MPC8545VTATGD - PowerQUICC III SoC, 1.2GHz e500, 783-FCPBGA | NXP
MPN: MPC8545VTATGD ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $275 | $2,750.00 |
| 100 | $250 | $25,000.00 |
| 500 | $230 | $115,000.00 |
| 1,000 | $215 | $215,000.00 |
MPC8545VTATGD Overview
System-on-chip processors (SoC) integrate one or more processor cores, memory controllers, and standard I/O peripherals into a single device, replacing traditional multi-chip designs and reducing BOM cost, board area, and power consumption in embedded networking and industrial control equipment. The MPC85xx family sits in NXP's high-performance communications-processor tier and is widely used in routers, switches, line cards, and industrial control platforms.
Key features include a 1.2 GHz e500 core with dual-precision integer and single-precision floating-point units, a 64-bit DDR2 SDRAM controller with ECC supporting up to DDR2-667, two Gigabit Ethernet controllers (TSEC), PCI Express x4/x8 (SRIO), PCI/PCI-X bus interface, four DMA channels, and a local bus controller supporting NAND/NOR flash and FPGA interfaces. Operating voltage rails are 1.0 V core, 1.5 V DDR2, and 2.5/3.3 V I/O, with industrial-grade 0 C to 105 C Tj support.
Built on a 90 nm copper-interconnect CMOS process with on-chip PLL and clock generators, the device consolidates a complete Power Architecture processing subsystem, dual-RGMII gigabit MACs, and high-speed serial I/O in one package, simplifying multi-rail power design with integrated DDR impedance calibration and thermal-diode output for chip-level monitoring.
Typical applications include enterprise router/switch control planes, telecom base-station control, industrial line cards, military/aerospace networking, networked storage controllers, and secure access devices, where 1.2 GHz e500 core performance, hardware ECC memory, and integrated GbE/SRIO/PCIe connectivity directly replace discrete CPU-plus-FPGA architectures.
When designing with this device, ensure the 1.0 V core rail is supplied by a high-current (>= 6 A) buck regulator with output-accuracy within 3 %, use controlled-impedance routing for SRIO and PCIe lanes, and follow NXP application note AN3534 for DDR2 layout to avoid signal-integrity violations.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MPC8545VTATGD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8545VTATGD (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, Memory Controller, Ethernet.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8548VTAQGD
✅ Drop-In✓ In Stock
$98.75 / Unit
View Datasheet →MPC8543VTANGD
✅ Drop-In✓ In Stock
$152 / Unit
View Datasheet →MPC8555EVTAPF
✅ Drop-In✓ In Stock
$218.75 / Unit
View Datasheet →MPC852TVR100A
✅ Drop-In✓ In Stock
$21.1 / Unit
View Datasheet →MPC8545VTATGD Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e500 (32-bit) |
| Core Frequency | 1.2 GHz |
| Process Technology | 90 nm CMOS |
| Package | 783-FCPBGA (29x29 mm) |
| Operating Temperature Range | 0 C to 105 C (Tj) |
| Core Voltage | 1.0 V |
| DDR2 I/O Voltage | 1.5 V / 1.8 V |
| Standard I/O Voltage | 2.5 V / 3.3 V |
| Memory Controller | 64-bit DDR2 with ECC, up to DDR2-667 |
| Ethernet | 2x Gigabit Ethernet (TSEC) |
| High-Speed Serial I/O | PCI Express, Serial RapidIO (SRIO) |
| Bus Interface | PCI / PCI-X (32/64-bit, up to 133 MHz) |
| DMA | 4 channels |
| Local Bus | 8/16-bit, NAND/NOR flash support |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Orderable Suffix | GD (Rev 3.0 silicon) |
MPC8545VTATGD 783-fcpbga (29x29 mm) Pin Configuration Guide
Pin configuration for MPC8545VTATGD (783-fcpbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8545VTATGD.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8545VTATGD is suitable for 6 applications: Enterprise Router Control Plane, Telecom Base Station Control, Industrial Line Cards and PLC Controllers, Networked Storage RAID Controllers, Military/Aerospace Networking, Secure Access Gateways and VPN Concentrators.
Enterprise Router Control Plane
The MPC8545VTATGD is well suited to enterprise router control-plane CPUs because of its 1.2 GHz e500 core, integrated 64-bit DDR2 with ECC, and two Gigabit Ethernet MACs. Placed on the route processor card, the device runs a Linux distribution such as Wind River Linux, handling routing-protocol daemons (OSPF/BGP) and management-plane forwarding decisions. Compared to CPU-plus-discrete-FPGA designs, the SoC integrates DUART, I2C, SPI and a local bus, eliminating the bridge chip and shrinking board area by 30-40 percent. The hardware ECC DDR2 controller is critical for telco-grade mean-time-between-failure (MTBF) targets, while the PCI/PCI-X host bridge connects to fabric ASICs on the same backplane.
Recommended
Telecom Base Station Control
In 3G/4G base-station control cards the MPC8545VTATGD interfaces to baseband DSPs via its Serial RapidIO (SRIO) ports while simultaneously handling the CPRI/OBSAI framer control over a second SRIO lane. The e500 core at 1.2 GHz plus 512 KB L2 cache provides real-time deterministic performance for L2/L3 protocol termination. Hardware ECC on DDR2 corrects single-bit soft errors that would otherwise force a remote reboot, and the 0 C to 105 C industrial temperature grade supports outdoor cabinet deployment without additional thermal management.
Recommended
Industrial Line Cards and PLC Controllers
MPC8545VTATGD powers industrial line cards where deterministic Ethernet and time-sensitive networking are required. The dual TSEC gigabit MACs feed two independent industrial-Ethernet rings while the local bus interfaces 16-bit parallel ADC/DAC converters for analog I/O modules. Running VxWorks or INTEGRITY, the e500 delivers the deterministic interrupt latency PLC firmware requires, and the DDR2 ECC controller prevents single-event upsets in 24/7 factory-floor deployments. Ruggedized (-40 C to +85 C) variants share the same BGA footprint, allowing the same PCB to host commercial or MIL-grade silicon.
Recommended
Networked Storage RAID Controllers
Used in iSCSI/SAS/SATA RAID controllers the MPC8545VTATGD's e500 executes the storage stack, while the PCI-X bus attaches to SAS controller ASICs and the local bus interfaces legacy parallel ATA. The 64-bit DDR2 with ECC keeps write-cache transactions reliable under continuous heavy load, and the four DMA channels accelerate zero-copy data paths between storage PHY and GbE MACs. Hardware encryption offload is added by migrating to MPC8548VTAQGD drop-in, which adds SEC 4.0 for AES/SHA acceleration without board changes.
Recommended
Military/Aerospace Networking
Ruggedized MPC8545VTATGD bins support aerospace networking applications such as Mission Computer Switches, MIL-STD-1553 bridges, and tactical-radio IP stacks. With hardware ECC memory, dual GbE MACs for redundant fabrics, and the extended 0 C to 105 C temperature range, the SoC delivers the deterministic performance and radiation-tolerance-friendly packaging aerospace programs require. The same part also retains a long-life-cycle program under NXP's product-change-notification workflow, ensuring multi-year availability for DO-254/DO-178 programs.
Recommended
Secure Access Gateways and VPN Concentrators
The MPC8545VTATGD plus its pin-compatible sibling MPC8548VTAQGD are widely deployed in datacenter VPN concentrators and remote-access gateways because the 8548 silicon adds a SEC 4.0 engine that accelerates AES-256 and SHA-1 at line rate. The e500 core terminates IKE/IPsec control-plane packets while the SEC engine handles bulk encryption over both GbE MACs. Drop-in compatibility lets designers ship a single board with a populated MPC8545V or MPC8548V, simplifying SKU management. Power consumption at 1.0 V core is approximately 6-8 W typical, comparable to a multi-chip CPU-plus-crypto accelerator solution at significantly lower BOM cost.
Recommended
Recommended Products Summary
Engineering reference data for MPC8545VTATGD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8548VTAQGD | MPC8543VTANGD | MPC8555EVTAPF | MPC852TVR100A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Frequency | 1.2 GHz | 1.2 GHz | 1.0 GHz (-17%) | 1.5 GHz (+25%) | 100 MHz (-92%) |
| L2 Cache | 256 KB | 512 KB (+100%) | 256 KB | 512 KB | 32 KB (-87%) |
| Serial RapidIO | Yes | Yes | No (removed) | Yes | No |
| PCI Express | Yes | Yes | Yes | Yes | No |
| Hardware Security (SEC) | No | Yes (SEC 4.0) | No | Optional | No |
| Operating Temperature | 0 C to 105 C (Tj) | 0 C to 105 C (Tj) | 0 C to 105 C (Tj) | 0 C to 105 C (Tj) | 0 C to 105 C (Tj) |
Key Differentiators
- Pin-compatible upgrade with integrated security engine (vs MPC8548VTAQGD)
- 1.2 GHz core in e500 family for route-processor-class workloads (vs MPC8543VTANGD)
- Combined GbE + SRIO + PCIe on one device (vs MPC852TVR100A)
Design Notes
The MPC8545VTATGD draws approximately 6-8 W at 1.0 V core under full load with all peripherals active, requiring a synchronous buck regulator rated at >= 8 A continuous. Use a controller with 1 percent output accuracy and a soft-start ramp <= 5 ms; excessive dv/dt triggers core reset. Place the input/output ceramic capacitors (22 uF X5R + 0.1 uF X7R in parallel) within 5 mm of the BGA balls, and route the 1.0 V plane on a dedicated inner layer with at least four via connections per BGA ball for low-impedance current return.
The 783-FCPBGA requires a 10+ layer PCB with controlled-impedance 50 ohm single-ended (GbE, TSEC) and 100 ohm differential (PCIe, SRIO) routing. The DDR2 64-bit interface demands matched-length tracking to within +/- 25 mil across all 72 lines (data + ECC + strobe). Per NXP application note AN3534, route the DDR2 byte lanes on the same inner layer with reference planes, and place the BGA-side VTT termination resistors within 0.5 inch of the memory devices to avoid signal-integrity failures at DDR2-667 speeds.
Insufficient thermal relief is the most common MPC8545V failure mode. Estimated junction-to-ambient thermal resistance theta_JA is approximately 13 C/W on a 6-layer JEDEC JESD51 test board with thermal vias; at 8 W total dissipation, junction-to-ambient temperature rise is roughly 104 C, leaving only 1 C of margin at the 105 C Tj industrial limit. Mount the BGA directly onto an 80 x 80 mm minimum copper footprint on the top layer plus a thermal-via array (12 x 12 via farm) for acceptable airflow-free operation in sealed enclosures.
SRIO and PCIe require AC-coupled lane routing with 0.1 uF 0402 capacitors at the transmit pin of every lane; missing the coupling capacitor causes link-training failures at Gen1/Gen2 rates. Keep the SRIO differential pair length-mismatch below 5 mil, and place the 100 MHz reference clock within 250 mil of the clock pin to avoid jitter exceedances.
Do not confuse the MPC8545VTATGD (e500, no CPM) with the MPC8555E (which adds the CPM). BIOS/UBOOT versions for the two families differ; flashing the wrong firmware bricks the boot loader. When swapping legacy MPC8543 designs, audit the DDR2 initialization sequence because the 8545's updated DDR controller has different ZQ calibration timing. For new designs, NXP now recommends the QorIQ P1010/P1020 family instead of MPC8545V because of the NRND status as of 2026-10-16.
Compliance Information
RoHS and lead-free per NXP product page; REACH SVHC declaration on file. AEC-Q100 not applicable for communications processors of this class - MIL-STD-810 qualification is available on extended-temperature bins.