PIC18LF2480T-I/ML - 40MHz 8-Bit MCU, 16KB Flash, ECAN, 28-QFN | Microchip
MPN: PIC18LF2480T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.62 | $9.62 |
| 10 | $8.85 | $88.50 |
| 100 | $7.7 | $770.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.1 | $6,100.00 |
PIC18LF2480T-I/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (SRAM), and configurable peripherals. Within the taxonomy of semiconductors, an MCU falls under digital logic ICs -> microcontrollers -> 8-bit microcontrollers -> PIC18 family (Microchip). The PIC18 family specifically uses a 16-bit wide instruction set with an 8-bit data path, and is widely adopted in industrial control, automotive body electronics, and CAN-bus embedded designs.
Key features of the PIC18LF2480T-I/ML include 25 digital I/O pins with individual direction and weak pull-up control, an enhanced CAN (ECAN) module that supports CAN 2.0B active with three transmit buffers and two receive buffers, and nanoWatt Technology that provides multiple idle/sleep modes (Idle, Sleep, and RTCC alarm wake-up) for ultra-low standby current. The instruction set is C-optimized, allowing efficient compilation from Microchip's XC8 toolchain, and the device supports in-circuit serial programming (ICSP) plus background debug via the ICD headers.
The 28-QFN (6x6) package with exposed thermal pad (EP) gives the LF2480 a small PCB footprint while still offering good thermal dissipation for sustained 40 MHz operation across the -40C to +85C industrial temperature range. The QFN EP must be soldered to the ground plane on the PCB for both thermal and electrical performance.
Typical applications include CAN-bus node controllers in automotive body and chassis ECUs, industrial sensor nodes using the 10-bit ADC, low-voltage handheld instrumentation (2x AA battery-powered), CAN-to-UART gateways, and sensor-actuator nodes on factory automation networks. Compared with the PIC18F2480 (standard F variant), the LF variant extends operation down to 2.0 V and adds nanoWatt Technology, making it the better choice for battery-powered and energy-efficient designs.
When designing with this MCU, note that the 28-QFN EP must be soldered to a grounded copper pad for thermal and electrical performance; omitting this connection can raise die temperature under sustained 40 MHz operation and may cause erratic ADC readings due to ground bounce. The LF variant is specified for 2.0 V to 5.5 V operation; the standard F variant requires 4.2 V to 5.5 V.
This page synthesizes distributor pricing, drop-in QFN-28 alternatives, and practical ECAN/battery design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC18LF2480T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18LF2480T-I/ML (same form factor and footprint) — differing in Timers, ADC, Package, MSL Level, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F2480-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18LF2580-I/ML
✅ Drop-In✓ In Stock
$4.72 / Unit
View Datasheet →PIC18F2580-I/ML
✅ Drop-In✓ In Stock
$4.31 / Unit
View Datasheet →PIC18LF4480-I/ML
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →PIC18LF2420T-I/ML
✅ Drop-In✓ In Stock
$1.85 / Unit
View Datasheet →PIC18LF2480T-I/ML Maximum Ratings & Electrical Characteristics
| Family | PIC18F (PIC18LF low-voltage variant) |
| Core | 8-bit PIC RISC |
| CPU Speed (Max) | 40 MHz (10 MIPS at 40 MHz, 4 clocks/instruction) |
| Program Memory (Flash) | 16 KB (8K x 16) |
| Data SRAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Operating Voltage (VDD) | 2.0 V to 5.5 V (LF variant) |
| I/O Pins | 25 |
| ADC | 10-bit, up to 8 channels |
| CAN Module | ECAN (Enhanced CAN 2.0B Active), 3 TX / 2 RX buffers |
| Communication Interfaces | 1x USART, 1x MSSP (SPI / I2C) |
| Timers | TMR0 (8/16-bit), TMR1 (16-bit), TMR2 (8-bit), TMR3 (16-bit) |
| Capture / Compare / PWM | ECCP + 2x CCP (10-bit PWM) |
| Low-Power Features | nanoWatt Technology (Idle, Sleep, RTCC alarm wake) |
| Programming / Debug | ICSP (In-Circuit Serial Programming), ICD background debug |
| Package | 28-QFN (6x6 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial, 'I' suffix) |
| MSL Level | MSL3 (per JEDEC J-STD-020, typical for QFN-28 EP) |
| RoHS Status | Compliant |
PIC18LF2480T-I/ML Pin Configuration
| Pin 1 | RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC positive voltage reference |
| Pin 2 | RA4/AN4 — Digital I/O / Analog input 4 |
| Pin 3 | RA5/AN5 — Digital I/O / Analog input 5 |
| Pin 4 | RA6/OSC2 — Digital I/O / Crystal oscillator output |
| Pin 5 | RA7/OSC1 — Digital I/O / Crystal oscillator input |
| Pin 6 | RC0/T1OSO/T1CKI — Digital I/O / Timer1 oscillator output / Timer1 external clock |
| Pin 7 | RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input / CCP2 PWM output |
| Pin 8 | RC2/CCP1 — Digital I/O / Enhanced CCP1 PWM output |
| Pin 9 | RC3/SCK/SCL — Digital I/O / MSSP SPI clock / I2C clock |
| Pin 10 | RC4/SDI/SDA — Digital I/O / MSSP SPI data in / I2C data |
| Pin 11 | RC5/SDO — Digital I/O / MSSP SPI data out |
| Pin 12 | RC6/TX/CK — Digital I/O / USART async TX / USART sync clock |
| Pin 13 | RC7/RX/DT — Digital I/O / USART async RX / USART sync data |
| Pin 14 | VSS — Ground reference |
| Pin 15 | VDD — Positive supply voltage (2.0 V to 5.5 V) |
| Pin 16 | RB0/INT0 — Digital I/O / External interrupt 0 |
| Pin 17 | RB1/INT1 — Digital I/O / External interrupt 1 |
| Pin 18 | RB2/INT2 — Digital I/O / External interrupt 2 |
| Pin 19 | RB3/INT3/ECCP — Digital I/O / External interrupt 3 / Enhanced CCP PWM |
| Pin 20 | RB4 — Digital I/O / interrupt-on-change |
| Pin 21 | RB5 — Digital I/O / interrupt-on-change |
| Pin 22 | RB6/PGC — Digital I/O / interrupt-on-change / ICSP clock |
| Pin 23 | RB7/PGD — Digital I/O / interrupt-on-change / ICSP data |
| Pin 24 | CANTX — ECAN transmit output (to external CAN transceiver) |
| Pin 25 | CANRX — ECAN receive input (from external CAN transceiver) |
| Pin 26 | RA0/AN0 — Digital I/O / Analog input 0 |
| Pin 27 | RA1/AN1 — Digital I/O / Analog input 1 |
| Pin 28 | RA2/AN2/VREF- — Digital I/O / Analog input 2 / ADC negative voltage reference |
| Pin EP | EP — Exposed thermal pad - solder to grounded copper for thermal/electrical performance |
Typical Applications
PIC18LF2480T-I/ML is suitable for 6 applications: Automotive CAN Bus Node Controllers, Industrial Sensor / Actuator Nodes, Battery-Powered Handheld Instrumentation, CAN-to-UART / CAN-to-SPI Gateways, HVAC and Building Automation Controllers, Low-Voltage Energy-Harvesting Sensor Nodes.
Automotive CAN Bus Node Controllers
The PIC18LF2480T-I/ML's integrated ECAN (Enhanced Controller Area Network 2.0B Active) module, 16 KB Flash, 25 digital I/O, and 2.0 V to 5.5 V VDD make it ideal for CAN-bus node controllers in automotive body and chassis ECUs. Per Microchip datasheet 39638D, the ECAN module supports standard 11-bit and extended 29-bit identifiers with three TX / two RX buffers, which is sufficient for typical body-electronics messages such as door module status, lighting control, and seat position. Compared with a discrete CAN transceiver + external controller design, the LF2480's integrated ECAN reduces BOM cost and PCB area by 30 to 40 percent, while the LF VDD range allows the node to remain operational during cranking transients when the battery drops to 6 V. The 10-bit ADC can read up to 8 sensor channels for thermistor, switch, and potentiometer inputs.
Recommended
Industrial Sensor / Actuator Nodes
The PIC18LF2480T-I/ML's 10-bit ADC, USART, MSSP (SPI/I2C), ECAN, and 16 KB Flash make it a strong fit for industrial sensor / actuator nodes on CANopen or DeviceNet networks. According to Microchip datasheet 39638D, the 10-bit ADC supports up to 8 single-ended channels at conversion rates up to ~100 ksps, which is sufficient for temperature, pressure, flow, and switch-state acquisition in process-control panels. The ECAN module can implement CANopen CiA 401 profiles directly on-chip, while the LF2480's 2.0 V minimum VDD allows the node to ride through brownouts caused by 24 V industrial bus transients stepped down by a wide-input LDO. The 28-QFN (6x6) package fits densely populated sensor modules where PCB area is at a premium.
Recommended
Battery-Powered Handheld Instrumentation
The PIC18LF2480T-I/ML is engineered for battery-powered handheld instrumentation: the LF variant operates down to 2.0 V (vs 4.2 V for the standard F part), enabling 2x AA / 3x AA cells to be used down to deep discharge. Per Microchip datasheet 39638D, nanoWatt Technology provides Idle and Sleep modes with sub-microampere current, plus RTCC alarm wake-up, so the LF2480 can be left in Sleep for years on a 3 V coin cell when intermittently sampling. The 25-I/O count is enough for a 4x4 keypad matrix, an LCD bias driver, and a UART-to-BLE bridge. The 28-QFN (6x6) EP package is well-suited to slim form factors such as handheld DMMs and portable medical monitoring.
Recommended
CAN-to-UART / CAN-to-SPI Gateways
The PIC18LF2480T-I/ML bridges CAN-bus networks to legacy UART or SPI peripherals in gateway modules used in industrial automation and vehicle retrofit applications. According to Microchip datasheet 39638D, the ECAN module, USART, and MSSP (SPI/I2C) peripheral set provide the three interfaces needed to translate between CAN frames on one side and UART / SPI on the other. The 16 KB Flash accommodates a CANopen or J1939 stack plus a serial command parser, and the 768-byte SRAM buffers incoming CAN frames before re-transmission. The LF2480's 25-I/O count leaves several pins free for status LEDs and a configuration switch.
Recommended
HVAC and Building Automation Controllers
The PIC18LF2480T-I/ML is a strong match for HVAC and building automation controllers that must interface to a CAN-bus backbone (e.g., BACnet-over-CAN, Schneider Electric Sedona, or vendor-proprietary protocols). According to Microchip datasheet 39638D, the ECAN, USART, MSSP, 25-I/O, and 10-bit ADC combination covers most zone-controller requirements: relay drive, thermistor input, damper actuator feedback, and CAN-side communication. The LF2480's industrial -40C to +85C temperature range handles rooftop and mechanical-room environments, while nanoWatt Technology allows the controller to enter Sleep when the zone is unoccupied. The 28-QFN package and small footprint ease installation inside the small junction-box enclosures common to building automation.
Recommended
Low-Voltage Energy-Harvesting Sensor Nodes
The PIC18LF2480T-I/ML's 2.0 V minimum VDD and nanoWatt Technology make it a fit for energy-harvesting sensor nodes that operate from a small solar cell, thermoelectric generator, or piezoelectric source. Per Microchip datasheet 39638D, the LF2480's nanoWatt Sleep current is sub-microampere, allowing the MCU to spend most of its life asleep and wake briefly to take an ADC reading and transmit a CAN or UART frame. The 16 KB Flash accommodates a small wireless protocol stack (e.g., a vendor-proprietary RF-to-CAN bridge), and the 25-I/O count supports an external energy-harvesting power-good signal, a watchdog timer, and an SPI-attached energy-meter IC. The 28-QFN (6x6) package fits the small footprint typical of wireless sensor nodes.
Recommended
Recommended Products Summary
Engineering reference data for PIC18LF2480T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F2480-I/ML | PIC18LF2580-I/ML | PIC18F2580-I/ML | PIC18LF4480-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) with Exposed Pad | 28-QFN (6x6) with Exposed Pad - same | 28-QFN (6x6) with Exposed Pad - same | 28-QFN (6x6) with Exposed Pad - same | 28-QFN (6x6) with Exposed Pad - same |
| Operating Voltage (VDD) | 2.0 V to 5.5 V (LF) | 4.2 V to 5.5 V | 2.0 V to 5.5 V (LF) | 4.2 V to 5.5 V | 2.0 V to 5.5 V (LF) |
| Flash Program Memory | 16 KB | 16 KB | 32 KB | 32 KB | 16 KB |
| Data SRAM | 768 bytes | 768 bytes | 1536 bytes | 1536 bytes | 768 bytes |
| ECAN Module | Yes (ECAN 2.0B Active) | Yes (ECAN 2.0B Active) | Yes (ECAN 2.0B Active) | Yes (ECAN 2.0B Active) | Yes (ECAN 2.0B Active) |
| ADC Channels (10-bit) | 8 channels | 8 channels | 8 channels | 8 channels | 11 channels |
| CPU Speed (Max) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) | 40 MHz (10 MIPS) |
| nanoWatt Technology | Yes (LF variant) | No | Yes (LF variant) | No | Yes (LF variant) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
Key Differentiators
- Low-voltage (LF) variant with nanoWatt Technology (vs PIC18F2480-I/ML)
- Integrated ECAN 2.0B Active module (vs PIC18F2420T-I/ML (no CAN))
- QFN package with exposed thermal pad (vs PIC18F2480-I/SP (SPDIP package))
- 25 I/O pins with nanoWatt peripherals (vs PIC18LF2420T-I/ML)
Design Notes
Estimated: The 28-QFN (6x6) package with exposed pad (EP) has theta_JA in the 30 to 40 C/W range when the EP is soldered to a 1 square-inch grounded copper pour on a 4-layer PCB. At sustained 40 MHz operation, supply current is roughly 15 to 25 mA (VDD = 5.0 V), so worst-case power dissipation is on the order of 125 mW, yielding a junction-temperature rise of approximately 4 to 5 C above ambient. The EP MUST be soldered to a continuous, grounded copper pad - do not skip this step; not only will thermal performance degrade, but the EP also provides the chip's main ground reference, and a poorly soldered EP can cause erratic ADC readings and ECAN communication errors.
For designs that operate below 4.2 V, the LF prefix is required; the standard F part will not regulate at 3.3 V or 2x AA cell voltages. Use a low-IQ LDO such as Microchip MCP1700 for the 3.3 V or 2.5 V rail, which adds only ~1.6 uA quiescent current and is compatible with nanoWatt Technology Sleep currents. Decouple VDD (pin 15) with a 100 nF ceramic placed within 5 mm of the pin, and add a bulk 4.7 uF tantalum or aluminum-polymer for the switching transients generated by ECAN frame transmission. For nanoWatt Sleep current below 1 uA, switch off all peripherals and configure all unused I/O as outputs driving low before executing the Sleep instruction.
Route the ECAN differential pair (CANTX pin 24, CANRX pin 25) as a 100-ohm differential microstrip from the LF2480 to the external CAN transceiver (e.g., MCP2551) using controlled impedance. Keep the CAN bus traces short (under 50 mm total on the MCU side) and avoid routing them parallel to high-current switching traces. The ICSP pins (RB6/PGC pin 22, RB7/PGD pin 23) should be brought out to a 5-pin header (0.1 inch pitch) with a 10 kohm pull-up on MCLR (RB5 pin 21, normally driven by an external reset supervisor) for in-circuit programming and ICD debugging. Per Microchip datasheet 39638D, ICSP pins are required to be free of any pull-up/pull-down that exceeds 10 kohm during programming.
Common pitfalls when designing with the PIC18LF2480T-I/ML include: (1) Forgetting to solder the QFN exposed pad to ground - causes erratic ADC and ECAN. (2) Choosing the standard F variant (PIC18F2480) instead of the LF variant when VDD will drop below 4.2 V - the F part requires 4.2 V minimum and will not start at 3.3 V. (3) Not configuring unused I/O as outputs driving low before Sleep - leaking current can reach tens of uA per pin. (4) Pull-up or pull-down resistors on RB6/RB7 (ICSP) that are too strong - prevents ICSP from driving the lines. (5) Driving CANTX/CANRX directly to the bus - the LF2480's ECAN is a logic-level controller and must be paired with an external CAN transceiver (MCP2551, TJA1050, etc.).
Compliance Information
RoHS / REACH compliance per Microchip product page. AEC-Q100 qualification is not standard for the industrial-temperature 'I' grade; for AEC-Q100 automotive grade, the 'F' variant is typically specified separately. Lead-free and halogen-free per Microchip material declarations.
