PIC16LF18444T-I/GZ - 8-bit 32MHz 7KB Flash XLP MCU | Microchip
MPN: PIC16LF18444T-I/GZ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.48 | $148.00 |
| 500 | $1.32 | $660.00 |
| 1,000 | $1.18 | $1,180.00 |
PIC16LF18444T-I/GZ Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and a rich set of peripherals including timers, ADCs, and communication interfaces. Within the broader semiconductor taxonomy, an 8-bit MCU such as the PIC16 sits below 32-bit Cortex-M devices and is preferred when cost, deterministic interrupt latency, and code-efficiency per MHz are the dominant constraints. The PIC16LF18444 belongs to the PIC16(L)F184xx family, which Microchip targets at general-purpose low-power and battery-powered designs.
Key features of the PIC16LF18444T-I/GZ include a 12-bit ADC with Computation (ADCC), a 5-bit DAC, two PWM modules, a Comparator, a Complementary Waveform Generator (CWG), an EUSART, and SPI/I2C peripherals. The device carries 18 general-purpose I/O pins and integrates Core Independent Peripherals (CIPs) that execute tasks in hardware without CPU intervention, enabling lower system power and faster deterministic response.
Architecturally, the PIC16LF18444 uses Microchip's enhanced mid-range 8-bit core with a hardware multiply/accumulate assist and an instruction pipeline that delivers up to 16 MIPS at 32 MHz. The XLP analog and sleep-mode design achieves sub-uA deep-sleep currents, making it well suited for Energy Harvesting and always-on sensor nodes where coin-cell or Li-ion battery life drives the BOM.
Typical applications include IoT sensor nodes, low-power wireless companion MCUs, battery-powered medical wearables, industrial telemetry, and consumer remote controls. The combination of small UQFN-20 footprint, 12-bit ADC, and 1.8 V minimum supply also fits wearable health patches and home-automation endpoints.
When designing with this part, budget pin count first: 18 I/O plus power/clock pins fit comfortably in 4x4 mm, but if the application needs more peripherals or a different footprint (e.g., SOIC for hand-rework prototypes), a same-family pinout-compatible variant in PIC16LF18424/18426 should be evaluated before laying out the PCB.
This page synthesizes distributor pricing, cross-reference alternatives, and design notes for the PIC16LF18444T-I/GZ drawn from Microchip's product page and authorized distributors.
Drop-in alternatives for PIC16LF18444T-I/GZ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF18444T-I/GZ (same form factor and footprint) — differing in ADC, Program Memory (Flash), Operating Temperature, Package, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16LF18444-I/GZ
✅ Drop-In✓ In Stock
$0.78 / Unit
View Datasheet →PIC16LF18444-E/GZ
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF18444T-E/GZ
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC16F18444T-I/GZ
✅ Drop-In✓ In Stock
$0.6 / Unit
View Datasheet →PIC16LF18344T-I/GZ
✅ Drop-In✓ In Stock
$0.78 / Unit
View Datasheet →PIC16LF18424T-I/JQ
✅ Drop-In✓ In Stock
$0.88 / Unit
View Datasheet →PIC16LF1829T-I/GZ
✅ Drop-In✓ In Stock
$1.28 / Unit
View Datasheet →PIC16LF1828T-I/GZ
✅ Drop-In✓ In Stock
$1.79 / Unit
View Datasheet →PIC16LF18444T-I/GZ Maximum Ratings & Electrical Characteristics
| Core | PIC16 8-bit enhanced mid-range |
| Series | PIC16(L)F184xx |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| Data SRAM | 512 B |
| Data EEPROM | 256 B |
| Maximum CPU Frequency | 32 MHz |
| Operating Supply Voltage | 1.8 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial, 'I') |
| I/O Pins | 18 |
| ADC | 12-bit ADC with Computation (ADCC), 17 channels |
| DAC | 1x 5-bit DAC |
| Comparators | Yes |
| PWM | 2x PWM modules |
| CWG | Complementary Waveform Generator |
| Communication | EUSART, SPI, I2C |
| Package | 20-pin UQFN (4x4 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
PIC16LF18444T-I/GZ Pin Configuration
| Pin 1 | VDD — Positive supply voltage (1.8 V to 3.6 V) |
| Pin 2 | RA5 — GPIO RA5 / analog input |
| Pin 3 | RA4 — GPIO RA4 / analog input |
| Pin 4 | RA3 — GPIO RA3 / MCLR (alternate) |
| Pin 5 | RA2 — GPIO RA2 / analog input |
| Pin 6 | RA1 — GPIO RA1 / analog input / DAC output |
| Pin 7 | RA0 — GPIO RA0 / analog input / ICSPDAT |
| Pin 8 | VSS — Ground reference |
| Pin 9 | RA7 — GPIO RA7 / oscillator input |
| Pin 10 | RA6 — GPIO RA6 / oscillator output |
| Pin 11 | RC5 — GPIO RC5 / PWM output |
| Pin 12 | RC4 — GPIO RC4 / PWM output |
| Pin 13 | RC3 — GPIO RC3 / SPI/I2C clock |
| Pin 14 | RC2 — GPIO RC2 / analog input |
| Pin 15 | RC1 — GPIO RC1 / analog input / comparator output |
| Pin 16 | RC0 — GPIO RC0 / analog input |
| Pin 17 | RB7 — GPIO RB7 / I2C data |
| Pin 18 | RB6 — GPIO RB6 / I2C clock |
| Pin 19 | RB5 — GPIO RB5 / analog input |
| Pin 20 | RB4 — GPIO RB4 / analog input |
Typical Applications
PIC16LF18444T-I/GZ is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health and Fitness Devices, Industrial Sensor and Telemetry Modules, Consumer Remote Controls and HMI Panels, Low-Power Wireless Companion MCUs, Automotive Body Electronics (Non-Safety).
Battery-Powered IoT Sensor Nodes
The PIC16LF18444T-I/GZ fits battery-powered IoT sensor nodes through its 1.8-3.6 V supply and XLP technology, which delivers sub-uA deep-sleep currents and enables coin-cell or 2x AA operation for 1-3 years. Its 12-bit ADCC supports 17 channels for temperature, humidity, and light sensors with hardware averaging that runs without waking the CPU, reducing firmware complexity. The 32 MHz core handles LoRaWAN or BLE radio handshakes in burst mode while staying asleep 99% of the duty cycle. With 7 KB Flash and 512 B RAM, the device runs Microchip's MPLAB XC8 stack with TCP/IP lite or a custom Modbus over UART protocol, making it a strong fit for indoor air-quality monitors and remote telemetry units where PCB area is constrained.
Recommended
Wearable Health and Fitness Devices
The PIC16LF18444T-I/GZ suits wearable health patches where small footprint (4x4 mm UQFN-20) and low quiescent current are critical. The 12-bit ADCC accurately samples PPG, skin-temperature, and motion-sensor data while the Core Independent Peripherals handle the timing in hardware, allowing the core to sleep between heart beats. The 1.8 V minimum supply matches single-cell Li-ion or rechargeable coin-cell chemistries used in continuous-monitoring patches. Designers pair the MCU with a low-power BLE radio and a 3-axis accelerometer, using the PIC16's I2C/SPI ports to drive both peripherals. The CWG (Complementary Waveform Generator) can also drive haptic feedback directly for notification pulses, eliminating an external driver IC.
Recommended
Industrial Sensor and Telemetry Modules
The PIC16LF18444T-I/GZ fits industrial 4-20 mA loop-powered or 24 V-bus sensor modules when paired with an external LDO and TVS protection. Its -40 to +85 C industrial rating handles factory-floor environments, and the 12-bit ADCC provides 17 channels for simultaneous pressure, flow, and temperature acquisition. The EUSART (with LIN support) and SPI/I2C peripherals connect directly to digital sensors, isolators, and HMI displays without an external transceiver. Hardware CIPs like the CWG and PWM modules drive solid-state relay or LED-indicator stages without CPU load, improving response time in deterministic control loops. Designers favor this MCU for compact PLC I/O expansion cards and remote IO-Link-like slave devices.
Recommended
Consumer Remote Controls and HMI Panels
The PIC16LF18444T-I/GZ powers IR/RF remote controls, smart-home keypads, and small HMI panels thanks to its low standby current, integrated CIPs, and 32 MHz performance. The CWG and PWM modules generate IR carrier waveforms with 1% duty-cycle accuracy, eliminating the need for an external timer IC. The 12-bit ADCC reads capacitive-touch or resistive-touch front panels, while the EUSART interfaces with sub-GHz radios or BLE modules. With 18 GPIO, designers can drive 4x4 key matrices, RGB status LEDs, and a small OLED display from a single chip. The XLP sleep modes below 50 nA extend battery life on coin-cell-powered remotes to multiple years.
Recommended
Low-Power Wireless Companion MCUs
The PIC16LF18444T-I/GZ is well matched as a companion MCU to sub-GHz transceivers, BLE modules, or LoRa radios in sensor-to-cloud gateways. The 32 MHz core runs a small TCP/IP or LoRaWAN stack while the ADCC samples multiple analog sensors in parallel via DMA-style hardware sequencing. The device's PPS (Peripheral Pin Select) lets the SPI, UART, and I2C lines be remapped to any GPIO, simplifying PCB routing when the radio is placed away from the MCU. With 1.8 V minimum supply, it draws power directly from the radio's internal LDO, reducing BOM. Designers often pair this MCU with RN2483 LoRa or RN4871 BLE modules for low-data-rate agricultural and asset-tracking applications.
Recommended
Automotive Body Electronics (Non-Safety)
The PIC16LF18444T-I/GZ fits non-safety automotive body modules such as ambient lighting controllers, seat-position memory, and HVAC blend-door actuators when paired with an external CAN transceiver. The 32 MHz core runs LIN slave stacks via the EUSART, while the PWM and CWG modules generate high-resolution LED dimming with 14-bit effective resolution. The 12-bit ADCC reads NTC temperature sensors and potentiometers with hardware averaging, and the 18 GPIOs drive multiple LEDs, relays, and motor bridges. Although the 'I' industrial grade is rated to +85 C, Microchip offers PIC16F18444-E/GZ (extended +125 C) for under-hood or cabin-temperature environments. Designers benefit from the same UQFN-20 footprint across commercial and extended-temperature SKUs.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF18444T-I/GZ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16LF18444-I/GZ | PIC16F18444T-I/GZ | PIC16LF18424T-I/JQ | PIC16LF18344T-I/GZ | PIC16LF1829T-I/GZ |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | UQFN-20 (4x4 mm) | UQFN-20 (4x4 mm) - same | UQFN-20 (4x4 mm) - same | UQFN-20 (4x4 mm) - same | UQFN-20 (4x4 mm) - same | UQFN-20 (4x4 mm) - same |
| Program Memory (Flash) | 7 KB | 7 KB | 7 KB | 4 KB | 7 KB | 14 KB |
| Data SRAM | 512 B | 512 B | 512 B | 256 B | 512 B | 1024 B |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Maximum Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| ADC Resolution | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC | 10-bit | 10-bit |
| Operating Temperature | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +85 C (I) |
Key Differentiators
- 12-bit ADCC with 17 channels vs older 10-bit ADC (vs PIC16LF18344T-I/GZ)
- 1.8-3.6 V XLP supply vs standard 5 V tolerance (vs PIC16F18444T-I/GZ)
- Larger 7 KB Flash vs lower-cost 4 KB Flash variant (vs PIC16LF18424T-I/JQ)
Design Notes
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the VDD pin (pin 1), plus a bulk 1-10 uF tantalum or ceramic on the same rail. The PIC16LF18444 XLP technology can enter sub-uA deep sleep with the ADC disabled, but a missing bulk cap allows voltage transients on the rail that can trigger BOR resets during PWM switching events. For battery-powered designs, add a 100 kohm+ resistor in series with MCLR to minimize leakage to <1 uA in shutdown.
The UQFN-20 (4x4 mm) package has an exposed thermal pad that must be soldered to a copper pour on the PCB. Estimated: at the maximum 32 MHz operating current of ~5 mA and 3.6 V supply, power dissipation is ~18 mW and the junction-to-ambient thermal resistance is ~35 C/W, giving a junction rise of less than 1 C above ambient. No heatsink is required for normal operation, but the thermal pad must be soldered for production reliability; failure to solder the pad can raise junction temperature by 5-10 C and degrade long-term reliability.
Route the ICSP clock and data signals (ICSPCLK and ICSPDAT) away from high-frequency switching nodes such as PWM outputs and oscillator traces. Keep the MCLR trace short (<25 mm) and avoid running it parallel to noisy I/O lines. The UQFN-20 land pattern requires a 0.4 mm pitch; use 0.2 mm trace width with 0.2 mm spacing for escape routing. Stitch the inner ground plane with vias around the package perimeter to maintain a low-impedance return path for the 12-bit ADCC.
Do not exceed the 3.6 V maximum VDD on the LF variant - the LF silicon is optimized for lower voltage and 5 V input will damage the part. Use PIC16F18444T-I/GZ instead if 5 V tolerance is required. When migrating from the legacy PIC16LF1829/1828, verify that all PPS mappings are configured via software; the 182x family used fixed peripherals while the 184xx requires PPS configuration for every peripheral pin. Also note that the 184xx 12-bit ADCC requires longer acquisition times than the older 10-bit ADC, especially at high source impedances above 5 kohm.
Place the 32.768 kHz low-frequency crystal (if used for RTCC) within 5 mm of pins RA6/RA7 with short traces and a guard ring tied to analog ground to minimize coupling from digital switching. The 12-bit ADCC accuracy degrades by ~1 LSB per 50 mV of digital switching noise on VDD; place analog reference bypass capacitors (10 uF + 100 nF) within 2 mm of the VREF+ pin if external reference is used. Estimated: for 12-bit ENOB at full throughput, the analog and digital grounds should connect at a single star point near the MCU's VSS pin.
Compliance Information
RoHS compliant per Microchip product page. Lead-free UQFN-20 package. AEC-Q100 not applicable to this industrial-grade part; Microchip offers PIC16F18444-E/GZ for extended temperature environments.
