MPC8540PX833LB - 833MHz PowerQUICC III MPU, 783-FCPBGA | NXP
MPN: MPC8540PX833LB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $235.4 | $23,540.00 |
| 250 | $210.75 | $52,687.50 |
| 500 | $189.9 | $94,950.00 |
MPC8540PX833LB Overview
An integrated host processor (often called an MPU or communications processor) combines a CPU core with on-chip peripherals, memory controllers, and I/O subsystems in one package, eliminating external chipset glue logic. The MPC8540 sits inside the broader taxonomy: microprocessor (MPU) -> embedded processor -> communications processor -> networking SoC. It is built on Power Architecture technology and uses the same PowerQUICC III family as the MPC8560, MPC8541, and MPC8548 series, enabling firmware and toolchain reuse across NXP's networking portfolio.
Key features include a 32-bit e500 core with dual-issue pipeline, integrated DDR memory controller, four 10/100/1000 Mbps Enhanced Three-Speed Ethernet controllers (eTSEC), dual PCI Express interfaces, dual RapidIO serial links, and a flexible I/O subsystem that supports UART, I2C, SPI, GPIO, and local bus. Security is enhanced by a built-in SEC 2.0 engine for DES, 3DES, AES, and public-key accelerators. A 256 KB on-chip SRAM is shared between the core and packet-processing engines, and the DDR controller supports up to DDR-333 for high-throughput packet handling.
The architecture uses a 256-bit internal bus matrix and dedicated DMA channels for I/O offload, allowing the e500 core to focus on control-plane and exception-path processing rather than per-packet data movement. Power consumption scales with clock and I/O activity, and the device supports multiple low-power states (Doze, Nap, Sleep) for power-sensitive designs. Operating voltage is 1.2 V core, with separate I/O rails.
Typical applications include enterprise routers and switches, line cards for multiservice platforms, network-attached storage (NAS) controllers, wireless base-station controllers, industrial embedded control, and edge computing gateways. The 833 MHz speed grade offers a balance of deterministic performance and low thermal dissipation for fan-cooled or conduction-cooled chassis.
When designing with the MPC8540PX833LB, ensure the FCBGA substrate uses a 12-layer or thicker stack-up with matched-impedance routing for DDR, RapidIO, and PCIe. Reference the NXP hardware specifications manual for JTAG, reset sequencing, and clock-tree requirements. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MPC8540PX833LB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8540PX833LB (same form factor and footprint) — differing in Processor Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8540PX667LB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8540PX1000LB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8540PX833LC
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$140 / Unit
View Datasheet →MPC8540PXAJC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8540PXAUJC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8540PXAQFC
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC8540PX833LB Maximum Ratings & Electrical Characteristics
| Processor Type | MPC85xx PowerQUICC III 32-Bit |
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Data Bus Width | 32-Bit |
| Clock Speed | 833 MHz |
| Operating Voltage | 1.2 V |
| Package / Case | 783-FCPBGA (29x29 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| On-chip SRAM | 256 KB |
| Ethernet Controllers | 4 x 10/100/1000 Mbps eTSEC |
| PCI Express Interfaces | 2 x PCIe |
| RapidIO Interfaces | 2 x Serial RapidIO |
| DDR Memory Controller | DDR-333 |
| Security Engine | SEC 2.0 (DES/3DES/AES/RSA) |
MPC8540PX833LB Pin Configuration
| Pin A1 | MDATA[0] — DDR data lane 0 |
| Pin B14 | GND — Ground reference |
| Pin C28 | VDD_CORE — 1.2 V core supply |
| Pin J7 | TX0_P — eTSEC0 transmit positive |
| Pin J8 | TX0_N — eTSEC0 transmit negative |
| Pin K9 | RX0_P — eTSEC0 receive positive |
| Pin M15 | PER0_P — PCI Express lane 0 transmit positive |
| Pin P20 | SRIO_TX_P — RapidIO serial transmit positive |
| Pin T25 | TCK — JTAG test clock |
| Pin AT29 | RESET — Hardware reset, active low |
Typical Applications
MPC8540PX833LB is suitable for 6 applications: Enterprise Router Control Plane, Wireless Base Station Controller, Network-Attached Storage Controller, Industrial Embedded Control Platform, Edge Computing Gateway, Telecom Line Card Processor.
Enterprise Router Control Plane
The MPC8540PX833LB's 833 MHz e500 core and four integrated gigabit Ethernet MACs make it a strong fit for the control plane of enterprise routers and multi-layer switches. It handles routing-table lookups, ACL processing, OSPF/BGP management, and SNMP polling without offloading to a separate NP. Designers place it on a routing engine line card with DDR-333, dual PCIe to a switching fabric ASIC, and local bus to a management CPLD. The 256 KB on-chip SRAM accelerates routing-cache hits, and the SEC 2.0 engine accelerates IPsec session establishment for VPN termination.
Recommended
Wireless Base Station Controller
In 3G/4G base-station controllers and small-cell nodes, the MPC8540PX833LB manages the backhaul, timing, and signalling-stack processing. Its dual RapidIO links connect to DSP arrays handling PHY-layer baseband, while the PCI Express lanes attach to a baseband ASIC. Deterministic interrupt latency from the e500 core benefits the radio-resource-management software. The industrial temperature grade (when selected) and long-term NXP lifecycle support suit telecom OEMs with multi-year deployment cycles.
Recommended
Network-Attached Storage Controller
The MPC8540PX833LB is widely used in mid-range NAS controllers where its 833 MHz e500 core handles filesystem metadata, RAID management, and iSCSI/ NFS protocol stacks. The four gigabit Ethernet MACs enable link-aggregation or multi-NIC bonding directly from the SoC, while the local bus attaches to a SATA multiplier for drive bays. The SEC 2.0 engine accelerates AES-XTS for self-encrypting drive management. Designers typically pair it with 512 MB-1 GB DDR-333 and 8-16 MB boot Flash.
Recommended
Industrial Embedded Control Platform
The MPC8540PX833LB serves as the main controller in industrial PCs, PLCs, and process-control platforms that require deterministic Ethernet and fieldbus connectivity. Its multiple UART/SPI/I2C controllers interface to sensors, motor drives, and HMI panels, while the PCI Express and PCI interfaces support motion-control cards. The extended-temperature option and high MTBF make it suitable for factory-floor equipment where downtime is costly.
Recommended
Edge Computing Gateway
Modern edge-compute gateways use the MPC8540PX833LB as the application processor because its deterministic e500 core runs VxWorks or Linux with predictable latency. It terminates industrial protocols (Modbus, EtherNet/IP, PROFINET) and bridges them to cloud MQTT brokers over the gigabit Ethernet MACs. The SEC engine handles TLS handshake acceleration, and the local bus can drive a display controller for on-device visualization.
Recommended
Telecom Line Card Processor
In multiservice access platforms and DSLAM/MSAN line cards, the MPC8540PX833LB acts as the line-card CPU handling OAM, performance monitoring, and per-subscriber QoS. Its dual Serial RapidIO links backhaul to a chassis-level switching fabric, while the PCI Express lanes connect to framer ASICs. The on-chip SEC engine accelerates MACsec for carrier Ethernet, and the large on-chip SRAM reduces external memory accesses for fast-path packets.
Recommended
Recommended Products Summary
Engineering reference data for MPC8540PX833LB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8540PX667LB | MPC8540PX1000LB | MPC8540PX833LC | MPC8540PXAJC | MPC8540PXAUJC | MPC8540PXAQFC |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Clock Speed | 833 MHz | 667 MHz (-20%) | 1000 MHz (+20%) | 833 MHz (same) | 833 MHz (same) | 833 MHz (same) | 833 MHz (same) |
| Core Architecture | PowerPC e500 | PowerPC e500 - same | PowerPC e500 - same | PowerPC e500 - same | PowerPC e500 - same | PowerPC e500 - same | PowerPC e500 - same |
| Operating Voltage | 1.2 V core | 1.2 V core - same | 1.2 V core - same | 1.2 V core - same | 1.2 V core - same | 1.2 V core - same | 1.2 V core - same |
| Ethernet MACs | 4 x eTSEC GbE | 4 x eTSEC GbE - same | 4 x eTSEC GbE - same | 4 x eTSEC GbE - same | 4 x eTSEC GbE - same | 4 x eTSEC GbE - same | 4 x eTSEC GbE - same |
| DDR Memory Controller | DDR-333 | DDR-333 - same | DDR-333 - same | DDR-333 - same | DDR-333 - same | DDR-333 - same | DDR-333 - same |
| Pin-to-Pin Compatible | Yes (reference) | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in | Yes - drop-in |
Key Differentiators
- Highest stock-clock speed bin in the MPC8540 family (vs MPC8540PX667LB)
- More thermally efficient than 1000 MHz sibling (vs MPC8540PX1000LB)
- RoHS-convertible variant available without redesign (vs MPC8540PXAQFC)
- Integrated 4-port GbE vs external switch chips (vs Discrete Ethernet switch + lower-end MPU)
Design Notes
Estimated: at 833 MHz core clock with full I/O activity the MPC8540PX833LB dissipates roughly 8-12 W. The 783-FCPBGA junction-to-ambient theta_JA on a 12-layer JEDEC test board is approximately 0.15 C/W with 200 LFM airflow. For chassis designs without active airflow, attach an aluminium heatsink with thermal interface material and provide at least 200 LFM to keep Tj below 105C. NXP application note AN2807 describes the recommended thermal relief pattern under the BGA.
The 783-FCPBGA requires a 12-layer or thicker PCB stack-up with controlled-impedance routing for DDR (50 ohm single-ended, 100 ohm differential), PCIe (85 ohm differential), and RapidIO (100 ohm differential). Use microvia-in-pad construction for the inner-row BGA balls, escape all signal rows on internal layers, and stitch a continuous ground plane under the BGA. Reference NXP AN2814 for the layout reference design.
Sequence the 1.2 V core rail only after the 3.3 V and 1.8 V rails are stable, and hold the MPC8540 in reset until all rails reach regulation. Use a voltage supervisor (e.g. MAX6369) to gate the PORESET input until the slowest rail settles. Place 100 nF X7R decoupling on every VDD ball and four 22 uF bulk capacitors within 25 mm of the BGA to suppress transient current spikes during DDR bursts.
Do not connect the TCK pin directly to a 3.3 V rail without a 10 kohm pull-down; floating JTAG pins can latch the TAP controller into an undefined state. Always issue a JTAG reset (TRST pulse) before boundary-scan operations. Also ensure the SYSCLK input has a series-termination resistor within 25 mm of the BGA pin to dampen reflections on the long clock trace.
Compliance Information
Lead Free Status: Contains Lead per DigiKey listing 1168279. RoHS variant available as MPC8540PXAQFC. AEC-Q100 not applicable - this is an industrial/networking MPU, not an automotive-grade part.