PIC16LF1503-I/MG - 8-bit MCU, 3.5KB Flash, 16-QFN | Microchip
MPN: PIC16LF1503-I/MG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.34 | $1.34 |
| 10 | $1.21 | $12.10 |
| 100 | $1.08 | $108.00 |
| 500 | $0.96 | $480.00 |
| 1,000 | $0.85 | $850.00 |
PIC16LF1503-I/MG Overview
An 8-bit PIC microcontroller is a compact, deterministic RISC-based processor core optimized for embedded control tasks including sensor reading, actuator driving, and low-power battery-backed duty-cycled applications. PIC MCUs sit within the broader category of microcontrollers -> embedded processors -> semiconductors, and are most often compared to ARM Cortex-M0 and 8051 cores on cost, power, and peripheral integration. The PIC16F/LF1503 family specifically targets cost-sensitive applications where XLP sleep current, analog peripherals, and low pin count matter more than raw CPU performance.
Key features include 20 MHz CPU execution, 49 instructions, 16-level hardware stack, 128 bytes of RAM, 3.5KB (2K x 14) self-programmable Flash, and an enhanced mid-range core with C-compiler-friendly instruction set. The 10-bit ADC with acquisition time and computation supports up to 12 analog channels, and the CWG and NCO allow hardware generation of waveforms without CPU intervention - useful for driving LEDs, buzzers, or simple power converters.
Typical applications include IoT sensor nodes, battery-powered remote controls, consumer appliance controllers, LED lighting drivers, and simple sensor hubs. The 16-QFN package is well suited to compact PCB designs where board height is critical, and the industrial temperature grade allows use in factory and outdoor enclosures.
When designing with this device, pair the QFN package with a properly sized thermal pad and follow Microchip's recommended footprint to ensure solder-joint reliability. The XLP technology provides nanoWatt sleep modes; verify that your firmware uses the available Doze, Idle and Sleep modes to maximize battery life. The QFN package requires careful PCB layout because the exposed pad (EP) provides both thermal dissipation and the IC's substrate ground connection.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC16LF1503-I/MG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1503-I/MG (same form factor and footprint) — differing in ADC, Operating Temperature, Package, Core Architecture, Maximum CPU Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1503-E/MG
✅ Drop-In✓ In Stock
$0.78 / Unit
View Datasheet →PIC16F1503-I/MG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1503T-I/MG
✅ Drop-In✓ In Stock
$0.62 / Unit
View Datasheet →PIC16F1503T-I/MG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1503-I/MG Maximum Ratings & Electrical Characteristics
| Product Series | PIC16 Family, PIC16F150x Series |
| Core Architecture | 8-bit PIC RISC (Enhanced Mid-Range) |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| RAM | 128 B |
| Maximum CPU Frequency | 20 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V (LF variant) |
| I/O Pins | 12 |
| ADC | 10-bit, up to 12 channels |
| Configurable Logic Cells (CLC) | Yes |
| Numerically Controlled Oscillator (NCO) | Yes |
| Complementary Waveform Generator (CWG) | Yes |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 16-QFN (3x3 mm) with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 1 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| XLP (Low-Power) Technology | Yes |
PIC16LF1503-I/MG Pin Configuration
| Pin 1 | RA0/AN0/C1IN0+/ICSPCLK — Bidirectional I/O, analog input, comparator input, programming clock |
| Pin 2 | RA1/AN1/C1IN0-/ICSPDAT — Bidirectional I/O, analog input, comparator input, programming data |
| Pin 3 | RA2/AN2 — Bidirectional I/O, analog input |
| Pin 4 | RA3/MCLR/VPP — Input only, master clear reset, programming voltage input |
| Pin 5 | RA4/AN3 — Bidirectional I/O, analog input |
| Pin 6 | RA5/AN4 — Bidirectional I/O, analog input |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA6/OSC2/CLKOUT — Bidirectional I/O, oscillator output, clock output |
| Pin 9 | RA7/OSC1/CLKIN — Bidirectional I/O, oscillator input, clock input |
| Pin 10 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 11 | RB4/AN10 — Bidirectional I/O, analog input |
| Pin 12 | RB5/AN11 — Bidirectional I/O, analog input |
| Pin 13 | RB6/ICSPCLK — Bidirectional I/O, ICSP clock, ICD clock |
| Pin 14 | RB7/ICSPDAT — Bidirectional I/O, ICSP data, ICD data |
| Pin 15 | RC0/AN8 — Bidirectional I/O, analog input |
| Pin 16 | RC1/AN9 — Bidirectional I/O, analog input |
Typical Applications
PIC16LF1503-I/MG is suitable for 6 applications: Battery-Powered IoT Sensor Node, Consumer Remote Control, LED Lighting Driver Controller, Small Appliance Control Board, Industrial Sensor Transmitter, Handheld Measurement Tool.
Battery-Powered IoT Sensor Node
The PIC16LF1503-I/MG suits battery-powered IoT sensor nodes because its XLP technology delivers sub-microamp sleep current while keeping the 10-bit ADC, CLC, and NCO peripherals active for periodic wake-and-sample cycles. Operating from 1.8V to 3.6V lets the design run directly from a single CR2032 or 2x AA cell stack without an additional boost regulator. The 16-QFN (3x3 mm) footprint keeps the sensor PCB small enough to fit inside sensor housings, and the CWG can drive a piezoelectric buzzer without extra logic. For thermistor, resistive, or 4-20 mA sensor front-ends the 10-bit ADC provides adequate resolution at the 1-2 ksps conversions typical of low-duty-cycle sensor sampling. Compared to an ARM Cortex-M0 design, this PIC removes the need for a separate low-power supervisor and reduces BOM count.
Recommended
Consumer Remote Control
The PIC16LF1503-I/MG is well-matched to consumer remote controls thanks to its low cost, small 16-QFN package, and ability to wake from sleep on a single I/O interrupt while consuming well under 1 uA. The CWG peripheral can synthesize the 36-40 kHz carrier used by typical consumer IR protocols (RC5, NEC, SIRC) without CPU support, freeing the core to handle key-matrix scanning. With 12 I/O pins, the design can decode a 4x4 key matrix or capacitive touch via the on-chip CLC. Flash self-programmability lets remote-control OEMs support custom IR codes and over-the-air firmware updates over unused IR or RF pins. The wide 1.8-3.6 V supply range matches 2x AAA battery packs directly.
Recommended
LED Lighting Driver Controller
In LED lighting controllers - particularly addressable RGB strips or compact constant-current LED drivers - the PIC16LF1503-I/MG's CWG and NCO blocks drive MOSFETs without CPU overhead. The 20 MHz core computes and updates PWM duty-cycle changes in single-digit microseconds, which is fast enough for closed-loop current sensing using a sense resistor and the on-chip comparator. The 10-bit ADC accepts up to 12 channels, so a multi-zone luminaire can monitor temperature, color sensors, and current on a single PIC. With 3.5 KB Flash the design supports DMX, DALI, or proprietary protocols used in architectural lighting. The LF variant's 1.8 V start-up voltage lets the design keep the LED off while the rest of the rail settles.
Recommended
Small Appliance Control Board
Small household appliances (coffee makers, kitchen scales, fan controllers) can use the PIC16LF1503-I/MG to consolidate user interface, motor control, and sensor reads into a single 16-QFN MCU. The CLC blocks can build state machines that handle debounced button inputs directly in hardware, freeing the CPU to manage sensors and time-of-day logic. The NCO synthesises audible alert tones for end-of-cycle beeps without timer overhead, and the 12 I/O drive a 7-segment display, keypad, and relay directly. The industrial -40C to +85C temperature grade handles ambient heating typical in kitchen environments. Compared to discrete logic designs, this PIC removes a handful of gates and timer ICs.
Recommended
Industrial Sensor Transmitter
Industrial 4-20 mA or 0-10 V sensor transmitters benefit from the PIC16LF1503-I/MG's industrial temperature range, robust ADC, and low power profile. The 10-bit ADC digitizes RTD, thermocouple, or strain-gauge signals through a low-cost front-end, and the CLC blocks implement first-order digital filtering in hardware to reduce software load. Operating from 1.8 V, the design can run from a 4-20 mA loop's residual compliance voltage at very low current draw, allowing loop-powered field transmitters with no local battery. The 16-QFN EP package accepts reflow soldering onto compact encapsulated PCBs conforming to IP67 housings. Compared to ASIC-based transmitters, this PIC offers field-reprogrammable calibration and protocol updates.
Recommended
Handheld Measurement Tool
Handheld measurement tools (digital calipers, light meters, humidity probes) need the PIC16LF1503-I/MG's low sleep current, small footprint, and wide 1.8-3.6 V supply. A single CR2032 or coin-cell can power the meter for months because the device wakes only briefly to take a measurement, display the result, then returns to sub-1 uA sleep. The exposed thermal pad on the 16-QFN package dissipates heat from a backlit LCD or OLED panel. Flash self-programmability supports custom unit conversions and linearity compensation tables that the meter manufacturer can update in the field. Compared to discrete logic, this PIC replaces an op-amp, ADC, and timing IC with one part.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1503-I/MG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1503-E/MG | PIC16F1503-I/MG | PIC16LF1503T-I/MG | PIC16F1503T-I/MG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-QFN (3x3 mm) | 16-QFN (3x3 mm) - same | 16-QFN (3x3 mm) - same | 16-QFN (3x3 mm) - same | 16-QFN (3x3 mm) - same |
| Program Memory (Flash) | 3.5 KB (2K x 14) | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB |
| RAM | 128 B | 128 B | 128 B | 128 B | 128 B |
| Operating Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| I/O Pins | 12 | 12 | 12 | 12 | 12 |
| ADC | 10-bit, up to 12 channels | 10-bit, 12 channels | 10-bit, 12 channels | 10-bit, 12 channels | 10-bit, 12 channels |
| Tape and Reel | Tube (no T-suffix) | Tube or Tray | Tube or Tray | Tape & Reel | Tape & Reel |
Key Differentiators
- Lowest-cost 16-QFN PIC16 with CLC, NCO, and CWG peripherals (vs PIC16F1503-I/MG)
- Extended temperature grade drop-in option (vs PIC16LF1503-E/MG)
- Higher-density thermal dissipation on compact PCBs (vs PIC16LF1503-I/P (PDIP-14))
Design Notes
Estimated: the 16-QFN exposed thermal pad (EP) is the primary heat-dissipation path for the PIC16LF1503-I/MG. At 20 MHz active and 3.3 V VDD, total current draw is ~3 mA yielding ~10 mW power dissipation - within the package's thermal limits for natural-convection cooling on a 4-layer board. However, the EP MUST be soldered to a copper land at least 10 mm^2 in area with multiple thermal vias for reliable industrial -40C to +85C operation. An unsoldered or poorly soldered EP dramatically raises junction temperature and reduces Flash data retention margin.
Keep the QFN footprint as close to Microchip's QFN-16 (3x3) recommended land pattern as possible. Use NSMD (non-solder mask defined) pads with 0.2-0.25 mm solder-mask openings to maximize copper for reflow wetting. Place the exposed pad as a single, contiguous copper region rather than multiple isolated sections. Add 4 to 6 thermal vias at 0.3 mm drill size in the EP region. Decoupling: place a 100 nF X7R ceramic capacitor within 2 mm of the VDD pin, with a 10 uF bulk capacitor on the same supply rail within 10 mm.
Do not apply more than 3.6 V to VDD on the LF variant - the LF silicon has a lower absolute-max VDD than the F variant (F is 5.5 V). The RA3/MCLR/VPP pin is the only input-only pin and can be configured as MCLR with internal pull-up disabled for use as a digital-only input. When using ICSP, ensure no strong pull-ups are present on RB6/RB7 because they will fight the programmer. Configure the WDT, BOR, and PWRT in CONFIG1 to your application's needs during the first firmware boot - locked-out bits cannot be changed later without a programmer.
Compliance Information
RoHS compliant per Microchip product page; lead-free QFN package finish. The -I industrial temperature grade is not AEC-Q100 qualified - automotive designs should reference Microchip's automotive-grade PIC portfolio.
