PIC16LF1719-E/MV - 28KB Flash 8-bit MCU, 40-UQFN | Microchip
MPN: PIC16LF1719-E/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.74 | $2.74 |
| 10 | $2.61 | $26.10 |
| 100 | $2.32 | $232.00 |
| 500 | $2.07 | $1,035.00 |
| 1,000 | $1.85 | $1,850.00 |
PIC16LF1719-E/MV Overview
What is a microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals such as ADCs, timers, and communication interfaces. MCUs sit at the top of the embedded system hierarchy: MCU -> embedded processor -> semiconductor IC, and they are the workhorse of consumer, industrial, automotive, and IoT products. The PIC16LF1719 belongs to the Microchip 8-bit PIC16 family, which prioritizes deterministic execution, low power, and core-independent peripherals over raw clock speed.
Key features include 28KB (16K x 14) self-programmable Flash, 2KB RAM, 1 x 5-bit and 1 x 8-bit DAC, 10-bit ADC, on-chip op amps, comparators, zero-cross detect, CLC (Configurable Logic Cell), COG (Complementary Output Generator), NCO (Numerically Controlled Oscillator), and Peripheral Pin Select for flexible signal routing. The XLP (eXtreme Low Power) architecture delivers nanoWatt sleep currents, making the device suitable for battery-powered sensor and IoT applications.
The architecture uses a Harvard-style 8-bit RISC core with 14-bit instruction word, supporting instruction pipelining and a hardware multiplier option. The device includes an integrated 32MHz internal oscillator with PLL flexibility, plus support for crystal operation. The 40-UQFN package provides an exposed thermal pad, enabling efficient heat extraction in space-constrained layouts.
Typical applications include low-cost sensor signal conditioning, LED lighting control, battery-powered IoT nodes, consumer white goods, and general-purpose embedded control where on-chip analog reduces BOM cost. The combination of op amps, DACs, and configurable logic on a single die eliminates many external components, shrinking PCB area and reducing overall system cost.
When designing with this MCU, ensure the exposed pad on the 40-UQFN package is properly soldered to a sufficient copper pour for both thermal dissipation and ground integrity. The supply decoupling network should follow the datasheet reference layout with a 100nF ceramic placed within 3mm of the VDD pins, and unused I/O should be configured as outputs to minimize quiescent current.
This page synthesizes distributor pricing, drop-in alternatives from the PIC16LF171x family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for PIC16LF1719-E/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1719-E/MV (same form factor and footprint) — differing in ADC, Package, DAC, Program Memory (Flash), Comparators.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF1718-E/MV
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →PIC16F1719-E/MV
✅ Drop-In✓ In Stock
$2.75 / Unit
View Datasheet →PIC16LF15355-I/MV
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC16LF15376-E/MV
✅ Drop-In✓ In Stock
$1.68 / Unit
View Datasheet →PIC16LF1503-I/MV
✅ Drop-In✓ In Stock
$0.52 / Unit
View Datasheet →PIC16LF1719-E/MV Maximum Ratings & Electrical Characteristics
| Core | PIC 8-bit RISC (14-bit instruction word) |
| Program Memory (Flash) | 28 KB (16K x 14) |
| RAM | 2 KB |
| Maximum CPU Frequency | 32 MHz |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +125C |
| ADC | 10-bit, multi-channel |
| DAC | 1 x 5-bit, 1 x 8-bit |
| Package | 40-UQFN (5x5 mm) with exposed pad |
| Pin Count | 40 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) / nanoWatt |
| On-chip Analog | Op amps, comparators, zero-cross detect |
| Configurable Logic | CLC, COG, NCO, Peripheral Pin Select |
PIC16LF1719-E/MV Pin Configuration
| Pin 1 | RA3/MCLR — Digital I/O / Master Clear (reset) input |
| Pin 2 | RA4 — Digital I/O / analog input |
| Pin 3 | RA5 — Digital I/O / analog input |
| Pin 4 | RA6 — Digital I/O / analog input |
| Pin 5 | RA7 — Digital I/O / analog input |
| Pin 6 | VDD — Positive supply voltage |
| Pin 7 | RA0 — Digital I/O / analog input |
| Pin 8 | RA1 — Digital I/O / analog input / op-amp output |
| Pin 9 | RA2 — Digital I/O / analog input / op-amp inverting input |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RC0 — Digital I/O / analog input |
| Pin 12 | RC1 — Digital I/O / analog input |
| Pin 13 | RC2 — Digital I/O / analog input |
| Pin 14 | RC3 — Digital I/O / analog input / SCL |
| Pin 15 | RC4 — Digital I/O / analog input / SDA |
| Pin 16 | RC5 — Digital I/O / analog input |
| Pin 17 | RC6 — Digital I/O / TX |
| Pin 18 | RC7 — Digital I/O / RX |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage |
| Pin 21 | RB0 — Digital I/O / analog input / interrupt |
| Pin 22 | RB1 — Digital I/O / analog input |
| Pin 23 | RB2 — Digital I/O / analog input |
| Pin 24 | RB3 — Digital I/O / analog input |
| Pin 25 | RB4 — Digital I/O / analog input |
| Pin 26 | RB5 — Digital I/O / analog input |
| Pin 27 | RB6 — Digital I/O / PGC (programming) |
| Pin 28 | RB7 — Digital I/O / PGD (programming) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | NC — Not connected (per datasheet) |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | RD0 — Digital I/O / analog input |
| Pin 36 | RD1 — Digital I/O / analog input |
| Pin 37 | RD2 — Digital I/O / analog input |
| Pin 38 | RD3 — Digital I/O / analog input |
| Pin 39 | RD4 — Digital I/O / analog input |
| Pin 40 | RD5 — Digital I/O / analog input |
| Pin EP | EP — Exposed thermal pad - connect to VSS for thermal dissipation |
Typical Applications
PIC16LF1719-E/MV is suitable for 7 applications: Battery-Powered IoT Sensor Node, LED Lighting Control, Consumer White Goods Control, Industrial Sensor Signal Conditioning, HVAC Fan and Blower Control, Low-Cost General Purpose Embedded Control, Battery Charger and Power Bank Controller.
Battery-Powered IoT Sensor Node
The PIC16LF1719-E/MV's 28KB Flash, 2KB RAM, XLP nanoWatt sleep mode, and integrated 10-bit ADC make it ideal for battery-powered IoT sensor nodes. With sub-microamp sleep current, the MCU can wake periodically to read sensors via the ADC, perform lightweight signal processing, and return to sleep, enabling multi-year battery life on a single CR2032. The integrated op amps condition sensor signals directly, eliminating external analog front-end ICs. Pair with a low-power radio module (e.g., sub-GHz or BLE) for duty-cycled wireless transmission.
Recommended
LED Lighting Control
The PIC16LF1719-E/MV is well-suited for smart LED lighting controllers, leveraging its CLC (Configurable Logic Cell), COG (Complementary Output Generator), and integrated op amps to drive constant-current LED strings without external driver ICs. The 8-bit DAC and 10-bit ADC enable smooth dimming curves and closed-loop current regulation, while the 32MHz core delivers flicker-free PWM generation up to 16-bit resolution. The wide 1.8V to 3.6V operating range supports direct battery or USB-powered fixtures.
Recommended
Consumer White Goods Control
For consumer white goods like washing machines, dishwashers, and small appliances, the PIC16LF1719-E/MV delivers ample Flash (28KB) for state-machine firmware, plus on-chip op amps for sensor conditioning (temperature, water level, motor current sensing). The Peripheral Pin Select feature allows flexible PCB layout with remappable peripheral I/O, while the 40-UQFN package fits behind displays in space-constrained control panels. AEC-Q100 is not required for indoor white-goods, so the standard industrial-grade LF device is cost-optimal.
Recommended
Industrial Sensor Signal Conditioning
The PIC16LF1719-E/MV's integrated on-chip op amps, 10-bit ADC, 5-bit and 8-bit DACs, and zero-cross detect make it ideal for analog sensor front-end processing in industrial applications. Bridge sensors (load cells, strain gauges) can be conditioned directly without external instrumentation amplifiers, reducing BOM count and PCB area. The 1.8V to 3.6V supply supports loop-powered 4-20mA transmitter designs when paired with a current loop interface, and the -40C to +125C operating range suits harsh factory environments.
Recommended
HVAC Fan and Blower Control
In HVAC fan and blower motor control, the PIC16LF1719-E/MV delivers 32MHz throughput for closed-loop RPM control via the integrated op amp for current sensing and the COG peripheral for complementary PWM generation. The CLC handles fault detection and timing logic independently of the CPU (Core Independent Peripheral), reducing firmware complexity and improving response time to over-current events. Its compact 40-UQFN footprint fits behind space-constrained control board assemblies.
Recommended
Low-Cost General Purpose Embedded Control
The PIC16LF1719-E/MV is a strong fit for general-purpose embedded control in cost-sensitive products where on-chip analog peripherals reduce external component count. The PIC16F170X/171X family is supported by the MPLAB X IDE ecosystem, MPLAB XC8 C compiler, and PICkit programmers. The 28KB Flash accommodates feature-rich firmware (FSM + sensor fusion + communication), while 2KB RAM is sufficient for buffer-based serial protocols (UART, I2C, SPI). Designers can prototype on the PIC16F1719 family development board then transition to the LF1719 for production.
Recommended
Battery Charger and Power Bank Controller
The PIC16LF1719-E/MV's integrated op amps enable direct battery current/voltage sensing for lithium-ion charge management, while the 10-bit ADC provides accurate termination control. The DAC outputs can be used to drive reference inputs of external chargers. XLP nanoWatt sleep modes prevent the controller itself from draining the battery during standby, which is critical for portable power bank designs. The 40-UQFN exposed pad supports the modest thermal dissipation of charge controller circuits.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1719-E/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF1718-E/MV | PIC16F1719-E/MV | PIC16LF15355-I/MV | PIC16LF15376-E/MV | PIC16LF1503-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-UQFN (5x5 mm) | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same | 40-UQFN (5x5 mm) - same |
| Supply Voltage (VDD) | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ADC | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| DAC | 1x 5-bit + 1x 8-bit | 1x 5-bit + 1x 8-bit | 1x 5-bit + 1x 8-bit | 1x 5-bit + 1x 8-bit | 1x 5-bit + 1x 8-bit | No DAC |
| Op Amps / Comparators | Yes (on-chip) | Yes | Yes | Yes | Yes | Limited / None |
| Low-Power Technology | XLP / nanoWatt | XLP / nanoWatt | XLP / nanoWatt | XLP / nanoWatt | XLP / nanoWatt | XLP / nanoWatt |
Key Differentiators
- On-chip intelligent analog reduces BOM count (vs PIC16LF1503-I/MV)
- Larger memory than newer-gen siblings (vs PIC16LF15355-I/MV)
- 40-UQFN pin-count matches same-family drop-in (vs PIC16LF15376-E/MV)
Design Notes
Estimated: The 40-UQFN package features a central exposed thermal pad (EP) that MUST be soldered to a sufficient copper pour on the PCB (typically at least 25 mm² of 1 oz copper connected to VSS) for both thermal dissipation and electrical ground reference. The thermal pad serves as the primary heat path; failing to solder it raises junction temperature and can cause thermal-shutdown issues at higher ambient temperatures. Use an array of thermal vias (typically 4-9 vias in a 1.2 mm pitch pattern) to connect the EP to the inner ground plane for optimal thermal performance.
Place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD pin (this part has two VDD pins on opposite sides of the UQFN-40 package) with the trace width and length minimized to reduce parasitic inductance. Add a bulk 1 µF to 10 µF capacitor adjacent to the MCU for transient load support, especially when using the ADC or driving PWM outputs. Tie unused I/O pins to defined logic levels (VSS or VDD via software) to minimize shoot-through current and quiescent power consumption in XLP sleep modes.
Estimated: Do not exceed 3.6 V on VDD (LF variant); the PIC16F1719-E/MV (F variant) is the 5V-tolerant alternative. Do not configure the MCLR pin as a regular GPIO without enabling the internal weak pull-up, or the device may not reset reliably. When using ICSP for in-circuit programming, ensure the PGC/PGD lines are not loaded down by external circuitry; a series resistor or buffer may be required if long traces are used. The PIC16LF1719 does NOT include Data EEPROM - if non-volatile data storage is required, allocate a Flash sector and emulate EEPROM, or choose PIC16F171x with on-chip EEPROM.
When using the on-chip 10-bit ADC, route analog signals on a separate analog-ground plane or guard trace, and isolate analog VDD from digital VDD with an LC or ferrite-bead filter to prevent digital switching transients from coupling into ADC measurements. The integrated op amps can buffer high-impedance sensors before the ADC, but keep op-amp output traces short to avoid picking up digital switching noise from nearby I/O traces.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - use automotive-grade PIC variants for AEC-Q100 applications.
