PIC16F15256-E/STX - 8-bit MCU, 28KB Flash, 32MHz, 28-VQFN | Microchip
MPN: PIC16F15256-E/STX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.62 | $1.62 |
| 10 | $1.46 | $14.60 |
| 100 | $1.21 | $121.00 |
| 500 | $1.04 | $520.00 |
| 1,000 | $0.91 | $910.00 |
PIC16F15256-E/STX Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash for program, SRAM for data, EEPROM for non-volatile storage), peripherals, and I/O on one die. The PIC16F152 family sits inside Microchip's 8-bit PIC16 portfolio, targeting cost-sensitive sensor and real-time control applications. Within the broader semiconductor taxonomy it is a member of the MCU -> embedded controller -> microcontroller -> 8-bit microcontroller -> PIC16 -> PIC16F152xx family chain. The part is designed for applications that demand deterministic real-time response, peripheral flexibility through Peripheral Pin Select (PPS), and low active/sleep power.
Key features include a 10-bit ADC with up to 18 input channels, multiple Enhanced Universal Synchronous/Asynchronous Receiver Transmitter (EUSART) ports, SPI/I2C master/slave modes, 2 Capture/Compare/PWM (CCP) modules, 4 8-bit timers, a Numerically Controlled Oscillator (NCO) for precision frequency generation, Complementary Waveform Generator (CWG), and a configurable Logic Cell. XLP technology typically delivers nano-amp sleep currents with fast wake-up, enabling multi-year battery life on coin cells or 2xAA chemistries. The 28-VQFN package keeps board area to roughly 16 mm², attractive for space-constrained sensor nodes.
Architecturally the part uses a Harvard-style 8-bit datapath with a 14-bit instruction word and hardware stack, providing deterministic interrupt latency well suited to motor-control, lighting, and sensor sampling loops. The PPS block remaps digital peripheral I/O onto a wide range of device pins, freeing designers from rigid pin-function assignment and shortening PCB revisions. Internal 32 MHz and 31 kHz oscillators plus an HFINTOSC with PLL reduce BOM cost by removing external crystals in many applications.
Typical applications include IoT sensor nodes, wearable health/fitness devices, home automation, low-power wireless remote controls, LED lighting controllers, battery-powered instrumentation, and small motor-control boards (fans, pumps, valve drivers). The combination of CIPs and PPS enables a single MCU to service multiple sensor and actuator channels without external glue logic.
When designing with the PIC16F15256-E/STX, mind the VQFN-4x4 thermal pad - it must be soldered to a sufficient copper pour (typically a 4 mm² thermal land on inner or bottom PCB layers) to meet the 32.1 VQFN package power-dissipation rating. Decouple VDD with a 100 nF X7R capacitor placed within 3 mm of the pin, and provide a 10 uF bulk capacitor on the same net if the source impedance is high. For low-power operation, configure unused peripherals off and select the LFINTOSC or 32 kHz external mode before sleep.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical engineering notes beyond what is published in the manufacturer datasheet, making it a faster reference for sourcing and design-in decisions.
Drop-in alternatives for PIC16F15256-E/STX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F15256-E/STX (same form factor and footprint) — differing in Operating Temperature Range, Package, Program Memory (Flash), ADC, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F15255-I/SS
✅ Drop-In✓ In Stock
$0.86 / Unit
View Datasheet →PIC16F15254-I/SS
✅ Drop-In✓ In Stock
$0.55 / Unit
View Datasheet →PIC16F15256-E/SP
✅ Drop-In✓ In Stock
$0.91 / Unit
View Datasheet →PIC16F15274-E/STX
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F15276-E/STX
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F15256-E/STX Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 28 KB (28K x 8) |
| Data Memory (SRAM) | 2 KB |
| Package | 28-VQFN (4x4 mm) |
| Pin Count | 28 |
| ADC | 10-bit, up to 18 channels |
| Timers | 4 x 8-bit, 2 x CCP |
| Communication | UART, SPI, I2C (EUSART + MSSP) |
| Core Independent Peripherals | CWG, NCO, PWM, Configurable Logic Cell |
| Peripheral Pin Select (PPS) | Yes |
| Low-Power Mode | eXtreme Low-Power (XLP) sleep |
| Operating Temperature Range | -40C to +125C (E = industrial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC16F15256-E/STX Pin Configuration
| Pin 1 | VDD — Positive supply voltage |
| Pin 2 | RA0 — Bidirectional I/O / analog input |
| Pin 3 | RA1 — Bidirectional I/O / analog input |
| Pin 4 | RA2 — Bidirectional I/O / analog input |
| Pin 5 | RA3 — Bidirectional I/O |
| Pin 6 | RA4 — Bidirectional I/O |
| Pin 7 | RA5 — Bidirectional I/O |
| Pin 8 | RA6 — Bidirectional I/O / OSC2 |
| Pin 9 | RA7 — Bidirectional I/O / OSC1 |
| Pin 10 | RB0 — Bidirectional I/O / INT |
| Pin 11 | RB1 — Bidirectional I/O |
| Pin 12 | RB2 — Bidirectional I/O |
| Pin 13 | RB3 — Bidirectional I/O |
| Pin 14 | VSS — Ground reference |
| Pin 15 | RB4 — Bidirectional I/O |
| Pin 16 | RB5 — Bidirectional I/O |
| Pin 17 | RB6 — Bidirectional I/O / ICSCLK |
| Pin 18 | RB7 — Bidirectional I/O / ICSDAT |
| Pin 19 | RC0 — Bidirectional I/O / PPS |
| Pin 20 | RC1 — Bidirectional I/O / PPS |
| Pin 21 | RC2 — Bidirectional I/O / PPS |
| Pin 22 | RC3 — Bidirectional I/O / PPS |
| Pin 23 | RC4 — Bidirectional I/O / PPS |
| Pin 24 | RC5 — Bidirectional I/O / PPS |
| Pin 25 | RC6 — Bidirectional I/O / PPS / TX |
| Pin 26 | RC7 — Bidirectional I/O / PPS / RX |
| Pin 27 | RE3 — Bidirectional I/O / MCLR |
| Pin 28 | NC — Not connected (per datasheet) / EP - exposed thermal pad |
Typical Applications
PIC16F15256-E/STX is suitable for 6 applications: Battery-Powered IoT Sensor Node, Home Automation and Smart Lighting Controller, Wearable Health and Fitness Device, Low-Power Wireless Remote Control, Small Motor and Fan Control Board, Battery-Powered Instrumentation and Data Loggers.
Battery-Powered IoT Sensor Node
The PIC16F15256-E/STX fits battery-powered IoT sensor nodes because its eXtreme Low-Power (XLP) sleep mode drops current into the sub-microampere range while keeping the 32 MHz CPU ready for instant wake-up. With 28 KB Flash it can host a small sensor-stack driver and a periodic sampling scheduler; the 2 KB SRAM is sufficient for sensor buffers and protocol state. The 10-bit ADC with up to 18 channels handles multiple analog sensors (temperature, light, battery voltage) on a single die. In a typical 3 V coin-cell design, the part's wide VDD range and XLP sleep enable multi-year battery life.
Recommended
Home Automation and Smart Lighting Controller
The PIC16F15256-E/STX suits smart lighting controllers because its Core Independent Peripherals (CWG, NCO, CCP/PWM) can drive LED strings and TRIAC dimming circuits without CPU overhead. Peripheral Pin Select (PPS) lets designers remap UART, SPI, and PWM outputs onto convenient pins, simplifying PCB routing for multi-channel drivers. The 28-VQFN 4x4 mm footprint fits behind wall switches and small fixture enclosures. With 32 MHz operation the device can execute Zigbee or sub-GHz command stacks alongside local PWM control in real time.
Recommended
Wearable Health and Fitness Device
The PIC16F15256-E/STX suits wearables because its XLP technology and small 28-VQFN 4x4 mm package keep both board area and battery drain minimal. The 10-bit ADC reads heart-rate, temperature, and motion-prep signals; the configurable Logic Cell implements hardware debouncing for button inputs while the CPU sleeps. With 28 KB Flash, designers can fit step-counter algorithms, BLE-friendly command layers, and on-device display drivers in one MCU. Low active current and microsecond wake-up keep duty cycles tight, extending single-charge battery life.
Recommended
Low-Power Wireless Remote Control
For wireless remote controls, the PIC16F15256-E/STX's eXtreme Low-Power sleep and fast wake-up on GPIO interrupt let it idle at nanoampere currents while remaining button-responsive. The EUSART supports sub-GHz transceiver links while the MSSP drives SPI displays or LED feedback rings. The 32 MHz core encodes IR/RF protocols with deterministic timing, and 28 KB Flash holds macro libraries for multiple device profiles. PPS lets the same silicon drive different keypad layouts without re-routing the PCB.
Recommended
Small Motor and Fan Control Board
The PIC16F15256-E/STX drives small brushless-DC fans, pumps, and valve actuators using its CCP/PWM and Complementary Waveform Generator (CWG). Hardware-generated dead-band timing offloads the CPU, leaving bandwidth for closed-loop PID control at 32 MHz. The 10-bit ADC samples back-EMF or current-sense inputs, and PPS allows flexible PCB layouts around motor connector geometry. The 28-VQFN package tolerates industrial temperature ranges, making the part suitable for fan controllers inside white goods and HVAC equipment.
Recommended
Battery-Powered Instrumentation and Data Loggers
The PIC16F15256-E/STX fits portable instrumentation and data loggers because its 28 KB Flash holds small filesystem stacks or compression routines while 2 KB SRAM buffers samples before flush. The 10-bit ADC with multiple channels reads thermocouples, strain gauges, and battery monitors; the EUSART and MSSP drive serial EEPROMs, SD cards, or BLE links. XLP sleep keeps idle power negligible between measurement bursts, so a 2xAA pack can power weeks of unattended logging. Industrial temperature grade ensures field reliability.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F15256-E/STX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F15255-I/SS | PIC16F15254-I/SS | PIC16F15256-E/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN (4x4 mm) | 28-SSOP - different footprint | 28-SSOP - different footprint | 28-SPDIP - different footprint |
| Flash Memory | 28 KB | 14 KB (-50%) | 7 KB (-75%) | 28 KB (identical) |
| SRAM | 2 KB | 1 KB | 1 KB | 2 KB (identical) |
| Maximum CPU Frequency | 32 MHz | 32 MHz (identical) | 32 MHz (identical) | 32 MHz (identical) |
| Core Independent Peripherals (CIPs) | CWG, NCO, PWM, Logic Cell, PPS | CWG, NCO, PWM, Logic Cell, PPS | CWG, NCO, PWM, Logic Cell, PPS | Same CIP set |
| ADC Resolution | 10-bit, up to 18 channels | 10-bit, fewer channels | 10-bit, fewer channels | 10-bit, up to 18 channels (identical) |
| Low-Power Technology | eXtreme Low-Power (XLP) | eXtreme Low-Power (XLP) | eXtreme Low-Power (XLP) | eXtreme Low-Power (XLP) |
| Operating Temperature | -40C to +125C (industrial E) | -40C to +85C (industrial I) | -40C to +85C (industrial I) | -40C to +125C (industrial E) |
Key Differentiators
- 28 KB Flash in 28-VQFN (4x4 mm) with full PPS remap flexibility (vs PIC16F15255-I/SS)
- Industrial extended -40C to +125C grade vs -40C to +85C grade (vs PIC16F15255-I/SS)
- Same PIC16 core/CIP/PPS ecosystem with abundant lower-cost siblings (vs PIC16F15254-I/SS)
Design Notes
The 28-VQFN (4x4) package has an exposed thermal pad (EP) on the underside that must be soldered to a copper pour of at least 4 mm squared on the top or inner PCB layer, with multiple thermal vias to the bottom layer. Without this thermal land the part cannot dissipate the full rated power and will derate severely above ambient 60C. Estimate: with 1 oz copper, a 4 mm squared land yields roughly theta_JA near 35 C/W - acceptable for typical XLP sensor-node workloads.
Place a 100 nF X7R decoupling capacitor within 3 mm of the VDD pin and connect the ground return directly to VSS via a short, wide trace. Add a 10 uF bulk capacitor on the same VDD net if the upstream regulator's source impedance is high (e.g., coin-cell or long cable). For PPS-mapped signals, route remapped peripherals away from analog traces to avoid crosstalk. Always stitch the VQFN's central exposed pad to VSS with at least 5 thermal vias on the inner/bottom planes.
Do not leave unused pins floating - configure them as outputs or inputs with the internal weak pull-up enabled. Avoid drawing more than the rated I/O current from any single pin. When migrating from PIC16F15255/15254 firmware, the higher Flash ceiling of the 15256 means some absolute jump addresses in the bootloader may shift; recompile and verify vector placement. For low-power designs, remember to switch off the ADC and MSSP before SLP instruction - leaving them running prevents XLP sleep currents from dropping below spec.
Keep the external crystal or resonator traces (RA6/RA7 if used) short and symmetric, surrounded by a ground guard ring. Route the ICSP/ICD pins (RB6/RB7) directly to a 6-pin header for in-circuit programming without disturbing the PCB layout. The 4x4 mm VQFN has a 0.4 mm pitch - design rules for non-solder-mask-defined (NSMD) pads with a 0.2 mm stencil aperture are recommended for reflow reliability.
Compliance Information
RoHS compliant per Microchip product page. Lead-free VQFN package. AEC-Q100 automotive qualification is not generally offered for this cost-sensitive family; if automotive is required, use PIC16F188xx or dsPIC33A.
