MK24FN1M0VLL12R - 120MHz Cortex-M4 K24 MCU, 1MB Flash, USB | NXP
MPN: MK24FN1M0VLL12R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.4 | $6,700.00 |
| 1,000 | $11.95 | $11,950.00 |
| 3,000 | $10.8 | $32,400.00 |
MK24FN1M0VLL12R Overview
What is a Kinetis K24 microcontroller? The Kinetis K24 is a sub-family of NXP's ARM Cortex-M4F portfolio that targets low-power, cost-sensitive applications requiring high-performance processing efficiency and large memory densities. It sits within the broader Kinetis K-series hierarchy (K20/K22/K24/K64), combining the M4F core with floating-point unit, DMA, flexible low-power modes, and a wide range of serial interfaces. The K24 is designed for connected devices where USB, CAN, and Ethernet (via external PHY) are common requirements.
Key features of the MK24FN1M0VLL12R include 1 MB program flash, 256 KB SRAM, full-speed USB 2.0 OTG with on-chip transceiver, dual CAN 2.0B controllers, three SPI modules, three I2C modules, four UART modules, 16-bit SAR ADC, 12-bit DAC, programmable delay block, low-power touch-sensing interface, and run currents as low as 250 uA/MHz. Stop-mode currents below 340 nA and 4.5 us wake-up times support battery-powered designs.
The device uses a Cortex-M4F core with single-precision FPU, MPU, and DSP extensions. Its flexible clocking topology supports PLL, FLL, and external references, and an integrated 4-channel DMA engine offloads peripheral transfers. The 1.71-3.6 V wide supply range enables direct operation from Li-Ion, 2xAA, or regulated 3.3 V rails, simplifying system power architecture.
Typical applications include industrial motor control and HMI, USB-CAN bridges, factory automation nodes, portable medical monitoring, low-power wireless sensor hubs, building automation, and connected consumer products. The K24 family balances compute throughput, memory headroom, and USB/CAN connectivity in one part.
When designing with the MK24FN1M0VLL12R, plan decoupling with 100 nF plus 4.7 uF bulk capacitors near each supply pin. Use the KSDK/Kinetis SDK and Processor Expert/Pins tool for peripheral initialization; the device's low-leakage wake-up unit supports up to eight internal modules triggered from low-power modes. PCB layout should give the 100-LQFP thermal pad a copper pour of at least 25 mm^2 to keep junction temperature within range during peak CPU loads.
This page synthesizes distributor pricing, drop-in K24-family alternatives, and PCB design guidance not found in the standalone datasheet, giving engineers a faster path from selection to prototype.
Drop-in alternatives for MK24FN1M0VLL12R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK24FN1M0VLL12R (same form factor and footprint) — differing in Package, USB, ADC, CAN, MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK24FN1M0VLL12
✅ Drop-In✓ In Stock
$8.95 / Unit
View Datasheet →MK24FN1M0VLQ12
✅ Drop-In📋 Reference alternative (not in catalog)
MK24FN1M0VDC12
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.75 / Unit
View Datasheet →MK64FN1M0VLL12
✅ Drop-In✓ In Stock
$7.95 / Unit
View Datasheet →MK64FN1M0VLL12R
✅ Drop-In📋 Reference alternative (not in catalog)
MIMXRT1064CVL5A
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.1 / Unit
View Datasheet →MK24FN1M0VLL12R Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with FPU, MPU, DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 256 KB |
| USB | USB 2.0 Full-Speed OTG with on-chip transceiver |
| CAN | 2 x CAN 2.0B |
| SPI | 3 modules |
| I2C | 3 modules |
| UART | 4 modules |
| ADC | 16-bit SAR ADC |
| DAC | 12-bit DAC |
| Supply Voltage | 1.71 V to 3.6 V |
| Operating Temperature | -40C to +105C |
| Package | 100-LQFP (14 x 14 mm) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| Run Current | 250 uA/MHz (typical) |
| Stop Current | <340 nA (typical) |
| Wake-up Time | 4.5 us from Stop mode |
MK24FN1M0VLL12R 100-lqfp (14 x 14 mm) Pin Configuration Guide
Pin configuration for MK24FN1M0VLL12R (100-lqfp (14 x 14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MK24FN1M0VLL12R.
Refer to the datasheet for full pin configuration.
Typical Applications
MK24FN1M0VLL12R is suitable for 6 applications: USB-CAN Industrial Gateway, Portable Medical Monitoring Device, Industrial HMI Controller, Building Automation Sensor Hub, Connected Consumer Product with USB, Low-Power Wireless Sensor Node.
USB-CAN Industrial Gateway
The MK24FN1M0VLL12R is well suited for USB-to-CAN gateway designs because it integrates both a USB 2.0 Full-Speed OTG controller with on-chip transceiver and two independent CAN 2.0B controllers on a single die. With 1 MB of flash the device can host a full CANopen or J1939 stack alongside USB CDC drivers without external memory. The 120 MHz Cortex-M4F core runs USB and CAN DMA transfers concurrently with minimal CPU load, and the 100-LQFP package exposes both buses on dedicated pins.
Recommended
Portable Medical Monitoring Device
Medical monitoring applications benefit from the MK24FN1M0VLL12R's 16-bit SAR ADC for high-resolution sensor digitization, 12-bit DAC for stimulus generation, and Cortex-M4F DSP extensions for real-time filtering. Stop-mode currents below 340 nA extend battery life on wearable form factors, while 4.5 us wake-up time preserves responsiveness. The 1.71-3.6 V supply range supports direct Li-Ion or 2xAA operation without additional regulators.
Recommended
Industrial HMI Controller
Human-machine interfaces require both display control and communication. The MK24FN1M0VLL12R drives TFT panels through SPI or parallel interfaces while simultaneously handling UART, SPI, and I2C peripherals for sensor aggregation. The 1 MB flash holds graphical libraries and protocol stacks, and 256 KB SRAM is sufficient for frame buffers on small displays. The 100-LQFP 14x14 mm footprint is compatible with mainstream industrial PCB layouts.
Recommended
Building Automation Sensor Hub
Building automation sensors demand low power, multiple serial interfaces, and reliable connectivity. The MK24FN1M0VLL12R integrates three SPI, three I2C, four UART, and dual CAN for sensor aggregation and backbone communication. Run currents of 250 uA/MHz and Stop currents below 340 nA keep average draw low. USB OTG enables local commissioning tools, and the wide supply voltage supports Power-over-Ethernet tap architectures.
Recommended
Connected Consumer Product with USB
Consumer products that need USB connectivity for firmware updates, charging, or data sync leverage the on-chip USB 2.0 Full-Speed OTG transceiver to eliminate external PHY cost. The 120 MHz Cortex-M4F runs UI stacks efficiently, while 1 MB flash stores graphics assets. Stop mode below 340 nA preserves battery life in standby, and the 100-LQFP footprint is widely supported by low-cost PCB manufacturers.
Recommended
Low-Power Wireless Sensor Node
When paired with an external sub-GHz or 2.4 GHz transceiver over SPI, the MK24FN1M0VLL12R forms a flexible wireless sensor node. The Cortex-M4F DSP extensions accelerate AES and whitening operations, while Stop mode below 340 nA preserves battery during sleep. The 1 MB flash supports OTA update partitions, and the wide 1.71-3.6 V supply tolerates discharged Li-Ion cells gracefully. USB OTG allows direct tethering for configuration.
Recommended
Recommended Products Summary
Engineering reference data for MK24FN1M0VLL12R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK24FN1M0VLL12 | MK24FN1M0VLQ12 | MK24FN1M0VDC12 | MK64FN1M0VLL12 | MK64FN1M0VLL12R | MIMXRT1064CVL5A |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) | 100-LQFP (20x20 mm) | 100-LQFP (Tray) | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 100 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M7 @ 600 MHz |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 1 MB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 1 x CAN 2.0B | 1 x CAN 2.0B | 2 x CAN FD |
| Carrier | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | Tray |
Key Differentiators
- Dual CAN 2.0B alongside USB 2.0 OTG on same die (vs MK64FN1M0VLL12)
- Wide 1.71-3.6 V supply with sub-340 nA stop current (vs MIMXRT1064CVL5A)
- 1 MB flash with USB-CAN without external memory (vs MIMXRT1064CVL5A)
Design Notes
Place a 100 nF decoupling capacitor on every VDD pin and at least one 4.7 uF bulk capacitor near the 100-LQFP package to suppress core switching noise. The USB transceiver requires a dedicated 3.0-3.6 V rail; do not share its decoupling network with the MCU core supply. Use a ferrite bead between the MCU VDD and USB VDD to prevent switching noise from coupling into USB signaling.
Estimated: at 120 MHz with peripherals active, the K24 typically dissipates around 200 mW. The 100-LQFP 14x14 mm package has a thermal resistance of approximately 50 C/W on a standard 4-layer JEDEC test board, yielding a junction rise of about 10 C above ambient. For continuous high-duty USB or CAN operation, attach a copper pour of at least 25 mm^2 to the exposed pad area to keep Tj below 105 C.
Route USB DP/DN as a 90-ohm differential pair with length matching within 150 mil, and place the ESD protection array within 5 mm of the USB connector. The CAN bus signals should also follow IPC-2221 guidelines with characteristic impedance near 120 ohms and 120-ohm termination at each end of the bus. Keep high-speed edges away from the analog ADC inputs to minimize digital switching noise pickup.
Do not operate the USB transceiver below 3.0 V - the on-chip PHY drops out of compliance. Verify the K24 boot configuration pins (BOOTCFG0/1) are pulled correctly for the desired boot source before locking the PCB. When migrating to MK64FN1M0VLL12, remap USB pins to Ethernet pins explicitly; the two families share the package but reassign some peripheral functions.
Compliance Information
RoHS and REACH compliance per NXP product environmental disclosures. Halogen-free status should be confirmed via the NXP MDDS for the specific date code. Not AEC-Q100 qualified; for automotive applications choose KEA or S32K families.