PIC16LF1709-E/SO - 8KB Flash 32MHz 8-bit MCU | Microchip
MPN: PIC16LF1709-E/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.5 | $2.50 |
| 10 | $2.25 | $22.50 |
| 100 | $1.95 | $195.00 |
| 500 | $1.7 | $850.00 |
| 1,000 | $1.5 | $1,500.00 |
PIC16LF1709-E/SO Overview
What is an 8-bit flash microcontroller? An 8-bit flash microcontroller is a single-chip computer built around an 8-bit data path with non-volatile Flash program memory that can be reprogrammed in-circuit, paired with RAM, EEPROM, digital I/O, timers, and analog peripherals. Microcontrollers sit in the broader embedded processing hierarchy: microcontroller -> embedded processor -> microprocessor -> integrated circuit -> semiconductor. The PIC16 family uses a RISC Harvard architecture with separate program and data buses, simplifying instruction fetch and supporting deterministic interrupt response for real-time control.
Key features include Active Clock Tuning for HF internal oscillator accuracy, 4-channel PWM with complementary outputs, Enhanced Universal Synchronous/Asynchronous Receiver/Transmitter (EUSART), two SPI/I2C masters, and a hardware touch slider interface. Integrated op amps and a 10-bit ADC with computation (ADC2) reduce external component count in sensor-conditioning designs. The 'LF' prefix denotes the low-voltage F-core variant, while the 'E' suffix indicates an extended temperature grade of -40°C to +125°C.
Typical applications include low-cost general-purpose embedded control, IoT sensor nodes, battery-powered consumer devices, capacitive touch user interfaces, LED lighting controllers, and low-power remote controls that benefit from XLP sleep currents in the microamp range. Industrial sensor signal-conditioning applications use the on-chip op amps to eliminate external amplifiers and shrink BOM cost.
Drop-in alternatives for PIC16LF1709-E/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1709-E/SO (same form factor and footprint) — differing in Operating Temperature, ADC, MSL Level, Package, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1709-I/SO
✅ Drop-In✓ In Stock
$1.38 / Unit
View Datasheet →PIC16F1709-E/SO
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16LF1708-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1508-I/SO
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16LF1509-I/SS
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.4 / Unit
View Datasheet →PIC16F1719-I/SO
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16LF1709-E/SO Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit RISC Harvard (PIC16) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1024 bytes |
| CPU Speed | up to 32 MHz |
| Supply Voltage (LF core) | 1.8 V to 3.6 V |
| ADC | 10-bit |
| On-Chip Op Amps | Yes (selectable) |
| Core Independent Peripherals | CLC, COG, Zero Cross Detect |
| PWM Channels | 4 with complementary outputs |
| Communication Interfaces | EUSART, 2x SPI/I2C, mTouch |
| Operating Temperature | -40C to +125C (E suffix) |
| Package | 20-pin SOIC (SO) |
| Mounting Type | Surface Mount |
| MSL Level | 1 (per Microchip SOIC standard) |
| RoHS Status | Compliant |
PIC16LF1709-E/SO Pin Configuration
| Pin 1 | RA3/AN3/C1IN+/C12IN0-/VREF+ — Bidirectional I/O; analog input; comparator input |
| Pin 2 | RA4/AN4/C1OUT/SDO/T0CKI — Bidirectional I/O; analog input; comparator output; SPI data out; Timer0 clock |
| Pin 3 | RA5/MCLR/VPP — Bidirectional I/O; Master Clear (reset) input; programming voltage |
| Pin 4 | RA0/AN0/C12IN0+ — Bidirectional I/O; analog input |
| Pin 5 | RA1/AN1/C12IN1- — Bidirectional I/O; analog input |
| Pin 6 | RA2/AN2/C12IN0-/C2IN+ — Bidirectional I/O; analog input |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7/OSC1/CLKIN — Crystal oscillator input / external clock input |
| Pin 9 | RA6/OSC2/CLKOUT — Crystal oscillator output / clock output |
| Pin 10 | RC0/SOSCO — Bidirectional I/O; secondary oscillator output |
| Pin 11 | RC1/SOSCI — Bidirectional I/O; secondary oscillator input |
| Pin 12 | RC2/CCP1 — Bidirectional I/O; Capture/Compare/PWM1 |
| Pin 13 | RC3/CCP2 — Bidirectional I/O; Capture/Compare/PWM2 |
| Pin 14 | RC4/SDA/SDI — Bidirectional I/O; I2C data; SPI data in |
| Pin 15 | RC5/SCL/SCK — Bidirectional I/O; I2C clock; SPI clock |
| Pin 16 | RC6/SS/TX/CK — Bidirectional I/O; SPI slave select; UART TX; EUSART clock |
| Pin 17 | RC7/SDO/RX/DT — Bidirectional I/O; SPI data out; UART RX; EUSART data |
| Pin 18 | RB7/ICSPDAT — Bidirectional I/O; In-Circuit Serial Programming data |
| Pin 19 | RB6/ICSPCLK — Bidirectional I/O; In-Circuit Serial Programming clock |
| Pin 20 | VDD — Positive supply voltage |
Typical Applications
PIC16LF1709-E/SO is suitable for 6 applications: Battery-Powered IoT Sensor Node, Capacitive Touch User Interface, Sensor Signal Conditioning and Data Acquisition, LED Lighting Controller, Low-Power Remote Control, Industrial Control and Automation Module.
Battery-Powered IoT Sensor Node
The PIC16LF1709-E/SO fits battery-powered IoT sensor nodes because its 1.8 V to 3.6 V LF core and XLP sleep currents in the microamp range enable years of operation from a single CR2032 cell. With 14 KB Flash it accommodates small protocol stacks or proprietary sensor firmware, while the on-chip 10-bit ADC and selectable op amps eliminate the external instrumentation amplifier usually required for resistive-bridge sensors. Designers place the part between a 3 V coin cell and the sensor, drive the ADC via firmware-controlled duty cycling, and let Core Independent Peripherals (CLC, ZCD) wake the core only on threshold events. The SOIC-20 footprint supports compact sensor modules where PCB area and BOM count are critical design drivers.
Recommended
Capacitive Touch User Interface
With the integrated mTouch peripheral plus a 10-bit ADC and selectable op amp, the PIC16LF1709-E/SO drives single-chip capacitive touch sliders, buttons, and proximity sensors without external driver ICs. The on-chip CLC and COG can replace glue logic that would otherwise encode button-press events or drive PWM buzzer feedback. In a 3.3 V appliance UI, the MCU sits between the touch electrodes and the host communication line (EUSART), debounces inputs in firmware, and uses the 32 MHz core to update gestures at 100 Hz with stable response. The 14 KB Flash accommodates a touch library plus app firmware, and the SOIC-20 package is hand-solderable for prototype HMI boards.
Recommended
Sensor Signal Conditioning and Data Acquisition
The PIC16LF1709-E/SO is well suited to low-cost sensor signal-conditioning boards because the on-chip selectable op amps eliminate the external instrumentation amplifier that usually accompanies strain-gauge or thermocouple front ends. Combined with the ADC2 (ADC with computation) that automates averaging and threshold comparison, the MCU converts, filters, and linearizes sensor data on-chip, reducing CPU wake time and improving battery life. In a 24-bit load-cell digitizer the PIC16LF1709-E/SO could act as front-end gain stage controller while pairing with a dedicated ADC; in lower-resolution flow meters or thermistor modules it acts as the sole ADC. The 14 KB Flash is plenty for calibration tables and linearization polynomials.
Recommended
LED Lighting Controller
The PIC16LF1709-E/SO is well matched to LED lighting controllers thanks to the four PWM channels with complementary outputs and the COG peripheral for hardware-managed dead-band generation - both essential for half-bridge and full-bridge LED driver topologies. The LF core supports 1.8 V to 3.6 V operation, so the part can run from a single-cell Li-ion supply, dimming strings of LEDs without external MOSFET drivers. Designers using the MCU in a 12 V MR16 retrofit lamp benefit from the small SOIC-20 footprint and the on-chip 32 MHz clock. The 14 KB Flash accommodates color-mixing algorithms, flicker-free dim curves, and DMX or DALI receive stacks.
Recommended
Low-Power Remote Control
For battery-powered remote controls commanding TVs, ceiling fans, or industrial cranes, the PIC16LF1709-E/SO provides the right balance of low power, modest Flash, and serial peripherals. XLP sleep currents below 1 microamp extend shelf life in storage, while the integrated EUSART supports one-way or two-way RF link control alongside an external transceiver. With 14 KB of Flash and the CLC peripheral, designers can implement command decoders, RF protocol state machines, and IR/Sub-GHz transmission without an extra logic IC. The 20-pin SOIC fits the typical remote control PCB with a coin-cell battery and tactile keypad.
Recommended
Industrial Control and Automation Module
In industrial control modules the PIC16LF1709-E/SO operates as a low-cost PLC sub-controller or sensor hub. The PWM channels drive small DC motor speed control or solenoid actuation, while EUSART/SPI interfaces link to upstream controllers or HMI panels. The op amps handle 4-20 mA current-loop receiver signal scaling, and the ADC with computation delivers averaged process variables with hardware oversampling. The -40°C to +125°C extended temperature grade (E suffix) allows placement near motor drives and power electronics. The SOIC-20 footprint is well established on DIN-rail carrier boards used in industrial assemblies.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1709-E/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1709-I/SO | PIC16F1709-E/SO | PIC16LF1708-I/SO | PIC16LF1508-I/SO | PIC16LF1509-I/SS |
|---|---|---|---|---|---|---|
| Package | SOIC-20 (SO) | SOIC-20 (SO) - same | SOIC-20 (SO) - same | SOIC-20 (SO) - same | SOIC-20 (SO) - same | SSOP-20 (SS) - same pin count |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory | 14 KB (8K x 14) | 14 KB (same) | 14 KB (same) | 7 KB (smaller) | 7 KB (smaller) | 14 KB (same) |
| Data RAM | 1024 bytes | 1024 B (same) | 1024 B (same) | 512 B (smaller) | 256 B (smaller) | 512 B (smaller) |
| Supply Voltage | 1.8 V to 3.6 V (LF) | 2.3 V to 5.5 V (F) | 2.3 V to 5.5 V (F) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) | 1.8 V to 3.6 V (LF) |
| CPU Speed | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS (same) | 32 MHz / 8 MIPS (same) | 32 MHz / 8 MIPS (same) | 20 MHz / 5 MIPS | 20 MHz / 5 MIPS |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| On-Chip Op Amps | Yes | Yes | Yes | Yes | No | No |
| Core Independent Peripherals | CLC, COG, ZCD | CLC, COG, ZCD | CLC, COG, ZCD | CLC, COG, ZCD | No | No |
Key Differentiators
- Intelligent Analog integration with selectable on-chip op amps (vs PIC16LF1508-I/SO)
- Larger program memory and RAM in same SOIC-20 footprint (vs PIC16LF1708-I/SO)
- Extended -40C to +125C temperature grade (E suffix) (vs PIC16F1709-I/SO)
- Low-voltage LF core for battery-powered products (vs PIC16F1709-E/SO (F core))
Design Notes
Estimated: at 32 MHz active and 3.3 V Vdd, the PIC16LF1709-E/SO core current is typically 2-4 mA (compute workloads), while XLP sleep draws under 1 uA. For battery-budget calculations, use Idle mode (~1-2 mA) and Doze to keep peripherals running while gating the CPU. Always include a 100 nF + 10 uF bulk decoupling pair close to pins 7 (VSS) and 20 (VDD), and place a 100 nF on MCLR/VPP (pin 3) to prevent spurious resets in noisy industrial environments.
The PIC16LF1709-E/SO in SOIC-20 benefits from a ground pour under and around the IC, with the decoupling caps on the same copper layer and tied to VSS pin 7 with short, wide traces. Keep the crystal traces (RA6/OSC2 pin 9, RA7/OSC1 pin 8) short, symmetric, and guarded by ground; for HFINTOSC-only designs these pins can be reassigned as GPIO via PPS to free the crystal area. Use a guard trace or via stitch around high-impedance analog inputs (AN0-AN4) to keep switching noise out of the ADC.
Do not connect MCLR (pin 3) directly to VDD without a pull-up; an RC (10 kohm + 100 nF) reset network or a 10 kohm pull-up with capacitor on MCLR is recommended per Microchip's mid-range family guideline. When migrating from PIC16LF1708 firmware, verify the larger Flash (14 KB vs 7 KB) and RAM (1024 B vs 512 B) changes the linker script and config-word addresses; always re-read the configuration bits because 170x and 150x families use different config-word bit ordering. Finally, do not exceed VDD = 3.6 V on the LF core - the wide-V-range F-core PIC16F1709-E/SO is required for 5 V rails.
When using the integrated op amps to condition a 4-20 mA loop, place a series 10 kohm gain resistor close to the op-amp input pin and a feedback network within 5 mm of the inverting input. For PWM-driven LED or motor loads, route high-di/dt traces (PWM outputs RC2/RC3, pins 12/13) away from analog input traces and add a small ferrite or RC snubber at the connector to reduce radiated emissions. Use ICSP pins RB6 (pin 19) and RB7 (pin 18) with a programming header that does not add stray capacitance above 20 pF, or in-circuit debug will fail to handshake.
Compliance Information
RoHS compliance and lead-free finish per Microchip product page; AEC-Q100 qualification not stated for PIC16LF1709-E/SO (E suffix denotes extended temperature grade, not AEC-Q100). For AEC-Q100 qualified PIC16 equivalents consider PIC16F1709-E/SO in automotive-qualified lots - confirm with Microchip sales.
