MPC8535AVTATHA - PowerQUICC III e500 MPU 1.25GHz 783-FCBGA | NXP
MPN: MPC8535AVTATHA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145.5 | $145.50 |
| 10 | $132.25 | $1,322.50 |
| 100 | $118 | $11,800.00 |
| 250 | $108.5 | $27,125.00 |
| 500 | $99.75 | $49,875.00 |
MPC8535AVTATHA Overview
A PowerQUICC processor is a system-on-chip (SoC) family that integrates one or more Power Architecture CPU cores with communications peripherals (Ethernet, ATM, HDLC, TDM) on a single die, targeting networking, telecom, and industrial control equipment. Within NXP's broader taxonomy it sits under MPC85xx -> communications processors -> application processors -> Power Architecture SoCs. The MPC8535 specifically targets mid-range routers, switches, and line cards where deterministic performance and rich I/O matter more than raw compute.
Key features include a 32-bit e500 core with MMU and dual-issue pipeline, integrated 36-bit DDR2/DDR3 memory controller with ECC support, two Gigabit Ethernet MACs, two PCI Express controllers, two SATA 2.0 ports, integrated security acceleration, and a flexible local bus controller. The device also includes dual USB 2.0 ports with PHY, SDHC host controller, four I2C controllers, and four UARTs for management and debug interfaces.
The MPC8535 uses a 512 KB L2 cache shared by the core and the integrated peripherals, with coherency maintained by hardware. The platform is supported by NXP/U-Boot/Linux BSP and is widely deployed in long-lifecycle industrial and networking products because of its stable silicon revision and 0 to 90C commercial temperature range. Engineers typically pair it with DDR3 ECC memory, a Vitesse/Marvell Ethernet PHY, and a NOR/NAND flash for boot storage.
Typical applications include branch-office routers, industrial gateways, network-attached storage controllers, factory-floor protocol converters, and telecom edge equipment. The wide I/O mix lets a single MPC8535 replace an external northbridge plus multiple companion chips. The 'V' suffix indicates the 0 to 90C commercial temperature grade and a specific die revision.
When designing with this device, allocate 4-layer minimum PCB with continuous reference planes for the DDR3 interface; the 783-ball FCBGA demands 1.0 mm pitch BGA routing and microvia stackups. Thermal design should target 8-12 W typical dissipation with a top-side heat spreader or heat sink attached to the lid. Decoupling follows NXP's reference design with bulk + ceramic caps at every supply pin and a dedicated PLL supply filter.
This page synthesizes current distributor stock and pricing, pin-compatible MPC8535/MPC8536 family variants, and practical board-design notes not always consolidated in the NXP datasheet.
Drop-in alternatives for MPC8535AVTATHA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8535AVTATHA (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, SATA, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8535AVTANGA
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$92.5 / Unit
View Datasheet →MPC8535BVJATHA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8535BVTATHA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8536CVJAULA
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8536AVJAULA
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8535AVTATHA Maximum Ratings & Electrical Characteristics
| Core Architecture | Power Architecture e500 (32-bit) |
| Core Frequency (Max) | 1.25 GHz |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 512 KB integrated |
| Memory Controller | DDR2/DDR3 with ECC, up to 32-bit |
| Ethernet MAC | 2x Gigabit (SGMII/RGMII) |
| PCI Express | 2x PCIe controllers |
| SATA | 2x SATA 2.0 |
| USB | 2x USB 2.0 with integrated PHY |
| SDHC | 1x SD/SDHC host |
| Local Bus | 16-bit with NAND flash controller |
| UART | 4x DUART |
| I2C | 4x I2C controllers |
| Package | 783-FCBGA (29x29 mm) |
| Operating Temperature | 0 C to +90 C (commercial) |
| Supply Voltage | 1.0 V core / 1.5/1.8 V DDR / 3.3 V IO |
MPC8535AVTATHA 783-fcbga (29x29 mm) Pin Configuration Guide
Pin configuration for MPC8535AVTATHA (783-fcbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8535AVTATHA.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8535AVTATHA is suitable for 6 applications: Branch-Office Router, Industrial Protocol Gateway, Network-Attached Storage Controller, Telecom Edge Equipment, Single-Board Computer / Embedded Linux Platform, Power-Over-Ethernet PD Controller with Networking.
Branch-Office Router
The MPC8535AVTATHA's e500 core at 1.25 GHz plus dual GbE MACs and PCIe make it well-suited for mid-range branch routers running embedded Linux. Its DDR3 controller with ECC delivers reliable memory bandwidth for routing tables and IPSec lookups, and the integrated SATA port allows a local log or cache SSD. Compared with discrete northbridge designs, the MPC8535 consolidates CPU, MACs, and PCIe onto one die, shrinking the BOM. Reference designs from NXP show typical power around 6-9 W at 25 C ambient.
Recommended
Industrial Protocol Gateway
The MPC8535AVTATHA is widely used in factory-floor gateways that bridge PROFINET, EtherNet/IP, or Modbus TCP. Its dual GbE supports two physical network segments, while the local bus controller plus USB allow legacy field-bus cards. The 0 to 90 C commercial grade suits cabinet-mounted equipment; designers needing extended temperature should select the J-grade MPC8535BVJATHA drop-in. The on-chip QUICC Engine simplifies deterministic serial protocol handling without burdening the CPU.
Recommended
Network-Attached Storage Controller
The MPC8535AVTATHA's two SATA 2.0 ports and USB 2.0 host make it an ideal main controller for small NAS appliances supporting two drive bays plus an external backup. The DDR3 controller with ECC protects file-system integrity against single-bit memory errors, which is critical for ZFS or Btrfs RAID arrays. Compared with ARM-based NAS ICs, the MPC8535 adds PCIe expansion for 10 GbE uplinks via add-in NIC. Power budget typically 8-12 W with two SSDs.
Recommended
Telecom Edge Equipment
The MPC8535AVTATHA supports telecom edge equipment such as small-cell baseband units, IP-PBX media gateways, and TDM-over-IP converters. Its TDM interface plus DUART enable legacy E1/T1 connectivity, while the GbE ports backhaul to the IP core. The hardware ECC memory controller and JTAG boundary-scan support meet carrier-grade reliability targets. Compared with newer QorIQ LS-series parts, the MPC8535 has the advantage of an installed base and validated BSP across many vendors.
Recommended
Single-Board Computer / Embedded Linux Platform
The MPC8535AVTATHA serves as the main MPU on long-lifecycle SBCs used in medical imaging controllers, digital signage, and transportation signage. Its Linux BSP plus NXP's SDK provides a familiar Yocto environment, and the 783-FCBGA allows compact board layouts with all I/O accessible through castellated edges or high-density connectors. Reference designs often include 1 GB DDR3 ECC, 256 MB NOR flash, and dual GbE, with 8-12 W typical dissipation under load.
Recommended
Power-Over-Ethernet PD Controller with Networking
The MPC8535AVTATHA can act as the networking host inside PoE-powered devices such as outdoor cameras, industrial sensors, or wireless access points. The GbE MAC supports 1000BASE-T with PoE+ delivered over the same cable, and the SATA port allows local storage in cameras. The 0 to 90 C temperature range covers most outdoor enclosures; the J-grade drop-in is recommended when -40 C start-up is required. Power consumption is typically 6-10 W depending on peripheral enable.
Recommended
Recommended Products Summary
Engineering reference data for MPC8535AVTATHA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8535AVTANGA | MPC8535BVJATHA | MPC8535BVTATHA | MPC8536CVJAULA | MPC8536AVJAULA |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency (Max) | 1.25 GHz | 1.0 GHz | 1.25 GHz | 1.25 GHz | 1.0 GHz | 1.25 GHz |
| Core Architecture | e500 | e500 | e500 | e500 | e500 | e500 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Operating Temperature | 0 to 90 C | 0 to 90 C | -40 to +105 C | 0 to 90 C | -40 to +105 C | -40 to +105 C |
| Cryptography Accelerator | No (non-E variant) | No (non-E variant) | No (non-E variant) | No (non-E variant) | Depends on suffix (E variant adds SEC) | Depends on suffix (E variant adds SEC) |
Key Differentiators
- DDR3 with ECC at 1.25 GHz in a single SoC (vs MPC8555E)
- Drop-in extended-temperature variant available (vs MPC8535BVJATHA)
- Pin-compatible path to MPC8536 family (vs MPC8536AVJAULA)
Design Notes
Estimated: the 783-ball FCBGA at 1.0 mm pitch requires a 4-layer minimum stack-up with microvias on the top side. Route all DDR3 signals on inner layers with continuous reference planes (ground on layer 2, power on layer 3). Match DDR trace lengths within the limits given in the NXP datasheet - typically +/- 25 mil for clock/address and tighter for byte-lane DQ. Provide at least 4 decoupling caps (1x 100 nF + 1x 10 uF bulk) per supply pin and a dedicated PI filter for the 1.0 V core.
Estimated: the MPC8535AVTATHA typically dissipates 6-9 W under full load with both GbE active. The FCBGA lid must be coupled to a heat spreader or heatsink using thermal interface material rated above 3 W/mK. Without cooling, junction temperature can exceed 100 C in a closed industrial cabinet. NXP reference designs use a 30x30 mm copper heat spreader plus 1 C/W external heatsink. Always validate with a thermal probe in worst-case ambient.
Do not assume JTAG boundary-scan will catch all DDR3 timing issues; the MPC8535's DDR controller has many calibration modes and must be locked at production via the SPD EEPROM. Always boot from a verified U-Boot image in NOR flash, and validate hardware POST (pre-OS self-test) before field deployment. Mixing 1.5 V DDR3 and 1.8 V DDR2 on the same design is a frequent error; pick one memory standard and stick with it across all SKUs.
Use a multi-rail PMIC such as the TPS65250 or NXP's MC34713 to generate the 1.0 V core, 1.5/1.8 V DDR, and 3.3 V IO rails with proper power sequencing (core before DDR). Hold RESET_LESB low until all rails are within 5% of nominal. Add a supervisory reset (e.g. TPS3808) to catch brownouts during PoE hot-plug events in gateway designs. Estimated: total board power at full load is 12-15 W including GbE PHYs and DDR.
Compliance Information
RoHS compliant and lead-free per NXP product documentation. Not AEC-Q100 qualified because the part is not intended for automotive under-hood use. Halogen-free status not explicitly published - recommend confirming with NXP product compliance team.