MPC8271CZQTIEA557 - PowerQUICC II MPU, 400 MHz, 516-PBGA | NXP
MPN: MPC8271CZQTIEA557 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $86.5 | $86.50 |
| 10 | $79.8 | $798.00 |
| 100 | $71.2 | $7,120.00 |
| 500 | $64.5 | $32,250.00 |
| 1,000 | $59.9 | $59,900.00 |
MPC8271CZQTIEA557 Overview
What is an MPU (Microprocessor Unit)? A microprocessor is the central processing IC in an embedded system. Unlike a microcontroller (MCU), an MPU typically requires external memory, external peripherals, and external power management, and is paired with companion chips to form a complete SoC-like platform. The PowerQUICC II hierarchy sits in the broader category of communications processors - PowerPC core -> PowerQUICC II family -> communications MPU -> embedded microprocessor -> semiconductor. PowerQUICC II MPUs are widely deployed in telecom, networking, and industrial control equipment where deterministic communication throughput matters.
Key features of the MPC8271CZQTIEA557 include a 16 Kbyte instruction cache, 16 Kbyte data cache, integrated Fast Ethernet MAC, dual UART, dual I2C, USB 2.0 (per the Freescale-era datasheet family), PCI bridge interface, and multiple serial interfaces. The device operates from a 3.3 V I/O supply with separate core voltage rails and supports operating temperatures up to 105 C junction. The 27 x 27 mm PBGA package provides the high pin count and thermal performance required for high-speed parallel buses.
The MPC8271 architecture combines a general-purpose 32-bit PowerPC core with a hardware protocol engine (CPM) that handles communication tasks independently, reducing CPU load for networking, serial, and bridging workloads. This makes the device suitable for routing, switching, and protocol conversion systems.
Typical applications include SOHO / mid-range routers, network attached storage (NAS), industrial control with Ethernet/IP, telecom base station controllers, and legacy DSLAM / access multiplexer designs. Engineering note: the 516-PBGA footprint demands multilayer PCB stack-up with controlled-impedance routing for the external memory bus.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MPC8271CZQTIEA557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8271CZQTIEA557 (same form factor and footprint) — differing in Package, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8271CZQTIEA
✅ Drop-In✓ In Stock
$44.1 / Unit
View Datasheet →KMPC8271CZQTIEA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8271CVRPIEA
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →MPC8271VVQLFA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8271CZQMIEA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8271CZQTIEA557 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC8271CZQTIEA557 |
| Core Architecture | PowerPC G2_LE |
| Product Family | PowerQUICC II (MPC82xx) |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum CPU Frequency | 400 MHz |
| Package | 516-PBGA (27 x 27 mm) |
| Mounting Type | Surface Mount |
| I/O Voltage | 3.3 V |
| Instruction Cache | 16 Kbyte |
| Data Cache | 16 Kbyte |
| USB | USB 2.0 (1 port) |
| Lifecycle | Last Time Buy / Legacy support through authorized distributors |
MPC8271CZQTIEA557 Pin Configuration
| Pin F25 | VDD — Core supply voltage |
| Pin A1 | TDI — JTAG Test Data Input |
| Pin B1 | TCK — JTAG Test Clock |
| Pin C1 | TMS — JTAG Test Mode Select |
| Pin D1 | TRST — JTAG Test Reset |
| Pin E2 | RESET — Hard reset input (active low) |
| Pin GND1 | GND — Common ground reference |
| Pin BGA_PAD | GND_PAD — Thermal/ground pad beneath package |
Typical Applications
MPC8271CZQTIEA557 is suitable for 6 applications: SOHO / Mid-Range Router, Network Attached Storage (NAS), Industrial Ethernet Gateway, Legacy DSLAM / Access Multiplexer, Telecom Base Station Controller, Embedded Industrial Control.
SOHO / Mid-Range Router
The MPC8271CZQTIEA557's integrated Fast Ethernet MAC and PCI bridge make it a strong fit for SOHO / mid-range router platforms. The PowerPC G2_LE core at 400 MHz executes routing tables and NAT translation while the CPM offloads packet processing in hardware, freeing the CPU for control-plane and management tasks. Typical BOM places the MPC8271CZQTIEA557 alongside an SDRAM for main memory, a NOR boot flash, and a 10/100 Ethernet PHY on the MII interface - providing a 4-port router with a single MPU. Compared with a software-only MCU approach, the CPM hardware assist keeps packet latency predictable under load.
Recommended
Network Attached Storage (NAS)
In NAS enclosures the MPC8271CZQTIEA557 acts as the central processor combining file-serving, RAID control, and Ethernet connectivity on a single chip. The 32-bit PowerPC core at 400 MHz runs embedded Linux, the USB 2.0 port supports external backup drives or printers, and dual UART enables console access and UPS signalling. With 16+16 Kbyte caches, throughput is sufficient for multi-user SOHO workloads. Designers add DDR SDRAM, SATA controllers over PCI, and an Ethernet PHY externally. Pin-compatible alternates in the MPC82xx family allow scaling performance without PCB rework.
Recommended
Industrial Ethernet Gateway
Industrial Ethernet gateways require deterministic communication, an extended temperature range, and robust peripherals - all delivered by the MPC8271CZQTIEA557. The on-chip CPM handles real-time Ethernet/IP, Profinet, or Modbus TCP frame forwarding at line rate while the PowerPC core runs the gateway application. Dual I2C and SPI connect to industrial sensors, dual UART bridges legacy RS-485 industrial buses, and the 516-PBGA package's mechanical stability suits vibration-prone factory environments. The 0 to +105 C junction range covers most indoor industrial enclosures.
Recommended
Legacy DSLAM / Access Multiplexer
The MPC8271CZQTIEA557 was designed specifically for the DSLAM and access multiplexer market segment, where its 400 MHz PowerPC G2_LE core and high-throughput CPM serial interfaces aggregate subscriber lines back to upstream routers. Each device typically handles dozens of subscribers via the Time-Division Multiplexed Serial Interface (TDM) channelized up to E1/T1 rates. The on-chip PCI bridge cascades multiple line-card controllers, and the 516-PBGA package exposes the full 32-bit external memory bus for bulk packet buffering. Operators deploying this part benefit from very long product lifecycles when sourced through authorized distributors.
Recommended
Telecom Base Station Controller
Small-cell and picocell base station controllers benefit from the MPC8271CZQTIEA557's combination of Ethernet, USB 2.0, and high-speed serial interfaces on a single die. The PowerPC core runs Layer 2/3 control protocols while the CPM handles backhaul Ethernet framing with hardware assist. The 516-PBGA footprint supports the dense board layout typical of base-station hardware, and the 0 to +105 C junction rating survives outdoor cabinet temperatures when paired with proper thermal management. Boot, firmware updates, and field diagnostics are exposed via UART and JTAG, simplifying manufacturing test.
Recommended
Embedded Industrial Control
Embedded industrial control platforms use the MPC8271CZQTIEA557 as a deterministic supervisory controller aggregating data from sensors, actuators, and fieldbuses. The PowerPC G2_LE core executes real-time control loops, the CPM manages serial fieldbus channels (UART, SPI, I2C) in hardware, and the USB 2.0 port supports local HMI panels or USB mass-storage. With 16 Kbyte instruction and data caches the device keeps interrupts deterministic. The 516-PBGA package provides EMI-resistant connectivity for noisy industrial environments, and identical-footprint MPC82xx alternates allow performance scaling within the same PCB.
Recommended
Recommended Products Summary
Engineering reference data for MPC8271CZQTIEA557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8271CZQTIEA | KMPC8271CZQTIEA | MPC8271CVRPIEA | MPC8271VVQLFA | MPC8271CZQMIEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 516-PBGA (27 x 27 mm) | 516-PBGA (27 x 27 mm) - same | 516-PBGA (27 x 27 mm) - same | 516-PBGA (27 x 27 mm) - same | 516-PBGA (27 x 27 mm) - same | 516-PBGA (27 x 27 mm) - same |
| Core Architecture | PowerPC G2_LE | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same |
| Maximum CPU Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Instruction / Data Cache | 16 Kbyte / 16 Kbyte | 16 K / 16 K - same | 16 K / 16 K - same | 16 K / 16 K - same | 16 K / 16 K - same | 16 K / 16 K - same |
| Ethernet MAC | 10/100 Mbps Fast Ethernet MAC | 10/100 Mbps - same | 10/100 Mbps - same | 10/100 Mbps - same | 10/100 Mbps - same | 10/100 Mbps - same |
| USB | USB 2.0 (1 port) | USB 2.0 - same | USB 2.0 - same | USB 2.0 - same | USB 2.0 - same | USB 2.0 - same |
| Lifecycle Status | Last Time Buy | Last Time Buy | Obsolete / Rochester authorized | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Identical silicon to base MPC8271CZQTIEA but with a '557' packing code (vs MPC8271CZQTIEA)
- PowerPC G2_LE core vs generic ARM9 / Cortex-A5 communications MPUs (vs Generic ARM9 communications MPU)
- On-chip Fast Ethernet MAC plus USB 2.0 (vs External Ethernet + USB controller chips)
Design Notes
Estimated: at full 400 MHz operation, the MPC8271CZQTIEA557 dissipates on the order of 1.5 to 2.0 W depending on CPM activity. The 516-PBGA 27 x 27 mm package requires thermal vias under the die flag and a copper pad area of at least 1 inch square on the top layer. Forced-air cooling is recommended when the device sits alongside a companion Ethernet switch.
Use a minimum 6-layer PCB stack-up with dedicated ground and power planes. The 516-PBGA 0.8 mm (or 1.0 mm) pitch requires microvia-in-pad or dog-bone fan-out escape; standard 4-layer 6-mil technology is borderline adequate. For the external memory bus, target 50 ohm single-ended impedance with matched trace lengths, and length-match the clock to data/address within +/- 25 ps.
Place SDRAM as close as possible to the memory bus pins to keep the address and data traces short; isolate Ethernet MII lines from the DDR clock group with a ground guard trace. The CPM outputs high-speed serial lines - keep these impedance-controlled and shield them with adjacent ground. Avoid routing sensitive analog signals (audio, precision ADC) beneath the BGA pad array.
Do not confuse the 'TQIE' suffix (temperature grade and packing) with the '557' suffix (reel/ordering variant). Both are ordering codes, not part variants. Verify the boot configuration word on every PCB build because misconfigured host bus width or boot device will hang the system silently. Always include a JTAG header (TDI/TDO/TCK/TMS/TRST) for production test and field recovery.
Compliance Information
Compliance flags must be verified per the exact MPN suffix on the NXP product page. The MPC82xx family is not AEC-Q100 qualified - it is a communications MPU rather than an automotive-grade device. RoHS / REACH status depends on date code and packing option '557'.
