MCF5249LCAG120 - ColdFire V2 MCU 32-Bit 120MHz ROMless | NXP
MPN: MCF5249LCAG120 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.19 | $9.19 |
| 10 | $8.45 | $84.50 |
| 100 | $7.62 | $762.00 |
| 500 | $6.85 | $3,425.00 |
| 1,000 | $6.1 | $6,100.00 |
MCF5249LCAG120 Overview
A ColdFire V2 microprocessor is a 32-bit RISC-style processor core derived from the legacy Freescale (now NXP) 68k architecture. The ColdFire family occupies the middle tier of NXP's embedded processor portfolio, sitting between the 8/16-bit S08 and the higher-performance ColdFire V4/V5 and Kinetis/EZport lines. ColdFire V2 cores target audio, industrial control, and connectivity applications where deterministic behavior and low power consumption outweigh raw MHz.
Key features include 96 KB of on-chip SRAM, hardware AES encryption via the ColdFire SEC engine (on selected family members), audio enhancements (I2S, Serial Audio interface), and a rich peripheral set: I2C, SPI, UART/USART, IDE, Memory Card, DMA, POR, and Watchdog. The 144-LQFP package supports 120 MHz operation with proper PCB thermal design for industrial-grade temperature ranges. The ROMless design enables full customization of boot code and firmware, common in OEM designs where intellectual property protection is critical.
Typical applications include industrial audio processors, networked audio endpoints, point-of-sale terminals, factory automation controllers, and embedded web servers. The MCF5249LCAG120's combination of audio peripherals and Ethernet-class connectivity peripherals (where populated) makes it especially well-suited for converged audio + control products.
When designing with this device, note that external boot Flash must be sized to accommodate both boot loader and application code. The ROMless architecture requires a verified memory interface timing closure between the ColdFire and the external Flash.
This page consolidates distributor pricing, pin-compatible family variants, and end-of-life replacement guidance that is not assembled in the manufacturer datasheet alone, helping engineers make sourcing decisions with full lifecycle context.
Drop-in alternatives for MCF5249LCAG120 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCF5249LCAG120 (same form factor and footprint) — differing in Program Memory Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCF5249LAG120
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View Datasheet →MCF5249LCA120
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5249CAG120
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5249LAG100
✅ Drop-In📋 Reference alternative (not in catalog)
MCF5248LCAG120
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCF5249LCAG120 Maximum Ratings & Electrical Characteristics
| Core Processor | ColdFire V2 |
| Core Size | 32-Bit |
| Maximum Core Frequency | 120 MHz |
| Dhrystone Performance | 125 MIPS at 140 MHz |
| Power Consumption | 1.3 mW/MHz (lowest in ColdFire family) |
| On-chip SRAM | 96 KB |
| Program Memory Type | ROMless (external Flash required) |
| Package | 144-LQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Connectivity | I2C, IDE, Memory Card, SPI, UART/USART |
| Peripherals | DMA, I2S, POR, Serial Audio, WDT |
| Series | MCF524x |
| Operating Temperature (industrial) | -40C to +85C |
| RoHS Status | Not compliant (legacy NXP/Freescale LQFP) |
| Lead-Free | No (SnPb finish typical for this family) |
MCF5249LCAG120 144-lqfp (20x20 mm) Pin Configuration Guide
Pin configuration for MCF5249LCAG120 (144-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCF5249LCAG120.
Refer to the datasheet for full pin configuration.
Typical Applications
MCF5249LCAG120 is suitable for 6 applications: Industrial Audio Processor, Point-of-Sale Terminal Controller, Factory Automation Controller, Networked Audio Endpoint, Embedded Web Server / IoT Gateway, Medical Device Data Logger.
Industrial Audio Processor
The MCF5249LCAG120 is well suited to industrial audio processing applications where its ColdFire V2 core delivers 125 Dhrystone 2.1 MIPS while consuming only 1.3 mW/MHz, enabling fanless enclosures. The integrated I2S and Serial Audio interfaces connect directly to common audio DACs (e.g., CS4344, PCM1774) without external glue logic, and the 96 KB on-chip SRAM buffers dual 48 kHz stereo streams with headroom for MP3/AAC decoding via the enhanced MAC unit. The 120 MHz operating frequency keeps codec latency under 5 ms, satisfying real-time audio requirements. ColdFire determinism plus 144-LQFP industrial temperature rating (-40C to +85C) make this part reliable for factory PA systems, kiosk audio endpoints, and intercom controllers.
Recommended
Point-of-Sale Terminal Controller
POS terminals require a 32-bit controller that can drive a graphical display, manage a magnetic-stripe or smart-card reader, and handle network connectivity simultaneously. The MCF5249LCAG120's ColdFire V2 core runs the terminal application and the EMAC unit accelerates DES/AES encryption for payment security, while the integrated DMA channels offload the central processor for sustained cryptographic throughput. With 96 KB of on-chip SRAM plus external boot Flash, the ROMless architecture protects custom payment firmware from cloning. The 144-LQFP package fits standard POS motherboard layouts and the -40C to +85C industrial range tolerates the enclosed thermal environment of retail terminals.
Recommended
Factory Automation Controller
Factory automation controllers benefit from the MCF5249LCAG120's deterministic ColdFire V2 architecture combined with its rich peripheral mix: UART/USART for RS-485 fieldbus, SPI for sensor interfacing, I2C for EEPROM and RTC, and DMA channels for high-throughput data acquisition. At 120 MHz the part can poll up to 16 sensor inputs at 1 ms intervals while running control loops with predictable jitter under 2 us. The 1.3 mW/MHz power figure keeps thermal dissipation manageable in sealed DIN-rail enclosures, and the 144-LQFP package withstands industrial vibration profiles better than BGA alternatives. ColdFire's mature GNU toolchain (m68k-elf-gcc) and NXP's CodeWarrior IDE shorten time-to-market.
Recommended
Networked Audio Endpoint
Streamed-audio endpoints such as IP speakers and intercom stations require an MCU that can decode compressed audio over Ethernet while maintaining low latency. The MCF5249LCAG120's ColdFire V2 EMAC accelerates Ogg Vorbis and MP3 decoding, and the integrated DMA moves decoded PCM samples to the I2S interface without CPU intervention. Combined with 96 KB of SRAM, the device handles single-stream 44.1 kHz decoding with 30% CPU headroom for TCP/IP stack processing. Power consumption of 1.3 mW/MHz enables PoE Class 2 designs without auxiliary power. The 144-LQFP industrial temperature rating supports outdoor and warehouse deployments where ambient temperatures swing widely.
Recommended
Embedded Web Server / IoT Gateway
Lightweight IoT gateways that expose Modbus or serial sensor data over HTTP benefit from the MCF5249LCAG120's combination of ColdFire V2 deterministic performance and rich peripheral connectivity. The V2 core runs a lightweight TCP/IP stack (e.g., lwIP ported to ColdFire) while the UART/USART, SPI, and I2C peripherals aggregate sensor data from downstream nodes. ROMless architecture enables custom secure-boot firmware, and the EMAC unit accelerates TLS handshake operations. The 120 MHz clock handles 10 simultaneous HTTP connections at sub-100 ms response times. The 144-LQFP package and -40C to +85C range suit industrial cabinet installations.
Recommended
Medical Device Data Logger
Medical data loggers require deterministic behavior, reliable long-term data retention, and a BOM that can survive multi-year product lifecycles. The MCF5249LCAG120's ColdFire V2 core provides the deterministic interrupt latency required by IEC 62304-style medical firmware, while the ROMless architecture allows cryptographic signing of recorded data. The 96 KB on-chip SRAM buffers sensor samples between Flash writes, and the DMA channels sustain high-throughput ADC sampling without CPU load. The 1.3 mW/MHz power figure supports battery-backed designs where the device sleeps between acquisitions. The 144-LQFP package and NXP/Freescale legacy lifecycle data simplify FDA 510(k) documentation.
Recommended
Recommended Products Summary
Engineering reference data for MCF5249LCAG120 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCF5249LAG120 | MCF5249LCA120 | MCF5249CAG120 | MCF5249LAG100 |
|---|---|---|---|---|---|
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Core Frequency | 120 MHz | 120 MHz | 80 MHz | 120 MHz | 100 MHz |
| On-chip SRAM | 96 KB | 96 KB | 96 KB | 96 KB | 96 KB |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless |
| Connectivity | I2C, SPI, UART, I2S, IDE | I2C, SPI, UART, I2S, IDE | I2C, SPI, UART, I2S, IDE | I2C, SPI, UART, I2S, IDE | I2C, SPI, UART, I2S, IDE |
| Lifecycle Status | EOL (NXP last-time-buy) | EOL (NXP last-time-buy) | EOL (NXP last-time-buy) | EOL (NXP last-time-buy) | EOL (NXP last-time-buy) |
Key Differentiators
- Lowest power consumption of any ColdFire V2 device (vs MCF5248LCAG120)
- 120 MHz top speed grade in 144-LQFP (vs MCF5249LAG100)
- Industrial temperature grade availability (vs MCF52254CAF66)
Design Notes
At 120 MHz full operation, the MCF5249LCAG120 dissipates approximately 156 mW of core power, plus peripheral I/O. The 144-LQFP package has a typical theta_JA of approximately 40 C/W (per NXP package thermal data), so a fully active part in still air sees a 6 C junction rise. Estimated: design the PCB with at least 4 square inches of unbroken ground pour beneath the part and use 4-layer PCB with a dedicated ground plane for production designs. For sealed enclosures without forced airflow, derate clock speed to 100 MHz to keep junction rise below 50 C.
Place the external boot Flash on the same PCB layer as the MCF5249LCAG120, with stub length under 25 mm to keep the ColdFire bus interface timing margins intact. Add 33 ohm series damping resistors on the data bus for EMI control if the Flash is placed more than 50 mm away. Provide 0.1 uF decoupling capacitors on every VDD pin plus 10 uF bulk caps on the main VDD rails, placed within 5 mm of the relevant pins. The 144-LQFP package has fine 0.5 mm pitch leads - use NSMD pads with 8 mil solder mask expansion for reliable reflow.
The ROMless architecture requires a verified boot Flash configuration: chip-select 0 must be sized correctly for the boot vector fetch (16-bit wide, 4-cycle access for 120 MHz). Verify that the external Flash OE/WE timings meet the ColdFire bus specification. Do not assume that later MCU vendor revisions (MCF5249CAG120) are drop-in for this part; the suffix ordering codes are non-trivial. Always re-validate firmware against the actual part marking on the reel, especially for last-time-buy inventory where substitutions are common.
Compliance Information
Non-RoHS SnPb finish is typical for the 144-LQFP variant. Lead-free versions may be available on limited distributor stock; check lot-specific material declaration. REACH compliant per NXP product environmental quality data. AEC-Q100 not applicable - this is an industrial-grade MCU, not automotive qualified.
