PIC16LF1613-E/ML - 8-bit 32MHz 3.5KB Flash XLP MCU | Microchip
MPN: PIC16LF1613-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.2 | $1.20 |
| 10 | $1.08 | $10.80 |
| 100 | $0.92 | $92.00 |
| 500 | $0.78 | $390.00 |
| 1,000 | $0.66 | $660.00 |
| 3,000 | $0.55 | $1,650.00 |
PIC16LF1613-E/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, RAM, and programmable peripherals on one die. The PIC16 family uses a 14-bit modified Harvard RISC architecture optimized for deterministic real-time control, sitting within Microchip's hierarchy as: PIC16 -> PIC mid-range 8-bit -> 8-bit MCU -> microcontroller -> embedded computing. The 'XLP' (eXtreme Low Power) designation guarantees sub-uA sleep currents, enabling battery-powered designs where quiescent draw dominates battery life.
Key features of the PIC16LF1613 include 12 I/O pins shared with peripheral functions, a 10-bit ADC with up to 11 channels, two comparators, two 8-bit timers plus one 16-bit timer, and an enhanced PWM module with complementary outputs suitable for half-bridge motor control. The 32MHz internal oscillator eliminates an external crystal in cost-sensitive applications. The 'ML' suffix denotes the 16-QFN (4x4) package, which provides compact PCB footprint and good thermal performance via the exposed pad.
Typical applications include low-cost sensor nodes, household appliance white goods, battery-powered IoT end-nodes, small DC motor and fan controllers, and general-purpose logic-replacement designs. The PIC16LF1613-E/ML also fits remote controls and human-interface boards where space is constrained.
When designing with this MCU, connect the exposed pad (EP) to a clean ground plane to improve thermal dissipation and electrical grounding. Decouple VDD with a 100nF ceramic capacitor placed within 5mm of the supply pin, and follow Microchip AN2169 'Family Migration Guide' for migration between PIC16LF1613, PIC16F1613, and the 8-pin/14-pin members of the PIC16(L)F161x family.
This page synthesizes distributor pricing, package-aware drop-in alternatives, and design notes not in the abstract - cross-references both same-family Microchip variants and pin-compatible cross-brand alternatives where available.
Drop-in alternatives for PIC16LF1613-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1613-E/ML (same form factor and footprint) — differing in Package, Program Memory (Flash), Core Architecture, ADC, Maximum CPU Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1613-I/ML
✅ Drop-In✓ In Stock
$0.92 / Unit
View Datasheet →PIC16LF1613-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1613T-I/ML
✅ Drop-In✓ In Stock
$0.62 / Unit
View Datasheet →PIC16LF1614-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.93 / Unit
View Datasheet →PIC16LF1613-E/ML Maximum Ratings & Electrical Characteristics
| Architecture | PIC16 8-bit RISC (14-bit instruction word) |
| Core | PIC mid-range 8-bit |
| Family | PIC16(L)F161x XLP |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 3.5 KB (2K x 14 words) |
| Data SRAM | 256 B |
| Operating Voltage (VDD) | 1.8 V to 3.6 V (LF variant) |
| I/O Pins | 12 |
| Package | 16-QFN (4x4 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| ADC | 10-bit, up to 11 channels |
| Comparators | 2 |
| Timers | Two 8-bit + one 16-bit |
| PWM | Enhanced PWM with complementary outputs |
| Internal Oscillator | 32 MHz (factory calibrated) |
| RoHS Status | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) - sub-uA sleep |
PIC16LF1613-E/ML Pin Configuration
| Pin 1 | RA5 — GPIO / ADC input / comparator input |
| Pin 2 | RA4 — GPIO / ADC input / Timer0 clock |
| Pin 3 | RA3 — GPIO / MCLR / ADC input |
| Pin 4 | RC5 — GPIO / PWM output |
| Pin 5 | RC4 — GPIO / PWM output |
| Pin 6 | RC3 — GPIO / PWM output / I2C SCL |
| Pin 7 | RC2 — GPIO / PWM output / I2C SDA |
| Pin 8 | RC1 — GPIO / PWM output / comparator output |
| Pin 9 | RC0 — GPIO / comparator output |
| Pin 10 | VSS — Ground |
| Pin 11 | RA2 — GPIO / ADC input / comparator input |
| Pin 12 | RA1 — GPIO / ICSPCLK / ADC input |
| Pin 13 | RA0 — GPIO / ICSPDAT / ADC input |
| Pin 14 | VDD — Positive supply voltage |
| Pin 15 | RA7 — GPIO / ADC input |
| Pin 16 | RA6 — GPIO / ADC input / oscillator |
| Pin EP | EP — Exposed thermal pad - connect to VSS/GND |
Typical Applications
PIC16LF1613-E/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Household Appliance White Goods, Small DC Motor and Fan Controllers, Remote Controls and HMI Keypads, LED Lighting and Strip Controllers, General-Purpose Logic-Replacement Designs.
Battery-Powered IoT Sensor Nodes
The PIC16LF1613-E/ML's XLP architecture and 1.8V minimum VDD make it ideal for battery-powered IoT sensor nodes where quiescent draw dominates energy budget. Its sub-uA deep-sleep current with RAM retention allows years of operation from a single CR2032 coin cell, while the 32 MHz internal oscillator eliminates external crystal BOM cost and reduces quiescent leakage paths. The 10-bit ADC with up to 11 channels reads multiple sensor inputs (temperature, humidity, light) sequentially, and 12 GPIO lines drive LEDs and an external sub-GHz/BLE transceiver's wake-up pin. The 16-QFN (4x4 mm) footprint enables nodes under 10x10 mm.
Recommended
Household Appliance White Goods
The PIC16LF1613-E/ML's -40C to +125C operating range (E grade) and 32 MHz CPU make it ideal for household appliance white-goods control boards such as coffee makers, blenders, and air purifiers. Its enhanced PWM with complementary outputs drives small DC motors and fan stages directly via gate-driver MOSFETs, while two analog comparators implement zero-cross detection for TRIAC-controlled resistive heaters. The 12 GPIO scan a 4x4 key matrix for user input, and the 10-bit ADC reads NTC thermistors for closed-loop temperature regulation. The wide 1.8V-3.6V range simplifies power supply design from a single 3.3V LDO.
Recommended
Small DC Motor and Fan Controllers
The PIC16LF1613-E/ML's enhanced PWM with complementary outputs and dead-band control makes it ideal for small DC motor and fan controllers. Two comparators sense motor back-EMF for sensorless commutation or zero-cross timing of AC fan TRIAC drives, and the 32 MHz MIPS-class throughput implements field-oriented control loops for small BLDC motors. The wide -40C to +125C operating range tolerates the under-hood thermal environment in motor housings. 256 B SRAM is sufficient for one-PI-axis control, and the 16-QFN (4x4 mm) package fits small brushless-DC inverter PCBs alongside the gate driver.
Recommended
Remote Controls and HMI Keypads
The PIC16LF1613-E/ML's 12 GPIO, XLP sleep, and 16-QFN (4x4 mm) package make it ideal for compact remote controls, IR transmitter keypads, and HMI front panels. Its sub-uA sleep current allows multi-year battery life on a coin cell with instantaneous wake on a GPIO interrupt, and the 32 MHz internal oscillator handles IR carrier generation (38 kHz typical) directly without external components. The 10-bit ADC reads resistive-touch or potentiometer inputs for slider controls. The exposed pad's small 4x4 mm footprint enables behind-glass mounting for clean industrial designs.
Recommended
LED Lighting and Strip Controllers
The PIC16LF1613-E/ML's enhanced PWM with multiple complementary output pairs makes it ideal for entry-level LED lighting controllers driving RGB or RGBW strips. The 32 MHz CPU implements software Color-Mixing-Wheel (CMW) algorithms for tunable-white or circadian-rhythm lighting, and the 10-bit ADC reads ambient light sensors for daylight harvesting. The 1.8V-3.6V range accepts a single-cell Li-ion battery for portable accent lighting. The 12 GPIO drive high-side MOSFETs for 4-channel strips or DMX-style addressable-LED data lines.
Recommended
General-Purpose Logic-Replacement Designs
The PIC16LF1613-E/ML's 32 MHz CPU and 12 GPIO make it ideal for replacing legacy 74-series discrete logic with a single low-cost MCU. State machines for cable adapters, simple protocol bridges (UART-to-I2C, SPI-to-UART), and pin-multiplexing glue logic are handled in 3.5 KB Flash with predictable interrupt latency from the 8-bit PIC core. The XLP architecture reduces quiescent draw compared to discrete CMOS logic arrays, and the 16-QFN (4x4 mm) fits existing logic-IC footprints with no PCB rework. The wide 1.8V-3.6V range interfaces directly with 1.8V, 2.5V, and 3.3V logic domains.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1613-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1613-I/ML | PIC16LF1613-I/ML | PIC16LF1613T-I/ML | PIC16LF1614-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-QFN (4x4) | 16-QFN (4x4) - same | 16-QFN (4x4) - same | 16-QFN (4x4) - same | 16-QFN (4x4) - same |
| Operating Voltage (VDD) | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Program Memory (Flash) | 3.5 KB | 3.5 KB | 3.5 KB | 3.5 KB | 7 KB (+100%) |
| Data SRAM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Maximum CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Low-Power Technology | XLP | XLP | XLP | XLP | XLP |
| I/O Pins | 12 | 12 | 12 | 12 | 12 |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- 1.8V minimum VDD enables single-cell Li-ion coin-cell designs (vs PIC16F1613-I/ML)
- E temperature grade supports -40C to +125C industrial thermal range (vs PIC16LF1613-I/ML)
- XLP architecture delivers sub-uA deep-sleep currents with RAM retention (vs PIC16F616)
Design Notes
Decouple VDD (pin 14) with a 100nF X7R ceramic capacitor placed within 5mm of the package pad to suppress switching transients from the internal core. For XLP sleep-mode designs, also add a 1uF bulk capacitor near the VDD pin to handle peak current during wake-up from sub-uA sleep. The exposed thermal pad (EP) must be soldered to a continuous ground plane with multiple vias to provide thermal dissipation and a stable VSS reference for the ADC and comparators.
Use IPC-7351 land pattern 'QFN-16 4x4 mm 0.65 mm pitch' for the 16-QFN (ML) footprint. Route RA0 and RA1 (ICSPDAT/ICSPCLK) to a 2x3 0.1-inch header for in-circuit serial programming and debugging using PICkit 3/4 or MPLAB Snap. Keep ADC traces short and isolated from PWM switching traces to minimize digital-noise coupling into analog measurements.
Do not confuse the LF (1.8V-3.6V) and F (2.3V-5.5V) variants when sourcing - the 'L' prefix is mandatory for designs that must operate below 2.3V. MCLR (pin 3, shared with RA3) must be tied to VDD through a 10 kohm resistor if not used as a reset source; floating MCLR prevents startup. Confirm the E vs I temperature grade is appropriate for the end environment (E for -40C to +125C industrial, I for -40C to +85C commercial).
Compliance Information
RoHS and REACH compliant per Microchip product page and DigiKey listing. Lead-free reflow profiles per JEDEC J-STD-020 supported. Not AEC-Q100 qualified - select PIC16F1613-E/ML or PIC16LF1613-E/ML only for non-automotive safety applications.
