PIC18F55K42T-I/MV - 32KB Flash 8-bit MCU, 48-UQFN | Microchip
MPN: PIC18F55K42T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.62 | $26.20 |
| 100 | $2.3 | $230.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.82 | $1,820.00 |
| 3,300 | $1.65 | $5,445.00 |
PIC18F55K42T-I/MV Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), small EEPROM for settings, and a rich set of on-chip peripherals such as timers, ADCs, communication controllers and interrupt logic. Within the broader taxonomy, the PIC18F55K42 belongs to the PIC18 8-bit RISC family, which itself sits under the Microchip 8-bit MCU line, ultimately a subset of microcontrollers -> microprocessors -> semiconductor devices. This category hierarchy helps place the part in the engineering knowledge graph alongside competing 8-bit families such as AVR and 8051 cores.
Key differentiating features include XLP (eXtreme Low Power) technology with nanoWatt XLP sleep currents, programmable DMA for background data movement that offloads the CPU, vectored interrupts with hardware context saving, and CIP (Core Independent Peripherals) such as the 12-bit ADC2 with computation, CWG (Complementary Waveform Generator) and NCO (Numerically Controlled Oscillator). These features let designers implement complex timing, signal generation and sensor-processing tasks without CPU intervention.
Architecturally, the part is built on an enhanced PIC18 Harvard RISC core with a 16-bit instruction word and 8-bit data path, augmented by a peripheral bus for DMA. The 64MHz internal oscillator (with PLL) provides instruction cycle throughput of 16 MIPS, while the 12-bit ADC2 supports up to 35 input channels depending on package, enabling direct interface to multiple analog sensors in industrial and consumer applications.
Typical applications include industrial control panels, home appliance user interfaces, low-power IoT sensor nodes, automotive body and interior modules, LED lighting controllers, and small motor control boards. The wide 2.5V-5.5V supply range allows direct operation from a 3.3V or 5V rail, including battery or USB-derived supplies, while the exposed-pad UQFN package gives good thermal performance for sustained peripheral activity.
When designing with this MCU, ensure the exposed pad is soldered to a sufficient copper pour for thermal relief and ground reference. Use the MAP feature to protect bootloader regions from accidental application writes, and leverage DMA to keep the CPU in XLP sleep for power-critical battery applications. The T-I/MV suffix indicates tape-and-reel packaging in the 48-pin UQFN.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC18 K42 family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC18F55K42T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F55K42T-I/MV (same form factor and footprint) — differing in Package, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F55K42-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F56K42-I/MV
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →PIC18F57K42-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F55K42-I/PT
✅ Drop-In✓ In Stock
$2.05 / Unit
View Datasheet →PIC18F55K42-E/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F46K42T-I/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC18F55K42T-I/MV Maximum Ratings & Electrical Characteristics
| Core | PIC18 8-bit RISC |
| Series | PIC XLP 18K |
| Program Memory (Flash) | 32 KB (16K x 16 words) |
| RAM | 2 KB |
| EEPROM | 256 B |
| Maximum CPU Speed | 64 MHz |
| Supply Voltage Range | 2.5 V to 5.5 V |
| Operating Temperature Range | -40 C to +85 C (Industrial, I grade) |
| ADC | 12-bit ADC2 with computation |
| DAC | 5-bit and 8-bit DAC |
| Comparators | Yes, with hysteresis |
| DMA Channels | Yes, programmable priority |
| Zero-Cross Detect (ZCD) | Yes |
| Fixed Voltage Reference (FVR) | 1.024 V / 2.048 V / 4.096 V |
| PWM Channels | Yes (CCP/ECCP/HCCP) |
| Communication | UART, SPI, I2C |
| Package | 48-pin UQFN (6x6 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T-I/MV) |
| RoHS Status | Compliant |
PIC18F55K42T-I/MV Pin Configuration
| Pin 1 | RA0 — Bidirectional I/O / analog input AN0 |
| Pin 2 | RA1 — Bidirectional I/O / analog input AN1 |
| Pin 3 | RA2 — Bidirectional I/O / analog input AN2 |
| Pin 4 | RA3 — Bidirectional I/O / analog input AN3 / reference voltage |
| Pin 5 | RA4 — Bidirectional I/O / analog input AN4 |
| Pin 6 | RA5 — Bidirectional I/O / analog input AN5 |
| Pin 7 | RA6 — Bidirectional I/O / analog input AN6 |
| Pin 8 | RA7 — Bidirectional I/O / analog input AN7 |
| Pin 9 | VDD — Positive supply (2.5V to 5.5V) |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RB0 — Bidirectional I/O / interrupt-on-change |
| Pin 12 | RB1 — Bidirectional I/O / interrupt-on-change |
| Pin 13 | RB2 — Bidirectional I/O / interrupt-on-change |
| Pin 14 | RB3 — Bidirectional I/O / interrupt-on-change |
| Pin 15 | RB4 — Bidirectional I/O / interrupt-on-change |
| Pin 16 | RB5 — Bidirectional I/O / interrupt-on-change |
| Pin 17 | RB6 — Bidirectional I/O / ICSCLK |
| Pin 18 | RB7 — Bidirectional I/O / ICSDAT |
| Pin 19 | RC0 — Bidirectional I/O |
| Pin 20 | RC1 — Bidirectional I/O |
| Pin 21 | RC2 — Bidirectional I/O |
| Pin 22 | RC3 — Bidirectional I/O |
| Pin 23 | RC4 — Bidirectional I/O |
| Pin 24 | RC5 — Bidirectional I/O |
| Pin 25 | RC6 — Bidirectional I/O / UART TX |
| Pin 26 | RC7 — Bidirectional I/O / UART RX |
| Pin 27 | RE0 — Bidirectional I/O |
| Pin 28 | RE1 — Bidirectional I/O |
| Pin 29 | RE2 — Bidirectional I/O |
| Pin 30 | RE3 — Bidirectional I/O |
| Pin 31 | VDD — Positive supply (2.5V to 5.5V) |
| Pin 32 | VSS — Ground reference |
| Pin 33 | RD0 — Bidirectional I/O |
| Pin 34 | RD1 — Bidirectional I/O |
| Pin 35 | RD2 — Bidirectional I/O |
| Pin 36 | RD3 — Bidirectional I/O |
| Pin 37 | RD4 — Bidirectional I/O |
| Pin 38 | RD5 — Bidirectional I/O |
| Pin 39 | RD6 — Bidirectional I/O |
| Pin 40 | RD7 — Bidirectional I/O |
| Pin 41 | RF0 — Bidirectional I/O / analog input AN16 |
| Pin 42 | RF1 — Bidirectional I/O / analog input AN17 |
| Pin 43 | RF2 — Bidirectional I/O / analog input AN18 |
| Pin 44 | RF3 — Bidirectional I/O / analog input AN19 |
| Pin 45 | RF4 — Bidirectional I/O / analog input AN20 |
| Pin 46 | RF5 — Bidirectional I/O / analog input AN21 |
| Pin 47 | RF6 — Bidirectional I/O / analog input AN22 |
| Pin 48 | RF7 — Bidirectional I/O / analog input AN23 |
Typical Applications
PIC18F55K42T-I/MV is suitable for 6 applications: Industrial Control Panels, Home Appliance User Interfaces, Low-Power IoT Sensor Nodes, Automotive Body and Interior Modules, LED Lighting Controllers, Small Motor Control Boards.
Industrial Control Panels
The PIC18F55K42T-I/MV is well matched to industrial HMI and control-panel designs because its 12-bit ADC2 with computation handles multi-channel analog sensing of temperature, pressure and current without CPU burden, while the 64MHz core and 16 MIPS throughput keep scan loops tight. Its 2.5V-5.5V VDD range tolerates 24V-to-5V industrial supply rails via simple LDO, and the DMA engine moves ADC results to RAM in the background so the CPU can remain in XLP sleep for the bulk of the duty cycle. The 48-UQFN with exposed pad spreads heat across the ground pour for reliable 24/7 panel operation in -40C to +85C environments.
Recommended
Home Appliance User Interfaces
For washing machines, dishwashers, induction cooktops and microwave ovens, the PIC18F55K42T-I/MV delivers the right mix of 32KB Flash for state-machine firmware, enough I/O for segmented LCD or LED-matrix displays, and 12-bit ADC2 for temperature and humidity sensing. The ZCD (Zero-Cross Detect) peripheral allows precise AC-line timing for triac-driven heater control without external optocouplers on every channel, and the FVR module provides a stable 1.024V/2.048V/4.096V reference for accurate thermistor readings across the operating range. Industrial -40C to +85C operation covers garage and basement installations.
Recommended
Low-Power IoT Sensor Nodes
Battery-powered wireless sensor nodes benefit from the PIC18F55K42T-I/MV's XLP nanoWatt technology, which delivers sleep currents in the nanoampere range, plus its DMA engine that streams ADC readings into RAM without waking the CPU. The 32KB Flash accommodates small LoRaWAN or BLE-stack protocol buffers, the 2KB RAM holds frame payloads, and the 12-bit ADC2 with computation performs local thresholding to wake the host radio only on real events. The compact 48-UQFN 6x6 footprint fits coin-cell enclosures and supports extended battery life when paired with sleep-mode firmware patterns.
Recommended
Automotive Body and Interior Modules
Automotive body controllers for seat adjustment, mirror folding, ambient lighting and HVAC blend doors benefit from the PIC18F55K42T-I/MV's rich PWM (CCP/ECCP/HCCP) channels, 12-bit ADC2 for position feedback, and ZCD for AC-line zero-crossing detection in dimmer circuits. While the I (Industrial) grade suits cabin modules, the K42 family also offers E (Extended) temperature -40C to +125C variants for under-hood body controllers. The exposed-pad UQFN provides solid thermal dissipation for continuous PWM-driven LED current, and the DMA engine offloads LED-update loops from the CPU.
Recommended
LED Lighting Controllers
Architectural and commercial LED drivers using the PIC18F55K42T-I/MV leverage its CCP/ECCP/HCCP peripherals for high-resolution PWM dimming down to sub-1% steps, while the 12-bit ADC2 monitors LED current via shunt sensing for closed-loop brightness and color-mixing control. The FVR provides a stable 4.096V reference independent of VDD drift, critical for maintaining color point across dimming transitions. Vectored interrupts and DMA keep multi-channel WS2812B or DMX512 updates flowing without jitter, while the 48-UQFN's exposed pad dissipates heat from the MCU and adjacent driver FETs.
Recommended
Small Motor Control Boards
Stepper, BLDC and small DC motor drives use the PIC18F55K42T-I/MV's ECCP modules for complementary PWM outputs to half-bridge drivers, while the 12-bit ADC2 with computation samples back-EMF or shunt current at high PWM rates. The ZCD peripheral detects rotor position on BLDC sensorless designs, and the CWG (Complementary Waveform Generator) adds dead-band control to prevent shoot-through. With 16 MIPS of CPU throughput, the part can run sensorless FOC or trapezoidal commutation loops at 20-30 kHz PWM while leaving margin for UART command handling.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F55K42T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F55K42-I/MV | PIC18F56K42-I/MV | PIC18F57K42-I/MV | PIC18F55K42-E/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (MV, 6x6) | 48-UQFN (MV, 6x6) - same | 48-UQFN (MV, 6x6) - same | 48-UQFN (MV, 6x6) - same | 48-UQFN (MV, 6x6) - same |
| Flash | 32 KB | 32 KB | 64 KB | 128 KB | 32 KB |
| RAM | 2 KB | 2 KB | 4 KB | 8 KB | 2 KB |
| EEPROM | 256 B | 256 B | 256 B | 256 B | 256 B |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
Key Differentiators
- Larger memory within the same 48-UQFN footprint (vs PIC18F56K42-I/MV)
- Highest memory in the 48-UQFN K42 family (vs PIC18F57K42-I/MV)
- Higher temperature range for harsh environments (vs PIC18F55K42-E/MV)
Design Notes
The 48-UQFN (MV) package has an exposed thermal pad directly beneath the die that must be soldered to a PCB ground pour of at least 50 mm^2 to meet the datasheet thermal resistance. A typical 4-layer FR4 with continuous ground plane on layer 2 keeps theta_JA below 30 C/W, ensuring the MCU stays within the -40C to +85C industrial range even when peripherals run at full load. Per Microchip AN2091, place at least 8 thermal vias (0.3 mm drill) in the pad area for heat transfer to inner layers.
The PIC18F55K42T-I/MV requires a 0.1uF ceramic decoupling capacitor within 3 mm of each VDD pin (the device has two VDD pins at positions 9 and 31 on the 48-UQFN). Add a bulk 1uF to 10uF tantalum or ceramic on the main supply trace. For battery-powered designs, leverage the XLP sleep modes plus DMA-driven ADC reads to keep average supply current under 1uA, extending coin-cell life into years per Microchip TB3118 nanoWatt XLP design guidelines.
Do not leave unused pins floating on the 48-UQFN: configure them as outputs driving low, or as inputs with the internal weak pull-up enabled, to avoid ICC current spikes of 200-400uA per floating pin. Additionally, ensure the MCLR pin (not bonded on this package variant; the 48-UQFN uses internal MCLR via configuration) is properly disabled in CONFIG1 to free the dedicated reset line for general I/O. Finally, clear the JTAGEN configuration fuse unless you actively use the 4-wire ICD interface for debug.
When routing the 64MHz internal oscillator's HFINTOSC to the system clock, keep the OSC1/OSC2 (or SOSC) traces under 10 mm with a ground guard on both sides. For SPI runs above 10 MHz, add a 33 ohm series damping resistor at the SDO pin to reduce ringback on long board traces. The 12-bit ADC2 achieves best SNR with a 10nF COG capacitor on the analog VDD pin and a single-point ground star at the exposed pad.
Compliance Information
RoHS and REACH compliant per Microchip product declaration. AEC-Q100 grade not available in the I (Industrial) suffix; choose the E (Extended) temperature variant for automotive body modules per Microchip automotive qualification matrix.
