H5CG26AGBDX021 - 16Gb DDR5 SDRAM x8 | SK hynix
MPN: H5CG26AGBDX021 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.8 | $6.80 |
| 10 | $6.3 | $63.00 |
| 100 | $5.85 | $585.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.95 | $4,950.00 |
Drop-in alternatives for H5CG26AGBDX021 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5CG46AGBDX015
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View Datasheet →H5CG28AGBDX022
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View Datasheet →H5CG46MEBDX015N
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View Datasheet →H5CG46MEBDX017N
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View Datasheet →H5CG26AGBDX021 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR5 SDRAM (DRAM) |
| Density | 16 Gbit |
| Organization | 2G x 8 |
| Interface | DDR5 (JEDEC-compliant) |
| Supply Voltage Class | 1.1 V class (JEDEC DDR5) |
| Package Type | FBGA (fine-pitch ball grid array) |
| On-Die ECC | Yes (DDR5 16Gb-class feature) |
| Mounting Type | Surface Mount |
| Manufacturer | SK hynix |
H5CG26AGBDX021 fbga (fine-pitch ball grid array) Pin Configuration Guide
Complete pinout information for H5CG26AGBDX021 (fbga (fine-pitch ball grid array) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5CG26AGBDX021.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG26AGBDX021 is suitable for 6 applications: Data Center Server Main Memory, Desktop and Workstation UDIMM, Embedded and Solder-Down Computing Modules, Networking and Telecommunications Equipment, AI and HPC Accelerator Memory Subsystems, Industrial Control and Data Logging.
Data Center Server Main Memory
The H5CG26AGBDX021's 16Gb 2Gx8 DDR5 configuration maps directly onto mainstream RDIMM and LRDIMM module designs used in cloud and enterprise servers, where SK hynix's first-to-market JEDEC-compliant DDR5 portfolio and approximately 20% lower power footprint than DDR4 reduce total cost of ownership at scale. In a module, eight or more x8 devices form the 64-bit-plus-ECC datapath across two independent 32-bit sub-channels per DDR5 DIMM, doubling effective memory-controller streams versus DDR4. The on-die ECC mitigates single-bit cell failures inherent to 16Gb-class node cells, protecting uncorrected-error rates in always-on server workloads. Designers should validate SPD programming and controller training profiles (including DFE read equalization) for this exact ordering code before module qualification, using SK hynix's SPD and device-operation documents from the Downloads portal.
Recommended
Desktop and Workstation UDIMM
For consumer and prosumer platforms, the H5CG26AGBDX021 16Gb x8 DDR5 component is the standard building block for desktop UDIMMs, where eight chips yield a 16 GB unbuffered module and sixteen yield 32 GB. DDR5's two independent 32-bit sub-channels per module improve concurrency for gaming and content-creation workloads, while the 1.1 V class supply lowers module power versus DDR4 UDIMMs. The H5CG family's on-die ECC improves data integrity without host-software overhead, important as cell densities shrink. Module makers should follow SK hynix device-operation documentation for MR (mode register) programming and ZQ calibration, and verify the DX021 ordering suffix against the part-number decoder to confirm the intended speed bin (4800-5600 MT/s class) matches the module's rated specification and XMP/EXPO profile targets.
Recommended
Embedded and Solder-Down Computing Modules
Solder-down designs such as COM Express, SMARC, and custom compute-on-module (COM) boards use FBGA-packaged DDR5 components like the H5CG26AGBDX021 to save board area and eliminate socket reliability concerns. The fine-pitch FBGA permits dense point-to-point routing between the SoC memory controller and DRAM, and DDR5's on-die ECC plus DFE-based receiver equalization sustain signal integrity at high data rates even on four-to-six-layer carrier boards when length matching and reference-plane discipline are followed. The 1.1 V class rail simplifies on-module power conversion versus DDR4's separate 1.2 V VDD/VPP rails, though designers must implement correct power sequencing. Confirm the SoC memory controller's DDR5 training support and the exact DX021 speed bin with the SK hynix part-number decoder before layout release.
Recommended
Networking and Telecommunications Equipment
Switches, routers, and 5G baseband cards demand high-bandwidth, low-latency packet buffering and flow tables, which the H5CG26AGBDX021's DDR5 bandwidth and bank-group parallelism address. DDR5 per-bank-group refresh reduces effective stall time versus DDR4, improving deterministic latency for deep packet buffers, while on-die ECC protects long-running telecom workloads from soft errors at 16Gb-class cell densities. The 20% smaller power footprint versus DDR4 helps meet the thermal budgets of fanless or constrained-feet telecom platforms. Networking designs typically solder the FBGA device down next to the network processor or FPGA; designers should verify CA/DQ length matching to the strict DDR5 topologies and validate the exact DX021 speed grade against link training limits, using SK hynix device-operation documentation for MR configuration.
Recommended
AI and HPC Accelerator Memory Subsystems
AI inference cards and HPC accelerators frequently pair HBM with DDR5 host-side buffers for weight streaming, KV-cache offload, and host-coherent scratch memory. The H5CG26AGBDX021 contributes high per-device bandwidth and the DDR5 architecture's doubled burst length, which suits sequential streaming of large model tensors, while its approximately 20% lower power draw than DDR4 relaxes accelerator board thermal design. On-die ECC maintains numeric-workload integrity across long training runs, and DFE equalization supports the high data rates needed for timely prefetch of model shards. Accelerator designers should co-verify the DDR5 PHY training and the DX021 ordering-code speed bin (per the SK hynix decoder) under worst-case temperature, since AI boards run DRAM near its thermal limits, and consider higher-density H5CG siblings when capacity per board edge is the binding constraint.
Recommended
Industrial Control and Data Logging
Industrial controllers, vision systems, and edge gateways use DDR5 components such as the H5CG26AGBDX021 as high-bandwidth working memory for real-time control loops, image pipelines, and local data logging before upload. DDR5's on-die ECC is especially valuable in electrically noisy factory environments where soft errors from EMI would otherwise corrupt state machines or logged telemetry, and the 1.1 V class supply reduces self-heating inside sealed industrial enclosures. Solder-down FBGA mounting withstands vibration better than socketed solutions, suiting DIN-rail and vehicle-mounted controllers. Industrial designers should extend derating analysis to the extended-temperature ordering options available in the H5CG family (verify via the SK hynix part-number decoder), implement robust power sequencing against brownouts, and validate controller training over the full temperature range before production release.
Recommended
Recommended Products Summary
Engineering reference data for H5CG26AGBDX021 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG46AGBDX015 | H5CG48AGBDX018 | H5CG28AGBDX022 | H5CG46MEBDX015N |
|---|---|---|---|---|---|
| Package | FBGA | FBGA - same family package class | FBGA - same family package class | FBGA - same family package class | FBGA - same family package class |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Density / Configuration Code | 16Gb class (26A code, 2Gx8) | 46A code (verify via SK hynix decoder) | 48A code (verify via SK hynix decoder) | 28A code (verify via SK hynix decoder) | 46M code (verify via SK hynix decoder) |
| Organization | x8 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| On-Die ECC | Yes (DDR5 16Gb-class) | Yes (DDR5) | Yes (DDR5) | Yes (DDR5) | Yes (DDR5) |
| Supply Voltage Class | 1.1 V class (JEDEC DDR5) | 1.1 V class | 1.1 V class | 1.1 V class | 1.1 V class |
Key Differentiators
- JEDEC-compliant DDR5 from the industry's first DDR5 developer (vs H5ANAG6NCMR-XNC (DDR4 generation))
- 16Gb-class density with on-die ECC (vs H5CG48AGBDX018)
- Same-family second-source flexibility (vs H5CG46MEBDX015N)
Design Notes
DDR5 at 4800-5600 MT/s class requires DFE-based read training in the memory controller and strict length matching on CA and DQ/DQS nets. Keep point-to-point (solder-down) traces within datasheet skew limits, route over continuous reference planes, and avoid vias on DQS strobes where possible. Follow the SK hynix DDR5 device-operation document for mode-register programming and read/write leveling sequences before attempting eye-margin validation.
DDR5 moved power management on-die, but the board still must supply the 1.1 V class VDD/VDDQ rails with low ripple and correct sequencing. Use a dedicated PMIC or VRM supporting the JEDEC DDR5 power rail set, place bulk and high-frequency decoupling close to each FBGA power ball, and verify rail sequencing per the SK hynix datasheet to avoid latch-up during multi-rail power-up. Estimated current draw scales with speed grade - size the regulator with margin above the datasheet IDD values for the decoded speed bin.
The most frequent substitution error is assuming all H5CG DDR5 ordering codes are interchangeable. The ordering suffix (e.g., DX021 vs DX015 vs DX017N) encodes speed grade, die revision, and package/temperature options per the SK hynix part-number decoder available on the Downloads portal. Decode both the original and candidate codes and confirm density, organization, speed, and temperature range match before qualifying a substitute, and re-run memory training on the target platform after any substitution.
Compliance Information
Compliance statements were not present in the verified web data for this MPN. Request the official SK hynix environmental report / certificate of conformance for RoHS, REACH, halogen-free, and conflict-minerals status.
