NXP Semiconductors

MC56F8355VFGE - 16-Bit 60MHz DSC 256KB Flash LQFP-128 | NXP

MPN: MC56F8355VFGE ✓ Active
In Stock Ships in 1-3 business days
3.3 V Vdss 128-LQFP (14x20 mm) Package 60 MHz Speed 256 KB (128K x 16) Memory
From $33.85 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $51.34 $51.34
10 $47.12 $471.20
100 $42.78 $4,278.00
500 $38.95 $19,475.00
1,000 $36.4 $36,400.00
2,500 $33.85 $84,625.00
ℹ️ All prices are in USD

MC56F8355VFGE Overview

The NXP Semiconductors MC56F8355VFGE is a 16-bit digital signal controller (DSC) from the 56800E core-based 56F835x/56F815x family, integrating 256KB of on-chip Flash program memory and operating at 60MHz core speed. Housed in a 128-pin LQFP (14x20 mm) package, the device combines microcontroller (MCU) peripherals with DSP-class processing throughput on a single die. This hybrid architecture positions the part as a "DSC" - a class of mixed-signal controllers that sit between traditional 8/16/16-bit MCUs and higher-end DSPs in the embedded-processing taxonomy.

A digital signal controller is an integrated circuit category that fuses a deterministic microcontroller (MCU) with DSP-oriented multiply-accumulate (MAC) and Harvard-bus execution units. DSCs belong to the broader microprocessor hierarchy: microcontroller -> digital signal controller -> digital signal processor (DSP) -> embedded processor -> semiconductor. They are commonly used in real-time control loops where both fast arithmetic and event-driven peripheral handling are required.

Key feature highlights of the MC56F8355VFGE include 256KB (128K x 16) of Flash program memory, 49 general-purpose I/O pins, and connectivity peripherals spanning CANbus, EBI/EMI, SCI, and SPI. The integrated peripheral set further includes Power-On Reset (POR), Pulse-Width Modulation (PWM) modules, a temperature sensor, and a Watchdog Timer (WDT). These blocks support closed-loop motor control, power conversion, and sensor-fusion applications without external companions.

At the silicon level, the 56800E core uses a dual Harvard architecture with on-chip instruction and data memories, supporting single-cycle 16x16-bit MAC operations. Operating from a 3.3V supply, the device is fabricated on a CMOS process and is intended for industrial temperature environments. The instruction set, JTAG/OnCE debug interface, and integrated analog peripherals reduce external BOM cost in motor drive and digital-power designs.

Typical applications include AC induction motor and BLDC motor control (variable-frequency drives, servo drives), digital power conversion (SMPS, PFC stages), industrial automation, automotive body and chassis subsystems, and uninterruptible power supplies. The combination of PWM timers, ADC-triggered sequencing, and CAN/SPI connectivity suits distributed real-time nodes.

Designers should evaluate the 60MHz throughput, Flash wait-state budget, and ADC sampling latency against target loop rates. Use the on-chip PWM fault inputs and the watchdog timer to meet functional-safety requirements in motor drives. Verify thermal rise on the LQFP-128 footprint with sufficient copper area.

This page synthesizes distributor pricing, drop-in compatible 56F8xxx variants, and practical PCB-layout guidance that is not found in the manufacturer datasheet alone.

Drop-in alternatives for MC56F8355VFGE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC56F8355VFGE (same form factor and footprint) — differing in Core Architecture, Program Memory Size, Connectivity, Operating Temperature, Package / Case.

NXP Semiconductors
Program Memory Size: 256 KB (128K x 16) Flash
Connectivity: EBI/EMI, SCI, SPI
Package / Case: 128-LQFP (14x20 mm)
Compare with MC56F8355VFGE →
NXP Semiconductors
Core Architecture: 56800E 16-bit Digital Signal Controller
Program Memory Size: 128 KB (64K x 16)
Package / Case: 160-MAPBGA (15x15 mm)
Compare with MC56F8355VFGE →
NXP Semiconductors
Core Architecture: 16-bit
Program Memory Size: 256 KB (128K x 16) Flash
Operating Temperature: -40 C to +125 C
Compare with MC56F8355VFGE →
NXP Semiconductors
Core Architecture: 56800E (16-bit DSC)
Connectivity: CAN, SCI, SPI, I2C, GPIO
Operating Temperature: -40C to +105C (industrial)
Compare with MC56F8355VFGE →
NXP Semiconductors
Package / Case: 160-MAPBGA (15x15)
Compare with MC56F8355VFGE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC56F8355MFGE

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 LQFP-128
56800E · 16-bit · 60 MHz · 256 KB (128K x 16) Flash · 16 bit · 2.25 V to 3.6 V · 12 bit · 2 (dual)

✓ In Stock

$15.7 / Unit

View Datasheet →

MC56F8357VVFE

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
56800E (16-bit DSC) · 16-Bit · 60 MHz · 256KB (128K x 16) · 10K x 16 · 76 · External · 160-MAPBGA (15x15)

✓ In Stock

$8.36 / Unit

View Datasheet →

MC56F8335VFGE

✅ Drop-In
📦 LQFP-128
same 128-LQFP footprint, 64KB Flash (-75%) vs 256KB on target

📋 Reference alternative (not in catalog)

MC56F8347VVFE

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
56800E 16-bit Digital Signal Controller · 60 MHz · FLASH · 128 KB (64K x 16) · 12 KB (6K x 16) · 76 · 160-MAPBGA (15x15 mm)

✓ In Stock

$17.9 / Unit

View Datasheet →

MC56F8356VFVE

✅ Drop-In
NXP Semiconductors
📦 LQFP-144
56800E (16-bit DSC) · 16-bit · 60 MHz · 60 MIPS · 256 KB (128K x 16) · 8 KB (4K x 16) · 144-LQFP (20x20 mm) · Surface Mount

✓ In Stock

$10.85 / Unit

View Datasheet →

MC56F8355VFGE Maximum Ratings & Electrical Characteristics

Core Processor 56800E
Core Size 16-Bit
Core Architecture DSC (Digital Signal Controller)
Maximum Clock Speed 60 MHz
Program Memory Size 256 KB (128K x 16)
Program Memory Type FLASH
Number of I/O Pins 49
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, Temperature Sensor, WDT
Supply Voltage 3.3 V
Package 128-LQFP (14x20 mm)
Mounting Type Surface Mount
Operating Temperature -40C to +105C
MSL Level 3 (168 hours)
RoHS Status Compliant
Series 56F8xxx
Instruction Set CISC
Lead-Free Yes

MC56F8355VFGE 128-lqfp (14x20 mm) Pin Configuration Guide

Pin configuration for MC56F8355VFGE (128-lqfp (14x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

128-lqfp (14x20 mm) package pinout diagram for MC56F8355VFGE

No detailed pinout data available for MC56F8355VFGE.

Refer to the datasheet for full pin configuration.

Typical Applications

MC56F8355VFGE is suitable for 6 applications: Variable-Frequency Motor Drives (VFD), BLDC / PMSM Servo Control, Digital Power Conversion (SMPS / PFC), Industrial Automation and PLC I/O Modules, Uninterruptible Power Supplies (UPS) and Inverters, Automotive Body and Chassis Subsystems.

🏭

Variable-Frequency Motor Drives (VFD)

The MC56F8355VFGE drives AC induction and permanent-magnet motors in industrial VFDs, where its 60MHz 56800E core executes field-oriented control (FOC) loops within microsecond-scale PWM cycles. The on-chip PWM modules with complementary outputs and programmable dead-time generate the 6-step or SVPWM waveforms needed for three-phase inverter bridges. With 49 GPIO, designers can route fault inputs, encoder feedback, and CANopen communications directly to the device without external glue logic, reducing BOM cost in 1-10 kW drive cabinets.

🤖

BLDC / PMSM Servo Control

Brushless DC and permanent-magnet synchronous motors require precise commutation timing that the MC56F8355VFGE delivers through its hardware PWM and quadrature decoder support. The 256KB Flash accommodates sensorless FOC firmware with observer-based rotor-position estimation, while the 60MHz throughput keeps the current loop well under 20 microseconds. CANbus connectivity allows multi-axis servos to synchronize over industrial CANopen DS402 networks, making the part a strong fit for robotics and CNC auxiliary axes.

⚡

Digital Power Conversion (SMPS / PFC)

Switch-mode power supplies and power-factor-correction stages benefit from the MC56F8355VFGE's fast PWM update rate, allowing digital control loops to regulate output voltage and current at high switching frequencies. The 256KB program Flash holds state-space compensator coefficients and adaptive digital-filter tables for PFC + LLC or full-bridge topologies. Built-in SCI and SPI links simplify telemetry to system controllers, while the watchdog timer and fault inputs support functional-safety requirements in commercial power-conversion designs.

🏭

Industrial Automation and PLC I/O Modules

Programmable logic controller slice I/O and remote terminal units (RTUs) leverage the MC56F8355VFGE's CANbus, SCI, and SPI connectivity to aggregate sensor data and forward it to host controllers. The wide operating temperature range of -40C to +105C supports installation in cabinets near motor drives without derating. With 256KB of Flash, engineers can implement IEC 61131-3 style runtime plus proprietary protocol stacks on a single chip, simplifying distributed-IO architectures in factory-automation lines.

⚡

Uninterruptible Power Supplies (UPS) and Inverters

Online UPS systems and solar inverters rely on the MC56F8355VFGE to execute DSP-class sine-PWM generation, grid-synchronization PLLs, and MPPT algorithms in real time. The 56800E core's 16x16-bit MAC speeds up the multiply-heavy math required for dq-frame current control and THD compensation. With 256KB Flash, designers can store lookup tables for multiple battery chemistries, while on-chip PWM fault inputs cut off the inverter within microseconds on grid loss events.

🚗

Automotive Body and Chassis Subsystems

Automotive body controllers, electric power steering, and HVAC actuators can use the MC56F8355VFGE where AEC-Q100 qualification is not strictly mandated. The CANbus peripheral provides OBD-II or CAN-FD linkage to the vehicle bus, while the 49 GPIO drive MOSFET arrays for seat, window, and mirror control. Designers must pair this DSC with an external watchdog supervisor and OVP protection to meet ISO 26262 functional-safety targets at the system level.

What is the core architecture and clock speed of MC56F8355VFGE?
The MC56F8355VFGE is built on the 56800E core, a 16-bit digital signal controller (DSC) architecture running at a maximum 60MHz core clock. According to the NXP MC56F8355 datasheet, the 56800E core combines a dual Harvard bus with single-cycle 16x16-bit MAC operations, giving the part DSP-class arithmetic throughput within an MCU-style programming model.
How much program Flash memory does MC56F8355VFGE have?
The MC56F8355VFGE integrates 256KB (128K x 16) of on-chip Flash program memory. This density supports field-updateable motor-control and digital-power firmware including state machines, lookup tables for SVPWM modulation, and CANopen or J1939 protocol stacks without external memory.
What is the difference between MC56F8355VFGE and MC56F8357VVFE?
The MC56F8355VFGE uses a 128-pin LQFP package while the MC56F8357VVFE uses a 144-pin LQFP package; both share the same 56800E core at 60MHz with 256KB Flash. The VVFE variant exposes additional I/O and peripheral pins for expanded connectivity, but the VFGE footprint is suitable for cost-sensitive designs where 49 GPIO is sufficient.
What is the difference between MC56F8355VFGE and MC56F8335VFGE?
Both share the 128-pin LQFP package and 56800E core, but the MC56F8335VFGE contains only 64KB of Flash while the MC56F8355VFGE contains 256KB. The smaller-Flash variant targets cost-optimized motor-control code, whereas the MC56F8355VFGE accommodates larger firmware such as sensorless FOC algorithms.
What integrated peripherals does the MC56F8355VFGE provide for motor control?
The MC56F8355VFGE integrates PWM modules with complementary outputs and fault inputs, a 12-bit ADC (via shared analog resources on this family), a temperature sensor, and a Watchdog Timer. According to the NXP datasheet, these peripherals, combined with CANbus and SCI/SPI connectivity, allow the part to implement complete variable-frequency motor drives with minimal external components.
Where can I buy MC56F8355VFGE online and what is the price?
As of 2026-10-19, the MC56F8355VFGE is available from authorized distributors including DigiKey, Mouser, and LCSC. Pricing tiers observed: $51.34 at qty 1, dropping to approximately $36.40 at qty 1000 (Rochester Electronics / LCSC indicated stock of 18,768 pieces; lead time on Heisener noted as Can Ship Immediately).
What is the lead time for MC56F8355VFGE?
As of 2026-10-19, distributor listings indicate MC56F8355VFGE is in stock with lead times of "Can Ship Immediately" (Heisener, Rochester, LCSC). NXP's product page lists the part as Active in its lifecycle. For high-volume orders, distributors typically quote 8-12 weeks for factory-direct replenishment through NXP authorized channels.
Is MC56F8355VFGE in stock at major distributors?
Yes, as of 2026-10-19 the MC56F8355VFGE is listed in stock at LCSC (price from $48.19) and through Rochester Electronics on the DigiKey Marketplace (18,768 pieces noted). The part also shows active inventory across Mouser and DigiKey according to multiple distributor results, confirming the component remains readily available.
Which NXP DSC families are drop-in compatible with MC56F8355VFGE?
The MC56F8357VVFE (256KB Flash, 144-LQFP) and MC56F8335VFGE (64KB Flash, 128-LQFP) are same-family NXP drop-in candidates. The MC56F8355MFGE variant retains the same 256KB Flash but uses a different pin/packaging option; check pinout compatibility on a case-by-case basis.
What is the best cross-brand equivalent for MC56F8355VFGE?
The MC56F8355VFGE has no drop-in equivalent from a different silicon vendor, because the 56800E core and its peripheral map are NXP proprietary. Cross-brand alternatives such as the TI TMS320F28x family offer similar DSC functionality but require PCB redesign and firmware port because neither the pinout nor the instruction set is pin-compatible.
Can MC56F8357VVFE directly replace MC56F8355VFGE on the same PCB?
No - the MC56F8357VVFE uses a 144-pin LQFP package whereas the MC56F8355VFGE uses a 128-pin LQFP package. Although they share the 56800E core family, the package pin counts differ, so the MC56F8357VVFE is not a drop-in substitute on an existing VFGE footprint.
Where can I download the MC56F8355VFGE datasheet PDF?
The official MC56F8355 datasheet PDF is hosted at https://www.nxp.com/docs/en/data-sheet/MC56F8355.pdf on NXP's website. The same document family also covers the 56F8155 variant; this single datasheet details the 56800E core, the 256KB Flash, and the peripheral set common to the MC56F8355VFGE.
Where can I find the pinout for MC56F8355VFGE?
The pinout for MC56F8355VFGE is documented in Section 2 of the MC56F8355 datasheet (signal descriptions table) hosted on NXP's website. The 128-LQFP package follows a standard LQFP-128 perimeter numbering with dedicated pins for PWM, ADC, CAN, SCI, SPI, JTAG/OnCE debug, and GPIO.
What is the operating temperature range of MC56F8355VFGE?
The MC56F8355VFGE operates across the industrial temperature range of -40C to +105C junction, per the NXP 56F8355 datasheet. This makes the part suitable for motor-drive cabinets, outdoor power-conversion systems, and industrial automation enclosures, but not extended-grade automotive under-hood applications above +125C.
What is the supply voltage requirement of MC56F8355VFGE?
The MC56F8355VFGE operates from a single 3.3V supply rail. According to the datasheet, internal regulators provide the core voltage from this rail, so designers must use low-noise LDO post-regulation for the digital 3.3V and a separate, well-decoupled analog supply if the on-chip ADC is used for precision measurements.
How many GPIO pins does MC56F8355VFGE provide?
The MC56F8355VFGE provides 49 general-purpose I/O pins out of the 128-LQFP package's total pin count. The remaining pins are dedicated to power, ground, JTAG/OnCE debug, PWM outputs, ADC inputs, and communications peripherals such as CAN, SCI, and SPI.
Is MC56F8355VFGE RoHS compliant and lead-free?
Yes, the MC56F8355VFGE is RoHS compliant and lead-free per NXP's product page. The part uses a Pb-free 128-LQFP package with matte-tin terminations and is qualified to the LQFP-128 moisture sensitivity level (MSL) per JEDEC J-STD-020 classification.

Engineering reference data for MC56F8355VFGE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC56F8355VFGE when your design needs the maximum Flash density (256KB) on a 128-LQFP footprint - typical for sensorless FOC motor drives, multi-protocol industrial nodes, and digital power firmware where code size outweighs package-pin count. Choose MC56F8335VFGE for cost-optimized motor loops that fit in 64KB or to ease second-source consolidation. Choose MC56F8357VVFE or MC56F8356VFVE on 144-LQFP when you need 62 GPIOs or larger Flash, but accept a PCB redesign. All five parts share the 56800E core, 60MHz clock, and CAN/SPI/SCI peripherals, easing firmware portability across the family.

Comparison with Alternatives

Parameter This Product MC56F8355MFGE MC56F8357VVFE MC56F8335VFGE MC56F8347VVFE MC56F8356VFVE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-128 LQFP-128 LQFP-144 LQFP-128 LQFP-144 LQFP-144
Core 56800E 56800E 56800E 56800E 56800E 56800E
Clock Speed 60 MHz 60 MHz 60 MHz 60 MHz 60 MHz 60 MHz
Flash Memory 256 KB 256 KB 256 KB 64 KB 128 KB 280 KB
Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 2.5 V
Connectivity CAN, EBI/EMI, SCI, SPI CAN, EBI/EMI, SCI, SPI CAN, SCI, SPI CAN, EBI/EMI, SCI, SPI CAN, EBI/EMI, SCI, SPI CAN, SCI, SPI
Peripherals POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT POR, PWM, Temp Sensor, WDT

Key Differentiators

  • Largest Flash density in the 56F83x sub-family on a 128-LQFP footprint (vs MC56F8335VFGE)
  • More I/O and connectivity than lower-tier 56F83x parts (vs MC56F8357VVFE)
  • Standard 3.3V supply aligns with mainstream digital logic (vs MC56F8356VFVE)

Design Notes

The 128-LQFP package dissipates heat predominantly through its peripheral leads and a center thermal pad of copper under the die. For motor-control loops running the 56800E core at full 60MHz with all peripherals active, the junction-to-ambient thermal resistance (theta_JA) of a JEDEC 4-layer test board (EIA/JESD51) should be verified against the worst-case power dissipation. Best practice is to implement a continuous copper pour on the top layer tied to the GND pins and stitch vias to inner ground planes for optimal heat extraction.

Decouple the 3.3V supply pins with 100nF X7R ceramic capacitors placed as close as possible to each VDD pin, plus a bulk 10uF tantalum or ceramic capacitor near the package. The 56800E core draws brief, high-frequency current transients during MAC operations and PWM updates; insufficient local decoupling can cause code-fetch errors. Route the analog supply (VDDA) traces away from switching PWM outputs, and keep ADC reference traces short and guarded by analog ground.

The MC56F8355VFGE's high-speed PWM outputs and 60MHz clock edges generate strong harmonics on the order of the third and fifth odd multiples. Source-terminate the PWM lines with 33-ohm series resistors if the trace length to the gate driver exceeds 25mm, and keep PWM traces away from sensitive analog op-amp inputs. The CANbus pins require an industry-standard transceiver such as the MC33937 or TJA1050; never wire the CAN pins of the DSC directly to the bus without galvanic isolation.

A common pitfall is assuming the on-chip temperature sensor is calibrated for absolute temperature readout - it is intended for relative thermal monitoring and over-temperature interrupts. Always pair it with a periodic factory calibration if you need a system-temperature value. Another frequent mistake is leaving the JTAG/OnCE debug pins floating during production; pull TMS and TCK to defined logic levels through 10k resistors to avoid accidental entry to debug mode that resets the part. Verify Flash wait-state settings in the SIM register for the operating VDD voltage to avoid bus errors.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliant per NXP product page (MC56F8355VFGE). Part is not AEC-Q100 qualified - cross-reference MC9S12DT128MPVE or other AEC-Q100 parts from the Site MPN list for automotive safety-critical applications.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors MC56F8355VFGE MC56F8355MFGE MC56F8357VVFE MC56F8335VFGE MC56F8347VVFE MC56F8356VFVE 56800E core digital signal controller DSC microcontroller MCU DSP embedded processor LQFP-128 LQFP-144 surface mount Flash memory 256KB Flash CANbus SCI SPI PWM RoHS JEDEC J-STD-020 motor control field-oriented control FOC industrial automation
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