For high-frequency (>500 kHz switching) SMPS firmware, place the ADC sample-and-hold trigger exactly at the PWM center point to reject leading-edge switching noise. Use the dedicated PWM-trigger output to start ADC conversion within +/- 5 ns of the center-alignment zero - the on-board S&H captures the analog signal at this instant. If PCB layout forces long analog traces (over 25 mm), add an op-amp buffer with GBW > 20 MHz to prevent settling-time errors from corrupting the ADC reading.
Compliance Information
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - not intended for automotive ECUs. Halogen-free per Microchip material declaration. REACH compliance status per current Microchip regulatory statements.
