MPC8548CPXAUJB - 1.333GHz PowerPC e500 MPU | NXP | 783-FCBGA
MPN: MPC8548CPXAUJB ✓ ActiveMPC8548CPXAUJB Overview
A microprocessor (MPU) is the central processing unit of an embedded system-on-chip platform. Within the broader taxonomy, the MPC8548CPXAUJB sits at: MPU -> embedded processor -> microprocessor -> system-on-chip (SoC) -> semiconductor. Unlike microcontrollers that typically integrate flash and analog, MPUs in the PowerQUICC III family rely on external memory and provide high-throughput interconnect for wired and wireless infrastructure equipment, including routers, switches, and storage controllers.
Key features of the MPC8548CPXAUJB include a 32-bit Power Architecture e500 core with double-precision FPU, integrated L1 instruction and data caches, a 256 KB L2 cache, three 10/100/1000 Mbps Enhanced Three-Speed Ethernet (eTSEC) controllers, a DDR/DDR2 memory controller with ECC, four PCI Express interfaces (x4/x2/x1 lane widths), a 64-bit PCI/PCI-X controller, local bus interface (32-bit), two I2C controllers, two UARTs, an SPI interface, and a 16-channel DMA engine. The SoC platform also provides a flexible interrupt controller, timers, and security/monitoring features for robust system design.
Architecturally, the MPC8548 uses the e500v2 core with Book E-enhanced Power Architecture ISA, MMU with hardware table-walk, and a high-bandwidth system bus connecting the core to integrated peripherals. The 1.333 GHz operation delivers up to ~3060 MIPS (Dhrystone 2.1), and the wide memory and I/O subsystem eliminates bottlenecks for packet processing workloads.
Typical applications include enterprise routers and Layer 2/3 switches, telecom base-station controllers, storage area network (SAN) controllers, industrial automation controllers, secure gateway appliances, and single-board computing platforms for avionics and defense. The integrated multi-protocol Ethernet and PCI Express reduce BOM cost and board complexity versus discrete ASSP designs.
When designing with this MPU, ensure the FCBGA substrate uses high-layer-count PCB with matched-impedance routing for DDR/DDR2, and that the thermal solution is sized for the device's TDP at the target ambient temperature. Use the NXP CodeWarrior or Linux BSP for firmware development and validate signal integrity on the high-speed SerDes lanes.
This page synthesizes distributor pricing, cross-reference notes for the MPC8548 family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MPC8548CPXAUJB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8548CPXAUJB (same form factor and footprint) — differing in Series, PCI Express, Package / Case.
MPC8548EPXAUJB
✅ Drop-InContact for price
View Datasheet →MPC8548EVTAUJB
✅ Drop-InContact for price
View Datasheet →MPC8548EVXAUJC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8548EVXAUJB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8548PXAUJC
✅ Drop-In📋 Reference alternative (not in catalog)
MPC8548CPXAUJB Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP USA Inc. (formerly Freescale) |
| Product Type | Microprocessor (MPU) / SoC |
| Series | PowerQUICC III, MPC85xx |
| Core | PowerPC e500 (32-bit) |
| Core Count | 1 |
| Maximum Core Frequency | 1.333 GHz |
| Package | 783-FCBGA (29x29 mm) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS SOI |
| L2 Cache | 256 KB |
| Memory Controller | DDR/DDR2 with ECC |
| Ethernet Interfaces | 3x 10/100/1000 Mbps eTSEC |
| PCI Express | 4 lanes (configurable x4/x2/x1) |
| PCI/PCI-X | 64-bit PCI-X 2.0 |
| Local Bus | 32-bit |
| Serial Interfaces | 2x I2C, 2x UART, 1x SPI, 16-channel DMA |
| Operating Temperature | 0C to +105C (industrial Tj) |
MPC8548CPXAUJB 783-fcbga (29x29 mm) Pin Configuration Guide
Pin configuration for MPC8548CPXAUJB (783-fcbga (29x29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8548CPXAUJB.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8548CPXAUJB is suitable for 6 applications: Enterprise Routers and Layer 3 Switches, Telecom Base Station Controllers, Storage Area Network (SAN) Controllers, Industrial Automation and Process Controllers, Secure Gateway Appliances, Single-Board Computing for Avionics and Defense.
Enterprise Routers and Layer 3 Switches
The MPC8548CPXAUJB is a strong fit for enterprise routing platforms because its 1.333 GHz e500 core, integrated three-port Gigabit Ethernet (eTSEC) controllers, and 64-bit PCI-X/PCI Express expansion enable wire-speed forwarding without external co-processors. Placed at the heart of the chassis with DDR2-ECC memory for routing tables and TCAM offload, it processes ACL and QoS policies deterministically. The integrated DMA engine accelerates bulk table maintenance, while four PCI Express lanes simplify connection to crypto or PHY ASICs. Estimated: forwarding at 2-3 Mpps sustained is achievable with NXP-supplied fast-path libraries in a Linux environment.
Recommended
Telecom Base Station Controllers
In telecom base-station controller applications, the MPC8548CPXAUJB delivers deterministic e500 execution for Layer 2/3 control-plane processing while integrating Serial RapidIO and PCI Express for backhaul connectivity. Its 256 KB L2 cache and ECC-protected DDR2 controller sustain jitter-sensitive protocol stacks such as CPRI and OAM. Use the eTSEC ports for management interfaces and PCI Express lanes for baseband ASIC coupling. Estimated: typical BTS controller builds consume ~6-8 W at 1.333 GHz with a copper spreader; the device operates across industrial temperature grades typical of outdoor cabinet deployments.
Recommended
Storage Area Network (SAN) Controllers
For SAN controllers and RAID-on-chip platforms, the MPC8548CPXAUJB's high-bandwidth DDR2 memory controller and dual PCI-X 2.0 interfaces provide direct attachment to host bus adapters and SAS/SATA controllers. The integrated DMA engine supports zero-copy data movement between host and disk paths. Placed with 1-2 GB DDR2 ECC DRAM and external SAS expanders via PCI-X, it can sustain multi-gigabit streaming throughput. Estimated: end-to-end iSCSI throughput of 600-800 Mbps is achievable with hardware-accelerated CRC offload in a typical deployment.
Recommended
Industrial Automation and Process Controllers
The MPC8548CPXAUJB fits industrial automation racks where deterministic networking, ECC memory, and long-term software stability outweigh raw clock speed. Its e500 core runs PLC logic and EtherCAT/PROFINET gateways, while the three eTSEC ports and PCI Express lanes connect to industrial I/O modules. Placed alongside DDR2-ECC DRAM and isolated serial interfaces, it supports 24/7 operation in plant environments. Estimated: a typical controller consumes 5-7 W at 1.333 GHz; an aluminum heatsink is sufficient given the FCBGA thermal resistance of ~5 C/W with a 4-layer PCB.
Recommended
Secure Gateway Appliances
The MPC8548CPXAUJB is well suited to secure gateway appliances (VPN, UTM, firewall) because its 1.333 GHz core and DDR2-ECC memory deliver high-throughput cryptographic frame processing, while the integrated eTSEC and PCI Express simplify connection to crypto accelerators and network PHYs. Placed with hardware AES/SHA engines via PCI Express, the platform can sustain multi-gigabit IPsec tunnels with mainline Linux fast-path support. Estimated: IPsec AES-128 throughput of 1-2 Gbps is achievable in a Linux/Strongswan deployment with hardware offload.
Recommended
Single-Board Computing for Avionics and Defense
The MPC8548CPXAUJB powers rugged single-board computers in avionics and defense where the Power Architecture ecosystem (VxWorks, INTEGRITY, LynxOS) is mandated. Its ECC memory controller and parity-protected buses meet the reliability requirements of DO-254/DO-178 programs. Placed on a VPX or VME form-factor board with conductive-cooled heatsinking, it delivers stable deterministic processing across extended temperature ranges. Estimated: total board power of 12-18 W is typical for a 3U VPX module with the MPC8548CPXAUJB plus companion I/O devices.
Recommended
Recommended Products Summary
Engineering reference data for MPC8548CPXAUJB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8548EPXAUJB | MPC8548EVTAUJB | MPC8548EVXAUJC | MPC8548EVXAUJB | MPC8548PXAUJC |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) |
| Maximum Frequency | 1.333 GHz | 1.333 GHz | 1.333 GHz | ~1.0 GHz (lower bin) | ~1.0 GHz (lower bin) | ~1.0 GHz (lower bin) |
| L2 Cache | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Ethernet (eTSEC) | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps | 3x 10/100/1000 Mbps |
| PCI Express Lanes | 4 lanes | 4 lanes | 4 lanes | 4 lanes | 4 lanes | 4 lanes |
| Memory Controller | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC | DDR/DDR2 with ECC |
Key Differentiators
- Highest-frequency production bin in the MPC8548 783-FCBGA family (vs MPC8548EVXAUJC)
- Production-grade ordering code (vs MPC8548EVTAUJB)
- Identical peripheral set across all 783-FCBGA MPC8548 variants (vs MPC8536BGALF)
Design Notes
Estimated: at 1.333 GHz the MPC8548CPXAUJB dissipates 6-9 W depending on peripheral activity. The 783-FCBGA package requires a copper spreader or thermal lid; design the PCB with an exposed thermal pad tied to an inner ground plane with 9 thermal vias in a 3x3 grid (0.3 mm drill, 0.6 mm pitch). A high-layer-count board (8+ layers) is required to meet the 5 C/W theta_JB target. Add a heatsink if the enclosure ambient exceeds 65C or if the unit must operate at full PCI Express lane utilization.
Use microvia stack-ups for BGA breakout; the 1.0 mm ball pitch of the FCBGA demands 4-mil trace/space and laser-drilled microvias to fan out the inner rows. Route DDR/DDR2 with matched-length pairs and a 50 ohm single-ended impedance. Place the 32.768 kHz RTC crystal within 1 cm of the RTC pins to minimize loading capacitance, and provide a JTAG header with TMS/TCK/TDI/TDO and TRST for boundary-scan and CodeWarrior debug access.
Do not power the device without sequencing the core and IO rails per the datasheet (VDD must ramp before AVDD). Ensure the SYSCLK input is stable before deasserting HRESET. Avoid routing high-speed signals across the BGA shadow - all SerDes and DDR traces must escape the package perimeter without crossing reference-plane splits. Verify ECC initialization at boot to prevent spurious correctable errors during early firmware bring-up.
Compliance Information
Compliance fields marked unknown - no explicit compliance statements appeared in the verified distributor snippets. Confirm RoHS/REACH status with NXP product documentation or your authorized distributor's material declaration before volume commitment.