NXP Semiconductors

MC9S08DZ96CLH - 8-bit S08 MCU, 96KB Flash, 40MHz, 64-LQFP | NXP

MPN: MC9S08DZ96CLH ✓ Active
In Stock Ships in 1-3 business days
2.7 V to 5.5 V Vdss 64-LQFP (10x10 mm) Package 40 MHz Speed 96 KB Memory
From $6.21 USD / Unit
MOQ: 1 |
Price updated: 2026-10-17
Volume Pricing
Qty Unit Price Extended
1 $9.95 $9.95
10 $8.92 $89.20
100 $7.84 $784.00
500 $6.99 $3,495.00
1,000 $6.21 $6,210.00
ℹ️ All prices are in USD

MC9S08DZ96CLH Overview

The NXP MC9S08DZ96CLH is an 8-bit microcontroller from the S08DZ family, featuring a 40 MHz enhanced HCS08 core, 96 KB of Flash program memory, and 6 KB of on-chip SRAM, packaged in a 64-pin LQFP (10x10 mm). It belongs to the high-performance, low-cost HCS08 family of 8-bit MCU units designed for cost-sensitive embedded designs that still require CAN connectivity, EEPROM, and a rich set of analog and timer peripherals.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash/ROM), working memory (RAM), and integrated peripherals such as timers, ADCs, communication interfaces, and GPIO. The 8-bit S08 architecture sits in the broad hierarchy MCU -> embedded microcontroller -> semiconductor IC, and is widely used in appliances, automotive body electronics, industrial control, and consumer devices where deterministic interrupt response, low power, and CAN connectivity outweigh the throughput advantage of 32-bit cores. The MC9S08DZ96CLH retains the legacy HC08 instruction set while adding the BGND instruction and improved interrupt handling.

Key features of the MC9S08DZ96CLH include 96 KB of on-chip Flash, 2 KB of EEPROM, 6 KB of SRAM, a 40 MHz HCS08 CPU with a 20 MHz bus, an integrated CAN 2.0 module, multiple timers (TPM), a 12-bit ADC, an internal voltage regulator, and low-power STOP/WAIT modes. The 64-LQFP package exposes up to 53 GPIO lines, supporting direct connection to keypad matrices, LED drivers, segment LCDs, and CAN transceivers.

From an architectural standpoint, the S08DZ family integrates a 40 MHz pipelined 8-bit core with a 20 MHz peripheral bus and on-chip voltage regulation, allowing single 3.3V or 5V supply operation. The part supports background debug mode (BDM) via the BKGD pin, enabling in-circuit programming and real-time debug without an external ICE.

Typical applications include CAN-based automotive body modules (window lift, seat control, climate), industrial control nodes, HVAC controllers, security alarm panels, and appliance control boards. For these uses, the combination of CAN 2.0, on-chip EEPROM, 12-bit ADC, and 64-pin LQFP gives designers a complete BOM in a single IC.

When designing with this device, ensure the BDM debug header (BKGD, RESET, VDD, GND) is brought out to a connector for development and field firmware updates. The internal voltage regulator requires a bulk decoupling capacitor on the VDDon pin per the reference manual.

This page consolidates distributor pricing, package-specific drop-in alternatives, and practical design guidance that goes beyond the manufacturer datasheet, helping engineers select and qualify the part for production builds.

Drop-in alternatives for MC9S08DZ96CLH — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08DZ96CLH (same form factor and footprint) — differing in Program Memory Size, Core Processor, Package, ADC, Series.

NXP Semiconductors
Program Memory Size: 32 KB Flash
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Program Memory Size: 32 KB (32K x 8) Flash
Core Processor: HCS08 (S08 CISC)
Package: 48-LQFP (7x7 mm)
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Program Memory Size: 32KB (32K x 8)
Core Processor: S08 (HCS08)
ADC: 24-channel, 12-bit, 2.5 us conversion time
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Package: 64-LQFP (10 mm x 10 mm)
Series: MC9S08DZ48
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Program Memory Size: 60 KB (60K x 8) Flash
Core Processor: S08 (HCS08)
ADC: 12-bit, 24 channels
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NXP Semiconductors
Package: 48-LQFP (7x7 mm)
ADC: 10-bit ADC
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NXP Semiconductors
Program Memory Size: 32 KB (32K x 8) FLASH
Core Processor: S08 (8-bit)
Series: S08GW
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NXP Semiconductors
Program Memory Size: 16KB (16K x 8)
Core Processor: S08 (CISC)
Package: 48-LQFP (7x7 mm)
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
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NXP Semiconductors
Program Memory Size: 60 KB (60K x 8)
Core Processor: S08
Package: 48-LQFP (7x7 mm)
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Core Processor: S08 (HCS08), 8-bit
Compare with MC9S08DZ96CLH →
NXP Semiconductors
Program Memory Size: 96 KB Flash
Package: LQFP-64 (QFP 64, square, LFQFP)
Compare with MC9S08DZ96CLH →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08DZ128CLH

✅ Drop-In
📦 64-LQFP (10x10)
Flash 128 KB vs 96 KB (+33%), identical peripherals and pinout

📋 Reference alternative (not in catalog)

MC9S08DZ60CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
MC9S08DZ60 · S08 (HCS08) · 8-Bit · 40 MHz · 20 MHz · 60 KB (60K x 8) Flash · 4 KB · 54 GPIO + 1 input-only

✓ In Stock

$4.6 / Unit

View Datasheet →

MC9S08DZ48CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
8-bit HCS08 CISC microcontroller · MC9S08DZ48 · 40 MHz · 48 KB (48K x 8) · 4 KB · 3.3 V / 5 V · HCS08, 8-bit CISC · 64-LQFP (10 mm x 10 mm)

✓ In Stock

Contact for price

View Datasheet →

MC9S08DZ32CLH

✅ Drop-In
NXP Semiconductors
📦 64-LQFP (10x10)
S08 (HCS08) · 8-Bit · 40 MHz (20 MHz bus) · HC08 with added BGND instruction · Up to 32 · 32KB (32K x 8) · FLASH · 2K x 8

✓ In Stock

Contact for price

View Datasheet →

MC9S08DZ96CLD

✅ Drop-In
📦 64-LQFP (10x10)
Same die, 64-LQFP, tape and reel packaging variant

📋 Reference alternative (not in catalog)

MC9S08DZ96CLH Maximum Ratings & Electrical Characteristics

Core HCS08 8-bit
CPU Family S08DZ
Maximum CPU Frequency 40 MHz
Bus Frequency 20 MHz
Program Memory (Flash) 96 KB
RAM 6 KB
EEPROM 2 KB
Package 64-LQFP (10x10 mm)
Pin Count 64
Mounting Type Surface Mount
Supply Voltage 2.7 V to 5.5 V
Operating Temperature Range -40C to +85C
CAN Module MSCAN (CAN 2.0A/B), 1 channel
ADC 12-bit
Timers TPM (Timer/PWM Module)
GPIO Up to 53
Debug Interface Background Debug Mode (BDM)
RoHS Status Compliant

MC9S08DZ96CLH Pin Configuration

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
Pin 1 PTC0 — General-purpose I/O / TPM channel 0
Pin 2 PTC1 — General-purpose I/O / TPM channel 1
Pin 3 PTC2 — General-purpose I/O
Pin 4 PTC3 — General-purpose I/O
Pin 5 PTC4 — General-purpose I/O
Pin 6 PTC5 — General-purpose I/O
Pin 7 PTC6 — General-purpose I/O
Pin 8 PTC7 — General-purpose I/O
Pin 9 VDD — Main supply voltage
Pin 10 VSS — Ground
Pin 11 PTD0 — GPIO / CAN TX
Pin 12 PTD1 — GPIO / CAN RX
Pin 13 PTD2 — GPIO
Pin 14 PTD3 — GPIO
Pin 15 PTD4 — GPIO / TPM
Pin 16 PTD5 — GPIO / TPM
Pin 17 PTD6 — GPIO / TPM
Pin 18 PTD7 — GPIO / TPM
Pin 19 PTE0 — GPIO / IRQ
Pin 20 PTE1 — GPIO / IRQ
Pin 21 PTE2 — GPIO / IRQ
Pin 22 PTE3 — GPIO / IRQ
Pin 23 PTE4 — GPIO
Pin 24 PTE5 — GPIO
Pin 25 PTE6 — GPIO
Pin 26 PTE7 — GPIO
Pin 27 PTF0 — GPIO / ADC channel
Pin 28 PTF1 — GPIO / ADC channel
Pin 29 PTF2 — GPIO / ADC channel
Pin 30 PTF3 — GPIO / ADC channel
Pin 31 PTF4 — GPIO / ADC channel
Pin 32 PTF5 — GPIO / ADC channel
Pin 33 PTF6 — GPIO / ADC channel
Pin 34 PTF7 — GPIO / ADC channel
Pin 35 VDD — Main supply voltage
Pin 36 VSS — Ground
Pin 37 PTG0 — GPIO
Pin 38 PTG1 — GPIO
Pin 39 PTG2 — GPIO
Pin 40 PTG3 — GPIO
Pin 41 PTG4 — GPIO
Pin 42 PTG5 — GPIO
Pin 43 PTG6 — GPIO
Pin 44 PTG7 — GPIO
Pin 45 PTH0 — GPIO
Pin 46 PTH1 — GPIO
Pin 47 PTH2 — GPIO
Pin 48 PTH3 — GPIO
Pin 49 PTH4 — GPIO
Pin 50 PTH5 — GPIO
Pin 51 PTH6 — GPIO
Pin 52 PTH7 — GPIO
Pin 53 VDDon — Internal voltage regulator output (decouple)
Pin 54 BKGD — Background Debug Mode data
Pin 55 RESET — External reset input, active low
Pin 56 VSS — Ground
Pin 57 PTJ0 — GPIO
Pin 58 PTJ1 — GPIO
Pin 59 PTJ2 — GPIO
Pin 60 PTJ3 — GPIO
Pin 61 PTJ4 — GPIO
Pin 62 PTJ5 — GPIO
Pin 63 PTJ6 — GPIO
Pin 64 PTJ7 — GPIO

Typical Applications

MC9S08DZ96CLH is suitable for 6 applications: Automotive CAN Body Control Module, HVAC Climate Controller, Industrial CAN Sensor Node, Security and Alarm Panel, Appliance Control Board, Building Automation Controller.

🚗

Automotive CAN Body Control Module

The MC9S08DZ96CLH's integrated MSCAN 2.0A/B module and 96 KB Flash make it a fit for CAN-connected body controllers (window lift, seat control, climate). With 6 KB SRAM the part handles CAN stack, periodic message scheduling, and ADC-driven sensor reads. The 64-LQFP gives 53 GPIO for direct keypad and LED connection. Unlike 32-bit CAN MCUs the DZ96CLH keeps BOM and tool-chain cost low.

🏭

HVAC Climate Controller

The MC9S08DZ96CLH is well suited to HVAC controllers where multiple analog temperature sensors, PWM-driven blower motors, and a CAN or LIN backhaul are needed. The 12-bit ADC samples thermistor and pressure-sensor channels, while TPM modules generate PWM for motor control and triac phase-angle firing. The 2 KB on-chip EEPROM stores calibration and trim data without an external memory part.

🏭

Industrial CAN Sensor Node

For factory-floor sensor nodes reporting over CAN, the MC9S08DZ96CLH delivers 96 KB Flash for protocol stacks plus custom application code, 2 KB EEPROM for node ID and calibration constants, and 6 KB SRAM for message buffering. The 2.7-5.5 V supply range matches 24 V industrial bus rails after buck regulation. A real-time interrupt structure and 40 MHz core ensure deterministic CAN response.

🎥

Security and Alarm Panel

The MC9S08DZ96CLH fits alarm-panel designs that need on-board EEPROM for event logs and zone configuration, plus CAN or RS-232 to the central station. 96 KB Flash runs the panel firmware with keypad scan, PIR sensor input via ADC, and siren-driver PWM. The Background Debug Mode pin enables field firmware updates without an external programmer.

⚡

Appliance Control Board

Washing machines, dishwashers, and induction cooktops use the MC9S08DZ96CLH for motor-control PWM via TPM, user-interface key scan through GPIO, and EEPROM-backed fault logs. The 2 KB EEPROM stores user preferences and diagnostic history. The 64-LQFP gives enough pins for direct drive of LED status displays, triac interfaces, and zero-cross detectors.

🧩

Building Automation Controller

Lighting-control and access-control panels benefit from the MC9S08DZ96CLH's CAN interface, large Flash, and on-chip EEPROM. The 12-bit ADC reads ambient light sensors and potentiometer-based dimmer setpoints; TPM channels drive 0-10 V analog outputs for dimmable ballasts. The 64-LQFP package is a drop-in for both DZ128CLH and DZ60CLH derivatives, simplifying BOM across product variants.

Recommended Products Summary

TJA1050 NXP Semiconductors Used in: Automotive CAN Body Control Module, Building Automation Controller MC9S08DZ128CLH Drop-in upgrade with 128 KB Flash Used in: Automotive CAN Body Control Module, Industrial CAN Sensor Node, Building Automation Controller MC9S08DZ60CLH NXP Semiconductors Used in: HVAC Climate Controller, Appliance Control Board MAX31865 RTD temperature sensor companion Used in: HVAC Climate Controller, Security and Alarm Panel TJA1040 High-speed CAN transceiver Used in: Industrial CAN Sensor Node MC9S08DZ48CLH NXP Semiconductors Used in: Security and Alarm Panel MC9S08DZ32CLH NXP Semiconductors Used in: Appliance Control Board
What is the flash memory size of the MC9S08DZ96CLH?
The MC9S08DZ96CLH provides 96 KB of on-chip Flash program memory. According to the NXP MC9S08DZ96 datasheet, the Flash is organized as 96K x 8 and supports in-application reprogramming and block protection. Combined with 6 KB of SRAM and 2 KB of EEPROM, it gives a total of 104 KB of on-chip non-volatile and volatile memory, suitable for CAN node firmware stacks plus data logging.
What is the maximum CPU clock frequency of the MC9S08DZ96CLH?
The MC9S08DZ96CLH runs at a maximum 40 MHz CPU frequency with a 20 MHz peripheral bus. This 2:1 ratio is characteristic of the S08 family: the core is fed by the FLL while peripherals see a divided clock. The 40 MHz core delivers approximately 20 MIPS of 8-bit throughput, which is adequate for CAN stack processing, ADC conversion, and TPM-driven PWM control simultaneously.
Does the MC9S08DZ96CLH include a CAN controller?
Yes. The MC9S08DZ96CLH integrates an MSCAN (Motorola Scalable CAN) module implementing CAN 2.0A and 2.0B active at up to 1 Mbps. The peripheral is mapped on the 20 MHz bus and supports 5 message buffers, programmable acceptance filters, and listen-only mode. An external CAN transceiver such as the TJA1050 is required for the physical layer.
What package does the MC9S08DZ96CLH use?
The MC9S08DZ96CLH ships in a 64-pin LQFP (Low-profile Quad Flat Pack) at 10x10 mm body size with 0.5 mm pitch. According to the NXP datasheet, the part is identified by the suffix CLH, where CL denotes the 64-LQFP package and H denotes the operating temperature grade -40C to +85C. The same-die variants ship in other suffixes such as CLK and CGH for different package and temperature combinations.
Where can I buy the MC9S08DZ96CLH and what is the price?
The MC9S08DZ96CLH is in active distribution at DigiKey, Mouser, and Rochester Electronics. Prices as of 2026-10-18 start around $9.95 at qty 1, dropping to roughly $6.21 per unit at qty 1000 in tape-and-reel packaging. Lead time is typically 8-12 weeks from authorized distributors due to mature-process allocation.
What is the lead time and stock status for the MC9S08DZ96CLH?
As of 2026-10-18, DigiKey lists Rochester Electronics LLC as a franchised source with active stock; Mouser and Octopart show variable inventory across 4 distributors. Typical lead time is 8-12 weeks from NXP factory orders. For urgent builds, NXP authorized distributors and the Rochester Electronics LLC franchise carry the part.
What is the best drop-in replacement for the MC9S08DZ96CLH?
The best drop-in replacement for the MC9S08DZ96CLH is the MC9S08DZ128CLH, which is the same S08DZ family die in 64-LQFP, with 128 KB Flash and the identical peripheral set. For firmware-compatible same-family drop-ins, the MC9S08DZ60CLH (60 KB Flash) and MC9S08DZ48CLH (48 KB Flash) are also pin-to-pin compatible in the same 64-LQFP footprint.
Can the MC9S08DZ128CLH replace the MC9S08DZ96CLH?
Yes. The MC9S08DZ128CLH is a pin-compatible superset of the MC9S08DZ96CLH in the same 64-LQFP package. It doubles the Flash to 128 KB while keeping the identical 6 KB SRAM, 2 KB EEPROM, MSCAN, 12-bit ADC, and TPM peripherals. Firmware built for the 96 KB variant runs unchanged on the 128 KB variant once the linker memory map is adjusted.
MC9S08DZ96CLH vs MC9S08AC60CPUE - which is better for CAN applications?
For CAN applications, the MC9S08DZ96CLH is the better fit. It integrates an MSCAN 2.0A/B module, 96 KB Flash, and 2 KB EEPROM in a 64-LQFP package - tailored for CAN node designs. The MC9S08AC60CPUE belongs to the S08AC family without an integrated CAN module and is built around the 8-bit S08 core but optimized for ADC and timer density, not CAN connectivity.
MC9S08DZ96CLH vs MC9S08FL8CLC - which should I choose for low-power?
For low-power battery applications, the MC9S08FL8CLC from the S08FL family is the better choice: it ships in a small 32-LQFP and adds an ultra-low-power stop mode with sub-uA current. The MC9S08DZ96CLH targets line-powered CAN nodes with 64-LQFP and richer peripherals. Pick FL8CLC for sub-100 uA sleep budgets, pick DZ96CLH for CAN-capable nodes.
When should I choose the MC9S08DZ96CLH over the MC9S08DZ60CLH?
Choose the MC9S08DZ96CLH when your firmware image exceeds 60 KB after compilation, or when you want headroom for field firmware updates and bootloader growth. Both parts share the same 64-LQFP pinout and identical peripheral set; the 96 KB part simply gives you 36 KB more Flash. If the compiled binary fits within 60 KB, the DZ60CLH is a cost-down drop-in option.
Where can I download the MC9S08DZ96CLH datasheet?
The official MC9S08DZ96CLH datasheet PDF is hosted on the NXP website at https://www.nxp.com/docs/en/data-sheet/MC9S08DZ96.pdf. It covers electrical characteristics, pinout, peripheral modules, and package dimensions. Pinout diagrams are located in section 1 of the datasheet (Device Overview) and the package drawing is in section 9 (Package Information).
Where to find the MC9S08DZ96CLH pinout?
The MC9S08DZ96CLH pinout for the 64-LQFP package is published in the NXP datasheet, section 1 (Device Overview) and section 9 (Package Information). Pin 1 is located at the top-left of the LQFP top surface marked by a dimple. The pinout assigns MSCAN, TPM, ADC, IRQ, BKGD, RESET, VDD, and VDDon functions to specific ball/pin positions on the 64-LQFP.
What are the key specifications of the MC9S08DZ96CLH that engineers should know?
The MC9S08DZ96CLH key specifications are: 8-bit HCS08 core at 40 MHz with 20 MHz bus, 96 KB Flash, 6 KB SRAM, 2 KB EEPROM, 64-LQFP 10x10 mm package, integrated MSCAN 2.0A/B, 12-bit ADC, up to 53 GPIO, 2.7-5.5 V single supply, -40C to +85C operating range, and Background Debug Mode for in-circuit programming. It is part of NXP's cost-optimized S08DZ CAN-enabled family.
What is the best Freescale/NXP equivalent for the MC9S08DZ96CLH?
The best NXP-family drop-in equivalent is the MC9S08DZ128CLH (128 KB Flash, same 64-LQFP). For downward scaling, MC9S08DZ60CLH (60 KB Flash) and MC9S08DZ48CLH (48 KB Flash) are pin-to-pin compatible. For different memory architecture, the S08AC-family MC9S08AC128CFGE provides 128 KB Flash in a similar 64-LQFP but lacks the MSCAN module.

Engineering reference data for MC9S08DZ96CLH — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08DZ96CLH when designing a CAN-connected embedded node that needs between 60 KB and 96 KB of Flash, up to 53 GPIO, and an integrated MSCAN controller. It is the sweet-spot part in the S08DZ family. For firmware images above 96 KB, pick the MC9S08DZ128CLH; for cost-down builds where the binary fits within 60 KB, the MC9S08DZ60CLH is a direct drop-in. For applications without CAN, look at the S08AC family (no MSCAN). For ultra-low-power designs, the S08FL family (sub-uA stop current) is the better fit.

Comparison with Alternatives

Parameter This Product MC9S08DZ128CLH MC9S08DZ60CLH MC9S08DZ48CLH MC9S08DZ32CLH
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Package 64-LQFP (10x10) 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same 64-LQFP (10x10) - same
Flash Memory 96 KB 128 KB 60 KB 48 KB 32 KB
SRAM 6 KB 6 KB 4 KB 4 KB 2 KB
EEPROM 2 KB 2 KB 2 KB 2 KB 2 KB
CPU Frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
CAN Module MSCAN 2.0A/B MSCAN 2.0A/B MSCAN 2.0A/B MSCAN 2.0A/B MSCAN 2.0A/B
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C

Key Differentiators

  • Higher Flash density in same 64-LQFP package (vs MC9S08DZ60CLH)
  • Integrated MSCAN controller (vs MC9S08AC60CPUE)
  • Pin-to-pin compatible upgrade path within S08DZ family (vs MC9S08DZ32CLH)

Design Notes

The MC9S08DZ96CLH requires a single 2.7-5.5 V supply on the VDD pins. The internal voltage regulator generates the core 1.8 V from VDD; VDDon pin must be decoupled with a 1 uF ceramic capacitor placed as close to the pin as possible. For CAN applications, power the VDD of the TJA1050 or TJA1040 transceiver from the same 5 V rail, with 100 nF + 10 uF bulk caps on the transceiver VCC.

Decoupling: place a 100 nF X7R ceramic on each VDD pin and a 4.7-10 uF bulk on the main VDD node. Keep the BGND/RESET trace short and route the BKGD/MSCAN lines away from PWM and ADC analog traces to avoid coupling. The 64-LQFP 10x10 mm package has a 0.5 mm pitch; use 0.2 mm traces with 0.2 mm spacing to escape the inner pins.

Estimated: when using the on-chip Flash for in-application reprogramming, ensure the FLASH protection register FPROT is set to lock application vectors from accidental overwrite during a brown-out. The 2 KB EEPROM supports 100k write cycles minimum - do not exceed this in datalogging loops, or move the wear to an external FRAM. The MSCAN module requires a clean 1 Mbps-capable bus; verify the CAN bus termination 120 ohm resistors are present.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per NXP product page. Not AEC-Q100 qualified - this is a commercial/industrial grade part. For automotive body-control applications requiring AEC-Q100, consult NXP automotive-grade S08DZ variants (different suffix).

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S08DZ96CLH MC9S08DZ128CLH MC9S08DZ60CLH MC9S08DZ48CLH MC9S08DZ32CLH HCS08 core 8-bit microcontroller S08DZ family MSCAN CAN 2.0A/B Flash memory EEPROM SRAM 64-LQFP package LQFP surface mount RoHS automotive CAN bus body control module Background Debug Mode (BDM) TPM Timer/PWM Module 12-bit ADC NXP Freescale
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